CN111266993A - Retainer ring of carrier head for chemical mechanical polishing apparatus and carrier head having the same - Google Patents
Retainer ring of carrier head for chemical mechanical polishing apparatus and carrier head having the same Download PDFInfo
- Publication number
- CN111266993A CN111266993A CN201811580191.8A CN201811580191A CN111266993A CN 111266993 A CN111266993 A CN 111266993A CN 201811580191 A CN201811580191 A CN 201811580191A CN 111266993 A CN111266993 A CN 111266993A
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- China
- Prior art keywords
- carrier head
- snap ring
- retainer
- outer side
- flap
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Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
- B24B37/32—Retaining rings
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
Abstract
The invention relates to a snap ring of a carrier head for a chemical mechanical polishing device and a carrier head with the same, wherein the carrier head comprises: a carrier head body; a diaphragm mounted on the lower surface of the carrier head body for pressing the substrate against the polishing pad; an elongate flap extending on an outer side of the septum; and the clamping ring is arranged on the extension flap and used for restraining the side surface of the substrate.
Description
Technical Field
The present invention relates to a retainer ring of a carrier head for a chemical mechanical polishing apparatus and a carrier head having the retainer ring, and more particularly, to a retainer ring of a carrier head for a chemical mechanical polishing apparatus and a carrier head having the retainer ring, which can minimize a lifting phenomenon of the retainer ring and prevent a substrate from being separated during a polishing process.
Background
A Chemical Mechanical Polishing (CMP) apparatus is an apparatus for precisely polishing a wafer surface in order to remove wide planarization in which a height difference occurs between a cell region and a peripheral circuit region due to irregularities on the wafer surface generated by repeatedly performing masking, etching, and wiring processes, etc., and to improve the surface roughness of the wafer due to contact/wiring film separation for circuit formation and high integrated componentization, etc., in a semiconductor device manufacturing process.
In such a CMP apparatus, the carrier head presses the wafer before and after the polishing process in a state where the polishing surface of the wafer faces the polishing pad, thereby performing the polishing process, and after the polishing process is completed, the carrier head directly or indirectly vacuum-adsorbs the wafer and transfers the wafer to the next process in a held state.
Referring to fig. 1 and 2, a carrier head 1 includes: a body portion 110; a base part 120 rotating together with the body part 110; a snap ring 130 installed in a ring shape surrounding the base part 120 to be movable up and down, and rotating together with the base part 120; a diaphragm 140 made of an elastic material and fixed to the base 120, and forming pressure chambers C1, C2, C3, C4, and C5 in a space between the diaphragm and the base 120; and a pressure control part 150 that adjusts pressure while supplying or discharging air to the pressure chambers C1, C2, C3, C4, and C5 through the air pressure supply passage 155.
The diaphragm 140 made of an elastic material is bent at the edge end of a flat base plate 141 for pressing the wafer W to form a side surface (not shown). A plurality of partition walls 143 in a ring shape fixed to the base portion 120 are formed between the center and the side surface of the diaphragm 140, and a plurality of pressure chambers C1, C2, C3, C4, and C5 are arranged in a concentric circle shape with respect to the partition walls 143.
Therefore, in the chemical mechanical polishing step, the pressure chambers C1, C2, C3, C4, and C5 are inflated by the air pressure received from the pressure control unit 150, and the plate surface of the wafer W is pressurized by the membrane substrate 141.
At the same time, the lower surface 130s of the retainer ring 130, which rotates together with the body 110 and the pedestal 120, also presses and rotates the polishing pad 11, thereby preventing the wafer W surrounded by the retainer ring 130 from being separated from the carrier head 1.
On the other hand, in the polishing process of the wafer W, the wafer W revolves while rotating at a high speed, and a wafer detachment phenomenon, that is, a slip-out phenomenon, occurs in which the wafer W is detached from the carrier head 1 due to a centrifugal force generated at the time of high-speed rotation.
In particular, if the posture of the retainer ring 130 is inclined in the polishing step, the retainer ring 130 for preventing the wafer W from being detached is lifted up LT away from the polishing pad 11 as shown in fig. 2, and thus there is a problem that the wafer falls down into a space between the lower surface of the retainer ring 130 and the polishing pad 11 and is detached.
