CN207669081U - The substrate loading device of chemical machinery polishing system - Google Patents

Abstract

The utility model is related to a kind of substrate loading device of chemical machinery polishing system, substrate loading device includes：Rack is used to place substrate；Alignment part, the inner faces contact with retainer ring, and retainer ring is made to be aligned to defined aligned position relative to substrate, it is hereby achieved that following advantageous effects：During loading substrate to carrier head, do not loaded accurately in the state of the deformation and damage of substrate.

Description

The substrate loading device of chemical machinery polishing system

Technical field

The utility model is related to a kind of substrate loading devices of chemical machinery polishing system, more specifically, are related to as follows A kind of substrate loading device of chemical machinery polishing system, by the substrate for being used to put into chemical mechanical milling tech load to It can accurately be loaded in the state of the deformation of not substrate and damage during carrier head.

Background technology

Chemical mechanical grinding (CMP) system is one kind in semiconductor element manufacturing process, in order to realize according to comprehensively flat Smoothization is improved with the wafer surface roughness of contact (the contact)/wiring UF membrane and integrated component that are used to form circuit Deng and in the device for the surface of wafer use when precise finiss processing, the global planarization refers to removal by by anti- The list caused by the bumps of (masking), etching (etching) and the wafer surface generated with Wiring technology etc. is sheltered again First region (cell) and the interregional difference in height of peripheral circuits.

CMP system is that wafer is loaded into carrier head is after 90s, such as Korean registered patent gazette the 10-1188579th As recording, the abradant surface of wafer is performed simultaneously on defined grinding flat plate while carrier head moves and passes through machine The mechanical lapping and the chemical grinding carried out by lapping liquid that tool friction carries out.

At this point, as shown in Figure 1, for carrier head 90, in chemical mechanical milling tech, for using bottom plate 92a to The film 92 of lower section pressurization wafer W is fixed on body part 91, and balancing gate pit 92C is formed between film 92 and body part 91, so as to With the wafer W that pressurizeed downwards by air pressure, air pressure is drawn by air pressure supply pipe 95a from pressure regulating part 95 Enter.Also, the retainer ring 93 for preventing wafer W to be detached from is provided with around film 92, to can be in chemical mechanical milling tech It is pressurizeed downwards retainer ring 93 by the air pressure of maintenance room 93C.

In addition, as shown in Figure 1, the loading attachment 1 for loading wafer W to carrier head 90 includes rack 10 and driving Portion MH, for rack 10 for placing wafer W, driving portion MH makes rack 10 be moved along upper and lower directions 10d.In other words, In the state of making wafer W be positioned over the middle section A1 of rack 10, as shown in Fig. 2, if so that rack 10 is upward Height 9H sizes as defined in square 10d1 movements, then carrier head 90 and rack 10 approach and apply to the through hole 95x in center and inhale Enter pressure, accordingly, wafer W becomes the state to be loaded in the form of the film bottom plate 92a for being tightly attached to carrier head 90.

But during without chemical mechanical milling tech, the pressure of the maintenance room 93C of carrier head 90 will not pass through Pressure regulating part 95 obtains accurate adjusting, and therefore, the retainer ring 93 of carrier head 90 is moved with the state hung low downwards.No Only so, it is difficult to the height with the error within 1mm to carrying out the height of mobile carrier head 90 by mobile driving portion M Carry out fine adjustment.

Therefore, even if so that the height of the rack 10 of loading attachment 1 is set as certain, the film bottom plate 92a of wafer W is held And be positioned over loading attachment 1 rack 10 wafer W between spacing e nor certain, therefore, in the spacing e ratios When defined spacing is big, have problems in that, will produce can not make the wafer W for being positioned over loading attachment 10 load to carrier First 90 mistake.

It is as described above in order to solve the problems, such as, in the prior art, as shown in Figures 3 and 4, propose a kind of following scheme：Make It obtains the movable contact 20 first contacted with the retainer ring 93 of carrier head 9 and wafer loading is set to the state flexibly supported by spring 30 The edge of device 1.Accordingly, it is contacted with movable contact 20 compared to the retainer ring 93 that the bottom plate of film 93 hangs low downwards, with carrier First 9 move downwards, while movable contact 20 is pressed by retainer ring 93, adsorb the bottom plate 92a and dress of the film 92 of fixed wafer W Carrying the gap between setting 1 wafer W can obtain more accurately adjusting.

But if the position of wafer W is slightly crooked on the rack 10 for placing wafer W, as shown in figure 5, The edge conflict of the bottom surface 93a and wafer W of retainer ring 93 while carrier head 9 moves downwards 9d, it is askew to the position of wafer W Tiltedly, it thus not only cannot accurately load to carrier head 9, but also there may be the serious problems for the damage for causing wafer W.

Accordingly, a variety of researchs have been carried out recently, for by wafer W from loading attachment 1 load to carrier head 9 when to eliminate The state of the damage possibility of wafer W is accurately loaded, still, also insufficient, it is therefore desirable to the exploitation to this.

Utility model content

The purpose of this utility model is to provide a kind of substrate loading devices of chemical machinery polishing system, enable to use It is loaded like clockwork to carrier head in the substrate of input chemical mechanical milling tech.

In particular, the purpose of this utility model is that, when substrate is loaded into carrier head, the side of substrate is eliminated from the root cause The conflict of edge and carrier head, to prevent substrate from breakage occurring in loading technique.

