CN207587705U - Substrate board treatment - Google Patents
Substrate board treatment Download PDFInfo
- Publication number
- CN207587705U CN207587705U CN201721861570.5U CN201721861570U CN207587705U CN 207587705 U CN207587705 U CN 207587705U CN 201721861570 U CN201721861570 U CN 201721861570U CN 207587705 U CN207587705 U CN 207587705U
- Authority
- CN
- China
- Prior art keywords
- substrate
- bracket
- carrier head
- board treatment
- placement section
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 239000000758 substrate Substances 0.000 title claims abstract description 180
- 238000011282 treatment Methods 0.000 title claims abstract description 38
- 238000000034 method Methods 0.000 claims abstract description 26
- 238000006073 displacement reaction Methods 0.000 claims description 12
- 238000005096 rolling process Methods 0.000 claims description 4
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 2
- 230000000694 effects Effects 0.000 abstract description 19
- 235000012431 wafers Nutrition 0.000 description 20
- 238000007517 polishing process Methods 0.000 description 10
- 238000000227 grinding Methods 0.000 description 5
- 239000012530 fluid Substances 0.000 description 4
- 238000004140 cleaning Methods 0.000 description 3
- 239000002002 slurry Substances 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 238000005299 abrasion Methods 0.000 description 2
- 230000006835 compression Effects 0.000 description 2
- 238000007906 compression Methods 0.000 description 2
- 239000000428 dust Substances 0.000 description 2
- 230000002093 peripheral effect Effects 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 230000001105 regulatory effect Effects 0.000 description 2
- 241000411998 Gliricidia Species 0.000 description 1
- 235000009664 Gliricidia sepium Nutrition 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000002401 inhibitory effect Effects 0.000 description 1
- 230000003993 interaction Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 239000012528 membrane Substances 0.000 description 1
- 230000000116 mitigating effect Effects 0.000 description 1
- 238000007665 sagging Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
- B24B37/32—Retaining rings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/304—Mechanical treatment, e.g. grinding, polishing, cutting
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6835—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The utility model is related to substrate board treatment, the substrate board treatment includes：Bracket is used to place substrate；Carrier head loads substrate from bracket；Portion is moved horizontally, in the loading process of substrate, bracket is made to be moved horizontally to defined arrangement position relative to carrier head；It by means of this, can obtain during substrate is loaded on carrier head, the advantageous effects that no substrate deformation and damage ground accurately load.
Description
Technical field
The utility model is related to a kind of substrate board treatments, and more specifically, inputization can will be used for by being related to one kind
During the substrate of mechanical polishing process loads on carrier head, no substrate deformation and the substrate accurately loaded with damaging
Processing unit.
Background technology
Chemical-mechanical polishing (CMP) device is, in order in semiconductor element manufacturing process, eliminate due to performing repeatedly
Difference in height between cell regions and peripheral circuit area caused by masking, the wafer surface convex-concave for etching and being generated with line procedures etc.
Wide area planarization, it is thick to improve the wafer surface caused by the separation of circuit formation contact/wiring membrane and highly integrated element
Rugosity etc., and it is used to carry out the surface of chip the device of precise finiss processing.
It is after 90s that chip is loaded on carrier head by CMP system, as disclosed in Korean Patent Publication No. 10-1188579 etc.
Shown in content, while carrier head is moved, in defined abrasive disk, at the same the abradant surface of chip is carried out by means of
The mechanical lapping of mechanical type friction, the chemical grinding by means of slurry.
At this point, carrier head 90 is as shown in Figure 1, be configured in chemical-mechanical polishing process, for utilizing bottom plate 92a will
The diaphragm 92 that wafer W is pressurizeed downwards is fixed on main part 91, and pressure chamber 92C is formed between diaphragm 92 and main part 91,
By means of the pneumatics accessed from pressure regulating part 95 by pneumatics supply pipe 95a, can downwards pressurize to wafer W.Moreover,
In the periphery of diaphragm 92, the snap ring 93 that wafer W is prevented to be detached from is installed, is configured in chemical-mechanical polishing process, by
In the pneumatics of retainer ring pressure chamber 93C, snap ring 93 can be pressurizeed downwards.
On the other hand, wafer W is loaded on into the loading device 1 of carrier head 90 as shown in Figure 1, bracket by placement wafer W
10th, form the driving portion MH that 10d is moved along the vertical direction of bracket 10.That is, in the middle section that wafer W is made to be positioned over bracket 10
In the state of A1, if as shown in Fig. 2, making the height 9H as defined in 10d1 movements upward of bracket 10, the close support of carrier head 90
Frame 10 applies sucking pressure to the through hole 95x in center, and by means of this, wafer W becomes the diaphragm bottom plate 92a for being adjacent to carrier head 90
The state of loading.
But without during chemical-mechanical polishing process, the pressure of the retainer ring pressure chamber 93C of carrier head 90 can not
It is fine adjusted by means of pressure regulating part 95, therefore, the snap ring 93 of carrier head 90 is moved with the state hung down.No
Only in this way, by means of mobile driving portion M and the height of the carrier head 90 of movement is difficult to exquisite adjust to having error within 1mm
Highly.
Therefore, even if the height of the bracket 10 of loading device 1 is made to keep appropriate, the diaphragm bottom plate 92a of wafer W is held with putting
It is spaced e between the wafer W being placed on the bracket 10 of loading device 1 to be also not fixed, at the interval, e is more than the situation of predetermined distance
Under, the problem is that the wafer W for being positioned over loading device 10 can not be loaded into the mistake of carrier head 90 by generation.
