CN206323356U - A kind of SAW resonator of wafer-level package - Google Patents
A kind of SAW resonator of wafer-level package Download PDFInfo
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- CN206323356U CN206323356U CN201621328914.1U CN201621328914U CN206323356U CN 206323356 U CN206323356 U CN 206323356U CN 201621328914 U CN201621328914 U CN 201621328914U CN 206323356 U CN206323356 U CN 206323356U
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Abstract
A kind of SAW resonator of wafer-level package, is related to the encapsulating structure and packaging technology technical field of SAW resonator.Solve existing SAW resonator encapsulation volume big, or the high technical deficiency of packaging cost, including sound watch core piece, it is characterised in that：Also include ceramic substrate, sound watch core piece is connected electrically on ceramic substrate by inverted structure, remains with cavity between sound watch core piece and ceramic substrate, the resin film for encapsulating sound watch core piece is additionally provided with ceramic substrate；Described SAW resonator overall dimensions are not more than the mm * 0.6mm of 2.0 mm * 1.6；Length is not more than 2.0 mm, and width is not more than 1.6 mm, and height is not more than 0.6mm.Unprecedented breakthrough is realized on device volume and cost, the CSP encapsulation of SAW resonator is realized.
Description
Technical field
The utility model is related to the encapsulating structure and packaging technology technical field of SAW resonator.
Background technology
SAW device is the device for being simulated processing to electric signal using surface acoustic wave.
As shown in fig. 1, SAW resonator is to place discontinuous structure gold respectively on the interdigital both sides of transducing grating array 11
Belong to the reflecting grating array 12 of band.Each grating array by hundreds of or it is thousands of wide be respectively that the metal bands of λ/4 is constituted with interval.This
It is a kind of distributed feedback structure.Although sound wave reflects very little on each metal band, all reflected signals are all with synchronization
Frequency is added with same, so that sound wave constitutes resonator close to all reflections.SAW resonator and bulk wave crystal are humorous
The device that shakes is compared, and has the advantages that resonant frequency height and vibration resistance.
SAW resonator is widely used in car door remote control switch, internal seizure system, data link, tire pressure prison
Control system, wireless security system, the reading of wireless bar code, Wireless Keyboard, wireless mouse, wireless operating bar, remote control lamp switch etc.
In civilian consumer electronics product, domestic annual consumption is at tens or so, and consumption is huge.
SAW resonator mainly has two class wrapper forms, the larger metal pin encapsulation of volume at present（Such as Fig. 2 institutes
Show）With the mm of 3.0 mm *, 3.0 mm * 1.3 and the LTCC ceramic packages (as shown in Figure 3) of the above.Wherein metal pin encapsulates valency
Lattice are low, it is impossible to be used in automatic chip mounting is produced, and reliability is low, is mainly used in low-end consumer market；LTCC ceramic cavities are sealed
Fill price of a relatively high, reliability is high, for the high-end consumption market such as automotive electronics.
With the subminaturization of electronic correlation product, the demand of more cost degradation, to core parts-surface acoustic wave resonance
Device proposes new volume requirement.Therefore, either metal pin is encapsulated, or the resonator that LTCC ceramic cavities are encapsulated, in body
It all must significantly reduce in product, also further to be reduced in price.
The content of the invention
In summary, the purpose of this utility model is to solve existing SAW resonator encapsulation volume greatly, or envelope
The technical deficiency of high cost is filled, a kind of SAW resonator of wafer-level package is proposed.
To solve the technical problem that is proposed of the utility model, the technical scheme used for：
A kind of SAW resonator of wafer-level package, including sound watch core piece, it is characterised in that：Also include ceramics
Substrate, sound watch core piece is connected electrically on ceramic substrate by inverted structure, and cavity is remained between sound watch core piece and ceramic substrate,
The resin film for encapsulating sound watch core piece is additionally provided with ceramic substrate；Described SAW resonator overall dimensions are not more than
2.0 mm *1.6 mm *0.6mm；Length is not more than 2.0 mm, and width is not more than 1.6 mm, and height is not more than 0.6mm.
Described sound watch core piece by between metal ball and ceramic substrate by electrically supporting connection.
The plating that described sound watch core piece is made up of plated bumps plating copper substrate, plating Ni interlayer and tin plating outer layer is convex
By electrically supporting connection between block and ceramic substrate.
Described sound watch core piece includes piezoelectric substrate, and piezoelectric substrate is provided with interdigital transducing grating array, reflecting grating array, input
Plant ball electrode district and ball electrode district is planted in output；Input is planted ball electrode district and is electrically connected with interdigital transducing grating array, and ball electrode is planted in output
The reflected grating array in area is electrically connected with interdigital transducing grating array.
Described ceramic substrate is HTCC ceramic substrates or LTCC ceramic substrates.
The manufacture craft of the SAW resonator of wafer-level package as described above, it is characterised in that the technique is included such as
Lower step：
A）, make ceramic substrate, ceramic substrate top surface includes pad, bottom surface include corresponded with pad it is electrically used
Wear the electrode terminal of connection；
B）, on the electrode district of sound watch core piece implanted metal ball, formed raised support block；
C）, sound watch core piece is inverted in above ceramic substrate, make sound watch core piece pass through metal ball with ceramic substrate top surface
Pad correspond and be electrically connected with, sound watch core piece and ceramic substrate top surface shape cavity；
D）, above ceramic substrate cover one layer of resin film, sound watch core piece is encapsulated on ceramic substrate；
E）, resin film and ceramic substrate split, obtain the surface acoustic wave resonance of some single wafer-level packages
Device finished product.
The beneficial effects of the utility model are：Sound watch core piece is loaded on ceramic base by the utility model using flip-chip packaged structure
On plate, it is packaged afterwards with resin film, so as in the case where ensureing that performance does not decline, obtain size for 2.0 mm *
1.6 mm * 0.6mm and smaller size of SAW resonator product, are realized unprecedented on device volume and cost
Breakthrough, realize SAW resonator CSP encapsulation.CSP is Chip Scale Package abbreviation, that is, core
Chip size package.CSP concept originates from IC industries, and definition substantially is that the area ratio of chip area and packaging body is more than 80%, sound
Table row industry be specifically defined be the packaging body length of side and chip difference be less than 1 millimeter.When invention size is the mm * of 2.0 mm * 1.6
During 0.6mm, with traditional SMD（Surface mount）The mm * 3.0mm*1.3mm of product 3.0 compare, volume of the present utility model and into
This only has the 16% and 25% of SMD respectively.
Brief description of the drawings
Fig. 1 is the basic structure schematic diagram of SAW resonator chip；
Fig. 2 is the SAW resonator structural representation that conventional metals pin is encapsulated；
Fig. 3 is the SAW resonator structural representation that tradition QCC8B type LTCC ceramic cavities are encapsulated；
Fig. 4 is the SAW resonator structural representation that tradition SMD is encapsulated；
Fig. 5 is the SAW resonator structural representation that CSP of the present utility model is encapsulated；
Fig. 6 is the structural representation of sound watch core piece of the present utility model；
Fig. 7 is the structural representation of ceramic substrate of the present utility model.
Embodiment
The specific embodiment selected below in conjunction with accompanying drawing and the utility model is further said to structure of the present utility model
It is bright.
Reference picture 5 is to shown in Fig. 7, and the SAW resonator of wafer-level package of the present utility model includes sound watch core
Piece 1 and ceramic substrate 2；Sound watch core piece 1 is connected electrically on ceramic substrate 2 by inverted structure, sound watch core piece 1 and ceramic substrate 2
Between remain with cavity 3, the resin film 4 for encapsulating sound watch core piece 1 is additionally provided with ceramic substrate 2.
Sound watch core piece 1 is except piezoelectric substrate 16 is included, and piezoelectric substrate 16 is provided with interdigital transducing grating array 11 and reflecting grating array
Outside 12, also include the input on piezoelectric substrate 16 and plant ball electrode district 13 and output plant ball electrode district 14；Ball is planted in input
Electrode district 13 is electrically connected with interdigital transducing grating array 11, and output plants the reflected grating array 12 of ball electrode district 14 and is electrically connected with interdigital transducing
Grating array 11.Ball electrode district 14 is planted in input plant ball electrode district 13 and output, and pad 21,22 corresponding with ceramic substrate 2 is aligned respectively
It is electrically connected with.
Ceramic substrate 2 can be HTCC ceramic substrates or LTCC ceramic substrates.
In order to realize sound watch core piece 1 and the formation cavity 3 of ceramic substrate 2 so that the interdigital He of transducing grating array 11 of sound watch core piece 1
Reflecting grating array can be in cavity 3 in, sound watch core piece 1 by between metal ball 5 and ceramic substrate 2 by electrically supporting connection.In addition,
Electric connection and supporting role can also be played instead of metal ball 5 using plated bumps, plated bumps are by plating copper substrate, nickel plating
Interbed and tin plating outer layer composition.
It that is to say that the utility model breaks the Conventional processing methods during SAW resonator makes.At sound watch core piece and bottom
With current Flip Chip during seat electric performance conducting（Upside-down mounting）Technology generations replace traditional Wire Bonding（Metal lead wire
Bonding）Technique；Traditional SMD is replaced out with vacuum resin coating technique in device enclosed package process（Surface mount）Technique.
SMD（Surface mount）Technique is as shown in figure 4, being in package cavity structure base board 62 by sound watch core piece 61 by the formal dress of bonding die glue 63
On, welded, be packaged afterwards with parallel soldering and sealing cap 65, its volume is typically minimum with electrode terminal by playing wire 64
3.0 mm *3.0mm*1.3mm；And SAW resonator overall dimensions of the present utility model are generally not greater than 2.0 mm *
1.6 mm *0.6mm；And length is not more than 2.0 mm, width is not more than 1.6 mm, and height is not more than 0.6mm；Minimum can be with
Reach the mm * 0.55mm of 2.0 mm * 1.2.
The manufacture craft of the SAW resonator of wafer-level package of the present utility model, comprises the following steps：
A）, make ceramic substrate 2, the top surface of ceramic substrate 2 includes pad 21,22, and bottom surface includes and pad 21,22 1
The used electrode terminal 211,221 for wearing connection of a pair of electrotropisms；
B）, on the electrode district 13,14 of sound watch core piece 1 implanted metal ball 5, formed raised support block；
C）, sound watch core piece 1 is inverted in the top of ceramic substrate 2, sound watch core piece 1 is pushed up by metal ball 5 with ceramic substrate 2
Pad 21,22 on face, which is corresponded, to be electrically connected with, sound watch core piece 1 and the top surface shape cavity of ceramic substrate 2；
D）, in one layer of resin film 4 of the top of ceramic substrate 2 covering, sound watch core piece 1 is encapsulated on ceramic substrate 2；
E）, resin film 4 and ceramic substrate 1 split, the surface acoustic wave for obtaining some single wafer-level packages is humorous
Shake device finished product.
Process of the present utility model is easy to batch production, and production efficiency is the several times of SMD type packaging technology, production effect
Rate is high.
Claims (5)
1. a kind of SAW resonator of wafer-level package, including sound watch core piece, it is characterised in that：Also include ceramic base
Plate, sound watch core piece is connected electrically on ceramic substrate by inverted structure, and cavity is remained between sound watch core piece and ceramic substrate,
The resin film for encapsulating sound watch core piece is additionally provided with ceramic substrate；Described SAW resonator overall dimensions are not more than
2.0 mm *1.6 mm *0.6mm；Length is not more than 2.0 mm, and width is not more than 1.6 mm, and height is not more than 0.6mm.
2. the SAW resonator of wafer-level package according to claim 1, it is characterised in that：Described sound watch core piece
By between metal ball and ceramic substrate by electrically supporting connection.
3. the SAW resonator of wafer-level package according to claim 1, it is characterised in that：Described sound watch core piece
By electrical between the plated bumps and ceramic substrate that are made up of plated bumps plating copper substrate, plating Ni interlayer and tin plating outer layer
Support connection.
4. the SAW resonator of wafer-level package according to claim 2, it is characterised in that：Described sound watch core piece
Include piezoelectric substrate, piezoelectric substrate plants ball electrode district provided with interdigital transducing grating array, reflecting grating array, input and ball electricity is planted in output
Polar region；Input is planted ball electrode district and is electrically connected with interdigital transducing grating array, and output plants the reflected grating array of ball electrode district and is electrically connected with fork
Refer to transducing grating array.
5. the SAW resonator of wafer-level package according to claim 1, it is characterised in that：Described ceramic substrate
For HTCC ceramic substrates or LTCC ceramic substrates.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621328914.1U CN206323356U (en) | 2016-12-06 | 2016-12-06 | A kind of SAW resonator of wafer-level package |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621328914.1U CN206323356U (en) | 2016-12-06 | 2016-12-06 | A kind of SAW resonator of wafer-level package |
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| CN206323356U true CN206323356U (en) | 2017-07-11 |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106549648A (en) * | 2016-12-06 | 2017-03-29 | 深圳市麦高锐科技有限公司 | A kind of SAW resonator and processing technology of wafer-level package |
| CN109060233A (en) * | 2018-07-27 | 2018-12-21 | 中国科学院声学研究所 | A kind of packaging system of surface acoustic wave sensor |
-
2016
- 2016-12-06 CN CN201621328914.1U patent/CN206323356U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106549648A (en) * | 2016-12-06 | 2017-03-29 | 深圳市麦高锐科技有限公司 | A kind of SAW resonator and processing technology of wafer-level package |
| CN109060233A (en) * | 2018-07-27 | 2018-12-21 | 中国科学院声学研究所 | A kind of packaging system of surface acoustic wave sensor |
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