In addition, the purpose of this utility model is that, enable to stability and reliability to improve, and after loading substrate, Next technique is accurately controlled.

According to the preferred embodiment of the utility model for realizing the purpose of this utility model, substrate loading device For loading substrate to carrier head in chemical mechanical milling tech, carrier head includes film and retainer ring, and film is in contact with substrate, card Circle is configured at around film, and the substrate loading device includes：Rack is used to place substrate；Alignment part, with retainer ring Inner faces contact, and retainer ring is made to be aligned to defined aligned position relative to substrate.

It is intended that during the substrate for being used to put into chemical mechanical milling tech is loaded into carrier head, from The conflict that substrate and carrier head are eliminated in root, to prevent substrate from breakage occurring in loading technique.

In particular, in the utility model, before substrate to be loaded to the technique to carrier head so that alignment part and retainer ring it is interior Face contacts and retainer ring is made accurately to be aligned to defined aligned position relative to substrate, can obtain following advantageous effect accordingly Fruit:So that the substrate for putting into chemical mechanical milling tech is loaded like clockwork to carrier head.

Accordingly, the utility model can obtain following advantageous effects：In the loading process of substrate, it can prevent because of substrate With the position of carrier head (retainer ring) be misaligned and so that substrate load to mistake position or prevent due to the contact with retainer ring Lead to substrate edges damage or damaged.

As reference, the aligned in position of the retainer ring of opposing substrate can be carried out by following procedure：Make retainer ring (carrier Head) frame staggered relatively moves horizontally (place rack position fix vs carrier heads move horizontally) or makes rack with respect to retainer ring (carrier head) moves horizontally the eccentric distance (dislocation of the retainer ring of (carrier head position is fixed vs racks and moved horizontally) opposing substrate The distance of ground configuration) size.It depending on the situation, can also be by making retainer ring opposite carrier head move horizontally (carrier head Position fix vs retainer rings move horizontally) come carry out opposing substrate retainer ring aligned in position.

Furthermore it is preferred that flexibly realizing the aligned in position of the retainer ring of opposing substrate.Here, so-called flexibly realize phase The aligned in position of the retainer ring of substrate is referred to for example, after retainer ring opposite carrier head moves horizontally, utilizes the bullet of spring-like Property component elastic force (or the magnetic force generated by magnet) make retainer ring automatically restore to initial position (to contact with retainer ring in alignment part It is configured with the original position of retainer ring before), after the aligned in position of the retainer ring of opposing substrate so that retainer ring is restored to initial bit It sets, thus allows for continuous loading technique.

For example, may include support shaft and elastomeric spring, support shaft the lower part of rack vertically extend and with It can be arranged by the form that rolling member (for example, ball or roller bearing) is moved to horizontal direction, elastomeric spring is in the horizontal direction The form setting of upper effect elastic recovering force, so that support shaft moves in the horizontal direction, and extends in the support shaft of placement section Move in the horizontal direction, so as to carry out opposing substrate retainer ring aligned in position.At this point, week of the elastomeric spring in support shaft Enclose circumferentially in the form of separating configure it is multiple.

May include support shaft, clamping block and clip magnet, support shaft is under rack as another example Portion vertically extends and is arranged in the form of it can be moved to horizontal direction by rolling member (for example, ball or roller bearing), Clamping block is enclosed in the state separated around a part for support shaft or more, and clip magnet is set to support shaft and clamping More than any one in block, so that support shaft is supported in discontiguous state the inside of clamping block, and extend in putting The support shaft for setting portion moves in the horizontal direction, so as to carry out opposing substrate retainer ring aligned in position.At this point, clip magnet Circumferentially configuration is multiple in the form of separating around support shaft, and can also configure multiple and folder in support shaft Hold the facing axis magnet of magnet (acting on repulsion with clip magnet).

Alignment part is formed as such as lower structure：In order to load substrate, during carrier head is close to substrate, reached in retainer ring It, first can be with the inner faces contact of retainer ring before the upper surface of substrate.

More specifically, it is configured between substrate and retainer ring while the inner faces contact of alignment part and retainer ring.For this purpose, alignment Portion is formed to have the outer diameter bigger and smaller than the internal diameter of retainer ring than the diameter of substrate.Preferably, alignment part has the side than substrate Closely spaced width between face and the inner face of retainer ring, and the shape separated with the side with substrate between substrate and the retainer ring Formula configures.In this way, obtaining following advantageous effects by alloing alignment part to be configured in the form of the side with substrate separates： When retainer ring and alignment part contact, though caused by contact impact so that the posture of alignment part occur small crooked displacement or Deformation, will not impact to substrate and (not contacted with substrate), and the placement status of substrate is made to keep stablizing.

Preferably, alignment part is formed as the circumferentially continuous annular state along retainer ring.In this way, by making alignment part Be formed as annular state and following advantageous effects can be obtained：So that the power being in contact outside the inner face of retainer ring and alignment part point It dissipates, so that more steadily being carried out for the aligned process of the retainer ring of alignment part.It depending on the situation, can also be with such as Lower form is constituted：Multiple alignment parts are separatedly formed along the circumferencial direction of retainer ring, the inner faces contact of multiple alignment parts and retainer ring, And carry out the aligned process of retainer ring.

In addition, in the upper end of alignment part, guide the angular guide surfaces to aligned position in the form of tilting down retainer ring It is formed.

In this way, angular guide surfaces make the form guiding that the corner angle (the inside bottom surface corner angle of retainer ring) of retainer ring contact, accordingly, So that the process (aligned in position process) being in contact outside the inner face of retainer ring and alignment part more swimmingly carries out.

In addition, due to the bottom surface of not instead of retainer ring, the corner angle of the bottom surface of retainer ring are contacted with angular guide surfaces, therefore can be with Obtain following advantageous effects：Alignment part and the contact area of retainer ring can be made to minimize, and more mitigate contact impact.

Furthermore it is possible to form fluid injection portion in alignment part, fluid injection portion is by the upper surface of fluid injection to substrate.It is preferred that Ground, fluid injection portion is before substrate is loaded to carrier head by the upper surface of fluid injection to substrate.

In this way, loaded to before carrier head in substrate, fluid is sprayed to the upper surface of substrate, it is thus possible to which obtaining following has Sharp effect：The surface of substrate keeps moistening (wet) state before substrate is loaded, so as to improve the loading effect of substrate Rate, and the foreign matter that the upper surface of will be present in substrate is washed off in advance, to prevent secondary pollution of the carrier head by foreign matter.

In addition, the loading attachment of substrate includes：Measurement portion, to being applied to placement while retainer ring and alignment part contact The power of frame measures；Control unit, if the result as measured by measurement portion reaches defined a reference value, control unit makes The operation that substrate is loaded to carrier head stops.For example, measurement portion includes：Load cell, to being pressed downwards by alignment part The power of rack measures.

When the eccentric error of the retainer ring of opposing substrate is more than it is certain above when (eccentric error greatly to be difficult to by alignment part into The case where row aligned in position), even if being provided with alignment part, there is also the feelings of the aligned in position for the retainer ring for being difficult to carry out opposing substrate Condition.In this regard, in the utility model, the power applied to rack by alignment part when retainer ring pressurizes alignment part is measured, If the measurement result reaches defined a reference value, judge to be not carried out aligned in position, so that the loading work of substrate Skill stops, and can obtain following advantageous effects accordingly：In the feelings of the aligned in position technique for the retainer ring that can not possibly carry out opposing substrate Under condition, loading technique is interrupted, to prevent substrate damage and breakage.

Rack could be provided as to place the various structures of substrate, and the utility model is not the structure by rack Limitation limits.

For example, rack includes the placement plate of the bottom surface of supporting substrate, alignment part protrusion is formed in the upper surface of placement plate.This When, the retainer ring contact surface placed the placed side of substrate and contacted with the bottom surface of retainer ring, retainer ring contact are formed in the upper surface of placement plate Face is formed in the form of with the height lower than placed side.

As another example, rack includes：Placement plate configures in the form of the bottom surface with substrate separates；Side Edge placement section, is configured at the upper surface of placement plate, is supported to the bottom edge of substrate, and alignment part is formed in edge placement Portion.At this point, edge placement section can move up and down, and edge placement section obtains elastic branch up and down through elastomeric element Support.

In this way, for substrate, only bottom edge region is partly supported by edge placement section, so, make The contact area for obtaining rack and substrate minimizes, and to remain on dust, cleaning solution, the chemistry between rack and substrate The foreign matter of drug etc. is minimized, can make substrate damage caused by being increased by the contact area of rack and substrate minimum accordingly Change.

In addition, edge placement section is flexibly supported by elastomeric element, thus when retainer ring and edge placement section contact, Edge placement section can carry out resilient movement with plate staggered relatively, so, it can weaken and be led with the contact of edge placement section by retainer ring The impact force of cause.

Include as another example, rack again：Placement plate is used to support the bottom surface of substrate；Retainer ring placement section, It is configured at the outside of placement plate along the radial direction of placement plate, and is used to support the bottom surface of retainer ring, alignment part is formed in card Enclose placement section.At this point, retainer ring placement section can move up and down, and retainer ring placement section is obtained up and down through elastomeric element Resilient support.

In this way, retainer ring placement section is flexibly supported by elastomeric element, thus when retainer ring and retainer ring placement section contact, Retainer ring placement section can carry out resilient movement with plate staggered relatively, so, it can weaken and be led with the contact of retainer ring placement section by retainer ring The impact force of cause.In addition, for the structure, when retainer ring and retainer ring placement section contact, retainer ring placement section to elastomeric element into Row elastic compression can simultaneously make elastomeric element move specified interval to lower part direction, so as to film and substrate relatively The loading of substrate is realized in the state of configuration.

As described above, following advantageous effects can be obtained according to the utility model：It will be used to put into chemical mechanical grinding During the substrate of technique is loaded into carrier head, the conflict of substrate and carrier head is eliminated from the root cause, to prevent substrate from existing Occur in loading technique damaged.

In particular, following advantageous effects can be obtained according to the utility model：By substrate load to carrier head technique it Before so that the inner faces contact of alignment part and retainer ring simultaneously makes retainer ring opposing substrate accurately be aligned to defined aligned position, according to This so that the substrate for putting into chemical mechanical milling tech is loaded like clockwork to carrier head.

Accordingly, following advantageous effects can be obtained：In the loading process of substrate, it can prevent because of substrate and carrier head The position of (retainer ring) be misaligned and so that substrate load to mistake position or prevent from leading to substrate side because of the contact with retainer ring Edge damages or breakage.

In addition, following advantageous effects can be obtained according to the utility model：Flexibly realize the position of the retainer ring of opposing substrate Alignment is set, accordingly, after realizing the aligned in position of retainer ring of opposing substrate so that retainer ring is restored to initial position, so as to Enough carry out continuous loading technique.

In addition, following advantageous effects can be obtained according to the utility model：By making alignment part with the side with substrate The form configuration separated, accordingly, when retainer ring is contacted with alignment part, even if impact makes the posture of alignment part caused by contact Small crooked displacement or deformation occurs, will not impact and (not contacted with substrate) to substrate, and makes putting for substrate State is set to keep stablizing.

In addition, following advantageous effects can be obtained according to the utility model：To passing through alignment when retainer ring pressurizes alignment part The power that portion applies to rack measures, if the measurement result reaches defined a reference value, judges to be not carried out position Alignment is set, so that the loading technique of substrate stops, accordingly, in the aligned in position work for the retainer ring that can not possibly carry out opposing substrate In the case of skill, loading technique is interrupted, to prevent substrate damage and breakage.

In addition, following advantageous effects can be obtained according to the utility model：So that stability and reliability improve, and filling After carried base board, next technique is accurately controlled.

Description of the drawings

Fig. 1 is the figure for the composition for showing existing wafer loading attachment,

Fig. 2 is the figure for showing the carrier head of Fig. 1 and the close state of wafer,

Fig. 3 and Fig. 4 is the figure of the composition for the wafer loading attachment for showing other existing forms,

Fig. 5 is the enlarged drawing of the part Fig. 4 " A ",

Fig. 6 is the figure of the substrate loading device for illustrating chemical machinery polishing system according to the present utility model,

Fig. 7 and Fig. 8 is the figure for the process that the alignment part for illustrating through Fig. 6 is aligned retainer ring,

Fig. 9 is the figure of the alignment part angular guide surfaces for definition graph 6,

Figure 10 and Figure 11 is the figure for the horizontal shift structure of the rack of definition graph 6,

Figure 12 to Figure 15 is the base of the chemical machinery polishing system for illustrating other embodiment according to the present utility model The figure of plate loading attachment.

Specific implementation mode

The preferred embodiment of the utility model is described in detail referring to the drawings, but the utility model is not by reality Apply the limitation or restriction of example.As reference, in the present note, identical label substantially refers to identical element, in the rule Under then, the content of other accompanying drawings can be recorded in illustrate by reference, and can be omitted and be judged as to affiliated technology Apparent or repetition content for the practitioner in field.

With reference to Fig. 6 to Figure 11, the substrate loading device of chemical machinery polishing system according to the present utility model be in order to Substrate 10 is loaded to carrier head 100 in chemical mechanical milling tech and is arranged, carrier head 100 includes film 192 and retainer ring 193, Film 192 is contacted with substrate 10, and retainer ring 193 is configured at around film 192, the substrate loading device of the chemical machinery polishing system Including：Rack 200 is used to place substrate 10；Alignment part 300, the inner faces contact with retainer ring 193, and make retainer ring 193 are aligned to defined aligned position relative to substrate 10.

After the loading that substrate loading device obtains substrate 10, lapping liquid is supplied to being set to grinding flat plate carrier head 100 Under grinding pad (not shown) states above on (not shown), pressurization substrate 10 simultaneously carries out chemical mechanical milling tech, utilizes After the chemical mechanical milling tech of grinding pad and lapping liquid, substrate 10 is transferred to cleaning device.

As reference, in the present invention, substrate 10 can be understood as the grinding object that can be ground on grinding pad Object, the utility model are not limited or restriction by the type and feature of substrate 10.It is, for example, possible to use wafer is as substrate 10.

Carrier head 100 includes：Body part 191 is arranged in the form of it can rotate；Film 192, is set to body part 191 bottom surface；And retainer ring 193, the edge part of body part 191 is incorporated into the form of being configured at around film 192, and Substrate 10 is prevented to be detached from.

Film 192 can be set as various structures according to desired condition and design pattern.For example, multiple traps are (for example, ring The trap of form) it can be formed in film 192, it can be provided with along this between body part 191 and film 192 by multiple traps The divided multiple balancing gate pit 192C of radial direction in body portion 191.

It can be respectively arranged to measure the pressure sensor of pressure in each balancing gate pit 192C.Each balancing gate pit 192C's Pressure can obtain an other adjusting by the control of pressure control portion 195, and pass through the pressure to each balancing gate pit 192C It is adjusted and the pressure for the substrate 10 that pressurizes can be adjusted individually.

Central part balancing gate pit 195X can be formed in the central part of carrier head 100, central part balancing gate pit 195X passes through film 192 Opening be formed through.Central part balancing gate pit 195X is directly connected to substrate 10 and acts on inhalation power, so that substrate 10 is tight It is affixed on the film 192 of carrier head 100, so as to load substrate 100.

Rack 200 is to be arranged to being placed for the substrate 10 of loading.For example, rack 200 is with energy Enough forms lifted along upper and lower directions are arranged, and the substrate 10 for loading is placed on the top of rack 200.According to circumstances Difference, to rack be fixed and make carrier head by with rack it is neighbouring in the form of move, so as to which substrate is filled It is loaded onto carrier head, unlike, it is also possible that rack and carrier head are mobile simultaneously, to be loaded to substrate.

As reference, when loading substrate 10, as rack 200 is moved upward in the lower part of carrier head 100, carrier First 100 retainer ring 193 can be contacted first with the upper surface of rack 200, and if between the upper surface of rack 200 and film 192 Spacing close to more than certain level, then substrate 10 can be made to load to carrier head 100 by the sucking pressure of carrier head 100.

Rack 200 could be provided as to place the various structures of substrate 10, and the structure and characteristic of rack 200 can be with Numerous variations are carried out according to desired condition and design pattern.For example, in rack 200, place substrate 10 region and with card The region of 193 contact of circle can be formed as one the form of connection or the form of separation.

For example, referring to Fig. 6 and Fig. 7, rack 200 includes the placement plate 210 of the bottom surface of supporting substrate 10.

Placement plate 210 is formed in the form of flat above, and is formed in the upper surface of placement plate 210 and is placed substrate 10 Placed side 212 and 193 contact surface 214 of retainer ring contacted with the bottom surface of retainer ring 193.At this point, 193 contact surface 214 of retainer ring can be with shape As with the height lower than placed side 212.Specifically, substrate 10 is placed on is arranged in the upper surface of rack 200 central portion Placed side 212, retainer ring 193 contacts with 193 contact surface 214 of retainer ring being arranged in the upper surface of rack 200 edge part.

Moreover, placement plate 210 can be lifted by being connected to the lifting shaft of its bottom surface along upper and lower directions, and lifting shaft It can be lifted by the driving portion MH of similar motor.As reference, the lifting structure of placement plate 210 can be according to requiring Numerous variations occur for condition and design pattern, and the utility model is not limited or restriction by the lifting structure of placement plate 210.

The inner faces contact of alignment part 300 and retainer ring 193, be in order to enable 193 opposing substrate 10 of retainer ring is aligned to as defined in Aligned position and be arranged.For example, the protrusion of alignment part 300 is formed in the upper surface of placement plate 210.

Here, so-called alignment part 300 makes 193 opposing substrate 10 of retainer ring be aligned to defined aligned position and be defined as, When the upper contact of carrier head 100 (retainer ring) and rack 200, the position of the retainer ring 193 of opposing substrate 10 is adjusted to card The position that the bottom surface of circle 193 does not conflict with the edge of substrate 10.

In this way, when making rack 200 and retainer ring 193 (carrier head) close to each other for the loading technique of substrate 10, Inner faces contact of the alignment part 300 first with retainer ring 193 is aligned in and 10 discontiguous aligned position (plane of substrate in retainer ring 193 When projection and 10 discontiguous position of substrate) in the state of so that the configuration of retainer ring 193 (being contacted with the upper surface of rack 200) in The periphery of substrate 10 can obtain following advantageous effects accordingly：Retainer ring 193 and the contact of substrate 10 are prevented in advance and prevent substrate 10 damage and breakage.

At this point, the aligned in position of the retainer ring 193 of opposing substrate 10 can be by making 193 opposite carrier head of retainer ring, 100 water Eccentric distance (the dislocation ground configuration of the retainer ring 193 of dynamic (carrier head position is fixed vs retainer rings and the moved horizontally) opposing substrate 10 of translation Distance) size carries out.It depending on the situation, can also be by making retainer ring (carrier head) frame staggered relatively move horizontally (placing rack position fixation vs carrier heads to move horizontally) or so that rack moves horizontally (carrier head with respect to retainer ring (carrier head) Position fix vs racks move horizontally) come carry out opposing substrate retainer ring aligned in position.

Furthermore it is preferred that flexibly realizing the aligned in position of the retainer ring 193 of opposing substrate 10.Here, so-called flexibly real The aligned in position of the retainer ring 193 of existing opposing substrate 10 refers to for example, after 193 opposite carrier head 100 of retainer ring moves horizontally, Retainer ring 193 is set to automatically restore to initially using the elastic force (or the magnetic force generated by magnet) of the elastomeric element 240' of spring-like Position (original position that retainer ring 193 is configured with before alignment part 300 is contacted with retainer ring 193), in the retainer ring of opposing substrate 10 After 193 aligned in position so that retainer ring 193 is restored to initial position, thus allows for continuous loading technique.

May include support shaft 120 and elastomeric spring 145, support shaft 120 is under rack 200 for example, referring to Figure 10 Portion vertically extends and is arranged in the form of it can be moved to horizontal direction by rolling member (for example, ball or roller bearing), Elastomeric spring 145 is arranged in the form of acting on elastic recovering force in the horizontal direction, so that support shaft 120 is moved in the horizontal direction It is dynamic, and extension is moved in the horizontal direction in the support shaft 120 of placement section, so as to carry out the retainer ring 193 of opposing substrate 10 Aligned in position.At this point, circumferentially configuration is multiple in the form of separating around support shaft for elastomeric spring.

As another example, referring to Fig.1 1, may include support shaft 120a, clamping block 140 and clip magnet 225, 245, support shaft 120a vertically extend in the lower part of rack 200 and with can be by rolling members (for example, ball or rolling Axis) to horizontal direction move form setting, clamping block 140 with the state separated be enclosed in a part of support shaft 120a with On around, clip magnet 225,245 is set in support shaft and clamping block 140 more than any one, so as to support shaft with Discontiguous state is supported in the inside of clamping block 140, and extends and moved in the horizontal direction in the support shaft 120a of placement section It is dynamic, so as to carry out opposing substrate 10 retainer ring 193 aligned in position.At this point, clip magnet around support shaft along Circumferencial direction is configured multiple in the form of separating, and can also be configured in support shaft 120a multiple facing with clip magnet Axis magnet (acts on repulsion) with clip magnet.

Alignment part 300 is formed as such as lower structure：In order to load substrate 10, during carrier head 100 is close to substrate 10, It, first can be with the structure of the inner faces contact of retainer ring 193 before retainer ring 193 reaches the upper surface of substrate 10.

More specifically, be configured at while the inner faces contact of alignment part 300 and retainer ring 193 substrate 10 and retainer ring 193 it Between.For this purpose, alignment part 300 is formed to have the outer diameter bigger and smaller than the internal diameter of retainer ring 193 than the diameter of substrate 10.Preferably, Alignment part 300 has the width L2 smaller than the spacing L1 between the side of substrate 10 and the inner face of retainer ring 193, and in 10 He of substrate It is configured in the form of the side with substrate 10 separates between the retainer ring 193.In this way, by make alignment part 300 with substrate The form that 10 side separates configures and can obtain following advantageous effects：When retainer ring 193 and alignment part 300 contact, even if Impact makes the posture of alignment part 300 that small crooked displacement or deformation occur caused by contact, will not be made to substrate 10 It (is not contacted with substrate 10) at influence, and the placement status of substrate 10 is made to keep stablizing.

Preferably, alignment part 300 is formed as the circumferentially continuous annular state along retainer ring 193.In this way, by making Alignment part 300 is formed as annular state and can obtain following advantageous effects：So that inner face and the alignment part 300 of retainer ring 193 is outer The power dispersion that face is in contact, so that more steadily being carried out for the aligned process of the retainer ring 193 of alignment part 300.According to The difference of situation can also be constituted in the form of following：Multiple alignment parts are separatedly formed (along circle along the circumferencial direction of retainer ring 3 to the 6 ring slicing forms that circumferential direction is separated from each other), the inner faces contact of multiple alignment parts and retainer ring, and carry out retainer ring Aligned process.

It is further preferable that with reference to Fig. 9, in the upper end of alignment part 300, the inclination of retainer ring 193 guiding to aligned position is drawn Guide face 400 is formed in the form of tilting down.

In this way, angular guide surfaces 400 are so that the shape that the corner angle (the inside bottom surface corner angle of retainer ring 193) of retainer ring 193 contact Formula guides, accordingly so that the process (aligned in position process) that the inner face of retainer ring is in contact with the outside of alignment part 300 is more smooth Ground carries out.

In addition, due to the bottom surface of not instead of retainer ring 193, corner angle and the angular guide surfaces 400 of the bottom surface of retainer ring 193 connect It touches, therefore following advantageous effects can be obtained：Alignment part 300 and the contact area of retainer ring 193 can be made to minimize, and more Add mitigation contact impact.

At this point, angular guide surfaces 400 can be formed as rectilinear configuration, but depending on the situation can also be by inclined lead Face is formed as tracing pattern.

Furthermore it is possible to form fluid injection portion (not shown) in alignment part 300, fluid injection portion is by fluid injection to substrate The upper surface of 10.Preferably, fluid injection portion before substrate is loaded to carrier head by the upper surface of fluid injection to substrate.

For example, fluid injection portion can be formed in the inside of alignment part to spray the pore morphology of fluid.According to circumstances not Together, fluid injection portion can also be formed in the outside of alignment part with nozzle-type.

In this way, loaded to before carrier head in substrate, fluid is sprayed to the upper surface of substrate, it is thus possible to which obtaining following has Sharp effect：The surface of substrate keeps moistening (wet) state (improving surface tension) before substrate is loaded, so as to improve The efficiency of loading of substrate, and the foreign matter that the upper surface of will be present in substrate is washed off in advance, to prevent carrier head by foreign matter Secondary pollution.

In addition, substrate loading device includes：Measurement portion, to being applied to while retainer ring 193 is contacted with alignment part 300 The power of rack 200 measures；Control unit 500, if the result as measured by measurement portion reaches defined a reference value, Control unit makes the operation for loading substrate 10 to carrier head 100 stop.

Measurement portion can use can be more to being measured with power caused by the contact of alignment part 300 by retainer ring 193 Kind measuring device.For example, measurement portion includes load cell, load cell by alignment part 300 to pressing downwards rack 200 power measures.

When the eccentric error of the retainer ring 193 of opposing substrate 10 is more than it is certain above when (eccentric error is greatly to being difficult to by right The case where neat portion 300 carries out aligned in position), even if being provided with alignment part 300, there is also be difficult to carry out the retainer ring of opposing substrate 10 The case where 193 aligned in position.In this regard, in the utility model, to passing through alignment part 300 when retainer ring 193 pressurizes alignment part 300 The power applied to rack 200 measures, if the measurement result reaches defined a reference value, judges to be not carried out position Alignment is set, so that the loading technique of substrate 10 stops, following advantageous effects can be obtained accordingly：It can not possibly carry out relatively In the case of the aligned in position technique of the retainer ring 193 of substrate 10, loading technique is interrupted, to prevent substrate 10 from damaging and breakage.

May include the police for generating alarm signal in addition, if interrupting the loading technique of substrate 10 by control unit 500 Report generating unit.Here, alarm signal acoustically that so-called alarm signal, which may include common audio device, to be sent out and logical It is at least one in the visual alarm signal that normal emergency warning lamp is sent out, and in addition to this can also utilize and enable to use Person recognizes other different a variety of alarm signals of the loading technique disrupted condition of substrate 10.

In addition, Figure 12 to Figure 15 is the chemical machinery polishing system for illustrating other embodiment according to the present utility model Substrate loading device figure.Meanwhile it being assigned for identical as aforementioned composition and suitable same section same or equivalent identical Reference numeral, and omit detailed description thereof.

Other embodiment according to the present utility model is placed the region of substrate 10 and is connect with retainer ring 193 in rack 200 Tactile region could be provided as the structure being separated from each other.

For example, referring to Figure 12 and Figure 13, the substrate loading device of other embodiment according to the present utility model includes placing Frame 200 and alignment part 300, also, rack 200 includes：Placement plate 210' matches in the form of the bottom surface with substrate 10 separates It sets；Edge placement section 230', is configured at the upper surface of placement plate 210', is supported to the bottom edge of substrate 10, alignment part 300 are formed in edge placement section 230'.

At edge, the top of placement section 230' is formed with alignment part 300, the inner faces contact of alignment part 300 and retainer ring 193, and So that 193 opposing substrate 10 of retainer ring is aligned to defined aligned position.In addition, in the upper end of alignment part 300, retainer ring 193 is drawn The angular guide surfaces for being directed at aligned position are formed (with reference to the 302 of Fig. 9) in the form of tilting down.

At this point, edge placement section 230' can be moved up and down, and edge placement section 230' up and down through bullet Property component 240' is flexibly supported.

Edge placement section 230' can be set as various structures according to desired condition and design pattern.For example, can edge The multiple edge placement section 230' detached in the form of separating are arranged in the circumferencial direction for retainer ring 193.As another example, side Edge placement section 230' could be provided as the annular state of the circumferencial direction along retainer ring 193.

As elastomeric element 240', common spring members can be used.Depending on the situation, pneumatics can also be utilized Or hydraulic pressure replaces spring members, so that weakened with impact force caused by the contact of edge placement section by retainer ring.

In this way, for substrate 10, only bottom edge region is partly supported by edge placement section 230', institute With so that the contact area of rack 200 and substrate 10 minimizes, and to remain between rack 200 and substrate 10 The foreign matter of dust, cleaning solution, chemicals etc. is minimized, can make accordingly by the contact area of rack 200 and substrate 10 The damage of substrate 10 caused by increasing minimizes.

In addition, edge placement section 230' is flexibly supported by elastomeric element 240', to be put with edge when retainer ring 193 When setting portion 230' contacts, edge placement section 230' can carry out resilient movement with plate 210' staggered relatively, so, it can weaken by card Circle 193 and impact force caused by the contact of edge placement section 230'.

As another example, 4 and Figure 15, the substrate of other embodiment according to the present utility model load dress referring to Fig.1 It sets including rack 200 and alignment part 300, and rack 200 includes：Placement plate 210 ", it is used to support the bottom surface of substrate； Retainer ring placement section 230 ", along the outside of placement plate 210 " radial direction be configured at placement plate 210 ", and it is used to support The bottom surface of retainer ring 193, alignment part 300 are formed in retainer ring placement section 230 ".

In retainer ring placement section 230 " top be formed with alignment part 300, the inner faces contact of alignment part 300 and retainer ring 193, and So that 193 opposing substrate 10 of retainer ring is aligned to defined aligned position.In addition, in the upper end of alignment part 300, retainer ring 193 is drawn The angular guide surfaces 400 for being directed at aligned position are formed (with reference to the 302 of Fig. 9) in the form of tilting down.

" can be moved up and down, and retainer ring placement section 230 " at this point, retainer ring placement section 230 up and down through bullet Property component 240' is flexibly supported.

Retainer ring placement section 230 " can be set as various structures according to desired condition and design pattern.For example, can edge The multiple retainer ring placement sections 230 detached in the form of separating are arranged in the circumferencial direction for retainer ring 193 ".As another example, block Circle placement section 230 " could be provided as the annular state of the circumferencial direction along retainer ring 193.

As elastomeric element 240', common spring members can be used.Depending on the situation, pneumatics can also be utilized Or hydraulic pressure replaces spring members, so that weakened with impact force caused by the contact of retainer ring placement section by retainer ring.

It " is flexibly supported by elastomeric element 240', to be put with retainer ring when retainer ring 193 in this way, retainer ring placement section 230 Set portion 230 " when contact, retainer ring placement section 230 " can be with plate 210 staggered relatively " carries out resilient movement, so, it can weaken by card Circle 193 and retainer ring placement section 230 " contact caused by impact force.In addition, for the structure, retainer ring 193 and retainer ring are placed Portion 230 " when contact, retainer ring placement section 230 " carries out elastic compression to elastomeric element 240' and elastomeric element 240' can be made downward Specified interval is moved in portion direction, so as to realize substrate 10 in the state that film 192 and substrate 10 relatively configure It loads.

As discussed above, it should be understood that although the preferred embodiment with reference to the utility model is illustrated, such as Fruit is the those skilled in the art of technical field, is not departing from the utility model recorded in following claims In the range of thought and field a variety of modifications and changes can be carried out to the utility model.

Label declaration

10：Substrate 100：Carrier head

192：Film 193：Retainer ring

200：Rack 210,210', 210 "：Placement plate

230'：Edge placement section 230 "：Retainer ring placement section

240'、240"：Elastomeric element 300：Alignment part

302：Angular guide surfaces 400：Measurement portion

500：Control unit

Claims (19)

1. a kind of substrate loading device of chemical machinery polishing system is used for as in chemical mechanical milling tech by substrate It loads to the substrate loading device of carrier head, carrier head includes film and retainer ring, and film is in contact with substrate, and retainer ring is configured at the film Around, the substrate loading device of the chemical machinery polishing system is characterised by comprising：

Rack is used to place substrate；

Alignment part, the inner faces contact with retainer ring, and the retainer ring is made to be aligned to defined alignment relative to the substrate Position.

2. the substrate loading device of chemical machinery polishing system according to claim 1, which is characterized in that

The alignment part is configured at while being in contact with the inner face of the retainer ring between the substrate and the retainer ring.

3. the substrate loading device of chemical machinery polishing system according to claim 2, which is characterized in that

The alignment part has than the closely spaced width between the side and the inner face of the retainer ring of the substrate, and in institute It states and is configured in the form of the side with the substrate separates between substrate and the retainer ring.

4. the substrate loading device of chemical machinery polishing system according to claim 1, which is characterized in that

The alignment part is formed as the circumferentially continuous annular state along the retainer ring.

5. the substrate loading device of chemical machinery polishing system according to claim 1, which is characterized in that

Along the circumferencial direction of the retainer ring, multiple alignment parts are separatedly set.

6. the substrate loading device of chemical machinery polishing system according to claim 1, which is characterized in that

The upper-end contact of the corner angle of the retainer ring and the alignment part, and be formed with the card in the upper end of the alignment part Circle is guided to the angular guide surfaces of the aligned position.

7. the substrate loading device of chemical machinery polishing system according to claim 1, which is characterized in that

It is formed with fluid injection portion in the alignment part, fluid injection portion is by the upper surface of fluid injection to the substrate.

8. the substrate loading device of chemical machinery polishing system according to claim 7, which is characterized in that

The fluid injection portion is before the substrate is loaded to the carrier head by the upper surface of fluid injection to the substrate.

9. the substrate loading device of chemical machinery polishing system as claimed in any of claims 1 to 8, feature exist In,

The rack includes placement plate, and placement plate is used to support the bottom surface of the substrate,

The alignment part protrusion is formed in the upper surface of described placement plate.

10. the substrate loading device of chemical machinery polishing system according to claim 9, which is characterized in that

It is formed with placed side and retainer ring contact surface in the upper surface of described placement plate, placed side is in contact with the bottom surface of the substrate, Retainer ring contact surface is formed in the height lower than the placed side and is in contact with the bottom surface of the retainer ring.

11. the substrate loading device of chemical machinery polishing system as claimed in any of claims 1 to 8, spy exists In the rack includes：

Placement plate configures in the form of the bottom surface with the substrate separates；

Edge placement section is configured at the upper surface of described placement plate, is supported to the bottom edge of the substrate,

The alignment part is formed in the edge placement section.

12. the substrate loading device of chemical machinery polishing system according to claim 11, which is characterized in that including：

Elastomeric element flexibly supports the edge placement section in the form of it can move up and down.

13. the substrate loading device of chemical machinery polishing system as claimed in any of claims 1 to 8, spy exists In the rack includes：

Placement plate is used to support the bottom surface of the substrate；

Retainer ring placement section, the outside of the placement plate is configured at along the radial direction of the placement plate, and is used to support The bottom surface of the retainer ring,

The alignment part is formed in the retainer ring placement section.

14. the substrate loading device of chemical machinery polishing system according to claim 13, which is characterized in that including：

Elastomeric element flexibly supports the retainer ring placement section in the form of it can move up and down.

15. the substrate loading device of chemical machinery polishing system as claimed in any of claims 1 to 8, spy exists In, including：

Measurement portion, the power to being applied to the rack while retainer ring is contacted with the alignment part measure；

Control unit, if the result as measured by the measurement portion reaches defined a reference value, control unit makes to described The operation that carrier head loads the substrate stops.

16. the substrate loading device of chemical machinery polishing system according to claim 15, which is characterized in that the measurement Portion includes：

Load cell, the power to pressing the rack downwards by the alignment part measure.

17. the substrate loading device of chemical machinery polishing system as claimed in any of claims 1 to 8, feature It is,

At least any one is arranged in the form of it can move horizontally in the rack and the carrier head.

18. the substrate loading device of chemical machinery polishing system according to claim 17, which is characterized in that including：

Support shaft vertically extends, to be supported to the rack；

Elastomeric spring is arranged in the form of acting on elastic recovering force in the horizontal direction, so that the support shaft is along level side To movement.

19. the substrate loading device of chemical machinery polishing system according to claim 17, which is characterized in that including：

Support shaft vertically extends, to be supported to the rack；

Block is clamped, is enclosed in around a part for the support shaft or more with the state separated；

Clip magnet is set to any one in the support shaft and the clamping block or more, so as to the support shaft with Discontiguous state is supported in the inside of the clamping block.