As described above, in the polishing process of the wafer W, the tilt LT phenomenon of the retainer ring 130 should be minimized in order to minimize the slip-out phenomenon of the wafer W, but conventionally, unlike the diaphragm 140 having a soft (flexible) property, the retainer ring 130 has a property close to a rigid body (rigid), and thus there is a problem in that the retainer ring 130 is partially tilted from the polishing pad 11 in the polishing process.
In other words, since the diaphragm 140 that presses the wafer W against the polishing pad 11 has a soft property (a property of being easily deformed and easily bent), even if the posture of the carrier head 1 is inclined in the polishing step, the diaphragm can be deformed in accordance with the posture change of the carrier head 1, and the state of pressing the wafer W against the polishing pad 11 can be uniformly maintained. In contrast, since the snap ring 130 is formed in a structure that cannot be deformed or bent in accordance with the posture change of the head 1, if the posture of the head 1 is slightly inclined, there is a problem in that the snap ring 130 is lifted.
For this reason, various studies have been recently made to minimize the warpage phenomenon of the retainer ring and to minimize the wafer detachment, but these studies are far from sufficient and development thereof is required.
Disclosure of Invention
Technical problem
The invention aims to provide a retainer ring of a carrier head for a chemical mechanical polishing device and the carrier head with the retainer ring, which can minimize the tilting phenomenon of the retainer ring and prevent a substrate from being separated in a polishing process.
In particular, the present invention aims to provide a snap ring with deformable properties.
Further, the present invention aims to improve stability and reliability.
Further, the present invention aims to improve workability and assemblability of a retainer ring and to improve the close contact of the retainer ring with a polishing pad.
Further, the present invention aims to simplify the replacement process of the snap ring and to shorten the time required for the replacement process.
In addition, the present invention aims to improve productivity and yield and to reduce manufacturing cost.
In addition, the invention aims to uniformly control the pressure of the clamp ring on the polishing pad, thereby improving the polishing quality.
Technical scheme
To achieve the above object, according to a preferred embodiment of the present invention, there is provided a carrier head including: a carrier head body; a diaphragm mounted on the lower surface of the carrier head body for pressing the substrate against the polishing pad; an elongate flap extending on an outer side of the septum; and the clamping ring is arranged on the extension flap and used for restraining the side surface of the substrate.
In the present specification and claims, "deformable property" and terms similar thereto are defined as a property that allows one or more of compression deformation, collapse deformation and distortion deformation by means of an external force such as a force applied in a grinding process. For example, it means a material having a lower compression rigidity, torsional rigidity, and collapse rigidity than a metal material.
Effects of the invention
As described above, according to the present invention, the advantageous effects of minimizing the snap ring from lifting up and preventing the substrate from being detached in the polishing process can be obtained.
Particularly, according to the present invention, by making the snap ring have a deformable property, an advantageous effect of minimizing the tilting phenomenon of the snap ring can be obtained.
In addition, according to the present invention, an advantageous effect of improving stability and reliability can be obtained.
According to the present invention, it is possible to obtain advantageous effects of improving workability and assemblability of the retainer ring and improving the close contact degree of the retainer ring with the polishing pad.
Further, according to the present invention, the advantageous effects of simplifying the replacement process of the snap ring and shortening the time required for the replacement process can be obtained.
According to the present invention, the productivity and yield can be improved, and the manufacturing cost can be reduced.
According to the invention, the beneficial effects of uniformly controlling the pressure of the clamp ring on the grinding pad and improving the grinding quality can be obtained.
Drawings
Figure 1 is a half-sectional view illustrating a conventional carrier head,
figure 2 is an enlarged view of portion "a" of figure 1,
figure 3 is a diagram illustrating a carrier head of the present invention,
figure 4 is an enlarged view of portion "B" of figure 3,
figure 5 is a bottom view of a carrier head useful in explaining the present invention,
FIG. 6 is a view for explaining a snap ring as a carrier head of the present invention,
fig. 7 is a view for explaining the constraining section of the carrier head according to the present invention.
