CN208889637U - Substrate board treatment - Google Patents
Substrate board treatment Download PDFInfo
- Publication number
- CN208889637U CN208889637U CN201821423838.1U CN201821423838U CN208889637U CN 208889637 U CN208889637 U CN 208889637U CN 201821423838 U CN201821423838 U CN 201821423838U CN 208889637 U CN208889637 U CN 208889637U
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- China
- Prior art keywords
- substrate
- snap ring
- board treatment
- placing component
- lifting
- Prior art date
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- 239000000758 substrate Substances 0.000 title claims abstract description 244
- 238000011282 treatment Methods 0.000 title claims abstract description 42
- 230000000694 effects Effects 0.000 abstract description 17
- 238000000034 method Methods 0.000 description 16
- 239000000126 substance Substances 0.000 description 8
- 238000000227 grinding Methods 0.000 description 6
- 230000000630 rising effect Effects 0.000 description 6
- 238000003701 mechanical milling Methods 0.000 description 5
- 238000010276 construction Methods 0.000 description 3
- 238000013461 design Methods 0.000 description 3
- 239000007788 liquid Substances 0.000 description 3
- 238000012545 processing Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 230000001105 regulatory effect Effects 0.000 description 2
- 230000003746 surface roughness Effects 0.000 description 2
- 238000013459 approach Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 230000006735 deficit Effects 0.000 description 1
- 230000009977 dual effect Effects 0.000 description 1
- 235000013399 edible fruits Nutrition 0.000 description 1
- 229920001971 elastomer Polymers 0.000 description 1
- 239000000806 elastomer Substances 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 238000005498 polishing Methods 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/34—Accessories
- B24B37/345—Feeding, loading or unloading work specially adapted to lapping
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model relates to a kind of substrate board treatment, substrate board treatment includes: carrier head comprising the film of mounted board and the snap ring being configured at around film；Rack comprising place the snap ring placing component of snap ring and be formed in snap ring placing component and place the substrate placement section of substrate, for substrate to be loaded into carrier head；Centering unit, makes snap ring placing component be moved to defined aligned position relative to carrier head, it is possible thereby to obtain the advantageous effects for carrying out stable loading to substrate in the state of the damage of not substrate.
Description
Technical field
The utility model relates to a kind of substrate board treatments, in more detail, are related to a kind of substrate board treatment, prevent
Substrate damage during loading substrate, and stability and reliability can be improved.
Background technique
Chemical mechanical grinding (CMP) system is a kind of for carrying out the device of precise finiss processing, mesh to wafer surface
Be in order to realize as large area planarization with caused by the contact/wiring UF membrane and highly integrated element that are used to form circuit
The raising etc. of wafer surface roughness (surface roughness), large area planarization are removals by semiconductor element system
Executes masking during making repeatedly, etch and the bumps of wafer surface that with Wiring technology etc. whiles generate caused by unit area
Difference in height between peripheral circuit area.
Chemical machinery polishing system, after wafer is loaded into carrier head 90, such as Korean registered patent gazette 10-
It is the same disclosed in No. 1188579 etc., so that carrier head is same in abradant surface of the defined grinding flat plate to wafer while mobile
Mechanical lapping of the Shi Jinhang using mechanical friction and the chemical grinding using lapping liquid.
At this point, as shown in Figure 1, carrier head 90 will be used to add downwards by bottom plate 92a in chemical mechanical milling tech
The film 92 of piezocrystal member W is fixed on body part 91, and pressure chamber (chamber) 92C is formed between film 92 and body part 91, benefit
Wafer W can be pressurizeed downwards with from pressure regulating part 95 by the air pressure that air pressure supply pipe 95a applies.Also,
The snap ring (retainer ring) 93 for preventing wafer W to be detached from is provided with around film 92, in chemical mechanical milling tech,
Snap ring 93 can be pressurizeed downwards by the air pressure of snap ring chamber (retaining chamber) 93C.
In addition, being used to put as shown in Figure 1, include: rack 10 by the wafer W loading attachment 1 for being loaded into carrier head 90
Set wafer W；Driving portion MH, making rack 10, vertically 10d is mobile.In other words, as shown in Fig. 2, by wafer W
It is placed in the state of the middle section A1 of rack 10, if by height 9H as defined in rack 10 upwards 10d1 movement,
Then the closely located frame 10 of carrier head 90 and will sucking pressure be applied to center through hole 95X, accordingly, wafer W become to be tightly attached to
The state that the form of the film bottom plate 92a of carrier head 90 is loaded.