In order to eliminate this problem, the scheme proposed in the past is as shown in Figures 3 and 4, on the side of chip loading device 1
Edge with the state flexibly supported by spring 30, installs the movable contact 20 contacted first with the snap ring 93 of carrier head 9.By
In this, than the bottom plate of diaphragm 92, sagging snap ring 93 is contacted with movable contact 20 downwards, with carrier head 9 downwards
Mobile, movable contact 20 is pressed by snap ring 93, at the same time, can more fine adjust the diaphragm 92 of absorption fixed wafer W
Bottom plate 92a and loading device 1 wafer W between interval.
But on the bracket 10 for placing wafer W, if the position of wafer W misplaces slightly, as shown in figure 5, carrying
First 9 while move downwards 9d, the bottom surface 93a of snap ring 93 and the peripheral collision of wafer W, the location dislocation of wafer W, not only without
Method is correctly loaded into carrier head 9, and the serious problems that wafer W may be caused to damage.
Therefore, it, from terms of loading device is loaded into carrier head, has carried out being intended to exclude damage to wafers by chip recently
A variety of explorations that the state of possibility loads like clockwork, but it is also far from enough, it is desirable that this is developed.
Utility model content
Technical problem to be solved
The utility model aim be to provide it is a kind of can will be accurate for putting into the substrate of chemical-mechanical polishing process
Inerrably load on the substrate board treatment of carrier head.
Particularly the utility model aim is, in terms of substrate is loaded into carrier head, fundamentally excludes substrate
The collision at edge and carrier head prevents substrate in loading process from breakage occurs.
In addition, the utility model aim is, enabling improves stability and reliability, after substrate loading accurately
Control subsequent handling.
Solve the scheme of technical problem
According to the preferred embodiment in the utility model for being intended to reach described the utility model aim, substrate board treatment packet
It includes：Bracket is used to place substrate；Carrier head loads substrate from bracket；Portion is moved horizontally, in the loading process of substrate
In, bracket is made to be moved horizontally to defined arrangement position relative to carrier head.
In the loading process of the substrate, the position of the carrier head is fixed, and the bracket is relative to the carrier head
It moves horizontally, is configured at the arrangement position.
This is in order to during the substrate for being used to putting into chemical-mechanical polishing process is loaded on carrier head, in root
The collision of substrate and carrier head is excluded in sheet, prevents the substrate in process is loaded from breakage occurs.
Particularly the utility model by substrate before the process of carrier head is loaded into so that bracket is relative to carrier head standard
Defined arrangement position really is arranged in, by means of this, can obtain will be for putting into the substrate of chemical-mechanical polishing process
The advantageous effects of carrier head are loaded on like clockwork.
In the loading procedure of substrate, can obtain can prevent because of bracket and carrier head (card the utility model as a result,
Ring) location dislocation cause substrate cause when loading on errors present or the contact because with snap ring substrate edges damage or breakage
Advantageous effects.
The carrier head includes：Carrier head ontology；Guide member is formed on the carrier head ontology, described in contact
Centering guiding piece, moves the bracket.
The carrier head ontology includes：Diaphragm is used to adsorb the substrate；Snap ring is configured at the outer of the diaphragm
Week, the guide member are configured at the outside of the snap ring.
More specifically, bracket includes：Placement section is used to place substrate；Support shaft liftably supports placement
Portion.
It protrudes to be formed in centering guiding piece edge above the placement section.
Placement section can be provided with that can place the various structures of substrate.
As an example, placement section includes：Substrate placement section is used to place substrate；Snap ring placement section, in substrate
The periphery of placement section is formed, for placing snap ring.At this point, it is used to place the region (substrate placement section) of substrate in placement section and supply
The region (snap ring placement section) of snap ring contact can be formed in the form of integrally connected or be formed in the form of independent separate.Separately
Outside, elastomeric element can be included, relative to substrate placement section, can support snap ring placement section to resilient movement.
As described above, by means of snap ring placement section is caused to be flexibly supported by elastomeric element, when snap ring contacts snap ring placement section
When, snap ring placement section can carry out resilient movement relative to substrate placement section, therefore, snap ring can be made to be contacted with snap ring placement section
Caused impact force attenuation.In addition, this structure can cause when snap ring is contacted with snap ring placement section, snap ring placement section elasticity
Elasticity of compression component simultaneously moves specified interval to lower part direction, so as to the state being closer configured in diaphragm and substrate
Under, realize the loading of substrate.
As another example, placement section includes：Placement plate is separatedly configured from the bottom surface of substrate；Edge placement section,
It is configured above placement plate, the bottom edge of supporting substrate.Furthermore it is possible to including elastomeric element, it can be up or down
Flexibly support edge placement section.
As described above, substrate only has fringe region partly to be supported by edge placement section, thus make connecing for bracket and substrate
Contacting surface product minimizes, and the foreign matters such as dust, cleaning solution, chemicals is made to remain realization between bracket and substrate and are minimized, thus energy
Substrate damage caused by enough making the contact area increase of bracket and substrate, which is realized, to be minimized.
Further, it enables edge placement section is flexibly supported by elastomeric element, by means of this, when snap ring engagement edge placement section
When, edge placement section can be relative to placement plate resilient movement, it is thus possible to caused by making snap ring contact with edge placement section
Impact force is decayed.
The portion of moving horizontally can move horizontally support the various structures of support shaft to provide.As an example, water
Flat moving portion can be configured at the lower end of the support shaft of bracket, can support support shaft with moving horizontally in the horizontal direction.According to feelings
The portion of moving horizontally can also be configured at the middle part of bracket by condition, be configured so that the upper end position of bracket relative under bracket
End portion is moved horizontally.Specifically, as portion is moved horizontally, can use can be rolled along horizontal direction
Move the rolling member (for example, ball or roller) that mobile mode supports support shaft.According to circumstances, air bearing can also be utilized
Deng in a non contact fashion, supporting support shaft with moving horizontally.
