CN206287000U - The wafer loading attachment of chemical machinery polishing system - Google Patents

Abstract

The utility model provides a kind of wafer loading attachment of chemical machinery polishing system, it is used as a kind of wafer loading attachment that the wafer is loaded into carrier head in chemical mechanical milling tech, the carrier head includes film and retaining ring, the film is contacted with the plate face of wafer, the retaining ring is configured at around the film, and the wafer loading attachment of the chemical machinery polishing system includes：Arrangement part, it includes guiding next door and contact surface, and the guiding next door is in contact with the outer peripheral face of the retaining ring, and is guided to the position of regulation with the retaining ring, the contact surface is in contact with the bottom surface of the retaining ring, and the arrangement part auxiliary is arranged for the position of the carrier head；Rack, its first wafer that will want to be loaded into the carrier head is positioned over supporting surface.Therefore the position for causing wafer to be loaded to mistake due to not arranging the position of wafer and carrier head is prevented in the loading process of wafer, or prevent from causing the edge of wafer to sustain damage or damaged due to the contact with retaining ring, in the state of the spacing that the spacing with wafer and carrier head is remained into regulation, wafer can be inerrably loaded into carrier head.

Description

The wafer loading attachment of chemical machinery polishing system

Technical field

The utility model is related to a kind of wafer loading attachment of chemical machinery polishing system, and a kind of crystalline substance is related in more detail First loading attachment, the wafer loading attachment will can not damaged for devoting the wafer of chemical mechanical milling tech with wafer The form of wound is loaded into carrier head exactly.

Background technology

Cmp (CMP) system be it is a kind of in order to realize global planarization with by the contact for forming circuit (contact)/wiring UF membrane and highly integrated element and improvement of wafer surface roughness for producing etc. and be used for Surface to wafer carries out the device of fine gtinding processing, and the global planarization is removed in semiconductor element manufacturing process It is repeated and shelters the concavo-convex of the wafer surface that is generated while (masking), etching (etching) and Wiring technique etc. and lead Unit (cell) region of cause and the interregional difference in height of peripheral circuits.

It is after 90s that wafer is loaded into carrier head by CMP system, as shown in Korean registered patent gazette 10-1188579 grades, While carrier head is moved, carried out by mechanical friction simultaneously for the abradant surface of wafer in the grinding flat plate of regulation Mechanical lapping and the chemical grinding by lapping liquid.

Now, as shown in figure 1, carrier head 90 will be used to add downwards by base plate 92a in chemical mechanical milling tech The film 92 of piezocrystal unit W is fixed on body 91, and pressure chamber (chamber) 92C is formed between film 92 and body 91, utilizes The air pressure applied by air pressure supply pipe 95a from pressure regulating part 95 can downwards be pressurizeed wafer W.Also, The retaining ring (retainer ring) 93 for preventing wafer W from departing from is provided with around film 92, in chemical mechanical milling tech, Retaining ring 93 can downwards be pressurizeed by the air pressure of guard ring room (retaining chamber) 93C.

Additionally, as shown in figure 1, the loading attachment 1 that wafer W is loaded into carrier head 90 is included, rack 10, its support is brilliant First W；Drive division MH, it causes that vertically 10d is moved rack 10.In other words, as shown in Fig. 2 being placed by wafer W In the state of the middle section A1 of rack 10, if 10d1 is moved to the height 9H of regulation upward by rack 10, The closely located frame 10 of carrier head 90 simultaneously by suck pressure put on center through hole 95X, accordingly, wafer W turn into be close to carrier First 90 film base plate 92a and the state for being loaded.

But, during chemical mechanical milling tech is not carried out, by pressure regulating part 95, the guard ring room of carrier head 90 The pressure of (retainer chamber) 93C can not be adjusted accurately, thus carrier head 90 retaining ring 93 with downwards Heavy state movement.Moreover, it is difficult to be precisely adjusted to tool come the height of the carrier head 90 for moving by mobile drive division M There is the height of the error within 1mm.

Therefore, have a problem in that, even if the height of the rack 10 of loading attachment 1 is set to necessarily, to grasp brilliant The film base plate 92a of first W and the spacing e being positioned between the wafer W of the rack 10 of loading attachment 1 cannot also preserve necessarily, In the case that the spacing e is more larger than the spacing for specifying, generation cannot cause that the wafer W for being positioned over loading attachment 10 is loaded into load The mistake of body first 90.

In order to solve the above problems, it is proposed that the scheme not being disclosed before the filing date of the present application.Such as Fig. 3 a and figure Shown in 3b, the edge of wafer loading attachment 1 with the state that is flexibly supported by spring 30 it is settable have first with load The moving contact portion 20 of the contact of retaining ring 93 of body first 9.Accordingly, compared with the base plate of film 93, the retaining ring 93 that sinks downwards with move Dynamic contact site 20 is contacted, and as carrier head 9 is moved downwards, is pressed by the moving contact portion 20 of retaining ring 93, can be more accurately The film 92 is fixed in gap between the base plate 92a of adjusting film 92 and the wafer W of loading attachment 1, wafer W absorption.

But, if as long as there are some deviations the position of wafer W on the rack 10 for be placed with wafer W, can also produce such as Serious problem down：While carrier head 9 moves 9d downwards, the edge of the bottom surface 93a and wafer W of retaining ring 93 is produced and touched Hit, so that the position of wafer W produces deviation, do not simply fail to correctly load to carrier head 9, can also cause the damage of wafer W.

Therefore, loaded to carrier head 9 from loading attachment 1 with regard to by wafer W, be necessary to exclude the damage of wafer W conscientiously The state for hindering possibility can inerrably be loaded.