But during not carrying out chemical mechanical milling tech, pass through pressure regulating part 95, the snap ring chamber of carrier head 90
The pressure of (retainer chamber) 93C cannot be adjusted accurately, therefore the snap ring 93 of carrier head 90 is with low downwards
Vertical state is mobile.Moreover, it is difficult to be precisely adjusted to by the height that mobile driving portion M carries out mobile carrier head 90
Height with the error within 1mm.
Therefore, it has a problem in that, even if the height of the rack 10 of loading attachment 1 is set as centainly, grasping brilliant
The film bottom plate 92a of first W and be placed in loading attachment 1 rack 10 wafer W between spacing e also cannot keep centainly,
In the case that the spacing e is bigger than defined spacing, generation can not make the wafer W for being placed in loading attachment 10 be loaded into carrier
First 90 mistake.
To solve the above-mentioned problems, as shown in figure 3, proposing a kind of following scheme in the prior art: loading and fill in wafer
Set 1 edge be provided with the state flexibly supported by spring 30 contacted first with the snap ring 93 of carrier head 9 it is movable
Contact portion 20.Accordingly, compared with the bottom plate of film 93, the snap ring 93 to hang low downwards is contacted with movable contact 20, with carrier
First 9 move downwards, by snap ring 93 press movable contact 20 while can more accurately the bottom plate 92a of adjusting film 92 and dress
The gap between the wafer W for setting 1 is carried, wafer W is adsorbed the bottom plate 92a for being fixed on film 92.
But relative to the position of the rack of carrier head 9 10 (center aligned position) as long as having some deviations, such as Fig. 4
It is shown, it can also lead to the problem of following serious: while carrier head 9 moves 9d downwards, the bottom surface 93a and wafer of snap ring 93
The edge of W generates collision, so that the position of wafer W is deviateed, does not simply fail to that wafer W is correctly loaded into carrier head 9, also
It can cause the damage of wafer W.
As a result, recently for loading wafer W from loading attachment 1 to carrier head 9, carrying out a variety of for exclude
The research that the state of the damage possibility of wafer W is inerrably loaded, but still have some deficits at present, need the exploitation to this.
Utility model content
The utility model aim is, provides a kind of substrate board treatment, can be in the damage and breakage of not substrate
In the case where steadily substrate is loaded.
In particular, the purpose of this utility model is that, in substrate to be loaded to the technique to carrier head, prevent by snap ring and base
The damage and breakage of substrate caused by the contact of plate, and improve the loading stability of substrate.
In addition, the purpose of this utility model is that, it can quickly and steadily execute the aligned in position of substrate, and can be with
Inerrably load substrate.
In addition, the purpose of this utility model is that, the power applied to substrate can be weakened in the loading technique of substrate, and
And substrate damage can be made to minimize.
In addition, the purpose of this utility model is that, stability and reliability are improved, is accurately controlled after loading substrate next
Technique.
In order to reach the purpose of this utility model, the utility model provides a kind of substrate board treatment comprising: it carries
Body head comprising the film of mounted board and the snap ring being configured at around film；Rack comprising place the snap ring placement section of snap ring
It part and is formed in snap ring placing component and places the substrate placement section of substrate, for substrate to be loaded into carrier head；Centering unit
(centering unit), makes snap ring placing component be moved to defined aligned position relative to carrier head.
As described above, according to the utility model, it is available in the case where the damage of not substrate and breakage steadily
The advantageous effects that substrate is loaded.
In particular, according to the available following advantageous effect of the utility model: in the technique that substrate is loaded into carrier head
In prevent as snap ring and the damage of substrate caused by the contact of substrate and breakage, and improve the loading stability of substrate.
In addition, according to the available following advantageous effects of the utility model: can quickly and steadily execute substrate
Aligned in position, and errorless accurately load substrate.
In addition, according to the available following advantageous effect of the utility model: can weaken in the loading technique of substrate
The power (power of pressing substrate) that substrate is applied, and make the damage of the substrate due to caused by the increase of the power applied to substrate
It minimizes.
In addition, according to the available following advantageous effects of the utility model: improving stability and reliability, accurately control
Next technique after loading substrate.