Preferably, the bracing strut moved horizontally of scheduled reference range is more than including limitation support shaft, it, can by means of this
To obtain the advantageous effects moved horizontally for inhibiting support shaft excessive.
The centering guiding piece that bracket is directed to arrangement position relative to carrier head is formed on bracket, on carrier head
The guide member for being formed with contact centering guiding piece and moving bracket.
Wherein, bracket is directed to arrangement position by so-called centering guiding piece relative to carrier head, is defined as adjusting bracket phase
For the horizontal position error of carrier head, to be moved to when carrier head (snap ring) contacts the top of bracket, the bottom surface of snap ring
The not position (bracket and the position of carrier head arranged coaxial) at bumped substrate edge.
Guide member can with carrier head in order to load substrate and close to substrate during, snap ring reach substrate on
Before face, the structure that can contact centering guiding piece first is formed.As an example, guide member is more than the straight of snap ring to have
The continuous loop form of diameter is formed, and is configured at the outside of snap ring.As another example, guide member can be along the circumference side of snap ring
It is multiple to being separatedly formed with.At this point, multiple guide members can be configured on mutually identical circumference, different from this, also may be used
Multiple guide members are configured on mutually different circumference.
As described above, adjust the horizontal position of bracket so that when bracket and carrier head in order to substrate loading process and phase
When mutually close, the guide member of carrier head contacts centering guiding piece first, and snap ring is arranged in the arrangement position not contacted with substrate
(during plane projection, do not contacted with substrate position), by means of this, can prevent contact of the snap ring with substrate, be prevented in advance
Only substrate damage and the advantageous effects of breakage.
Further, also may be used (during centering guiding piece is contacted with guide member) during bracket is arranged in arrangement position
To adjust the angle position error of bracket (axis of bracket is relative to the inclined angle of vertical line) together, thus, it is possible to obtain
The advantageous effects of substrate damage caused by preventing the angle position error of bracket (snap ring damages caused by being contacted with substrate).
Preferably, the guide member of angular guide surfaces, the angular guide surfaces and carrier head is formed on centering guiding piece
Contact, arrangement position is directed to by bracket.
As described above, it contacts the angular guide surfaces of centering guiding piece by means of the guide member of carrier head and is guided, more
Swimmingly realize that (position arranged relative to the contact process of the fixed guide member in position for the centering guiding piece that can move horizontally
Journey).In addition, be not the bottom surface of guide member but corner contact angular guide surfaces, it is thus possible to make centering guiding piece with guiding
The contact area of component minimizes, and can obtain the advantageous effects for further alleviating contact impact.
It is highly preferred that the mobile mistake that moves horizontally distance be formed larger than carrier head of the bracket by means of angular guide surfaces
Difference.In general, carrier head is configured by means of the quick-action stick (quick stick) driven with linear motor principle and moved
To loading position (or abrasion site).But the displacement error of quick-action stick (position precision) is ± 1 ㎜ or so, therefore, even if
Carrier head is made to be precisely located at desired position, due to the displacement error (position precision) of carrier head, carrier head is relative to support
The allocation position of frame is also difficult to accurately arrange.But in the utility model, by bracket by means of the level of angular guide surfaces
Displacement distance is formed larger than the displacement error of carrier head, by means of this, even if there are the displacement error of carrier head, can also incite somebody to action
Bracket is configured at accurate arrangement position relative to carrier head.
In addition, substrate board treatment includes：Restoring force forming portion provides to make support shaft relative to bracing strut level
It is moved to the restoring force of initial position.
Restoring force forming portion allows to flexibly realize that bracket is arranged relative to the position of carrier head.Show as one
Example, restoring force forming portion include that one end is connected to bracing strut, the other end is connected to the spring members of support shaft.Show as another
Example, restoring force forming portion include：Multiple first support magnet are configured at the periphery of support shaft；Multiple second support magnet,
It is configured at the inner face of bracing strut opposite to each other with first support magnet.As another example, it is supplied between bracing strut and support shaft
Fluid by means of the pneumatics or hydraulic pressure of fluid is utilized, can also form the restoring force for returning to bracket initial position.
Advantageous effect
In conclusion according to the utility model, it can be in the substrate loading that will be used to put into chemical-mechanical polishing process
During carrier head, the collision of substrate and carrier head is fundamentally excluded, acquisition prevents substrate in loading process from occurring to break
The advantageous effects of damage.
In particular according to the utility model, before substrate is loaded into the process of carrier head so that bracket is relative to holding
Carrier head is accurately arranged in defined arrangement position, will be for putting into the substrate of chemical-mechanical polishing process it is possible thereby to obtain
The advantageous effects of carrier head are loaded on like clockwork.
That is, in bracket and carrier head close to each other for the loading process of substrate, the horizontal position of bracket is adjusted, is made
The guide member for obtaining carrier head contacts centering guiding piece first, (is put down so that snap ring is arranged in the arrangement position not contacted with substrate
When face projects, the position that is not contacted with substrate), by means of this, can obtain prevents contact of the snap ring with substrate in advance, prevents base
The advantageous effects of damage and the breakage of plate.
As a result, in the loading procedure of substrate, can obtain can prevent because the position of bracket and carrier head (snap ring) is wrong
Position causes substrate to load on errors present or substrate edges is caused when contact with snap ring to damage or damaged advantageous effects.Into
It, can also a people having the same aspiration and interest during bracket is aligned to arrangement position (during centering guiding piece is contacted with guide member) for one step
The angle position error (axis of bracket is relative to the inclined angle of vertical line) of bracket is saved, thus can obtain and prevent bracket angle
The advantageous effects of substrate damage (snap ring damages caused by being contacted with substrate) caused by spending site error.