[ reference numerals ]
100: the carrier head 101: bearing head body
110: the body portion 120: base part
130: snap ring 131: clasp body
132: inclined contact surface 134: horizontal contact surface
136: storage section 137: inclined outer side part
138: vertical outer side 139: guide hole
140: the diaphragm 145: extended petal
146: upper flap 147: lower valve
145 a: inclined lobe portion 145 b: horizontal petal part
145 c: projecting lobe portion 160: guard ring
162: the inclined guide portion 164: vertical guide part
166: the guide pin 170: restraining part
Detailed Description
Preferred embodiments of the present invention will be described in detail below with reference to the accompanying drawings, but the present invention is not limited or restricted by the embodiments. In the present description, the same reference numerals designate substantially the same elements, and under such a rule, description may be made with reference to contents described in other figures, and contents that are judged to be self-evident or duplicated by a practitioner may be omitted.
Fig. 3 is a view for explaining a carrier head of the present invention, and fig. 4 is an enlarged view of a portion "B" of fig. 3. Fig. 5 is a bottom view of a carrier head according to the present invention, fig. 6 is a view for explaining a snap ring as a carrier head according to the present invention, and fig. 7 is a view for explaining a restraining portion as a carrier head according to the present invention.
Referring to fig. 3 to 7, the carrier head 100 of the present invention includes: a carrier head body 101; a diaphragm 140 attached to the lower surface of the carrier head body 101 and configured to press the substrate W against the polishing pad 11; an elongate flap 145 extending on the outside of the septum 140; and a retainer ring 130 attached to the extension piece 145 to restrain a side surface of the substrate W.
This is to minimize the lift-up of the retainer ring 130 and to prevent the substrate W from being detached during the polishing process.
That is, in the polishing process of the substrate, in order to minimize the slip-out phenomenon of the substrate W, the lift-up phenomenon of the retainer ring should be minimized, but conventionally, unlike a diaphragm having a soft (flexible) property, the retainer ring has a behavior similar to a rigid body (rigid), and thus there is a problem in that, if the carrier head undergoes a displacement of being lifted up due to friction with the polishing pad in the polishing process, the retainer ring also undergoes a phenomenon of being partially lifted up from the polishing pad in synchronization with the tilt displacement of the carrier head.
In other words, since the diaphragm that presses the substrate against the polishing pad has a soft property (deformable or bendable property), even if the posture of the carrier head is inclined in the polishing step, the diaphragm can be deformed in accordance with the change in the posture of the carrier head, and the state in which the substrate is pressed against the polishing pad can be uniformly maintained. In contrast, since the retainer ring is attached to the carrier head in a structure that cannot be deformed or changed in posture in accordance with the change in posture of the carrier head, the retainer ring also tilts up when the carrier head is slightly tilted due to friction with the polishing pad.
However, the snap ring 130 of the present invention is fixed to the extension piece 145, and the posture thereof can be freely changed, and the snap ring 130 has a deformable material. Accordingly, even if the posture of the carrier head 100 is changed in an inclined manner, the retainer ring 130 can be independently changed in posture by the pressurizing force from the upper cavity of the extension flap 145, and at the same time, since the material of the retainer ring 130 can be compressed and deformed (twisted and collapsed), even if the carrier head is tilted in the polishing process, the retainer ring 130 is kept in close contact with the polishing pad, and thus, an advantageous effect of preventing the carrier head from being locally tilted and displaced can be obtained.
More importantly, the present invention allows the ring 130 for restraining the substrate W from being detached to be coupled to the diaphragm 140 in a floating manner, and thus, the posture of the ring 130 can be freely changed, thereby obtaining advantageous effects of minimizing the tilting phenomenon of the ring 130 and the detachment of the substrate W.
For reference, the carrier head 100 is provided to load the substrate W from a carrier (not shown), perform a cmp process by pressurizing the substrate W in a state where slurry is supplied onto the upper surface of the polishing pad 11 provided on a polishing platen (not shown), and transfer the substrate W to a cleaning apparatus after the cmp process using the polishing pad 11 and the slurry is completed.
In the present invention, the substrate W is understood to be an object to be polished on the polishing pad 11, and the present invention is not limited or restricted by the kind and nature of the substrate W. As an example, a wafer may be used as the substrate W.
More specifically, the carrier head body 101 includes: a body part 110 connected to a driving shaft (not shown) and rotated; and a base part 120 connected to the body part 110 and rotating together therewith.
The upper end of the body 110 is coupled to a driving shaft not shown in the drawings and is rotationally driven. For reference, in the embodiment of the present invention, although the description is given by taking an example in which the main body 110 is formed of only one body, the main body may be configured by combining 2 or more bodies according to circumstances.