Detailed description of the invention
Fig. 1 is the figure for indicating the composition of existing wafer loading attachment,
Fig. 2 be indicate the carrier head of Fig. 1 close to the figure of the state of wafer,
Fig. 3 and Fig. 4 is the figure for indicating the composition of wafer loading attachment of existing other forms,
Fig. 5 is the side view for illustrating substrate board treatment according to the present utility model,
Fig. 6 is the perspective view for illustrating the rack as substrate board treatment according to the present utility model,
Fig. 7 is the plan view for illustrating the rack as substrate board treatment according to the present utility model,
Fig. 8 and Fig. 9 is the figure for illustrating the loading substrate process as substrate board treatment according to the present utility model,
Figure 10 to Figure 12 is the figure for illustrating the constraint element as substrate board treatment according to the present utility model,
Figure 13 is the figure for illustrating the mobile unit as substrate board treatment according to the present utility model.
Specific embodiment
Hereinafter, the preferred embodiment of the utility model is described in detail referring to attached drawing, but the utility model not by
The limitation or restriction of embodiment.As reference, label identical in the present specification actually refers to identical element, such
It provides that the content for being recorded in other accompanying drawings can be quoted down to be illustrated, and can be omitted and be judged as to the skilled practitioner
For obvious content or duplicate content.
Fig. 5 is the side view for illustrating substrate board treatment according to the present utility model, and Fig. 6 is for illustrating as root
According to the perspective view of the rack of the substrate board treatment of the utility model, Fig. 7 is for illustrating as according to the present utility model
The plan view of the rack of substrate board treatment.In addition, Fig. 8 and Fig. 9 are for illustrating as substrate according to the present utility model
The figure of the loading substrate process of processing unit, Figure 10 to Figure 12 are for illustrating to fill as processing substrate according to the present utility model
The figure for the constraint element set, Figure 13 are for illustrating the mobile unit as substrate board treatment according to the present utility model
Figure.
Referring to Fig. 5 to Figure 13, substrate board treatment according to the present utility model includes: carrier head 100 comprising carries base
The film 192 of plate 10 and the snap ring 193 being configured at around film 192；Rack 200 comprising place the snap ring placement section of snap ring 193
It part 210 and is formed in snap ring placing component 210 and places the substrate placement section 220 of substrate 10, for substrate 10 to be loaded into load
Body head 100；Feel relieved unit (centering unit) 250, is moved to snap ring placing component 210 relative to carrier head 100
Defined aligned position.
It is intended that in the case where the damage and breakage of no substrate 10 by substrate 10 from rack 200 steadily
It loads to carrier head 100.
In other words, during the substrate for being placed in rack is loaded into carrier head, relative to putting for carrier head
The position (center aligned position) of frame is set as long as there are some deviations, also may create the problem that the snap ring of carrier head and substrate produce
The position of substrate is deviateed while raw collision, is not simply failed to that substrate is correctly loaded into carrier head, can also be caused substrate
Damage and breakage.
In particular, having a problem in that the substrate placement section for placing substrate in rack and the snap ring for placing snap ring are placed
It portion can be with being mutually shifted in isolated construction, even if making snap ring placement section relative to carrier head aligned position, if phase
The position words devious of the substrate placement section of carrier head will be generated with the collision of substrate and snap ring in loading technique.
But the utility model places the base of substrate 10 by being formed on the snap ring placing component 210 for placing snap ring 193
Plate placement section 220, available following advantageous effects: while being aligned snap ring placing component 210 relative to carrier head 100
The alignment that can be realized simultaneously the substrate 10 relative to carrier head 100, thus prevents the carrier head in the loading technique of substrate 10
The collision of 100 (snap rings) and substrate.
In addition, the available following advantageous effect of the utility model: until being maintained before substrate 10 is carried to film 192
The aligned condition of substrate 10 relative to carrier head 100 simultaneously can make the shaking of substrate 10 minimize, and thus improve substrate 10
Loading stability.
In addition, the available following advantageous effect of the utility model: and the snap ring placement section that carrier head 100 contacts at first
Part 210 can be aligned substrate placement section 220 while alignment relative to carrier head 100, thereby simplify relative to carrier head
The aligned process of 100 rack 200 and shorten alignment needed for time.
As reference, when loading substrate 10, as rack 200 is moved upward from the lower part of carrier head 100, carrier
First 100 snap ring 193 can be contacted first with the upper surface of rack 200, and the upper surface of rack 200 (the upper surface of substrate) and carrier
If the interval between the film 192 of head approaches more than certain, substrate 10 is loaded to carrier head 100.
Carrier head 100 is after the loading that rack 200 obtains substrate 10, to being provided on grinding flat plate (not shown)
It pressurizes substrate 10 thereby executing chemical mechanical milling tech in the state of supply lapping liquid above grinding pad (not shown),
Terminate metacoxal plate 10 using the chemical mechanical milling tech of grinding pad and lapping liquid and is transferred to cleaning device.
Carrier head 100 can be set as various structures according to desired condition and design pattern.For example, carrier head 100 includes:
Body part 191 is arranged in the form of rotatable；Film 192 is set to the bottom surface of body part 191；And snap ring 193, with
The form being configured at around film 192 is incorporated into the edge part of body part 191 and prevents the disengaging of substrate 10.
Film 192 can be set as various structures according to desired condition and design pattern.For example, can be formed in film 192 multiple
Trap (flap) (for example, trap of annular state), and can be formed between body part 191 and film 192 by multiple traps
Along the divided multiple pressure chamber 192C of the radial direction of body part 192.
The pressure sensor of measurement pressure can be separately provided in each pressure chamber 192C.Each pressure chamber
The pressure of 192C can individually be adjusted by the control of pressure control portion 195, and by each pressure chamber
The pressure of 192C is adjusted, so as to individually adjust the pressure of pressurization substrate 10.
In the central part pressure chamber that the central part of carrier head 100 can be formed through the opening of film 192 and be formed through
195X.Central part pressure chamber 195X is directly connected to substrate 10 and substrate 10 is tightly attached to carrier head under the action of sucking pressure
Thus 100 film 192 can be loaded substrate 10.
Rack 200 is set as to go up and down along up and down direction, the upper surface of rack 200 be placed with for load (or
Unloading) substrate 10.
More specifically, rack 200 includes: snap ring placing component 210, is used to place snap ring 193；It is placed with substrate
Portion 220 is formed in snap ring placing component 210 and for placing substrate 10.
Snap ring placing component 210 is formed as that the structure of the multiplicity of snap ring 193 can be placed, and the utility model is not put by snap ring
Set the shape of component 210 and defining or limiting for structure.
For example, snap ring placing component 210 is being spaced apart along the circumferencial direction of snap ring 193 (for example, with 120 degree of interval
To separate) position can partially support the bottom surface of snap ring 193.Depending on the situation, snap ring placing component can also be along
The circumferencial direction of snap ring forms annular and can continuously support the bottom surface of snap ring.
Substrate placement section 220 and snap ring placing component 210 are formed as one and the bottom surface of supporting substrate 10.
Preferably, substrate placement section 220 is configured at the inside of snap ring 193, and snap ring 193 is placed in than substrate placement section 220
The snap ring placing component 210 of high position.
For example, substrate placement section 220 is formed in the upper surface of snap ring placing component 210 in the form of protrusion.Hereinafter, will be with base
Plate placement section 220 is illustrated for being generally formed into conical form.Depending on the situation, substrate placement section is formed as more
Face prism form or other different forms, and the form of substrate placement section and structure can be according to required condition and design samples
Formula carries out various deformation.
Preferably, multiple substrate placement sections 220 are set in form spaced apart along the circumferencial direction of substrate, by more
A substrate placement section 220 places substrate, the advantageous effects of the available shelf-stability for improving substrate.According to circumstances not
Together, substrate placement section can also be formed as into annular along the circumferencial direction of substrate.
In addition, substrate board treatment includes: that substrate places component 230, being set as can be relative to snap ring placing component 210
It moves up and down and makes substrate from the rising of 220 selectivity of substrate placement section；With lifting part 240, selectively pacify substrate
Put the lifting of component 230.
Substrate placement component 230 is formed as the rising of the substrate that can make to be placed in substrate placement section 220 selectivity
Various structures.
Match for example, substrate places component 230 and is placed in the bottom surface of the substrate of substrate placement section 220 in form spaced apart
Be placed in the upper surface of snap ring placing component 210, with the rising of lifting part 240 along the circumferencial direction of substrate in (example spaced apart
Such as, separated with 120 degree of intervals) position part support is carried out to the bottom surface of substrate.Depending on the situation, substrate placement department
Part can also be formed as annular along the circumferencial direction of substrate, so as to the bottom surface of continuously supporting substrate.
As reference, it is illustrated although being placed for component 230 is formed as plate form by substrate in the present invention,
But substrate can also be placed by component according to different situations and be formed as rodlike or rod-shaped.
Lifting part 240 is set as going up and down substrate placement component 230 selectively, and snap ring placing component 210 is set as
It is selectively gone up and down by lifting part 240.
For example, it includes by snap ring placing component 210 and from the bottom surface of snap ring placing component 210 that substrate, which places component 230,
The lifting guide portion 232 of exposing, lifting part 240 are set as going up and down lifting guide portion 232 selectively.
For this purpose, being formed through through hole (not shown) along up and down direction in snap ring placing component 210, guide portion is gone up and down
232 are incorporated into the bottom surface that substrate places component 230 by through portion.