In addition, according to the utility model, it can obtain and independently accurately be arranged with carrier head displacement error (position precision)
The advantageous effects of row carrier head and bracket.
In addition, according to the utility model, after the external force (external force caused by carrier head) for acting on bracket releases, by means of
Restoring force (elastic force) caused by restoring force forming portion so that bracket recovers to initial position automatically, and (carrier head is contacted with bracket
The original position that is configured of front rack), thus there are the advantageous effects that can realize continuous loading process.
In addition, according to the utility model, stability and reliability can be improved, can be obtained after substrate loading accurately
Control the advantageous effects of subsequent handling.
Description of the drawings
Fig. 1 is the figure for the structure for showing previous chip loading device,
Fig. 2 is to show the carrier head of Fig. 1 close to the figure of the state of chip,
Fig. 3 and Fig. 4 is the figure of the structure for the chip loading device for showing previous another form,
Fig. 5 is the enlarged drawing of Fig. 4 " A " part,
Fig. 6 is the figure for illustrating the substrate board treatment of the utility model,
Fig. 7 is the enlarged drawing of Fig. 6 " B " part,
Fig. 8 and Fig. 9 be for the figure of the ordered state of the bracket of definition graph 6,
Figure 10 is the figure for illustrating the bracket alignment processes by means of guiding piece of feeling relieved shown in Fig. 6,
Figure 11 is the bottom view for the centering guiding piece for showing Fig. 6,
Figure 12 is another exemplary bottom view for the centering guiding piece for showing Fig. 6,
Figure 13 is the enlarged cross-sectional view of Fig. 6 " C " part,
Figure 14 to Figure 16 is the figure for illustrating the restoring force forming portion of the substrate board treatment of the utility model respectively,
Figure 17 and Figure 18 is for illustrating another exemplary figure of the bracket of the substrate board treatment of the utility model respectively.
Reference numeral
10：Substrate 100：Carrier head
110：Carrier head ontology 192：Diaphragm
193：Snap ring 197：Guide member
200：Bracket 210：Placement section
220：Support shaft 222：Bracing strut
230：Centering guiding piece 232：Angular guide surfaces
240：Restoring force forming portion 242：Spring members
242a：First support magnet 242b：Second support magnet
300：Move horizontally portion 302：Rolling member
Specific embodiment
With reference to the accompanying drawings, the preferred embodiment of the utility model is described in detail, but the utility model is not by embodiment
Limitation limits.As reference, in the present note, identical reference numeral refers to substantially the same element, under this rule,
The content described in different attached drawings can be quoted to illustrate, those skilled in the art are judged as content that is self-evident or repeating
It can be omitted.
With reference to Fig. 6 to Figure 13, the substrate board treatment 1 of the utility model includes：Bracket 200 is used to place substrate 10；
Carrier head 100 loads substrate 10 from bracket 200；Portion 300 is moved horizontally, in the loading process of substrate 10, makes bracket
200 are moved horizontally to defined arrangement position relative to carrier head 100.
Carrier head 100 is supplied in abrasive disk in slurry (on figure after loading substrate 10 is received from 10 loading device of substrate
Be not shown) on the grinding pad that provides (be not shown on figure) under states above, pressurize to substrate 10, perform chemical-mechanical polishing
Substrate 10 after the chemical-mechanical polishing process of grinding pad and slurry is utilized, is transplanted on cleaning device by process.
As reference, in the utility model, so-called substrate 10, it can be understood as the grinding pair that can be ground on grinding pad
As object, the utility model is not the type and characteristic for limiting or being defined in substrate 10.It as an example, can as substrate 10
To use chip.
More specifically, carrier head 100 includes carrier head ontology 110 and guide member 197, and the guide member 197 exists
It is formed on carrier head ontology 110, the centering guiding piece 230 that contact bracket 200 is equipped with moves bracket 200.
Carrier head ontology 110 includes：Main part 191 is used to that carrier head 100 to be enable to rotate；Diaphragm 192, is located at
The bottom surface of main part 191；And snap ring 193, the edge part of main part 191 is incorporated into a manner of being configured at 192 periphery of diaphragm,
Substrate 10 is prevented to be detached from.
Diaphragm 192 can be provided according to desired condition and design pattern with various structures.As an example, every
Multiple fins (for example, fin of annular state) are could be formed on film 192, by means of multiple fins, in main part 191 and diaphragm
Between 192, multiple pressure chamber 192C along the radial direction division of main part 192 can be provided.
In each pressure chamber 192C, it can be respectively provide for measuring the pressure sensor of pressure.The pressure of each pressure chamber 192C
Power can individually be adjusted according to the control of pressure control portion 195, can be adjusted the pressure of each pressure chamber 192C, individually be adjusted
Save the pressurized pressure of substrate 10.
In the central part of carrier head 100, the central part pressure that could be formed with by means of the opening of diaphragm 192 and be formed through
Power chamber 195X.Central part pressure chamber 195X is directly connected with substrate 10, and sucking pressure is acted on, and substrate 10 is made to be adjacent to carrier head
100 diaphragm 192, so as to load substrate 10.
Bracket 200 is used to place substrate 10 to be loaded.As an example, bracket 200 can along the vertical direction up and down
It is equipped with, substrate 10 to be loaded is placed on the top of bracket 200.
As reference, when substrate 10 is loaded into, in the lower part of carrier head 100, bracket 200 is moved upward, therefore, carrying
First 100 snap ring 193 can be contacted first above bracket 200, connect if be spaced between diaphragm 192 above bracket 200
More than nearly specified degree, then by means of the sucking pressure of carrier head 100, substrate 10 can be loaded into carrier head 100.