Utility model content

The utility model is proposed under above-mentioned technical background, and the purpose of this utility model is, there is provided Yi Zhongjing First loading attachment, the wafer loading attachment can will be used for the wafer for devoting chemical mechanical milling tech in errorless form Carrier head is loaded into exactly.

Additionally, the utility model purpose is to be loaded to carrier head with regard to by wafer, essence ground excludes the side of wafer The collision of edge and carrier head, prevents from being produced in loading technique the breakage of wafer.

In order to reach the purpose, the utility model provides a kind of wafer loading attachment, the wafer loading attachment conduct A kind of wafer loading attachment that the wafer is loaded into carrier head in chemical mechanical milling tech, the carrier head include with Film, the retaining ring that is configured at around the film of the plate face contact of wafer, the wafer loading attachment is characterised by, including： Arrangement part, it includes guiding next door and contact surface, and aids in the position arrangement for the carrier head, the guiding next door Contacted with the outer peripheral face of the retaining ring and guide to assigned position the retaining ring, the bottom surface phase of the contact surface and the retaining ring Contact；Rack, its first wafer that will want to be loaded into the carrier head is positioned over supporting surface.

It is intended that including arrangement part, so as to wafer is loaded to the technique of carrier head, the shield with carrier head Ring outer circumference is in contact, and first the position between retaining ring and arrangement part can be arranged, and thus, is being positioned over rack The relative position of the film base plate of wafer and carrier head is arranged to predetermined position exactly, and wafer can be loaded In carrier head.

Thus, the available favourable effect of the utility model is that can prevent during wafer is loaded due to not having Have wafer is arranged with the position of carrier head, therefore wafer is loaded on the position of mistake, or due to being connect with retaining ring Touching causes wafer edge damage or breakage.

Herein, it is preferable that the arrangement part is flexibly supported by spring.Accordingly, the retaining ring of carrier head relative to During arrangement part is arranged, by the elastic deformation of spring, the power applied from carrier head to arrangement part can be housed, Even if the retaining ring pressing arrangement part of carrier head, the displacement or the generation of deformation being twisted prevented also from the attitude of arrangement part. Additionally, the arrangement part is flexibly supported by spring, thus, arrangement part by the elastic recovering force of spring from It is dynamic to return to original position, so as to successional loading technique can be carried out.

Also, the arrangement part also includes determination part, and the determination part is contacted with the retaining ring, while to the spring The power for moving downwards and being pressed is measured, and also may be configured as being determined by the determination part due to the pressure of the spring Compression deformation amount and the elastic recovering force that produces, and it is sent to the control unit of the carrier head.

Accordingly, during wafer is loaded to carrier head, the bottom surface of the retaining ring of the carrier head position compared with the base plate of film In downside, therefore contacted with arrangement part first from retaining ring and promoted downwards by retaining ring and the movement of mobile arrangement part Distance, can more accurately perceive the spacing of the wafer on the film base plate and support with carrier head, so that using it will be with crystalline substance The spacing of unit and carrier head is remained in the state of regulation spacing so that wafer is loaded into carrier head.

Therefore, available favourable effect is that following mistake is completely eliminated：In the prior art, with carrier head And adjust the spacing between wafer and carrier head on the basis of the absolute position of rack, due to the mistake of spacing being so conditioned Differ from and lead to not for wafer to be loaded into carrier head.

Moreover, because arrangement part is flexibly supported by spring, enter downwards thus according to arrangement part The mobile distance of row determines the power being pressed between retaining ring and arrangement part, therefore in view of with retaining ring downwards Amount of movement and the power that is pressed and positioned at the upside of retaining ring guard ring room air pressure state of making a concerted effort, can be more accurately true The relative position of fixed and carrier head and rack.

Here, the determination part is to by arrangement part, displacement is measured downwards, and from the elasticity of spring Recuperability come determine retaining ring press arrangement part power, so as to can also perceive the power that the retaining ring is pressurizeed to the contact surface Whether the value of regulation is reached.

With this parallel or additionally, the determination part includes load sensor (load cell), and the load sensor is surveyed The power that the fixed arrangement part is pressed downwards, so as to the determination part can also perceive the retaining ring be carried out to the contact surface Whether the power of pressurization reaches the value of regulation.

If in this way, the power that presses downwards arrangement part of retaining ring reaches the value of regulation, by the value of the regulation Carrier head can be learnt and the distance between wafer of supporting surface is positioned over and reach the distance for being suitable for loading, thus, now passed through Applying etc. of suction pressure is obtained in carrier head grasp in the loading technique of film base plate entering to be about to wafer.

Therefore, because wafer is loaded to carrier head in the state of being maintained a certain distance with carrier head all the time, therefore subtract It is few that the mistake generation frequency for grasping wafer cannot be sucked in the loading technique of wafer, and operating reliability can be improved.

In addition, the upper end in the guiding next door can be formed with it is interior to inclined plane.Thus, can swimmingly realize carrier head The technique that retaining ring is connected and contacts with the inner peripheral surface in the guiding next door of arrangement part.

Also, the arrangement part and the rack are formed as one.It not only includes arrangement part and rack Be formed as a composition for main body, and including to arrangement part and rack each other by etc. connection member come fixing phase To the composition of position.Accordingly, in the state of the position of arrangement part and carrier head is arranged, as the crystalline substance for being positioned over rack Unit can be close to the state for obtaining position arrangement of the film base plate of carrier head.

In addition, the arrangement part and the rack are formed as annular state.Accordingly, the contact surface and ring of arrangement part The bottom surface of the retaining ring of form is contacted, and the form that the fringe region of wafer is positioned over supporting surface is carried out into contact support, from And prevent the central portion of wafer from causing the part to turn into the state for tilting due to supporting surface, and can stably realize filling wafer It is loaded in the operation of carrier head.