More specifically, lifting part 240 includes: lifting shaft 242, and support is installed on determining for the bottom surface of rack 200
Heart unit 250 and be arranged with respect to centering unit 250 can move up and down；With axis extension 244, it is connected to lifting shaft 242
And with lifting shaft 242 move up and down selectively with lifting guide portion 232 contact and make go up and down guide portion 232 lifting.Example
Such as, axis extension 244 is formed as protruding from the outer peripheral surface of lifting shaft 242 in the form that can be contacted with lifting guide portion 232
Form.
By the structure, by the rising of lifting shaft 242 so that interval between carrier head 100 and rack 200
Close to more than certain when (snap ring is contacted with snap ring placing component), the rising of snap ring placing component 210 is limited, and is put in snap ring
It sets lifting shaft 242 under the confined state of rising of component 210 and is directed to snap ring placing component 210 (centering unit) to upper direction
It is mobile.
Meanwhile during snap ring 193 and snap ring placing component 210 contact, snap ring placing component 210 is relative to carrier
Alignment of the substrate 10 relative to carrier head 100 is carried out while first 100 alignment.
Later, mobile to upper direction for snap ring placing component 210 with lifting shaft 242, it is extended from lifting shaft 242
Axis extension 244 can be contacted with the extended lifting guide portion 232 of component 230 is placed from substrate, in axis extension 244 and lifting
In the state that guide portion 232 contacts, as lifting shaft 242 is mobile to upper direction, be placed in the substrate of substrate placement section 220 with
The state and substrate for being placed in substrate placement component 230 place component 230 and rise together and be tightly attached to carrier head 100 (film).
As described above, the utility model passes through the snap ring placing component 210 that will place snap ring 193 and places the base of substrate 10
Plate placement section 220 is formed as one, so that base may be implemented while alignment relative to carrier head 100 in snap ring placing component 210
Alignment of the plate 10 relative to carrier head 100, it is hereby achieved that prevent in the loading technique of substrate 10 carrier head 100 (snap ring) and
The advantageous effects that substrate 10 collides.
In addition, the available following advantageous effects of the utility model: until maintaining base before substrate 10 is carried to film 192
Plate 10 relative to carrier head 100 aligned condition and the shaking of substrate 10 can be made to minimize, thus improve substrate 10 dress
Carry stability.
In addition, the available following advantageous effects of the utility model: and the snap ring placing component that carrier head 100 contacts at first
210 can be aligned substrate placement section 220 while alignment relative to carrier head 100, thereby simplify relative to load
The aligned process of the rack 200 of body head 100 and shorten alignment needed for time.
Preferably, relative to the substrate placement component 230 of snap ring placing component 210 up and down through the first elastic portion
Part 246 is flexibly supported.
As the first elastomeric element 246, common spring members can be used.Other bullets can be used according to different situations
Property body replaces spring members, or also can use air pressure or hydraulic constitute the first elastomeric element.
As described above, passing through so that the substrate relative to snap ring placing component 210, which places component 230, moves up and down elasticity
Ground is supported, and when film 192 is in contact with substrate, substrate places component 230 can be square to the lower part relative to snap ring placing component 210
To flexibly being moved, this makes it possible to obtain following advantageous effects: can make to be applied to substrate 10 as film 192 is contacted with substrate 10
Power decaying, and the damage and minimizing deformation of substrate 10 caused by the impact force that is applied to substrate 10 will be passed through.
In addition, relative to centering unit 250 (snap ring placing component) lifting shaft 242 up and down through second elasticity
Component 234 is flexibly supported.
Common spring members can be used as the second elastomeric element 234.Other can be used not according to different situations
With elastomer replace spring members, or also can use air pressure or hydraulic constitute the second elastomeric element.
As described above, passing through the branch for moving up and down to obtain elasticity so that the lifting shaft 242 relative to centering unit 250
Support, when film 192 is in contact with substrate, lifting shaft 242 can direction be elastic to the lower part for centering unit 250 (snap ring placing component)
Ground is moved, it is hereby achieved that following advantageous effects: as film 192 can make to be applied to substrate 10 with the contact of substrate 10
Power decaying, and can be by the damage and minimizing deformation by being applied to substrate caused by the impact force of substrate.
In particular, the utility model in the loading technique of substrate by be applied to the power (power of pressing substrate) of substrate
Dual decaying is obtained by the first elastomeric element 246 and the second elastomeric element 234, available following advantageous effects: can be subtracted
The weak power for being applied to substrate 10, and by the damage and minimizing deformation of substrate 10.
The setting of centering unit 250 be in order to enable snap ring placing component 210 is moved to relative to carrier head 100 as defined in
Aligned position.
Here, so-called centering unit 250 makes snap ring placing component 210 be moved to alignment bit relative to carrier head 100
It sets, is defined as adjusting the position of snap ring placing component 210, center and snap ring placing component 210 so as to carrier head 100
Center is consistent.
At this point, the aligned in position of the snap ring placing component 210 relative to carrier head 100 can be carried out by following form:
So that snap ring placing component 210 moves horizontally the snap ring placing component 210 relative to carrier head 100 relative to carrier head 100
Eccentric distance (distance of dislocation configuration) degree.
In particular, centering unit 250 by make before substrate 10 is loaded into carrier head 100 rack 200 relative to
Carrier head 100 is aligned, available following advantageous effect: preventing connecing for snap ring 193 and substrate 10 in advance in loading technique
Touch and prevent the damage and breakage of substrate 10.
More specifically, centering unit 250 includes: the first centering block (centering block) 252, is incorporated into lifting
Axis 242；With the second centering block 254, it is incorporated into snap ring placing component 210 and is horizontally moved relative to the first centering block 252.
First centering block 252 and the second centering block 254 are in combination with the various structures to be capable of relative level movement, and this is practical
It is novel not limited or restriction by the integrated structure of the first centering block 252 and the second centering block 254.
Preferably, the first centering block 252 and the second centering block 254, which release external force, (makes the second centering block 254 relative to the first centering block
252 mobile power) when, the first centering block 252 and the second centering block are made by the mutual magnetic force of the first centering block 252 and the second centering block 254
254 center reverts to initial position aligned with each other.It can also be by the first centering block and the second centering block knot according to different situations
It is combined into universal joint (gimbal) structure.
In addition, substrate board treatment includes constraint element 260, constraint element 260 is used on rack 200 to substrate 10
Carry out the constraint of selectivity.
The setting of constraint element 260 is the substrate 10 in order to steadily maintain to be placed in rack 200 (substrate placement section)
Placement status.
Constraint element 260 can be formed as that substrate 10 can be carried out the various structures of selective constraint.For example, constraint is single
Member 260 includes: fixture 262, can be installed on card along the form that the direction in surrounding face close and far from substrate 10 is moved
Ring placing component 210；Spring members 264 are used to be elastically supported the shifting of the fixture 262 relative to snap ring placing component 210
It is dynamic.
Fixture 262 along the direction (for example, radial direction of substrate) in surrounding face close and far from substrate 10 can move
Dynamic form is installed on snap ring placement section 210, when surrounding's face contact of fixture 262 and substrate 10 to the placement status of substrate 10 into
Row constraint.
For example, 3 fixtures 262 are arranged in form spaced apart along the circumferencial direction of substrate 10.Depending on the situation,
Constraint element can be made of 2 or more fixtures, or may also comprise 4 or more fixtures.
Spring members 264 flexibly realize the movement of the fixture 262 relative to snap ring placing component 210 and support fixture
262.For example, common helical spring (coi l spring) can be used as spring members 264.
In addition, substrate board treatment includes unlocking unit 270, it is used to unlock (unlock) snap ring 193 close to snap ring
Constraint of the fixture 262 to substrate when placing component 210.
Automatic unlocking presss from both sides when unlocking unit 270 is set as the snap ring 193 of carrier head 100 close to snap ring placing component 210
Has the constraint of 262 pairs of substrates 10.
For example, unlocking unit 270 includes: upper angled guide portion 272, it is formed in the top of fixture 262；Unlocking part
274, snap ring placing component 210 is installed in the form of moveable along up and down direction, along top when contacting with snap ring 193
Inclined lead part 272 is moved, and keeps fixture 262 mobile to the direction far from substrate.
By the construction, when the upper contact of snap ring 193 and unlocking part 274, unlocking part 274 by snap ring 193 plus
It presses and direction is mobile to the lower part.The lower end of the unlocking part 274 while direction to the lower part is mobile of unlocking part 274 is along top
Inclined lead part 272 is moved, so that moving up and down for unlocking part 274 can be converted to moving left and right for fixture 262, and
And moved by fixture 262 to the direction far from substrate, thus constraint of the Unlocking clamp 262 to substrate.
Preferably, unlocking unit 270 includes unlock spring members 276, and unlock spring members 276 are for being elastically supported solution
Lock assembly 274 moves up and down.Made when the contact of snap ring and unlocking part 274 releases by unlocking the elastic force of spring members 276
Fixture 262 is again restored to the position of constraint substrate.
Moreover, substrate board treatment includes mobile unit 280, before substrate 10 is placed on substrate placement section 220, move
Moving cell 280 keeps fixture 262 mobile to the direction far from substrate 10.
Fixture 262 to it is mobile close to the direction of substrate 10 in the state of be difficult to substrate 10 being placed in substrate placement section
220.For this purpose, the setting of mobile unit 280 is to determine fixture 262 before substrate 10 is placed on substrate placement section 220
Positioned at unlocked position.Here, the unlocked position of so-called fixture 262, be defined as fixture 262 with separated around substrate 10
The state that mode configures.
For example, mobile unit 280 includes: lower tilt guide portion 282, it is formed in the lower part of fixture 262；Moving parts
284, it is set to the lower part of fixture 262 in the form that can be moved along up and down direction, inclines when being contacted with fixture 262 along lower part
Oblique guide portion 282 is moved, and keeps fixture 262 mobile to the direction far from substrate.
By the construction, moving parts 284 is relative to fixture before substrate 10 is placed on substrate placement section 220
262 is mobile to upper direction.Moving parts 284 is inclined the upper end of moving parts 284 along lower part while direction is mobile to the lower part
Oblique guide portion 282 is moved, and accordingly, moving up and down for moving parts 284 can be converted to moving left and right for fixture 262, and
And fixture 262 is located at the unlocked position separated with substrate 10.
Substrate 10 is placed on after substrate placement section 220, and rack 200 rises to certain height, thus fixture 262
It is moved again to the constrained (position being in contact with substrate) of constraint substrate 10.
Preferably, mobile unit 280 includes mobile spring component 286, for being elastically supported the upper and lower of moving parts 284
It is mobile.The side to the lower part of moving parts 284 is made by the elastic force of mobile spring component 286 when rack 200 rises to certain altitude
To recurrence.
As described above, although the preferred embodiment referring to the utility model is illustrated, but it is understood that, such as
Fruit is the skilled practitioner of correlative technology field, the thought and neck of the utility model recorded in not departing from claims
The utility model can be modified and be changed in the form of various in the range of domain.
Label declaration
10: substrate 100: carrier head
200: rack 210: snap ring placing component
220: substrate placement section 230: substrate places component
232: lifting 234: the second elastomeric element of guide portion
240: lifting part 242: lifting shaft
244: 246: the first elastomeric element of axis extension
250: centering 252: the first centering block of unit
254: the second centering blocks 260: constraint element
262: fixture 264: spring members
270: unlocking unit 272: upper angled guide portion
274: unlocking part 276: unlock spring members
280: mobile unit 282: lower tilt guide portion
284: moving parts 286: mobile spring component
Claims (19)
1. a kind of substrate board treatment characterized by comprising
Carrier head comprising the film of mounted board and the snap ring being configured at around the film；
Rack comprising place the snap ring placing component of the snap ring and be formed in snap ring placing component and place the substrate
Substrate placement section, for the substrate to be loaded into the carrier head；
Centering unit, makes the snap ring placing component be moved to defined aligned position relative to the carrier head.
2. substrate board treatment according to claim 1, which is characterized in that
The substrate placement section is configured at the inside of the snap ring,
And the snap ring is placed on the snap ring placing component of the position higher than the substrate placement section.
3. substrate board treatment according to claim 2, which is characterized in that
Along the circumferencial direction of the substrate, multiple substrate placement sections are set in a spaced apart manner.
4. substrate board treatment according to claim 1 characterized by comprising
Substrate places component, and being arranged with respect to the snap ring placing component can move up and down, and selectively make
The substrate rises from the substrate placement section；
Lifting part, the lifting for being used to that the substrate to be made to place component selectivity.
5. substrate board treatment according to claim 4 characterized by comprising
First elastomeric element is used to be elastically supported and places component relative to the substrate of the snap ring placing component
Lower movement.
6. substrate board treatment according to claim 4, which is characterized in that
It includes lifting guide portion that the substrate, which places component, and lifting guide portion is by the snap ring placing component and from the snap ring
The bottom surface of placing component is exposed,
The lifting part makes the lifting guide portion carry out selective lifting.
7. substrate board treatment according to claim 6, which is characterized in that the lifting part includes:
Lifting shaft is used to support the centering unit, and is arranged with respect to the centering unit and can move up and down；
Axis extension, and the lifting axis connection, and with the lifting shaft move up and down selectively with the lifting
Guide portion contacts and goes up and down the lifting guide portion.