Bracket 200 can be can place the offer of the various structures of substrate 10, and the structure and characteristic of bracket 200 can bases
It is required that condition and design pattern and diversely change.More specifically, bracket 200 includes：Placement section 210 is used to place
Substrate 10；Support shaft 220 liftably supports placement section 210.At this point, in placement section 210, the region of substrate 10 is placed
(substrate placement section), the region (snap ring placement section) contacted with snap ring 193 can be formed or with independence in the form of integrally connected
The form of setting is formed.
As an example, with reference to Fig. 6 and Fig. 8, placement section 210 can (substrate be placed to place the region of substrate 10
Portion), integrally formed form is formed on one sheet for the region (snap ring placement section) that is contacted with snap ring 193.
That is, placement section 210 is formed in the form of flat above, above placement section 210, it is respectively formed with placement substrate
10 region, the region contacted with the bottom surface of snap ring 193.More specifically, central portion places substrate above placement section 210
10, snap ring 193 contacts edge part above bracket 200.As reference, in the embodiment of the utility model, although enumerating
In placement section 210, place the region of substrate 10, the region that is contacted with the bottom surface of snap ring 193 be configured at mutually level example into
Gone explanation, but according to circumstances, can also be formed in placement section, compared with the region for placing substrate, with snap ring
The region of bottom surface contact has more low clearance.
Moreover, placement section 210 can be lifted by the support shaft 220 for being connected to its bottom surface along upper and lower directions, support
Axis 220 can be lifted by means of the driving portion (MH) of such as motor.As reference, the lifting structure of placement section 210 can be with
It is diversely changed according to desired condition and design pattern, the utility model is not limited by the lifting structure of placement section 210
System limits.
Portion 300 is moved horizontally in the loading process of substrate 10, bracket 200 is made to be moved horizontally to relative to carrier head 100
Defined arrangement position.(with reference to Figure 13)
As an example, the lower end of support shaft 220 of bracket 200 can be configured at by moving horizontally portion 300, can be along level
Direction movably supports support shaft 220.According to circumstances, the portion of moving horizontally can also be configured to the middle part of bracket, be configured
The upper end position of bracket is made to be moved horizontally relative to the lower end position of bracket.
As the portion that moves horizontally 300, support support shaft 220 a variety of mobile equipment with moving horizontally can be used, this
Utility model is not limited or is limited by the structure and type that move horizontally portion 300.As an example, as moving horizontally
Portion 300, can use can roll mobile mode in the horizontal direction supports the rolling member 302 of support shaft 220 (for example, ball
Or roller).According to circumstances, can also use such as air bearing supports support shaft with moving horizontally in a non contact fashion
Equipment.
Preferably, substrate board treatment 1 includes：Bracing strut 222, limitation support shaft 220 are more than predetermined benchmark
Range moves horizontally.Bracing strut can be formed with the various structures that 220 excessive level of support shaft can be inhibited to move.As one
Example, bracing strut can be configured at the periphery of support shaft 220 to have the tubular state of the internal diameter bigger than support shaft 220 to be formed.
Centering guiding piece 230 is formed on bracket 200, the centering guiding piece 230 is by bracket 200 relative to carrier head
100 are directed to arrangement position, and guide member 197, the contact of the guide member 197 centering guiding are formed on carrier head 100
Part 230 moves bracket 200.
Wherein, bracket 200 is directed to arrangement position by so-called centering guiding piece 230 relative to carrier head 100, is defined as adjusting
Horizontal position of the bracket 200 relative to carrier head 100 is saved, works as the upper of carrier head 100 (snap ring) contact bracket 200 to be moved to
During portion, the position (position of bracket and carrier head arranged coaxial) at the bottom surface of snap ring 193 not 10 edge of bumped substrate.Preferably,
Guiding piece 230 of feeling relieved protrudes above bracket 200 (above the edge of bracket) to be formed, and guide member 197 is to be configured at snap ring
The mode in 193 outsides is protruded to be formed in the bottom surface of carrier head 100.
Guide member 197 with carrier head 100 in order to load substrate 10 and close to substrate 10 during, in snap ring 193
Before reaching substrate 10 above, the structure that can contact centering guiding piece 230 first is formed.
As an example, with reference to Figure 11, guide member 197 is to have the continuous annular of the diameter bigger than snap ring 193
State is formed, and is configured at the outside of snap ring 193 (along the outside of snap ring radial direction).As described above, by means of being formed with annular state
Guide member 197, the power that dispersive vectoring component 197 is contacted with centering guiding piece 230, can obtain and more stably realize bracket
The advantageous effects of 200 alignment process.
As another example, it can also be separatedly equipped with along 193 circumferencial direction of snap ring with reference to Figure 12, guide member 197'
It is multiple.It is assumed that it can separatedly be formed at least two in a manner of being configured on the circumference than 193 diameter bigger of snap ring
Guide member 197'.At this point, guide member 197' can be formed in the form of pin or ring plate break, the utility model is not by guiding
The form and number of component 197' is limited or is limited.According to circumstances, it is also possible that multiple guide members are configured at mutually not phase
On same circumference.
As reference, in the embodiment of the utility model, guide member 197,197' are enumerated in carrier head ontology 110
The example that bottom surface is formed is illustrated, but according to circumstances, can also form guide member in the side of carrier head ontology.
As described above, the horizontal position of bracket 200 is adjusted, so as to the adding for substrate 10 in bracket 200 and carrier head 100
Carry process and it is close to each other when, guide member 197, the 197' of carrier head 100 contact centering guiding piece 230 first, make snap ring 193
The arrangement position (during plane projection, do not contacted with substrate 10 position) not contacted with substrate 10 is arranged in, it, can be with by means of this
Obtain prevent snap ring 193 from being contacted with substrate 10 in advance, prevent substrate 10 damage and breakage advantageous effects.
Bracket 200 relative to carrier head 100 position arrange, can by means of according to snap ring 193 relative to substrate 10
Eccentric distance (distance being in staggered configuration), makes bracket 200 move horizontally (100 position of carrier head relative to snap ring 193 (carrier head)
It is fixed and bracket 200 moves horizontally) and carry out.
More specifically, with reference to Figure 10, in the upper end of centering guiding piece 230, angular guide surfaces are formed with tilting down
232, the angular guide surfaces 232 are contacted with the guide member 197 of carrier head 100, and bracket 200 is directed to arrangement position.
As described above, by means of the guide member 197 of carrier head 100 is caused to contact the inclined lead of centering guiding piece 230
Face 232 is simultaneously guided, and more swimmingly realizes the horizontally movable centering fixed guide member 197 of 230 contact position of guiding piece
Process (position alignment processes).
In addition, not being the bottom surface of guide member 197 but corner contact thus can make centering in angular guide surfaces 232
Guiding piece 230 and the contact area of guide member 197 minimize, and can obtain the advantageous effects for further mitigating contact impact.
At this point, angular guide surfaces 232 can be formed with rectilinear configuration, but according to circumstances, can also be formed with tracing pattern
Angular guide surfaces.
Preferably, with reference to Fig. 7 and Figure 10, bracket 200 can be with shape by means of the distance L1 that moves horizontally of angular guide surfaces 232
Into the displacement error LE obtained more than carrier head 100.
Wherein, so-called bracket 200 moves horizontally distance by means of angular guide surfaces 232, is defined as inclined lead
Face 232 is moved relative to fixed guide member 197, the distance that bracket 200 can move horizontally, so-called carrier head 100
Displacement error, be defined as the position precision of carrier head 100.
In general, carrier head 100 is configured the quick-action stick (quick by means of being driven with linear motor principle
Stick) it is moved to loading position (or abrasion site).But the displacement error of quick-action stick (position precision) is left for ± 1 ㎜
The right side, therefore, even if carrier head 100 is made to be precisely located at desired position, due to displacement error (the position precision of carrier head 100
Degree), carrier head 100 is also difficult to accurately arrange relative to the allocation position of bracket 200.Therefore, more than the movement of carrier head 100
It forms to error LE bracket 200 and moves horizontally distance L1 by means of angular guide surfaces 232, even if there are carrier heads 100 as a result,
Displacement error LE, also bracket 200 can be configured at accurate arrangement position relative to carrier head 100.
In addition, substrate board treatment 1 includes：Restoring force forming portion 240 provides to make support shaft 220 relative to axis
Stent 222 is moved horizontally to the restoring force of initial position.
Restoring force forming portion 240 allows to elasticity and realizes that bracket 200 is arranged relative to the position of carrier head 100.Wherein,
So-called elasticity realizes that bracket 200 is arranged relative to the position of carrier head 100, is interpreted as：It (is held in the external force for acting on bracket 200
External force caused by carrier head) release after, by means of the restoring force (elastic force) of restoring force forming portion 240, bracket 200 automatically restores to
Initial position (before carrier head is contacted with bracket, original position that bracket was once configured).
As an example, with reference to Figure 14, restoring force forming portion 240 is connected to bracing strut 222 including one end, the other end connects
It is connected to the spring members 242 of support shaft 220.Spring members 242 can be in the periphery of support shaft 220 circumferentially separatedly
It is configured multiple, the number and configuration space of spring members 242 can diversely be changed according to desired condition and design pattern.
As another example, with reference to Figure 15, restoring force forming portion 240 includes：Multiple first support magnet 242a, configuration
In the periphery of support shaft 220；Multiple second support magnet 242b are configured at bracing strut opposite to each other with first support magnet 242a
222 inner face.First support magnet 242a can form phase repulsive interaction (RF) with second support magnet 242b, act on bracket
After 200 external force (external force caused by carrier head 100) releases, by means of first support magnet 242a and second support magnet 242b
Repulsion, bracket 200 is automatically moved back to initial position.
As another example, with reference to Figure 16, can also between bracing strut 222 and support shaft 220 supply fluid 230',
By means of the pneumatics or hydraulic pressure of fluid 230' is utilized, the restoring force for the initial position for returning to bracket 200 is formed.
On the other hand, Figure 17 and Figure 18 is the bracket 200 for illustrating the substrate board treatment of the utility model respectively
Another exemplary figure.Moreover, for same or equivalent in identical part with aforementioned composition, assign same or equivalent in identical
Reference numeral omits the detailed description to this.
Place in another embodiment according to the present utility model, in placement section 210', 210 " substrate 10 region and with card
The region that ring 193 contacts can be provided with the structure being separated from each other.
As an example, with reference to Figure 17,10 loading device of substrate of another embodiment of the utility model, which includes having, to be put
It puts the bracket 200' of portion 210' and support shaft (with reference to the 220 of Fig. 6), carrier head 100, move horizontally portion 300, and placement section
210' includes：Substrate placement section 212' is used to place substrate 10；Snap ring placement section 214', substrate placement section 212''s
Periphery is separatedly formed, and places snap ring 193；Elastomeric element 216', can resilient movement relative to substrate placement section 212' branch
Support snap ring placement section 214'.
Snap ring placement section 214' can be provided according to desired condition and design pattern with various structures.Show as one
Example, snap ring placement section 214' can provide separatedly detached along the circumferencial direction of snap ring 193 it is multiple.As another example, block
Ring placement section 214' can be provided along the circumferencial direction of snap ring 193 with annular state.Moreover, guide bracket 200' is relative to carrying
The first 100 centering guiding pieces 230 moved horizontally can be formed above snap ring placement section 214'.
As elastomeric element 216', common spring can be used.According to circumstances, pneumatics or hydraulic pressure can also be utilized to substitute
Spring, make snap ring contacted with snap ring placement section caused by impact force decay.
As described above, by means of snap ring placement section 214' is caused to be flexibly supported by elastomeric element 216', when snap ring 193 contacts
During snap ring placement section 214', snap ring placement section 214' can carry out resilient movement, therefore, snap ring relative to substrate placement section 210'
193 contacted with snap ring placement section 214' caused by impact force can decay.In addition, this structure is placed in snap ring 193 and snap ring
When portion 214' is contacted, snap ring placement section 214' is allow to carry out elastic compression to elastomeric element 216' and be moved to lower part direction pre-
Determine section, in the state of being configured in diaphragm 192 and substrate 10 further to ground, realize the loading of substrate 10.
As another example, with reference to Figure 18,10 loading device of substrate of another embodiment of the utility model, which includes having, to be put
It puts portion 210 " and bracket 200 of support shaft (with reference to the 220 of Fig. 6) ", carrier head 100, move horizontally portion 300, and placement section
210 " include：Placement plate 212 " is separatedly configured from the bottom surface of substrate 10；Edge placement section 214 ", is configured at placement plate
212 " above, the bottom edge of supporting substrate 10；Elastomeric element 216 " can flexibly support edge placement section up or down
214"。
The top of the placement section 214 at edge " is formed with centering guiding piece 230, the guide member formed on carrier head 100
197 contact centering guiding pieces 230, so as to which bracket 200 can be arranged in defined arrangement position relative to carrier head 100.
Edge placement section 214 " can be provided according to desired condition and design pattern with various structures.Show as one
Example, edge placement section 214 " can provide multiple, separatedly be detached along the circumferencial direction of snap ring 193.As another example, side
Edge placement section 214 " can be provided along the circumferencial direction of snap ring 193 with annular state.
As elastomeric element 216 ", common spring can be used.According to circumstances, pneumatics or hydraulic pressure can also be utilized to substitute
Spring, make snap ring contacted with edge placement section caused by impact force decay.
As described above, substrate 10 is by means of edge placement section 214 ", only bottom edge region is partly supported, thus
Can make bracket 200 " being minimized with the contact area of substrate 10, make the foreign matters such as dust, cleaning solution, chemicals in bracket 200 " with
Residual, which is realized, between substrate 10 minimizes, and by means of this, can make because of bracket 200 that " the contact area increase with substrate 10 causes
Substrate 10 damage realize minimize.
In addition, by means of flexibly supporting edge placement section 214 " by elastomeric element 216 ", when 193 engagement edge of snap ring is put
Put portion 214 " when, edge placement section 214 " can be relative to placement plate 212 " carries out resilient movement, therefore, because of snap ring 193 and side
Impact force can decay caused by edge placement section 214 " contact.
As described above, the preferred embodiment with reference to the utility model is illustrated, but as long as being relevant art field
Those skilled in the art are just it will be appreciated that in the thought of the utility model recorded without departing from claims and the range in field
It is interior, it diversely can revise and change the utility model.
Claims (23)
1. a kind of substrate board treatment, which is characterized in that including：
Bracket is used to place substrate；
Carrier head loads the substrate from the bracket；
Portion is moved horizontally, in the loading process of the substrate, the bracket is made to be moved horizontally to relative to the carrier head
Defined arrangement position.
2. substrate board treatment according to claim 1, which is characterized in that
In the loading process of the substrate, the position of the carrier head is fixed, and the bracket is relative to the carrier head water
Translation is dynamic, is configured at the arrangement position.
3. substrate board treatment according to claim 1, which is characterized in that
The centering guiding that the bracket is directed to the arrangement position relative to the carrier head is formed on the bracket
Part.
4. substrate board treatment according to claim 3, which is characterized in that
Angular guide surfaces are formed in the upper end of the centering guiding piece, the angular guide surfaces are contacted with the carrier head, will
The bracket is directed to the arrangement position.
5. substrate board treatment according to claim 4, which is characterized in that
The bracket moves horizontally distance by means of the angular guide surfaces, more than the displacement error of the carrier head.
6. substrate board treatment according to claim 3, which is characterized in that
The carrier head includes：
Carrier head ontology；
Guide member is formed on the carrier head ontology, is contacted with the centering guiding piece, is moved the bracket.
7. substrate board treatment according to claim 6, which is characterized in that
The carrier head ontology includes：
Diaphragm is used to adsorb the substrate；
Snap ring is configured at the periphery of the diaphragm,
The guide member is configured at the outside of the snap ring.
8. substrate board treatment according to claim 7, which is characterized in that
The guide member is formed along the circumferencial direction of the snap ring with continuous annular state.
9. substrate board treatment according to claim 7, which is characterized in that
Along the circumferencial direction of the snap ring separatedly equipped with multiple guide members.
10. substrate board treatment according to claim 9, which is characterized in that
Multiple guide members are configured on same circumference.
11. substrate board treatment according to claim 7, which is characterized in that
The bracket includes：
Placement section is used to place the substrate；
Support shaft liftably supports the placement section；
The portion of moving horizontally is moved horizontally the support shaft.
12. substrate board treatment according to claim 11, which is characterized in that
The centering guiding piece protrusion is formed in edge above the placement section.
13. substrate board treatment according to claim 11, which is characterized in that
The placement section includes：
Substrate placement section is used to place the substrate；
Snap ring placement section is formed in the periphery of the substrate placement section, for placing the snap ring.
14. substrate board treatment according to claim 13, which is characterized in that
The substrate placement section and the snap ring placement section link into an integrated entity.
15. substrate board treatment according to claim 13, which is characterized in that
The substrate placement section and the snap ring placement section are independently arranged.