Especially, the supporting surface is formed at the position lower than the contact surface, thus, in connecing for retaining ring and arrangement part The moment that contacting surface is contacted, or during retaining ring presses downwards arrangement part and arrangement part is moved, can prevent Only retaining ring is interfered with the edge of the wafer for being positioned over supporting surface.

In addition, the arrangement part is set to be moved to horizontal direction.Accordingly, it is located at wafer loading attachment in carrier head Upside in the state of, cause wafer loading attachment arrangement part and carrier head arrange during, even if carrier head is not Moved to horizontal direction, also can moving horizontally come so that the position arrangement of wafer and carrier head, thus exists by arrangement part The operation of arrangement position is more successfully realized in wafer loading technique.

Here, may also include：Support shaft, it is extended in the form of supporting the arrangement part to vertical direction；Elastic bullet Spring, it supports axial horizontal direction movement to horizontally arranged so as to described.Accordingly, arrangement part is overcome due to elastic bullet Spring and produce elastic force while, be capable of achieving the movement to horizontal direction, and recover to original position with desired Property.

Now, it is preferable that the elastomeric spring is around the support shaft circumferentially being spaced in intervals Form be configured with multiple.In this way, elastomeric spring around support shaft circumferentially being spaced 45 degree to 120 degree scopes The form of spacing be configured with multiple, thus support shaft is in the permission that the displacement to horizontal direction is obtained by elastomeric spring, together When with by the elastic recovering force of elastomeric spring cause support shaft recover to regulation position property.

In addition, similarly, may also include：Support shaft, it is in the form of supporting the arrangement part to vertical direction Extension；Support block (holder block), it is carried out with the state separated around the part above with the support shaft Parcel；Support magnet, it is arranged in the support shaft and the support blocks more than any one, so as to the support shaft with Non-contacting state is supported in the inside of the support block.Accordingly, support shaft wants position by the magnetic force with support magnet In a position, but if external force is acted on, then it is capable of achieving along the movement of horizontal direction.

Now, it is preferable that the support magnet is around the support shaft along the circumferential direction being spaced in intervals Form configuration is multiple.

In addition, the axle magnet facing with the support magnet also can be configured with multiple in the support shaft.Also, it is described Support magnet is configured with the axle magnet in the form of repulsion interaction, thus passes through support magnet and axle magnetic with support shaft The magnetic force of iron and be located at the property of original position (position of centre of gravity), if overcoming the external force of magnetic force to work, also obtain to The permission of the movement of horizontal direction.

Therefore, position fixing part part is may also include, if the position fixing part part arrangement part is to the carrier Head is arranged, then constrain the axial horizontal direction movement of the support.Therefore, if arrangement part and support shaft carry out level shifting Move so as to wafer and carrier head are mutually arranged, then the position of support shaft and arrangement part is fixed by position fixing part part Put, so as to during wafer is loaded into carrier head, support can stably be kept as the state fixed to position.

Preferably, the arrangement part is formed as annular state, and to be equably connected on the state of whole surface with retaining ring Move downwards.

In addition, the utility model provides a kind of wafer loading attachment, the wafer loading attachment is as one kind in chemical machine The wafer is loaded into the wafer loading attachment of carrier head, the carrier head includes film and retaining ring, described in tool grinding technics Film is contacted with the surface of wafer, and the retaining ring is configured at around the film, and the wafer loading attachment is characterised by, bag Include：Rack, it is placed with wants the first wafer for being loaded into the carrier head；Drive device, it causes that the support is upper and lower It is mobile；Arrangement part, it is configured at around the support, and the retaining ring is accommodated in the form of contacting, and relative to described Rack is set in form moving up and down；Determination part, it includes load sensor, and the load sensor is in the row The power that row part is moved downwards and be pressed while contact with the retaining ring is measured.

In other words, it is configured with the load sensor that arrangement part is pressed as determination part in the downside of arrangement part The load sensor of (load cell) etc., becomes near if over the distance between carrier head and rack, and arrangement part is by retaining ring Press and move downwards, then can determine the power that arrangement part is pressed by retaining ring.Thus, available favourable effect is, Air pressure size according to guard ring room, if the state of part pressing is arranged with the range degree for specifying as retaining ring, can Enough spacing being positioned between the wafer of rack and the film base plate of carrier head that reliably perceives turn into the state of contact, or turn into Close state is carried out with the degree that can carry wafer, so as to can prevent from producing mistake during wafer is loaded into carrier head By mistake.

According to the utility model, available favourable effect is to be provided with arrangement part, to be loaded by wafer To before the technique of carrier head, the outer circumference with the retaining ring of carrier head is contacted, can first to the position between retaining ring and arrangement part Put and arranged, thus, be positioned over the relative position of the film base plate of the wafer of rack and carrier head exactly to level side To being arranged to predetermined position, wafer can be loaded into carrier head

Thus, the available favourable effect of the utility model is that in the loading process of wafer, can prevent due to crystalline substance The position align-err of unit and carrier head causes wafer to be loaded to the position of mistake, or because the contact with retaining ring causes wafer Edge sustains damage or damaged.

Additionally, the advantage that the utility model is obtained is, the position along horizontal direction of carrier head is caused by spring pair The arrangement part for putting arrangement is flexibly supported, and thus, arrangement part is automatically restored to originally by the elastic recovering force of spring Position, so as to successional loading technique can be carried out.

Also, the available favourable effect of the utility model is that, also including determination part, the determination part is to row The power that the spring is moved downwards and is pressed while row part and the retaining ring are in contact is measured, by carrier head and Vertical interval between wafer is interpreted as retaining ring pressing arrangement part power when reaching the spacing for being suitable for loading reaches rule The time point of fixed value, thus, in the state of the spacing that the spacing with wafer and carrier head is remained into regulation, can be by wafer Carrier head is loaded into like clockwork.

Especially, available effect is that the supporting surface is formed at the position lower than the contact surface, thus in shield The moment that ring is contacted with the contact surface of arrangement part, or press arrangement part downwards in retaining ring and cause that arrangement part is moved During dynamic, can prevent retaining ring from being interfered with the edge of the wafer for being positioned over supporting surface.

Thus, the available favourable effect of the utility model is that following mistake is completely eliminated：In prior art In, in the case of on the basis of the absolute position of carrier head and rack to adjust the spacing between wafer and carrier head, by Lead to not for wafer to be loaded into carrier head in the error of spacing.

Brief description of the drawings

Fig. 1 is the figure of the composition for representing existing wafer loading attachment.

Fig. 2 is the figure of the carrier head and close state of wafer loading attachment for representing Fig. 1.

Fig. 3 a and Fig. 3 b are the figures of the composition of the wafer loading attachment for representing existing other forms.

Fig. 4 is the enlarged drawing of Fig. 3 b ' A' parts.

Fig. 5 is the figure of the composition for representing the wafer loading attachment according to one embodiment of the present utility model.

Fig. 6 is the enlarged drawing of Fig. 5 ' B' parts.

Fig. 7 a are the sectional views along the cutting line VII-VII of Fig. 5.

Fig. 7 b are according to the sectional view with the composition of other corresponding embodiments of cutting line VII-VII of Fig. 5.

Fig. 8 a to Fig. 8 c are the figures of the composition of the operation order for representing the wafer loading attachment according to Fig. 5.

Fig. 9 is to represent the figure constituted according to the determination part of other embodiments.

Specific embodiment

Hereinafter, the wafer referring to the drawings to the chemical machinery polishing system according to one embodiment of the present utility model is loaded Device 100 is described in detail.But, for just being illustrated to the utility model, in order that obtaining main idea of the present utility model Clearly, omit for known function or the specific description of composition.

As illustrated, the wafer loading attachment of the chemical machinery polishing system according to one embodiment of the present utility model 100 include：Arrangement part 110A, its bottom surface for being formed with contact surface 112 and guiding next door 111, the contact surface and retaining ring 93 93a is in contact, and the guiding next door 111 guides retaining ring 93；Rack 110B, it is integratedly operated with arrangement part 110A, and Supporting surface 117 is formed with, the supporting surface 117 is placed with the wafer W for wanting to load to carrier head 90；Spring 130, its elasticity branch Support rack 110B；Support shaft 120, its support spring 130, and extend downwards from horizontal translational components 120, the level Moving parts 120 is set to be moved along horizontal direction；Support block 140, it is formed as around parcel support shaft 120 Form；Multiple elastomeric springs 145, it is arranged between support block 140 and support shaft 120；Position fixing part part 150, its choosing Limit to selecting property moving horizontally for support shaft 120 and arrangement part 110A.

As shown in Figures 5 and 6, the arrangement part 110A is formed as annular state, and is formed with contact surface 112 and guiding Next door 111, the contact surface 112 connects with the bottom surface 93a of the retaining ring 93 of carrier head 90, the guiding next door 111 be formed as from The neighboring of contact surface 112 extends upward, to aid in the arrangement technique with carrier head 90.Guide the diameter in next door 111 Da is formed as more bigger in the range of the second allowable error than the outer diameter D r of retaining ring 93.

It is formed with towards in inner sides of radius to inclined plane 111a, the shield of carrier head 90 in the upper end in guiding next door 111 Ring 93 by guiding next door 111 to be guided, meanwhile, successfully realize the bottom surface 93a and arrangement part 110A of retaining ring 93 The process that contact surface 112 is contacted.Although exemplified with the interior composition for being formed as rectilinear configuration to inclined plane 111a in figure, Be it is interior to inclined plane 111a be formed as tracing pattern and in a variety of forms play a part of guide retaining ring 93.

Contact surface 112 is shaped so as to annular state according to the bottom surface 93a's of retaining ring 93.

The rack 110B is formed as being placed with and wants the wafer W for being loaded into carrier head 90.As illustrated, rack The supporting surface 117 of 110B is formed as annular state and the edge bottom surface of wafer W is supported in the form of contacting.Therefore, with supporting surface shape Situation as flat plate morphology is compared, and to be may be such that and cause wafer W quilts due to that can flow into the foreign matter of flat board central portion The situation that the posture of tilting etc. becomes unstable is minimized.According to other embodiments of the present utility model, supporting surface 117 also may be used Be formed as plectane form.

The arrangement part 110A is formed at the peripheral region A2 of the rounded middle part A1 of rack 110 with annular state.Row Row part 110A is used in the loading technique of wafer W and the retaining ring 93 of carrier head 90 is contacted, therefore is formed as and protects The similar width of the width of ring 93.

In addition, arrangement part 110A may be alternatively formed to circumferentially disconnected from each other three to six ring slicings.For Pair power for being in contact and being pressed with retaining ring 93 carries out dispensing support, is integrally formed as a ring.Arrangement part passes through bullet Spring 130 is flexibly supported, and supports the power being pressed by retaining ring 93, therefore in order to the weight of itself is minimized, Can be formed by the material of the lighter in weight such as aluminium, resin, and be formed in relatively thin form.

As illustrated, rack 110B and arrangement part 110A is combined and is formed as by bolt, interference fit, bonding etc. Integrally, so as to form arrangement part 110.According to other embodiments of the present utility model, as shown in fig. 6, rack 110B and Arrangement part 110A also may be configured as not being combined as a whole, and connected and carried out together by connection member (not shown) It is mobile.Thus, if arrangement part 110A is arranged in carrier head 90 by retaining ring 93, rack 110B also turns into and is arranged in load The state of body first 90, thus rack 110B wafer W turn into can be arranged in carrier head 90 and the state for being loaded.

Especially, under the supporting surface 117 of rack 110B is located at the contact surface 112 being in contact than the bottom surface with retaining ring 93 more Side.Therefore, retaining ring 93 is by guiding next door 111 to be guided and reaching contact surface 112, even if pressing aligning section in carrier head 90 Part 110B and cause arrangement part 110B downwards move during, also can completely exclude the wafer W being positioned on contact surface 117 The possibility contacted with retaining ring 93, therefore, during carrier head 90 is contacted with the wafer W of desired loading, can be basic Property prevent due to retaining ring 93 and wafer W edge produce collision so as to wafer damage situation.

In addition, the outer ledge in the supporting surface 117 for being placed with wafer W is also formed with for so that wafer W is positioned over branch The guide surface 116 in support face 117.Can be formed with the upper end of guide surface 116 it is interior to inclined plane 116a, so as to the edge of wafer W It is smoothly inserted into guide surface 116.Now, the internal diameter Db of guide surface 116 than the diameter Dw of wafer in the second allowable error scope It is interior to be formed in bigger form

Here, the summation of the first allowable error and the second allowable error, it is stipulated that be than the center of gravity of the wafer from desired loading The state completely the same with the center of gravity of carrier head 90 is normally loaded into the maximum eccentric distance (eccentric of carrier head 90 Distance it is) smaller.For example, the summation of the first allowable error and the second allowable error may be designated as 0.2mm to 1.0mm.

The loading part 110 of arrangement part 110A and rack 110B is combined with by the material with high stiffness such as steel Formed, so that the minimizing deformation that the power being pressed when being contacted with carrier head 90 causes.According to different situations, carrier First 90 is not vertically to move, but can vertically obtain moving driving by drive device MH yet, So as to approach carrier head 90 or away from.

Although not shown in figure, can additionally be provided with and the up and down motion of arrangement part 110A is guided Guide member.

The spring 130 is arranged between horizontal translational components 120 and loading part 110, and allows loading part 110 Can vertically move.Therefore, even if being pressed downwards close to the bottom surface of wafer loading attachment 100 and retaining ring 93 in carrier head 90 In the case of the contact surface 112 of pressure arrangement part 110A, loading part 110 also can be obtaining elastic branch by spring 130 The state of support is moved downwards, and stress is not locally concentrated on arrangement part 110A.

Additionally, as be described hereinafter, generally, the retaining ring 93 of carrier head 90 generally is in sink down into and compares film in movement The state of 92 bottom surface lower side, thus, since not controlling guard ring room 92c in addition, just between film bottom surface and wafer W , it is necessary to so that retaining ring 93 is moved to upside untill as the size for being suitable for loading, in order that retaining ring 93 to upside Move, and moved carrier head 90 downwards with the state that the bottom surface 93a and contact surface 112 of retaining ring 93 are in contact.Herein During, the elastic recovering force of the spring 130 by being supported to arrangement part 110 is moved downwards in carrier head 90 During, it is capable of achieving for retaining ring 93 to lift role upward.

Spring 130 is circumferentially matched somebody with somebody relative to the loading part 110 of annular state in the form of the spacing of interval regulation It is equipped with multiple.For example, can be multiple in the form of being spaced 15 degree to 120 degree of spacing be configured with three to 12 springs 130.

The horizontal translational components 120 are formed as can edge to flexibly support the state of loading part 110 by spring 130 The horizontal direction movement in front, rear, left and right direction.Therefore, the central part in horizontal translational components 120 is provided with and prolongs downwards Support shaft 125 long, as shown in Figure 7a, elastomeric spring 145 is around support shaft 125 along the circumferential direction being spaced in intervals Form is configured.

Thus, support shaft 125 is not to obtain position to horizontal direction to fix, but as by elastomeric spring 145 come To resilient support state, thus, if overcoming being worked to the power of horizontal direction for the elastic recovering force of elastomeric spring 145, Then turn into the state that can be moved to horizontal direction.

Here, in order to for equably acting on elastic recovering force around horizontal translational components 120, and for support shaft 125 circumferencial direction is configured with multiple elastomeric springs 145 in the form of being spaced 15 degree to 120 degree of spacing.In figure 7 a, illustrate The composition of elastomeric spring 125 is configured with the form of being spaced 90 degree of spacing.Now, in the joining distal ends with elastomeric spring 125 The inwall of tactile support block 140, is provided with spring base 144, and other ends contact of elastomeric spring 125 support shaft 125 Outer peripheral face be formed as tabular surface 120a so that the position of elastomeric spring 125 fixes firm and stably carry out.

Also, the bottom surface of support shaft 125 is provided with ball (ball) 129 or slides (sliding) part (not shown), ignores The deadweight of support shaft 125 and horizontal translational components 120, can also carry out the movement to horizontal direction.

In addition, exemplified with following composition in Fig. 5 and Fig. 7 a：Support shaft 125 is set to the elasticity by elastomeric spring 145 Recuperability 145F tolerable injury levels moving parts 120 is moved horizontally, but other embodiments according to Fig. 7 b, support shaft 125 levels that may be alternatively provided as the magnetic force 245F tolerable injury levels moving parts 120 by support magnet 245 and axle magnet 225 are moved It is dynamic.In the case of by the moving horizontally of magnetic force 245F tolerable injury levels moving parts 120, the level of horizontal translational components 120 Mobile displacement is limited to below the gap of facing magnet 225,245, thus, may also function as limiter (stopper) effect. Shown in figure by magnet 225,245 facing round about come respectively so that repulsion acts on the and of support shaft 125 The composition of support block 140, but according to other embodiments of the present utility model, support shaft 125 has reaction by magnetic force Magnetic is formed, and magnet 245 is only arranged at the inwall of support block 140, so that support shaft 125 can also be by outside to radius The gravitation of the magnet 245 that direction pulls is supported.

In this way, support shaft 125 is set to be obtained so that moving horizontally displacement by elastomeric spring 145 or magnet 225,245 120d is allowed, thus, during the arrangement part 110A that carrier head 90 is arranged in loading attachment 100, to carrier head 90 In the state of the horizontal direction bias of arrangement part 110A, if carrier head 90 and arrangement part 110A are approached and contacted, Even if not making carrier head 90 be moved to horizontal direction, only vertically move, arrangement part 110A can also be moved to horizontal direction The degree of the dynamic eccentric displacement with carrier head 90, thus can turn into by arrangement part 110A move horizontally with carrier head 90 to The state that horizontal direction is arranged.

The position fixing part part 150 is formed with and (including the support blocks moved together with support shaft of support shaft 120 128) face for connecting, and be set to that 150d can be moved by drive division Mf.Accordingly, if carrier head 90 and arrangement part 110A into It is the state arranged mutually to horizontal direction, then causes that position fixing part part 150 is moved and and support shaft with drive division Mf 120 forms for connecting are operated, so as to constrain support shaft 120 be moved to horizontal direction.

Here, in the case where position fixed component 150 and support shaft 125 directly connect, being formed as and support shaft 125 The curved surface that connects of outer peripheral face, with connect positioned at the support blocks 128 of the downside of support shaft 125 in the case of, be formed as with The surface of the shape that the shape (plane or the face heaved) of the outer peripheral face of support blocks 128 matches.Accordingly, in position fixing part In the state of part 150 and support shaft 125 (including support blocks) connect, moving horizontally for support shaft 1125 is restricted, thus The ordered state of carrier head 90 and arrangement part 110A can stably be kept.

Exemplified with following composition in figure：Position fixing part part 150 is moved to horizontal direction and limits the water of support shaft 125 Translation is dynamic, but the movement to horizontal direction of support shaft 125 can also be constrained by air pressure etc., also may be configured as to Vertical direction is moved and limits moving horizontally for support shaft 125.

In addition, determination part 135 is provided with, its loading part 110 to being combined with arrangement part 110A and rack 110B The 110d displacements that move up and down be measured, and the power that loading part 110 is pressed downwards is measured.Such as Fig. 6 institutes Show, determination part 135 is arranged at the bottom surface of loading part 110, in a non-contact manner to above horizontal translational components 120 Be measured apart from y, the coefficient of elasticity of spring 130 is multiplied by the distance that loading part 110 is moved downwards, accordingly, can to row The power that row part 110A is pressed downwards is measured.

As shown in figure 9, the load sensor 235 of load sensor etc. is arranged at loading part 110 and horizontal translational components Between 120, the power that loading part 110 is pressed downwards also can be directly determined.Now, load sensor 235 is relative to fixation Portion 235b keeps piston (plunger) 235a to be contacted with the state of loading part 110, afterwards, carrier is passed through to loading part 110 First 90 power for being pressed downwards and moving are measured.

In this way, in loading technique, being contacted with arrangement part 110A first in the retaining ring 93 of carrier head 90, and cause arrangement Part 110A be pressed downwards and it is mobile during, propped up come arrangement part 110A by the elastic recovering force of spring 130 Support, the correlation of the elastic recovering force 130 of air pressure and spring according to the guard ring room 93C positioned at the upside of retaining ring 93, If the power being pressed downwards of arrangement part 110A (can be calculated, so that including moving downwards from displacement downwards Distance) reach the setting value of regulation, then can exactly real-time perception carrier head 90 film base plate 92a be positioned over rack Wafer W above 110 very near state is approached.

Figure passed the imperial examinations at the provincial level determination part 135 be arranged at arrangement part 110A bottom surface and as determine until rack The example of the range sensor apart from y above 120 extension 111, but also may be configured as from the 3rd position to aligning section The range sensor that distance change above part 110A is measured.

As described above, in the prior art, being moved with the absolute coordinate of the absolute coordinate of carrier head 90 and rack 10 In the state of dynamic, the spacing between rack 10 and carrier head 90 is adjusted to the inhalable degree for grasping wafer W, with this not Together, in the utility model, than the row that the insertion of retaining ring 93 that the film base plate of carrier head 90 sinks downwards can be moved to horizontal direction The guiding next door 111 of row part 110A, while the arrangement to horizontal direction is carried out, the bottom surface 93a of retaining ring 93 is horizontally arranged In arrangement part 110A contact surface 112 and in the state of contacting, retaining ring 93 is relative to arrangement part 110A additionally downwards It is mobile.Thus, the spacing between carrier head 90 and rack 110 gets over change closely, and arrangement part is promoted downwards by retaining ring 93 110A, so as to determine arrangement part 110A distances for moving downwards by determination part 135,235 or be pressed downwards Whether power 120F, under the authorized pressure state of guard ring room 93C, with the displacement for calculating in advance and learning or reach loading To learn spacing between carrier head 90 and rack 110 whether turn into can grasp wafer W close distance (for example, 0.3mm to 0mm).

In other words, the available favourable effect of the utility model is, in order to load wafer, not rely on rack 110 and the absolute coordinate of carrier head 90, and utilize and interaction between rack 110 and carrier head 90 power and they it Between spacing relation, can perceive exactly whether turn into be best suitable for load wafer spacing distance, even if therefore rack 110 And the position control of carrier head 90 is wrong, also wafer W normally can be inerrably loaded into carrier head 90.

Hereinafter, the operating principle to wafer loading attachment 100 of the present utility model as constructed as above is described in detail.

Step 1：First, the first wafer W of desired loading is positioned on rack 110.Now, the first wafer W is placed In the supporting surface 117 of the annular state of rack 110.

Step 2：Then, as shown in Figure 8 a, enter the rack 110 and carrier head 90 of enforcement to be moved with to the close form of other side The first dynamic moving process.The composition being moved upward exemplified with rack 110 in figure, but also may be configured as, rack 110 Cause that carrier head 90 is moved downwards with state static in the original location, it is also possible to so that rack 110 and carrier head 90 together to Other side moves.In this way, the first moving process 9d proceeds to is contacted with arrangement part by the bottom surface 93a of the retaining ring 93 of carrier head 90 Untill above 110A.

With the 1st moving process is carried out, the retaining ring 93 of carrier head 90 passes through the inclined-plane 111a that dips down of arrangement part 110A The space surrounded with guiding next door 111 is guided and is inserted into, in the process, because being inserted into drawing by retaining ring 93 The power of horizontal direction that is acted on while the space for leading the encirclement of next door 111 causes that horizontal translational components 120 and support shaft 125 enter Row moves horizontally, so carrier head 90 and loading attachment 100 are eliminated to the offset of horizontal direction in allowed band.It is logical The arrangement of arrangement part 110A and retaining ring 93 is crossed, is positioned over the rack 110B's that is integrally formed and moves with arrangement part 110A Wafer W turns into the state arranged to horizontal direction relative to carrier head 90.

As shown in Figure 8 b, even if turning into bottom surface and the aligning section of the retaining ring 93 for causing carrier head 90 by the first moving process The state that the contact surface 112 of part 110A is in contact, also the film base plate 92a as carrier head 90 and wafer W interval fully it is big between State of the gauge from e1.

Now, the air pressure of the guard ring room 93a of the upside of retaining ring 93 is formed at because not entering from pressure regulating part 95 The other control of row is so remain atmospheric pressure, or remain by pressure regulating part 95 authorized pressure to control.Now, it is excellent Selection of land, when wafer W is loaded into carrier head 90, the pressure of guard ring room 93a remain prespecified value (for example, -0.5atm~ Any one value in 0.5atm), so as to the spacing between film base plate 92a and wafer W can accurately be kept.

Step 3：Pass throughStep 2, if realizing the arrangement to horizontal direction of carrier head 90 and wafer W, drive division Mf makes The movement 150d of position fixing part part 150 is obtained, so that physically interference support shaft 125 and horizontal support member 120 are to level side To movement and constrain.

By position fixing part part 150, loading part 110 is restricted to the movement of horizontal direction, by level side To movement be restricted, with carrier head 90 and loading part 110 to horizontal direction arranged in stable condition keep To wafer loading technique is completed.

Step 4：As shown in Figure 8 c, the bottom surface 93a in the retaining ring 93 of carrier head 90 is contacted with above arrangement part 110A Afterwards, more than any one in carrier head 90 and rack 110 it is also carried out the second moving process for continuing to move 9d to other side.The Two moving process also can separately be carried out with the first moving process, but be generally carried out continuously with the first moving process.

In this way, as arrangement part 110A is moved downwards relative to support 110, loading part 110 and to level Being tapered into apart from y untill above moving parts 120, with the pressure of the spring 130 for flexibly supporting loading part 110 The generation of contracting displacement, the power for promoting arrangement part 110A upward is produced by the elastic recovering force of spring 130.

Therefore, according to the pressure value of guard ring room 93a, retaining ring 93a promotes downwards arrangement part 110A, accordingly, arrangement The height of part 110A reaches prespecified setting value y1 from initial value yo.If in this way, determination part 135,235 rows of perceiving The height of row part 110A reaches prespecified setting value y1, or the power of pressing arrangement part 110A reaches prespecified setting Definite value, then the spacing e2 between wafer W and the film base plate 92a of carrier head 90 is below 0.3mm, so as to turn into be suitable for loading brilliant More than any one in the spacing of first W, therefore completion carrier head 90 and rack 110 continue the second shifting to other side's movement 9d Start building skill.

Now, the power of pressing arrangement part 110A reaches prespecified setting value according to the shield being supported to retaining ring 93 Enclose the pressure of room 93C and change, thus the setting value is differently specified according to the pressure of guard ring room 93C.

Step 5：Then, pressure will be sucked to apply to the central inlet hole 95x of carrier head 90, wafer W on rack 110 into It is the state for being close to the film base plate 92a of carrier head 90 and loaded.

The composition illustrated in figure is that inlet hole 95x is formed at the central portion of the film base plate 92a of carrier head 90, but this reality Following carrier head is applied equally to new：The inlet hole 95x for directly applying suction pressure is not formed with film base plate 92a, and It is divided into multiple rooms and adjusts the pressure of divided room, so as to loads wafer W with the form for grasping.

According to the available favourable effect of wafer loading attachment 100 of one embodiment of the present utility model as constructed as above Fruit is to be provided with arrangement part 110A, so as to before by the technique of wafer W devices to carrier head 90, the shield with carrier head 90 The outer circumference contact of ring 93, and first the position between retaining ring 93 and arrangement part 110A can be arranged, thus, placing It is arranged to predetermined to horizontal direction exactly in the relative position of the film base plate 92a of the wafer W and carrier head 90 of rack In the state of position, wafer is loaded into carrier head, therefore prevents in the loading process of wafer due to wafer W and carrier head 90 Position align-err and cause wafer W to be loaded on the position of mistake, or because the contact with retaining ring 93 causes wafer edge to be received To damage or damaged.

Additionally, the available favourable effect of the utility model is that retaining ring 93 contacts arrangement part 110A first so that Displacement y that arrangement part 110A is moved downwards relative to rack 110 or the power 120F for pressing downwards reach in advance During the setting value of regulation, turn into suitable with the spacing between the wafer W and the film base plate 92a of carrier head 90 caused on rack 110 Wafer W is loaded together in the principle of the spacing e2 for loading wafer, thus, positively prevents from being filled from loading attachment 100 by wafer W Mistake is produced during being loaded onto carrier head 90.

The utility model is illustrated in the form of illustrating above by preferred embodiment, but the utility model is not Be defined in specific embodiment as described above, the utility model proposes technological thought category in, specifically in claim Can be modified with variform, changed or improved in described category.

For example, being illustrated with being configured to illustration as follows in the embodiment shown in the drawings：In the position of loading attachment 100 Put in the state of being fixed, carried out while carrier head 90 is moved downwards it is mutually arranged, and with suitable distance degree every In the state of opening, mobile wafer, but it is fixed in the position of carrier head 90 and that loading attachment 100 is moved upward is same Shi Jinhang is mutually arranged, and in the state of being separated with suitable distance degree, it is also possible to mobile wafer.Additionally, also may be configured as Carrier head 90 and loading attachment 100 are moved together.

Label declaration

W：Wafer 100：Wafer loading attachment

110：Loading part 110A：Arrangement part

110B：Rack 112：Contact surface

111：Guiding next door 117：Supporting surface

120：Horizontal translational components 125：Support shaft

130：Spring 140：Support block

145：Elastomeric spring 225：Magnet

130：Spring 140,240：Determination part

Claims (18)

1. a kind of wafer loading attachment, it is loaded to carrier head the wafer in chemical mechanical milling tech as a kind of Wafer loading attachment, the carrier head includes film and retaining ring, and the film is contacted with the plate face of wafer, and the retaining ring is configured at described Around film, the wafer loading attachment is characterised by, including：

Arrangement part, it includes guiding next door and contact surface, and the guiding next door is in contact with the outer peripheral face of the retaining ring, and will The retaining ring is guided to the position of regulation, and the contact surface is in contact with the bottom surface of the retaining ring, and the arrangement part auxiliary is right Arranged in the position of the carrier head；

Rack, its first wafer that will want to be loaded into the carrier head is positioned over supporting surface.

2. wafer loading attachment according to claim 1, it is characterised in that

The arrangement part is flexibly supported by spring.

3. wafer loading attachment according to claim 2, it is characterised in that

Also include determination part, the determination part to while the arrangement part is in contact with the retaining ring spring it is downward The Fang Yidong and power being pressed is measured.

4. wafer loading attachment according to claim 3, it is characterised in that

The determination part determines the compress variation of the spring, and perceives the power that the retaining ring is pressurizeed to the contact surface Whether the value that arrival specifies.

5. wafer loading attachment according to claim 3, it is characterised in that

The determination part includes load sensor, and the load sensor determines the power that the arrangement part is pressed downwards.

6. wafer loading attachment according to claim 1, it is characterised in that

The upper end in the guiding next door is formed with interior to inclined plane.

7. wafer loading attachment according to claim 1, it is characterised in that

The arrangement part and the rack form as one.

8. wafer loading attachment according to claim 7, it is characterised in that

The arrangement part and the rack are formed as annular state.

9. wafer loading attachment according to claim 7, it is characterised in that

The supporting surface supports the fringe region of the wafer in the form of contacting.

10. wafer loading attachment according to claim 7, it is characterised in that

The supporting surface is formed at the position lower than the contact surface.

11. wafer loading attachments as claimed in any of claims 1 to 10, it is characterised in that

The arrangement part is set to be moved to horizontal direction.

12. wafer loading attachments according to claim 11, it is characterised in that also include：

Support shaft, it is extended in the form of supporting the arrangement part along vertical direction；

Elastomeric spring, it is set to elastic recovering force and acts in the horizontal direction, so that the support shaft is moved in the horizontal direction It is dynamic.

13. wafer loading attachments according to claim 12, it is characterised in that

The elastomeric spring along the circumferential direction configures multiple around the support shaft.

14. wafer loading attachments according to claim 11, it is characterised in that also include：

Support shaft, it is extended in the form of supporting the arrangement part along vertical direction；

Support block, it is wrapped in around the part above of the support shaft with the state being spaced；

Support magnet, it is arranged in the support shaft and the support block more than any one, so as to the support shaft with Non-contacting state is supported in the inside of the support block.

15. wafer loading attachments according to claim 14, it is characterised in that

The support magnet along the circumferential direction configures multiple around the support shaft in the form of being spaced in intervals.

16. wafer loading attachments according to claim 14, it is characterised in that

Multiple axle magnet facing with the support magnet are also configured with the support shaft.

17. wafer loading attachments according to claim 16, it is characterised in that

The support magnet and the axle magnet are configured in the form of repulsion interaction.

18. wafer loading attachments according to claim 11, it is characterised in that

Also include position fixing part part, if the position fixing part part arrangement part is arranged the carrier head, Then constrain the axial horizontal direction movement of the support.