8. substrate board treatment according to claim 7, which is characterized in that
One lifting of the snap ring placing component and the lifting shaft,
When the snap ring placing component and the snap ring contact, the lifting shaft is moved relative to the snap ring placing component
And the substrate is made to place component lifting.
9. substrate board treatment according to claim 7 characterized by comprising
Second elastomeric element is flexibly supported the moving up and down for the lifting shaft relative to the centering unit.
10. substrate board treatment according to claim 7, which is characterized in that the centering unit includes:
First centering block is incorporated into the lifting shaft；
Second centering block is incorporated into the snap ring placing component, and is horizontally moved relative to the first centering block.
11. according to claim 1 to substrate board treatment described in any one in 10 characterized by comprising
Constraint element carries out the constraint of selectivity on the rack to the substrate.
12. substrate board treatment according to claim 11, which is characterized in that the constraint element includes:
Fixture, snap ring placing component can be installed on along the form that the direction in surrounding face close and far from substrate is moved；
Spring members are used to be elastically supported the movement of the fixture relative to snap ring placing component.
13. substrate board treatment according to claim 12, which is characterized in that
Form spaced apart is provided with multiple fixtures along the circumferencial direction of the substrate.
14. substrate board treatment according to claim 12 characterized by comprising
Unlocking unit, when snap ring is close to snap ring placing component, constraint of the Unlocking clamp to substrate.
15. substrate board treatment according to claim 14, which is characterized in that the unlocking unit includes:
Upper angled guide portion is formed in the top of fixture；
Unlocking part is installed on snap ring placing component in the form that can be moved along up and down direction, when being contacted with snap ring along
Upper angled guide portion is mobile, and keeps fixture mobile to the direction far from substrate.
16. substrate board treatment according to claim 15 characterized by comprising
Spring members are unlocked, moving up and down for unlocking part is supported with being used for elasticity.
17. substrate board treatment according to claim 12 characterized by comprising
Mobile unit keeps fixture mobile to the direction far from substrate before substrate is placed on substrate placement section.
18. substrate board treatment according to claim 17, which is characterized in that the mobile unit includes:
Lower tilt guide portion is formed in the lower part of fixture；
Moving parts is set to the lower part of fixture in the form that can be moved along up and down direction, when contacting with fixture under
Portion's inclined lead part is moved, and keeps fixture mobile to the direction far from substrate.
19. substrate board treatment according to claim 18 characterized by comprising
Mobile spring component is used to be elastically supported moving up and down for moving parts.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2018-0034262 | 2018-03-26 | ||
| KR1020180034262A KR102038508B1 (en) | 2018-03-26 | 2018-03-26 | Substrate processing apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208889637U true CN208889637U (en) | 2019-05-21 |
Family
ID=66510695
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821423838.1U Active CN208889637U (en) | 2018-03-26 | 2018-08-31 | Substrate board treatment |
Country Status (2)
| Country | Link |
|---|---|
| KR (1) | KR102038508B1 (en) |
| CN (1) | CN208889637U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113547437A (en) * | 2021-08-09 | 2021-10-26 | 河南科技学院 | Multifunctional grinding and polishing machine for laboratory |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4524084B2 (en) | 2003-08-05 | 2010-08-11 | Ｓｕｍｃｏ Ｔｅｃｈｘｉｖ株式会社 | Semiconductor wafer loading device and loading method |
| KR101036605B1 (en) * | 2008-06-30 | 2011-05-24 | 세메스 주식회사 | Substrate supporting unit and single type substrate polishing apparatus using the same |
| KR102412773B1 (en) * | 2015-11-27 | 2022-06-24 | 주식회사 케이씨텍 | Apparatus of loading wafeer in chemical mechanical polishing system |
| KR102461598B1 (en) * | 2015-12-18 | 2022-11-01 | 주식회사 케이씨텍 | Apparatus of loading substrate in chemical mechanical polishing system |
-
2018
- 2018-03-26 KR KR1020180034262A patent/KR102038508B1/en active IP Right Grant
- 2018-08-31 CN CN201821423838.1U patent/CN208889637U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113547437A (en) * | 2021-08-09 | 2021-10-26 | 河南科技学院 | Multifunctional grinding and polishing machine for laboratory |
| CN113547437B (en) * | 2021-08-09 | 2022-05-27 | 河南科技学院 | Multifunctional grinding and polishing machine for laboratory |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20190112369A (en) | 2019-10-07 |
| KR102038508B1 (en) | 2019-10-30 |
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