The base unit 120 is arranged coaxially with the main body 110, is coupled to the main body 110 to rotate together, and rotates together with the main body 110.
The diaphragm 140 is attached to the lower surface of the carrier head body 101, and presses the substrate W against the polishing pad 11.
As one example, the diaphragm 140 has a structure shown in fig. 3. Namely, the diaphragm 140 includes: a base plate 141 formed of a resiliently flexible material (e.g., polyurethane); a side surface (not shown) bent from an edge end of the base plate 141 and formed to extend in an upward vertical direction, and formed of a flexible material; a plurality of ring-shaped partition walls 143 coupled to the base unit 120 between the center and the side surfaces of the base plate 141; a plurality of pressure chambers C1 to C5 partitioned by the partition wall 143 are formed between the diaphragm 140 and the base 120.
Pressure sensors for measuring pressures may be provided in the plurality of pressure chambers C1 to C5, respectively. The pressures of the pressure chambers C1 to C5 can be individually adjusted according to the control of the pressure control unit 150.
The retainer ring 130 is movably coupled to the diaphragm 140, and restrains the substrate W from being separated in the chemical mechanical polishing process.
The term "the snap ring 130 is movably coupled to the diaphragm 140" is defined as a structure and a form of the snap ring 130 being coupled to the diaphragm 140 so as to be deformable (e.g., to undergo a collapsing displacement or a compression displacement). As an example, the retainer ring 130 may change and deform in conformity with changes in the attitude of the carrier head 100 to maintain contact with the polishing pad 11.
The retainer ring 130 is disposed to surround the periphery of the substrate W with a predetermined gap provided on the outer surface of the diaphragm 140, and includes a ring-shaped retainer ring main body 131 coupled to the extended lobe 145.
Preferably, the snap ring body 131 is formed of a material having a property of being deformable by itself. The retainer ring body 131 has a deformable property, and is defined as one or more of a property that allows the retainer ring body 131 to undergo collapse deformation, torsion deformation, and compression deformation.
As an example, the snap ring body 131 is formed of a non-metal material. More preferably, the snap ring body 131 is made of at least one plastic material selected from polyetheretherketone (peek) and polyphenylene Sulfide (PPS).
The retainer ring 130 can be deformed by an external force in various ways according to required conditions and design specifications, and can be movably coupled to the diaphragm 140 so that the posture thereof can be changed. As an example, an extension flap 145 is formed to extend on an outer side surface of the diaphragm 140, and the snap ring main body 131 is mounted on the extension flap 145.
The extension flap 145 is formed of an elastically flexible material (e.g., polyurethane) as with the diaphragm 140, and the retainer ring 130 is attached to the extension flap 145, whereby the retainer ring 130 can be provided with a soft property that allows posture change and deformation.
Further, a ring pressure chamber CR for applying a pressurizing force to the ring 130 is formed at an upper portion of the extension flap 145. As an example, the snap ring pressure chamber CR is formed in a ring shape along the snap ring 130 at an upper portion of the extension flap 145.
The retainer ring 130 moves up and down by the pressure applied to the retainer ring pressure chamber CR, or controls the pressurizing force of the retainer ring 130 to the surface of the polishing pad 11. At this time, the pressure control of the ring pressure chamber CR can be controlled by the pressure control section 150 that adjusts the pressure of the pressure chambers C1 to C5. According to another embodiment of the present invention, the pressure control of the snap ring pressure chamber may be performed by a separate control unit.
More specifically, referring to fig. 3, the extension flap 145 includes: an upper flap 146 integrally extending on the outer surface of the diaphragm 140 and coupled to the head body 101; a lower flap 147 integrally extending on the outer side surface of the diaphragm 140 at a distance from the upper flap 146 and coupled to the carrier head body 101; a snap ring pressure chamber is formed between upper lobe 146 and lower lobe 147.
One end of the upper flap 146 is integrally connected to the upper end of the outer surface of the diaphragm 140, and the other end is coupled to the head body 101.
The lower flap 147 is disposed at a distance below the upper flap 146, and has one end integrally connected to the outer surface of the lower end of the diaphragm 140 and the other end coupled to the head main body 101.
Preferably, referring to fig. 4 to 6, the extension flap 145 includes an inclined flap portion 145a formed obliquely with respect to the outer side surface of the diaphragm 140, and a horizontal flap portion 145b formed horizontally at an end of the inclined flap portion 145a, and the snap ring 130 includes an inclined contact surface 132 contacting the inclined flap portion 145a and a horizontal contact surface 134 contacting the horizontal flap portion 145 b.
Specifically, the horizontal flap portion 145b is formed horizontally on the upper surface of the snap ring main body 131, and the inclined flap portion 145a is formed obliquely downward inside the horizontal flap portion 145b along the radial direction of the diaphragm 140.
More preferably, the inclined contact surface 132 abuts against the inclined lobe portion 145a, and the horizontal contact surface 134 abuts against the horizontal lobe portion 145 b.
As described above, the inclined flap portion 145a of the extension flap 145 is brought into close contact with the inclined contact surface 132 of the snap ring 130, and the horizontal flap portion 145b of the extension flap 145 is brought into close contact with the horizontal contact surface 134 of the snap ring 130, whereby when pressure is supplied to the pressurized chamber of the snap ring 130, the force P2 in the inclined direction (the force pushing the snap ring body outward along the diaphragm radius) and the force P1 in the vertical direction are applied to the snap ring body 131, and therefore, an advantageous effect of more stably maintaining the arrangement state of the snap ring body 131 with respect to the extension flap 145 can be obtained.
That is, although it may be configured such that only the vertical force P1 is applied to the snap ring main body 131, since the extension flap 145 is formed of an elastically flexible material, if only the vertical force P1 is applied to the snap ring main body 131, the extension flap 145 is easily distorted or the snap ring main body 131 moves in a planar direction (for example, a radial direction of the diaphragm 140) unnecessarily, and in a state where the extension flap 145 is distorted, there is a problem in that it is difficult to accurately apply the pressure in the pressure chamber of the snap ring 130 to the snap ring main body 131.
However, the present invention can obtain advantageous effects of minimizing deformation of the extension petals 145 and unnecessary play of the snap ring body 131 and stably maintaining the arrangement state of the extension petals 145 and the snap ring body 131 by simultaneously applying the oblique force P2 and the vertical force P1 to the snap ring body 131.
For reference, in the embodiment of the present invention, the example in which the inclined contact surface 132 is formed only on the inner circumferential surface of the snap ring 130 and the extension lobe 145 includes only one inclined lobe portion 145a is exemplified, but according to another embodiment of the present invention, the inclined contact surfaces may be formed on both side portions (the inner circumferential surface and the outer circumferential surface) of the snap ring, respectively, and the extension lobe includes 2 inclined lobe portions corresponding to the respective inclined contact surfaces.
In addition, the extended lobe 145 may include a protruding lobe 145c protrudingly formed from the horizontal lobe 145b, and the snap ring 130 may include a receiving portion 136 in which the protruding lobe 145c is received. Preferably, the protruding flap portion 145c may have a width (e.g., a trapezoidal sectional form) that increases from the upper end to the lower end.
As described above, by forming the projecting lobe portion 145c in the extending lobe 145 and forming the receiving portion 136 for receiving the projecting lobe portion 145c in the snap ring main body 131, it is possible to obtain an advantageous effect of more stably maintaining the arrangement state of the snap ring main body 131 with respect to the extending lobe 145 and suppressing the snap ring main body 131 from being detached from the extending lobe 145.
As described above, the snap ring 130 of the present invention has a soft property, by which the posture of the snap ring 130 can be deformed in conformity with the posture change (e.g., inclination) of the carrier head 100, and in this process, a portion where a large force is locally applied to the snap ring is deformed, so that an advantageous effect of minimizing the phenomenon that the snap ring 130 is locally lifted up in the polishing process can be obtained.
More importantly, the ring 130 for restraining the substrate W from being detached is coupled to the diaphragm 140 so as to be able to move, so that the ring 130 is provided with a soft property, and thus, the advantageous effects of minimizing the warping phenomenon of the ring 130 and minimizing the substrate W from being detached can be obtained.
Further, by mounting the snap ring 130 to the extension flap 145 extending on the outer side surface of the diaphragm 140, the depth (height) of the gap between the diaphragm 140 and the snap ring 130 (or the gap between the snap ring 130 and the snap ring main body 131) can be minimized, and thus the slurry remaining in the gap between the diaphragm 140 and the snap ring 130 can be minimized.
In particular, the slurry flowing into the gap between the diaphragm 140 and the snap ring 130 is more difficult to effectively remove as the depth of the gap between the diaphragm 140 and the snap ring 130 is larger, and the slurry flowing into the gap is fixed to prevent the snap ring 130 from smoothly moving up and down, so that the slurry remaining in the gap is again attached to the substrate W or the diaphragm 140 or acts as an S/C source. However, the present invention minimizes the depth of the gap between the diaphragm 140 and the snap ring 130, and thus, advantageous effects of minimizing foreign substances (slurry and particles) remaining in the gap between the diaphragm 140 and the snap ring 130 and effectively removing foreign substances flowing into the gap can be obtained.
The carrier head 100 of the present invention may further include a retainer 160 disposed outside the ring 130 in a radial direction of the substrate W.
The retainer 160 is disposed outside the snap ring body 131, and is used to suppress excessive deformation of the snap ring body 131 and fix the end portions of the extended petals to the snap ring body 131.
That is, since the snap ring body 131 is formed of a material having a deformable property, the deformation of the snap ring body 131 may excessively occur in the polishing process, and in a state where the snap ring body 131 excessively deforms, there is a problem in that it is difficult to accurately apply the pressure in the pressure chamber of the snap ring 130 to the snap ring body 131.
However, the present invention suppresses excessive deformation of the snap ring main body 131 by the retainer 160 outside the snap ring 130, and thereby, the advantageous effects of stably maintaining the arrangement state of the snap ring main body 131 and improving stability and reliability can be obtained.
The retainer 160 can be attached to various positions according to the required conditions and design specifications.
As one example, the retainer 160 is coupled to the carrier head body 101. According to another embodiment of the present invention, the retainer may be mounted to the outside of the carrier head body or to a peripheral device, and the present invention is not limited or restricted by the mounting position of the retainer.
Preferably, the lower surface of the retainer 160 is spaced apart from the upper surface of the polishing pad 11. As described above, by disposing the lower surface of the retainer 160 so as to be spaced apart from the upper surface of the polishing pad 11, it is possible to obtain an advantageous effect of minimizing deterioration in performance and life of the polishing pad 11 due to contact between the retainer 160 and the polishing pad 11.
The retainer 160 is disposed spaced apart from the outer surface of the snap ring main body 131. As described above, by disposing the retainer 160 so as to be spaced apart from the outer side surface of the snap ring body 131, an advantageous effect of suppressing excessive deformation while allowing deformation of the snap ring body 131 can be obtained.
The retainer 160 may be formed in various structures capable of suppressing excessive deformation of the snap ring main body 131.
As an example, the snap ring 130 includes a vertical outer side portion 138 forming an outer side surface of the snap ring 130, an inclined outer side portion 137 connected to a lower portion of the vertical outer side portion 138 and formed to be inclined toward the diaphragm 140, and the retainer 160 includes a vertical guide portion 164 corresponding to the vertical outer side portion 138, and an inclined guide portion 162 corresponding to the inclined outer side portion 137.
The angles and lengths of the inclined outer part 137 and the inclined guide part 162 may be variously changed according to required conditions and design specifications, and the present invention is not limited or restricted by the angles and lengths of the inclined outer part 137 and the inclined guide part 162.
As described above, the vertical outer side portion 138 of the snap ring 130 is caused to interfere with the vertical guide portion 164 of the retainer 160, and the inclined outer side portion 137 of the snap ring 130 is caused to interfere with the inclined guide portion 162 of the retainer 160, so that it is possible to obtain an advantageous effect of suppressing excessive deformation of the snap ring body 131 and more stably maintaining the arrangement state of the snap ring body 131.
Referring to fig. 7, the carrier head 100 of the present invention includes a restraining portion 170 that restrains the snap ring 130 relative to the retainer 160.
The constraining portion 170 is used to constrain the retainer ring 160 and the snap ring 130 so that the snap ring 130 can stably rotate when the carrier head 100 rotates.
Preferably, the restraint portion 170 allows up-and-down movement of the snap ring 130 relative to the retainer 160 and restrains rotation of the snap ring 130 relative to the retainer 160.
The restricting portion 170 may be formed in various structures that allow the up-and-down movement of the snap ring 130 with respect to the retainer 160 and restrict the rotation of the snap ring 130 with respect to the retainer 160.
As an example, the restraint portion 170 includes: a guide hole 139 formed in the snap ring 130; the guide pin 166 has one end fixed to the retainer 160 and the other end received in the guide hole 139.
The guide hole 139 may be formed in an elongated hole shape capable of moving the guide pin 166 in the up-down direction.
As described above, the end of the guide pin 166 coupled to the retainer 160 is received in the guide hole 139 formed in the snap ring 130, so that the rotational force of the carrier head 100 can be effectively transmitted to the snap ring 130. Further, the end portion of the guide pin 166 is accommodated in the guide hole 139 so as to be movable in the vertical direction, so that the vertical movement of the snap ring 130 can be permitted, and the pressing force can be controlled by the snap ring 130.
For reference, in the embodiment of the present invention, an example in which the end portion of the guide pin 166 coupled to the retainer 160 is received in the guide hole 139 formed in the retainer ring 130 is described, but according to another embodiment of the present invention, the end portion of the guide pin coupled to the retainer ring may be received in the guide hole formed in the retainer ring.
As described above, although the present invention has been described with reference to the preferred embodiments thereof, it will be understood by those skilled in the relevant art that various modifications and changes can be made without departing from the spirit and scope of the present invention as set forth in the appended claims.
Claims (31)
1. A carrier head for pressing a substrate against a polishing pad during a chemical mechanical polishing process, comprising:
a carrier head body;
a diaphragm mounted on the lower surface of the carrier head body for pressing the substrate against the polishing pad;
an elongate flap extending from an outer side of the septum;
a snap ring mounted on the extension flap for constraining a side of the substrate.
2. The carrier head of claim 1,
a snap ring pressure chamber for applying pressure to the snap ring is formed in an upper portion of the extension flap.
3. The carrier head of claim 2,
the extension flap includes:
an upper flap integrally extending on an outer side surface of the diaphragm and coupled to the carrier head body;
a lower flap integrally extending on an outer side surface of the diaphragm at a distance from the upper flap and coupled to the head body;
the snap ring pressure chamber is formed between the upper lobe and the lower lobe.
4. The carrier head of claim 1,
the extension flap includes: an inclined flap portion formed to be inclined with respect to an outer side surface of the diaphragm; and a horizontal flap portion formed horizontally at an end portion of the inclined flap portion,
the snap ring includes: an inclined contact surface contacting the inclined lobe portion and a horizontal contact surface contacting the horizontal lobe portion.
5. The carrier head of claim 4,
the inclined contact surface clings to the inclined petal part, and the horizontal contact surface clings to the horizontal petal part.
6. The carrier head of claim 4,
the elongate lobes include projecting lobes formed projecting from the horizontal lobes,
the snap ring includes a receiving portion for receiving the projecting lobe portion.
7. The carrier head of claim 6,
the projecting lobes have a width that increases from an upper end to a lower end.
8. The carrier head of claim 1,
the retainer ring is formed of a material that can be deformed by a force applied in a polishing process.
9. The carrier head of claim 8,
the snap ring is made of non-metal materials.
10. The carrier head of claim 8,
the snap ring is made of more than one plastic material of polyether ether ketone (peek) and polyphenylene Sulfide (PPS).
11. The carrier head of claim 1,
the retainer includes a retainer arranged outside the snap ring in a radial direction of the substrate.
12. The carrier head of claim 11,
the retainer is coupled to the carrier head body.
13. The carrier head of claim 11,
the lower surface of the retainer ring is configured to be spaced apart from the upper surface of the polishing pad.
14. The carrier head of claim 11,
the retainer is disposed to be spaced apart from an outer side surface of the snap ring.
15. The carrier head of claim 11,
the snap ring includes: a vertical outer side portion forming an outer side surface of the snap ring; and an inclined outer side portion connected to a lower portion of the vertical outer side portion and inclined toward the diaphragm,
the retainer includes: a vertical guide corresponding to the vertical outer side portion and an inclined guide corresponding to the inclined outer side portion.
16. The carrier head of claim 11,
the retainer includes a restraining portion that restrains the snap ring relative to the retainer.
17. The carrier head of claim 16,
the restraining portion allows up-and-down movement of the snap ring relative to the retainer and restrains rotation of the snap ring relative to the retainer.
18. The carrier head of claim 17,
the restraint portion includes:
a guide hole formed in the snap ring;
and a guide pin having one end fixed to the retainer and the other end received in the guide hole.
19. The carrier head of claim 18,
the guide hole is formed in an elongated hole shape that allows the guide pin to move in the vertical direction.
20. A retainer ring of a carrier head for a chemical mechanical polishing apparatus, which is attached to the carrier head for pressing a substrate against a polishing pad in a chemical mechanical polishing process to restrain the substrate from being detached, comprising:
and a snap ring body which is movably coupled to a diaphragm mounted on a lower surface of the carrier head.
21. The retaining ring of a carrier head for a chemical mechanical polishing apparatus as recited in claim 20, wherein,
the snap ring body is mounted on an elongate flap extending from an outer side surface of the diaphragm.
22. The retaining ring of a carrier head for a chemical mechanical polishing apparatus as recited in claim 21, wherein,
the extension flap includes:
an upper flap integrally extending on an outer side surface of the diaphragm and coupled to the carrier head;
a lower flap integrally extending on an outer side surface of the diaphragm at a distance from the upper flap and coupled to the carrier head;
a snap ring pressure chamber for applying a pressure to the snap ring is formed between the upper flap and the lower flap.
23. The retaining ring of a carrier head for a chemical mechanical polishing apparatus as recited in claim 21, wherein,
the extension flap includes: an inclined flap portion formed to be inclined with respect to an outer side surface of the diaphragm; and a horizontal flap portion formed horizontally at an end portion of the inclined flap portion,
the snap ring main body includes: an inclined contact surface contacting the inclined lobe portion; and a horizontal contact surface contacting the horizontal lobe.
24. The retaining ring of a carrier head for a chemical mechanical polishing apparatus as recited in claim 23,
the inclined contact surface clings to the inclined petal part, and the horizontal contact surface clings to the horizontal petal part.
25. The retaining ring of a carrier head for a chemical mechanical polishing apparatus as recited in claim 23,
the elongate lobes include projecting lobes formed projecting from the horizontal lobes,
the snap ring includes a receiving portion that receives the projecting lobe portion.
26. The retaining ring of a carrier head for a chemical mechanical polishing apparatus as recited in claim 25, wherein,
the projecting lobes have a width that increases from an upper end to a lower end.
27. The retaining ring of a carrier head for a chemical mechanical polishing apparatus as recited in claim 20, wherein,
the retainer ring body is formed of a material that can be deformed by a force applied in a polishing process.
28. The retaining ring of a carrier head for a chemical mechanical polishing apparatus as recited in claim 27, wherein,
the snap ring main body is made of non-metal materials.
29. The retaining ring of a carrier head for a chemical mechanical polishing apparatus as recited in claim 27, wherein,
the snap ring main body is made of more than one plastic material of polyether ether ketone (peek) and polyphenylene Sulfide (PPS).
30. The retaining ring of a carrier head for a chemical mechanical polishing apparatus as recited in claim 20, wherein,
a retainer disposed outside the snap ring at a distance in a radial direction of the substrate,
the snap ring main body includes: a vertical outer side portion forming an outer side surface of the snap ring; and an inclined outer side portion connected to a lower portion of the vertical outer side portion and inclined toward the diaphragm,
a vertical guide portion corresponding to the vertical outer side portion and an inclined guide portion corresponding to the inclined outer side portion are formed on the retainer.
31. The retaining ring of a carrier head for a chemical mechanical polishing apparatus as recited in claim 30, wherein,
comprising a guide pin, one end of which is fixed to the retainer and the other end of which is configured as a free end,
a guide hole is formed in the snap ring body, and the other end of the guide pin is housed in the guide hole so as to be movable in the vertical direction.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2018-0155031 | 2018-12-05 | ||
| KR20180155031 | 2018-12-05 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN111266993A true CN111266993A (en) | 2020-06-12 |
| CN111266993B CN111266993B (en) | 2023-06-30 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811580191.8A Active CN111266993B (en) | 2018-12-05 | 2018-12-24 | Clamping ring of bearing head for chemical mechanical polishing device and bearing head with clamping ring |
Country Status (2)
| Country | Link |
|---|---|
| KR (1) | KR20200068561A (en) |
| CN (1) | CN111266993B (en) |
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Also Published As
| Publication number | Publication date |
|---|---|
| CN111266993B (en) | 2023-06-30 |
| KR20200068561A (en) | 2020-06-15 |
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