16. substrate board treatment according to claim 15, which is characterized in that including：
Elastomeric element supports the snap ring placement section in a manner of relative to the substrate placement section energy resilient movement.
17. substrate board treatment according to claim 11, which is characterized in that
The placement section includes：
Placement plate is separatedly configured from the bottom surface of the substrate；
Edge placement section is configured above the placement plate, supports the bottom edge of the substrate.
18. substrate board treatment according to claim 17, which is characterized in that including：
Elastomeric element flexibly supports the edge placement section in a manner of it can move up and down.
19. substrate board treatment according to claim 11, which is characterized in that
The portion of moving horizontally include by can roll it is mobile in a manner of support the rolling member of the support shaft.
20. substrate board treatment according to claim 11, which is characterized in that including：
Bracing strut, limit the support shaft is more than moving horizontally for scheduled reference range.
21. substrate board treatment according to claim 20, which is characterized in that including：
Restoring force forming portion, it is extensive needed for initial position that offer makes the support shaft be moved horizontally to relative to the bracing strut
Multiple power.
22. substrate board treatment according to claim 21, which is characterized in that
The restoring force forming portion includes spring members, and one end of the spring members is connected to the bracing strut, and the other end connects
It is connected to the support shaft.
23. substrate board treatment according to claim 21, which is characterized in that
The restoring force forming portion includes：
First support magnet is configured at the periphery of the support shaft；
Second support magnet is configured at the inner face of the bracing strut with the first support magnet opposite to each other.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2017-0020680 | 2017-02-15 | ||
| KR1020170020680A KR101946786B1 (en) | 2017-02-15 | 2017-02-15 | Substrate procesing apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207587705U true CN207587705U (en) | 2018-07-06 |
Family
ID=62740059
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721861570.5U Active CN207587705U (en) | 2017-02-15 | 2017-12-27 | Substrate board treatment |
Country Status (2)
| Country | Link |
|---|---|
| KR (1) | KR101946786B1 (en) |
| CN (1) | CN207587705U (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102670164B1 (en) * | 2018-12-24 | 2024-05-29 | 주식회사 케이씨텍 | Substrate processing apparatus |
| CN110142689B (en) * | 2019-04-17 | 2021-09-14 | 杭州众硅电子科技有限公司 | Wafer loading support, wafer loading system and wafer loading method |
| US11325223B2 (en) * | 2019-08-23 | 2022-05-10 | Applied Materials, Inc. | Carrier head with segmented substrate chuck |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3768352B2 (en) * | 1998-06-02 | 2006-04-19 | 株式会社荏原製作所 | Polishing device |
| JP2999192B1 (en) * | 1998-12-15 | 2000-01-17 | 三菱マテリアル株式会社 | Wafer loading device and wafer manufacturing method |
| JP4524084B2 (en) * | 2003-08-05 | 2010-08-11 | Ｓｕｍｃｏ Ｔｅｃｈｘｉｖ株式会社 | Semiconductor wafer loading device and loading method |
| KR101902049B1 (en) * | 2012-01-25 | 2018-09-27 | 어플라이드 머티어리얼스, 인코포레이티드 | Retaining ring monitoring and control of pressure |
-
2017
- 2017-02-15 KR KR1020170020680A patent/KR101946786B1/en active IP Right Grant
- 2017-12-27 CN CN201721861570.5U patent/CN207587705U/en active Active
Also Published As
| Publication number | Publication date |
|---|---|
| KR101946786B1 (en) | 2019-02-12 |
| KR20180094409A (en) | 2018-08-23 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN207587705U (en) | Substrate board treatment | |
| TWI752200B (en) | Vacuum suction pad and substrate holding device | |
| US20060194519A1 (en) | Wafer carrier with pressurized membrane and retaining ring actuator | |
| CN114274041B (en) | Double-side polishing apparatus and double-side polishing method | |
| EP1710047A2 (en) | Apparatus and methods for aligning a surface of an active retainer ring with a wafer surface during chemical mechanical polishing | |
| CN109773628A (en) | Handle the device and method on the surface of substrate | |
| US20030166383A1 (en) | Polishing apparatus | |
| TW493229B (en) | Method for polishing surface of semiconductor device substrate | |
| US11724357B2 (en) | Pivotable substrate retaining ring | |
| CN114227524A (en) | Double-side polishing apparatus and double-side polishing method | |
| KR20110137719A (en) | Apparatus for polishing rear surface of substrate, system for polishing rear surface of substrate, method for polishing rear surface of substrate and recording medium having program for polishing rear surface of substrate | |
| JP4531389B2 (en) | Polishing head and chemical mechanical polishing apparatus | |
| US20040072518A1 (en) | Platen with patterned surface for chemical mechanical polishing | |
| KR20070077971A (en) | Wafer loader and method for loading/unloading semiconductor wafer using the same | |
| KR102038508B1 (en) | Substrate processing apparatus | |
| KR102330274B1 (en) | Substrate stand device and substrate processing apparatus having the same | |
| CN209598937U (en) | Substrate board treatment | |
| CN207669081U (en) | The substrate loading device of chemical machinery polishing system | |
| US20120021673A1 (en) | Substrate holder to reduce substrate edge stress during chemical mechanical polishing | |
| KR102591914B1 (en) | Apparatus of loading substrate in chemical mechanical polishing system | |
| CN221211217U (en) | Substrate cleaning member and substrate processing apparatus | |
| KR20040074269A (en) | Chemical mechanical polishing apparatus | |
| KR20200071296A (en) | Substrate processing apparatus | |
| KR100553704B1 (en) | Chemical mechanical polishing apparatus and polishing pad used in the apparatus | |
| CN111266993A (en) | Retainer ring of carrier head for chemical mechanical polishing apparatus and carrier head having the same |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |