CN206364009U - One kind support posture induction structure - Google Patents
One kind support posture induction structure Download PDFInfo
- Publication number
- CN206364009U CN206364009U CN201621002046.8U CN201621002046U CN206364009U CN 206364009 U CN206364009 U CN 206364009U CN 201621002046 U CN201621002046 U CN 201621002046U CN 206364009 U CN206364009 U CN 206364009U
- Authority
- CN
- China
- Prior art keywords
- inductance coil
- induction structure
- utility
- model
- insulating barrier
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Landscapes
- Coils Or Transformers For Communication (AREA)
Abstract
The utility model is related to a kind of support posture induction structure, belongs to technical field of semiconductor encapsulation.It includes inductance coil（1）, the inductance coil（1）Periphery is coated with insulating barrier（3）, the insulating barrier（3）Surrounding is provided with multiple support frames（2）, support frame as described above（2）Arrangement, the multiple support frame are sloped downwardly outwardly（2）In at least two and inductance coil（1）It is connected.The utility model one kind support posture induction structure, it can reduce encapsulation planar dimension, reduce the area occupied of encapsulating structure on a printed circuit, improve the integrated level of printed circuit board (PCB).
Description
Technical field
The utility model is related to a kind of support posture induction structure, belongs to technical field of semiconductor encapsulation.
Background technology
It is typically all at present to be embedded into substrate for the structure containing inductor product in each encapsulation（Referring to Fig. 1 and Fig. 2）.This
Plant the unsuitable High Density Integration encapsulating structure of encapsulating structure form that substrate is embedded in inductance coil, the number of turns of embedded inductance coil
Limited by substrate size, be also great challenge for base plate line design, and packaging body planar dimension is because line will be integrated
Enclose the layout with circuit and increase.The encapsulating structure of follow-up this substrate insertion inductance coil is mounted on a printed circuit, meeting
Make printed circuit board (PCB) integrated level relative reduction, integrated functionalities relative reduction.
Utility model content
Technical problem to be solved in the utility model is to provide a kind of support posture inductance knot for above-mentioned prior art
Structure, it can be flexibly applied to substrate package, reduce substrate package planar dimension, reduce encapsulating structure on a printed circuit
Area occupied, improves the integrated level of printed circuit board (PCB), and induction structure is not limited by base plate line, can increase inductor wire
The number of turns is enclosed, inductance value is lifted.
The technical scheme in the invention for solving the above technical problem is：One kind support posture induction structure, it includes
Inductance coil, the inductance coil periphery is coated with insulating barrier, and the insulating barrier surrounding is provided with multiple support frames, the support
Frame is sloped downwardly at least two support frames in arrangement, the multiple support frame and is connected with inductance coil outwardly.
Compared with prior art, the utility model has the advantage of：
1st, the utility model is applicable to High Density Integration encapsulating structure, can effectively reduce High Density Integration structural plan
Size, reduces the area occupied of pcb board, improves the integrated level of pcb board；
2nd, the utility model induction structure is not limited by base plate line, can design the inductance coil knot of more number of turns
Structure, lifts inductance value.
Brief description of the drawings
Fig. 1 is the existing encapsulating structure schematic diagram with inductance.
Fig. 2 is the existing another encapsulating structure schematic diagram with inductance.
Fig. 3 is a kind of schematic diagram of support posture induction structure of the utility model.
Fig. 4 is with a kind of encapsulating structure schematic diagram of support posture induction structure of the utility model.
Fig. 5 is with a kind of schematic diagram of another embodiment of encapsulating structure of support posture induction structure of the utility model.
Wherein：
Inductance coil 1
Support frame 2
Insulating barrier 3
Substrate 4
Chip 5
Plastic packaging material 6.
Embodiment
The utility model is described in further detail below in conjunction with accompanying drawing embodiment.
As shown in Fig. 3 ~ Fig. 5, a kind of support posture induction structure in the present embodiment, it includes inductance coil 1, the electricity
Sense coil 1 periphery is coated with insulating barrier 3, and the surrounding of insulating barrier 3 is provided with multiple support frames 2；
At least two are connected with inductance coil 1 in the multiple support frame 2.
In addition to the implementation, the utility model also includes other embodiment, all use equivalents or equivalent
The technical scheme of substitute mode formation, all should fall within the utility model scope of the claims.
Claims (1)
1. one kind support posture induction structure, it is characterised in that：It includes inductance coil（1）, the inductance coil（1）Periphery bag
It is covered with insulating barrier（3）, the insulating barrier（3）Surrounding is provided with multiple support frames（2）, support frame as described above（2）Laterally have a down dip outwardly
Tiltedly arrange, the multiple support frame（2）In at least two and inductance coil（1）It is connected.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621002046.8U CN206364009U (en) | 2016-08-31 | 2016-08-31 | One kind support posture induction structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621002046.8U CN206364009U (en) | 2016-08-31 | 2016-08-31 | One kind support posture induction structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206364009U true CN206364009U (en) | 2017-07-28 |
Family
ID=59368783
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621002046.8U Active CN206364009U (en) | 2016-08-31 | 2016-08-31 | One kind support posture induction structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206364009U (en) |
-
2016
- 2016-08-31 CN CN201621002046.8U patent/CN206364009U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN204102862U (en) | A kind of based on bulk technology multi-chip superposition packaging system | |
| CN103107171B (en) | Semiconductor device of flip chip | |
| TW200943519A (en) | Improved methods of mid-frequency decoupling | |
| CN104752389A (en) | Mosfet Pair With Stack Capacitor And Manufacturing Method Thereof | |
| CN102197445A (en) | Integrated circuit packages incorporating an inductor and methods | |
| CN206364009U (en) | One kind support posture induction structure | |
| CN203733790U (en) | Internal decoupling integrated circuit packaging | |
| TWM406265U (en) | Inductance IC chip packaging multi-layer substrate | |
| CN201450006U (en) | Semi-conductor device of integrated memory chip and control chip | |
| CN203774319U (en) | Stackable packaging structure | |
| CN103943585B (en) | Mainboard, chip packaging module and motherboard | |
| CN206116395U (en) | Packaging structure with support posture inductance | |
| CN104900622B (en) | Lead frame and chip-packaging structure | |
| CN107742625A (en) | A kind of vertical surface mount package structure of element and its process | |
| CN104051450B (en) | Semiconductor packages | |
| CN106952886A (en) | A kind of radio frequency chip encapsulating structure | |
| CN106298709A (en) | Low cost fan-out formula encapsulating structure | |
| CN202434503U (en) | DIP10 integrated circuit device and lead frame, and lead frame matrix | |
| CN213094569U (en) | Support frame type inductor packaging structure | |
| CN202111082U (en) | Multi-loop arrangement integrated circuit (IC) chip package element | |
| CN207199599U (en) | A kind of ultra-thin small size encapsulating structure | |
| CN207021253U (en) | A kind of ultra-thin integrated package structure | |
| CN204464266U (en) | A kind of POP Stacked die package structure of little sphere gap | |
| CN204361080U (en) | Circuits System and chip package thereof | |
| CN108807306A (en) | A kind of novel power supply power module architectures of band input protection |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |