CN111266993B - Clamping ring of bearing head for chemical mechanical polishing device and bearing head with clamping ring - Google Patents
Clamping ring of bearing head for chemical mechanical polishing device and bearing head with clamping ring Download PDFInfo
- Publication number
- CN111266993B CN111266993B CN201811580191.8A CN201811580191A CN111266993B CN 111266993 B CN111266993 B CN 111266993B CN 201811580191 A CN201811580191 A CN 201811580191A CN 111266993 B CN111266993 B CN 111266993B
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- Prior art keywords
- carrier head
- retainer
- flap
- snap ring
- outer side
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- 238000005498 polishing Methods 0.000 title claims abstract description 56
- 239000000126 substance Substances 0.000 title claims abstract description 14
- 239000000758 substrate Substances 0.000 claims abstract description 34
- 230000000452 restraining effect Effects 0.000 claims abstract description 13
- 238000003825 pressing Methods 0.000 claims abstract description 8
- 238000007517 polishing process Methods 0.000 claims description 14
- 239000000463 material Substances 0.000 claims description 13
- 239000004734 Polyphenylene sulfide Substances 0.000 claims description 6
- 229920000069 polyphenylene sulfide Polymers 0.000 claims description 6
- 239000004696 Poly ether ether ketone Substances 0.000 claims description 2
- 239000004033 plastic Substances 0.000 claims description 2
- 229920003023 plastic Polymers 0.000 claims description 2
- 229920002530 polyetherether ketone Polymers 0.000 claims description 2
- 230000000694 effects Effects 0.000 description 15
- 239000002002 slurry Substances 0.000 description 7
- 238000000034 method Methods 0.000 description 5
- 230000002093 peripheral effect Effects 0.000 description 5
- 230000006835 compression Effects 0.000 description 4
- 238000007906 compression Methods 0.000 description 4
- 238000005192 partition Methods 0.000 description 4
- 238000013461 design Methods 0.000 description 3
- 238000006073 displacement reaction Methods 0.000 description 3
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000005452 bending Methods 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000012528 membrane Substances 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 229920002635 polyurethane Polymers 0.000 description 2
- 239000004814 polyurethane Substances 0.000 description 2
- 238000004140 cleaning Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007599 discharging Methods 0.000 description 1
- 239000013013 elastic material Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 230000000873 masking effect Effects 0.000 description 1
- 239000002245 particle Substances 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 230000003746 surface roughness Effects 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
Images
Classifications
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
- B24B37/32—Retaining rings
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/27—Work carriers
- B24B37/30—Work carriers for single side lapping of plane surfaces
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B24—GRINDING; POLISHING
- B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
- B24B37/00—Lapping machines or devices; Accessories
- B24B37/04—Lapping machines or devices; Accessories designed for working plane surfaces
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
- H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
- H01L21/302—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to change their surface-physical characteristics or shape, e.g. etching, polishing, cutting
- H01L21/306—Chemical or electrical treatment, e.g. electrolytic etching
- H01L21/30625—With simultaneous mechanical treatment, e.g. mechanico-chemical polishing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67092—Apparatus for mechanical treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Mechanical Engineering (AREA)
- Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
The invention relates to a clasp of a bearing head for a chemical mechanical polishing device and a bearing head with the same, wherein the bearing head comprises: a carrier head body; a diaphragm mounted below the carrier head body for pressing the substrate against the polishing pad; an elongate flap extending over an outer side of the septum; and a clasp mounted on the extension flap for restraining a side of the substrate.
Description
Technical Field
The present invention relates to a retainer ring of a carrier head for a chemical mechanical polishing apparatus and a carrier head having the same, and more particularly, to a retainer ring of a carrier head for a chemical mechanical polishing apparatus capable of minimizing a tilting phenomenon of a retainer ring and preventing detachment of a substrate in a polishing process, and a carrier head having the same.
Background
A Chemical Mechanical Polishing (CMP) apparatus is an apparatus for performing precision polishing processing on a wafer surface in order to eliminate wide planarization of a level difference between a cell region and a peripheral circuit region due to roughness of the wafer surface generated by repeatedly performing masking, etching, wiring steps, and the like in a semiconductor device manufacturing process, and to improve wafer surface roughness and the like due to contact/wiring film separation for circuit formation and high integration element formation.
In such a CMP apparatus, the carrier head pressurizes the wafer with the polishing surface of the wafer facing the polishing pad before and after the polishing step, and the wafer is directly and indirectly vacuum-sucked and held after the polishing step is completed and transferred to the next step.
Referring to fig. 1 and 2, the carrier head 1 includes: a body portion 110; a base portion 120 that rotates together with the body portion 110; a clasp 130 mounted in a ring shape surrounding the base portion 120 so as to be movable up and down, and rotated together with the base portion 120; a diaphragm 140 made of an elastic material, which is fixed to the base portion 120, and forms pressure chambers C1, C2, C3, C4, and C5 in spaces between the diaphragm and the base portion 120; and a pressure control part 150 which adjusts pressure while supplying or discharging air to or from the pressure chambers C1, C2, C3, C4, C5 through the air pressure supply passage 155.
The elastic diaphragm 140 is formed with a side surface (not shown) by bending an edge end of the flat bottom plate 141 for pressing the wafer W. A plurality of partition walls 143 in the form of a ring fixed to the base portion 120 are formed between the center and the side surfaces of the diaphragm 140, and the plurality of pressure chambers C1, C2, C3, C4, and C5 are arranged in concentric circles based on the partition walls 143.
Therefore, in the chemical mechanical polishing step, the pressure chambers C1, C2, C3, C4, and C5 expand and simultaneously press the surface of the wafer W through the membrane substrate 141 by the air pressure supplied from the pressure control unit 150.
At the same time, the lower surface 130s of the retainer ring 130 rotating together with the main body 110 and the base 120 also pressurizes and rotates the polishing pad 11, thereby preventing the wafer W surrounded by the retainer ring 130 from being detached from the carrier head 1.
On the other hand, in the polishing step of the wafer W, the wafer W revolves while rotating and rotates at a high speed, and thus a wafer detachment phenomenon, i.e., a slip-out phenomenon, occurs in which the wafer W is detached from the carrier head 1 due to a centrifugal force generated during the high-speed rotation.
In particular, in the polishing step, if the posture of the retainer ring 130 is inclined, as shown in fig. 2, the retainer ring 130 for preventing the wafer W from being detached is lifted up LT from the polishing pad 11, and thus there is a problem that a detachment phenomenon occurs in which the wafer falls to a space between the lower surface of the retainer ring 130 and the polishing pad 11.
As described above, in the polishing process of the wafer W, in order to minimize the slip-out phenomenon of the wafer W, the tilt LT phenomenon of the retainer ring 130 should be minimized, but conventionally, unlike the diaphragm 140 having a soft (flexible) property, the retainer ring 130 has a property close to a rigid body (rib), and thus there is a problem in that the phenomenon that the retainer ring 130 partially tilts from the polishing pad 11 occurs in the polishing process.
In other words, since the membrane 140 that presses the wafer W against the polishing pad 11 has a soft property (property of being easily deformed and easily bent), even if the posture of the carrier head 1 is inclined in the polishing step, the wafer W can be deformed in accordance with the posture change of the carrier head 1, and the state in which the wafer W is pressed against the polishing pad 11 can be uniformly maintained. In contrast, since the retainer ring 130 is formed in a structure that cannot be deformed and bent in response to the posture change of the carrier head 1, if the posture of the carrier head 1 is slightly inclined, there is a problem in that the retainer ring 130 is lifted.
For this reason, various studies have been recently conducted to minimize the warpage of the snap ring and minimize the detachment of the wafer, but there is still a far insufficient need for development of this.
Disclosure of Invention
Technical problem
The invention aims to provide a clamp ring of a bearing head for a chemical mechanical polishing device, which can minimize the tilting phenomenon of the clamp ring and prevent a substrate from separating in a polishing process, and a bearing head with the clamp ring.
In particular, the invention aims at providing a snap ring with deformable properties.
In addition, the present invention aims to improve stability and reliability.
The present invention also aims to improve workability and assemblability of a retainer ring and to improve adhesion of the retainer ring to a polishing pad.
In addition, the invention aims to simplify the replacement process of the clamping ring and shorten the time required by the replacement process.
The present invention also aims to improve productivity and yield and to reduce manufacturing costs.
In addition, the invention aims to uniformly control the pressurizing force of the clamp ring for pressurizing the polishing pad and improve the polishing quality.
Technical proposal
In order to achieve the above object, according to a preferred embodiment of the present invention, there is provided a carrier head comprising: a carrier head body; a diaphragm mounted below the carrier head body for pressing the substrate against the polishing pad; an elongate flap extending over an outer side of the septum; and a clasp mounted on the extension flap for restraining a side of the substrate.
In the present specification and claims, the meaning of the term "deformable property" and the like is defined as a property that allows one or more of compression deformation, collapse deformation, and distortion deformation by an external force such as a force applied in the polishing process. For example, a material having lower compression rigidity, torsional rigidity and collapse rigidity than a metal material is meant.
Effects of the invention
In summary, according to the present invention, the advantageous effect of minimizing the tilting phenomenon of the retainer ring and preventing the detachment of the substrate in the polishing process can be obtained.
In particular, according to the present invention, by virtue of the property of giving the snap ring a deformable property, an advantageous effect of minimizing the tilting phenomenon of the snap ring can be obtained.
In addition, according to the present invention, advantageous effects of improving stability and reliability can be obtained.
According to the present invention, the workability and the assemblability of the retainer ring can be improved, and the adhesion of the retainer ring to the polishing pad can be improved.
In addition, according to the present invention, the replacement process of the snap ring can be simplified, and the time required for the replacement process can be shortened.
According to the present invention, the productivity and yield can be improved, and the manufacturing cost can be reduced.
According to the invention, the pressurizing force of the clamp ring for pressurizing the polishing pad can be uniformly controlled, and the polishing quality can be improved.
Drawings
Figure 1 is a half-section view illustrating a prior art carrier head,
figure 2 is an enlarged view of the "a" portion of figure 1,
figure 3 is a diagram illustrating a carrier head of the present invention,
figure 4 is an enlarged view of the "B" portion of figure 3,
figure 5 is a bottom view of a carrier head for illustrating the present invention,
fig. 6 is a view for explaining a snap ring as the carrier head of the present invention,
fig. 7 is a view for explaining a restraining portion as a carrier head according to the present invention.
[ reference numerals ]
100: carrier head 101: bearing head body
110: the body portion 120: base portion
130: clasp 131: snap ring body
132: inclined contact surface 134: horizontal contact surface
136: the storage unit 137: inclined outer side portion
138: vertical outer side 139: guide hole
140: diaphragm 145: extension valve
146: upper lobe 147: lower valve
145a: oblique flap 145b: horizontal flap part
145c: protruding petals 160: guard ring
162: the inclined guide portion 164: vertical guide
166: guide pin 170: restraint part
Detailed Description
Preferred embodiments of the present invention will be described in detail below with reference to the accompanying drawings, but the present invention is not limited or restricted by the embodiments. In the present description, the same reference numerals designate substantially the same elements, and under such rules, the description will be given with reference to the contents described in other drawings, and the judgment will be omitted so that the practitioner will be aware of or repeat the description.
Fig. 3 is a view for explaining the carrier head of the present invention, and fig. 4 is an enlarged view of a portion "B" of fig. 3. Fig. 5 is a bottom view for explaining the carrier head of the present invention, fig. 6 is a view for explaining the retainer ring as the carrier head of the present invention, and fig. 7 is a view for explaining the restraining portion as the carrier head of the present invention.
Referring to fig. 3 to 7, the carrier head 100 of the present invention includes: a carrier head body 101; a diaphragm 140 mounted on the lower surface of the carrier head body 101 and pressing the substrate W against the polishing pad 11; an extension flap 145 extending on an outer side of septum 140; and a clasp 130 attached to the extension flap 145 to restrict the side surface of the substrate W.
This is to minimize the tilting phenomenon of the retainer ring 130 during the polishing process, and prevent detachment of the substrate W.
That is, in the polishing process of the substrate, in order to minimize the detachment (slip-out) phenomenon of the substrate W, the tilting phenomenon of the retainer ring should be minimized, but conventionally, unlike the diaphragm having a soft (flexible) property, the retainer ring has a behavior similar to that of a rigid body (rib), and thus there is a problem in that, in the polishing process, if the carrier head is tilted by friction with the polishing pad, the retainer ring is also tilted locally from the polishing pad in synchronization with the tilting displacement of the carrier head.
In other words, the diaphragm pressing the substrate against the polishing pad has a soft property (deformable or bendable property), and therefore, even if the posture of the carrier head is inclined in the polishing step, the diaphragm can be deformed in accordance with the posture change of the carrier head, and the state in which the substrate is pressed against the polishing pad can be uniformly maintained. In contrast, since the retainer ring is attached to the carrier head in a structure that cannot be deformed and changed in posture in response to the posture change of the carrier head, the retainer ring also tilts when the posture of the carrier head is slightly tilted by friction with the polishing pad.
However, the retainer ring 130 of the present invention is fixed to the extension flap 145 so that the posture thereof can be freely changed, and the retainer ring 130 has a deformable material. Accordingly, even if the posture of the carrier head 100 is changed obliquely, the retainer ring 130 can be changed independently by the pressing force from the upper chamber of the extension flap 145, and at the same time, the retainer ring 130 is kept in close contact with the polishing pad even when the carrier head is tilted in the polishing step because the retainer ring 130 is compressively deformed (twisted and collapsed) by the material thereof, so that the retainer ring 130 can be advantageously displaced so that no local tilting occurs.
More importantly, the present invention allows the snap ring 130 restraining the detachment of the substrate W to be coupled to the diaphragm 140 in a free manner, by which the posture of the snap ring 130 can be freely changed, and thus, advantageous effects of minimizing the tilting phenomenon of the snap ring 130 and minimizing the detachment of the substrate W can be obtained.
For reference, the carrier head 100 is provided to load the substrate W from a carrier (not shown), press the substrate W in a state where slurry is supplied to an upper surface of a polishing pad 11 provided on a polishing platen (not shown), perform a chemical mechanical polishing process, and transfer the substrate W to a cleaning apparatus after the chemical mechanical polishing process using the polishing pad 11 and the slurry is completed.
In the present invention, the substrate W is understood to be a polishing object that can be polished on the polishing pad 11, and the present invention is not limited or restricted by the type and properties of the substrate W. As an example, as the substrate W, a wafer may be used.
More specifically, the carrier head body 101 includes: a body portion 110 connected to a driving shaft (not shown) and rotated; a base portion 120 connected to the body portion 110 and rotated together.
The upper end of the body 110 is coupled to a driving shaft, not shown in the drawings, and is rotatably driven. For reference, in the embodiment of the present invention, the main body 110 is described by taking an example in which only one main body is formed, but 2 or more main bodies may be combined to form a main body according to circumstances.
The base portion 120 is arranged coaxially with the main body portion 110, and is connected to and coupled to rotate with the main body portion 110, and rotates with the main body portion 110.
The diaphragm 140 is mounted on the lower surface of the carrier head body 101, and presses the substrate W against the polishing pad 11.
As one example, the diaphragm 140 has the structure shown in fig. 3. That is, the diaphragm 140 includes: a base plate 141 formed of an elastically flexible material (e.g., polyurethane); a side surface (not shown) formed by bending from the edge end of the bottom plate 141, extending in the upward vertical direction, and made of a flexible material; a plurality of ring-shaped partition walls 143 connected to the base portion 120 between the center and the side surfaces of the bottom plate 141; a plurality of pressure chambers C1 to C5 divided by a partition wall 143 are formed between the diaphragm 140 and the base portion 120.
In the plurality of pressure chambers C1 to C5, pressure sensors for measuring the pressure respectively may be provided. The pressures of the pressure chambers C1 to C5 can be individually adjusted under the control of the pressure control unit 150.
The retainer ring 130 is coupled to the diaphragm 140 so as to be movable, and is configured to restrict detachment of the substrate W in the chemical mechanical polishing process.
The retainer ring 130 is coupled to the diaphragm 140 so as to be movable, and is defined as a structure and a shape of the retainer ring 130 coupled to the diaphragm 140 so as to be deformable (for example, to be subjected to a collapse displacement or a compression displacement). As an example, the snap ring 130 may be deformed and changed in posture in compliance with the posture change of the carrier head 100 so as to maintain a state of contacting the polishing pad 11.
The retainer ring 130 is disposed on the outer surface of the diaphragm 140 with a predetermined gap therebetween so as to surround the periphery of the substrate W, and includes a ring-shaped retainer ring main body 131 coupled to the extension flap 145.
Preferably, the snap ring body 131 is formed of a material having a property of being deformable per se. Among these, the property that the snap ring main body 131 is deformable is defined as that the snap ring main body 131 has one or more properties of allowing collapse deformation, torsion deformation, and compression deformation.
As one example, the snap ring body 131 is formed of a non-metallic material. More preferably, the clip body 131 is formed of one or more plastic materials selected from polyether ether ketone (peek) and polyphenylene sulfide (Poly Phenylene Sulfide; PPS).
The retainer ring 130 may be deformed by external force in various ways according to the required conditions and design specifications, and may be coupled to the diaphragm 140 so as to be movable, so that the posture may be changed. As an example, an extension flap 145 is formed to extend on the outer side surface of the diaphragm 140, and the clasp body 131 is attached to the extension flap 145.
The extension flap 145 is formed of an elastically flexible material (for example, polyurethane) similarly to the diaphragm 140, and the clasp 130 is attached to the extension flap 145, whereby the clasp 130 can be given soft properties allowing posture change and deformation.
Further, a clasp pressure chamber CR for applying a pressurizing force to the clasp 130 is formed at an upper portion of the extension flap 145. As one example, the clasp pressure chamber CR is formed in a ring shape at an upper portion of the extension flap 145 along the clasp 130.
The retainer ring 130 moves up and down by the pressure applied to the retainer ring pressure chamber CR, or controls the pressurizing force of the retainer ring 130 to pressurize the surface of the polishing pad 11. At this time, the pressure control of the snap ring pressure chamber CR can be controlled by the pressure control unit 150 that adjusts the pressures of the pressure chambers C1 to C5. According to another embodiment of the present invention, the pressure of the clasp pressure chamber may be controlled by a separate control unit.
More specifically, referring to fig. 3, extension flap 145 comprises: an upper flap 146 integrally extending on the outer surface of the diaphragm 140 and coupled to the carrier head body 101; a lower flap 147 integrally extending on the outer surface of the diaphragm 140 at a distance from the upper flap 146 and coupled to the carrier head body 101; a snap ring pressure chamber is formed between upper and lower petals 146, 147.
One end of the upper flap 146 is integrally connected to the upper end of the outer surface of the diaphragm 140, and the other end is coupled to the carrier head body 101.
The lower flap 147 is disposed at a lower portion of the upper flap 146 so as to be spaced apart from each other, and has one end integrally connected to an outer surface of a lower end portion of the diaphragm 140 and the other end coupled to the carrier head body 101.
Preferably, referring to fig. 4 to 6, the extension flap 145 includes an inclined flap portion 145a formed obliquely with respect to an outer side surface of the diaphragm 140, and a horizontal flap portion 145b formed horizontally at an end of the inclined flap portion 145a, and the snap ring 130 includes an inclined contact surface 132 contacting the inclined flap portion 145a and a horizontal contact surface 134 contacting the horizontal flap portion 145b.
Specifically, the horizontal flap portion 145b is formed horizontally on the upper surface of the snap ring main body 131, and the inclined flap portion 145a is formed obliquely downward on the inner side of the horizontal flap portion 145b along the radial direction of the diaphragm 140.
More preferably, the inclined contact surface 132 is in close contact with the inclined flap portion 145a, and the horizontal contact surface 134 is in close contact with the horizontal flap portion 145b.
As described above, the inclined flap portion 145a of the extension flap 145 is brought into close contact with the inclined contact surface 132 of the snap ring 130, and at the same time, the horizontal flap portion 145b of the extension flap 145 is brought into close contact with the horizontal contact surface 134 of the snap ring 130, whereby when pressure is supplied to the pressure chamber of the snap ring 130, a force P2 in an inclined direction (a force pushing the snap ring body outward along the radius of the diaphragm) and a force P1 in a vertical direction are applied to the snap ring body 131, and thus, an advantageous effect of more stably maintaining the arrangement state of the snap ring body 131 with respect to the extension flap 145 can be obtained.
That is, although it is also possible to construct such that only the force P1 in the vertical direction is applied to the snap ring main body 131, since the extension flap 145 is formed of an elastically flexible material, if only the force P1 in the vertical direction is applied to the snap ring main body 131, the extension flap 145 is likely to be distorted, or the snap ring main body 131 is unnecessarily moved in the planar direction (for example, the radial direction of the diaphragm 140), and in a state where the extension flap 145 is distorted, there is a problem that it is difficult for the pressure to be accurately applied to the snap ring main body 131 in the pressurizing chamber of the snap ring 130.
However, the present invention can obtain an advantageous effect of stably maintaining the arrangement state of the extension valve 145 and the snap ring main body 131 while minimizing the deformation of the extension valve 145 and the unnecessary play of the snap ring main body 131 by simultaneously applying the force P2 in the tilt direction and the force P1 in the vertical direction to the snap ring main body 131.
For reference, in the embodiment of the present invention, the inclined contact surface 132 is formed only on the inner peripheral surface of the snap ring 130, and the extension piece 145 includes only one inclined piece portion 145a, but according to another embodiment of the present invention, inclined contact surfaces may be formed on both side portions (inner peripheral surface and outer peripheral surface) of the snap ring, respectively, and the extension piece includes 2 inclined piece portions corresponding to the respective inclined contact surfaces.
In addition, the extension flap 145 may include a protruding flap portion 145c formed protruding from the horizontal flap portion 145b, and the snap ring 130 may include a receiving portion 136 for receiving the protruding flap portion 145 c. Preferably, protruding petals 145c can have a width (e.g., trapezoidal cross-sectional configuration) that increases from an upper end to a lower end.
As described above, by forming the protruding flap portion 145c in the extension flap 145 and forming the receiving portion 136 for receiving the protruding flap portion 145c in the clip main body 131, the advantageous effects of more stably maintaining the arrangement state of the clip main body 131 with respect to the extension flap 145 and suppressing the detachment of the clip main body 131 with respect to the extension flap 145 can be obtained.
As described above, the snap ring 130 of the present invention has a soft property, by which the posture of the snap ring 130 can be deformed in conformity with the posture change (e.g., tilting) of the carrier head 100, and in the course of this, a large force locally acts on a portion of the snap ring to be deformed, so that an advantageous effect of minimizing the phenomenon of local tilting of the snap ring 130 in the grinding process can be obtained.
More importantly, the snap ring 130 for restraining the detachment of the substrate W can be coupled to the diaphragm 140 so as to provide the snap ring 130 with soft properties, and thus, the advantageous effects of minimizing the tilting phenomenon of the snap ring 130 and minimizing the detachment of the substrate W can be obtained.
In addition, by mounting the snap ring 130 to the extension flaps 145 extending at the outer side surface of the diaphragm 140, the depth (height) of the gap between the diaphragm 140 and the snap ring 130 (or the gap between the snap ring 130 and the snap ring body 131) can be minimized, and thus slurry remaining at the gap between the diaphragm 140 and the snap ring 130 can be minimized.
In particular, as the depth of the gap between the diaphragm 140 and the retainer ring 130 is larger, the slurry flowing into the gap between the diaphragm 140 and the retainer ring 130 is more difficult to remove effectively, and the slurry flowing into the gap is fixed, which may prevent the retainer ring 130 from moving up and down smoothly, and may cause the slurry remaining in the gap to adhere again to the substrate W or the diaphragm 140 or act as an S/C source. However, the present invention minimizes the depth of the gap between the diaphragm 140 and the snap ring 130, by which the advantageous effects of minimizing foreign substances (slurry and particles) remaining in the gap between the diaphragm 140 and the snap ring 130, and effectively removing foreign substances flowing into the gap can be obtained.
The carrier head 100 of the present invention may further include a retainer 160 disposed outside the retainer ring 130 in the radial direction of the substrate W.
The retainer 160 is disposed outside the ring main body 131, and is configured to suppress excessive deformation of the ring main body 131, and to fix the end portion of the extension flap to the ring main body 131.
That is, since the retainer ring main body 131 is formed of a material having a deformable property, deformation of the retainer ring main body 131 may excessively occur in the polishing process, and in a state where the retainer ring main body 131 excessively deforms, there is a problem in that it is difficult to accurately apply pressure to the retainer ring main body 131 in the pressurizing chamber of the retainer ring 130.
However, the present invention suppresses excessive deformation of the snap ring body 131 by the retainer 160 on the outer side of the snap ring 130, and thus, the present invention can obtain advantageous effects of stably maintaining the arrangement state of the snap ring body 131 and improving stability and reliability.
The retainer 160 can be mounted in various positions according to the required conditions and design specifications.
As one example, retainer 160 is coupled to carrier head body 101. According to another embodiment of the present invention, the retainer may be mounted on the outer side of the carrier head body or on a peripheral device, and the present invention is not limited or restricted by the mounting position of the retainer.
Preferably, the lower surface of the retainer 160 is spaced apart from the upper surface of the polishing pad 11. As described above, by disposing the lower surface of the retainer 160 away from the upper surface of the polishing pad 11, the advantageous effect of minimizing the deterioration of the performance and lifetime of the polishing pad 11 due to the contact of the retainer 160 with the polishing pad 11 can be obtained.
The retainer 160 is disposed apart from the outer surface of the retainer body 131. As described above, by disposing the retainer 160 spaced apart from the outer side surface of the snap ring main body 131, the advantageous effect of suppressing excessive deformation while allowing the snap ring main body 131 to deform can be obtained.
The retainer 160 may be formed in various structures capable of suppressing excessive deformation of the snap ring body 131.
As one example, the snap ring 130 includes a vertical outer side portion 138 forming an outer side surface of the snap ring 130, an inclined outer side portion 137 connected to a lower portion of the vertical outer side portion 138 and formed obliquely toward the diaphragm 140, and the retainer 160 includes a vertical guide portion 164 corresponding to the vertical outer side portion 138, and an inclined guide portion 162 corresponding to the inclined outer side portion 137.
The angles and lengths of the inclined outer side portion 137 and the inclined guide portion 162 may be variously changed according to the required conditions and design specifications, and the present invention is not limited or restricted by the angles and lengths of the inclined outer side portion 137 and the inclined guide portion 162.
As described above, the vertical outer side portion 138 of the snap ring 130 is interfered by the vertical guide portion 164 of the retainer 160, and the inclined outer side portion 137 of the snap ring 130 is interfered by the inclined guide portion 162 of the retainer 160, so that an advantageous effect of suppressing excessive deformation of the snap ring body 131 and more stably maintaining the arrangement state of the snap ring body 131 can be obtained.
Referring to fig. 7, the carrier head 100 of the present invention includes a restraining portion 170 that restrains the snap ring 130 relative to the retainer 160.
The restraining portion 170 serves to restrain the retainer 160 and the snap ring 130 so that the snap ring 130 can stably rotate when the carrier head 100 rotates.
Preferably, the restraining portion 170 allows up and down movement of the snap ring 130 relative to the retainer 160 and restrains rotation of the snap ring 130 relative to the retainer 160.
The restraining portion 170 may be formed in various structures that allow the up-and-down movement of the snap ring 130 relative to the retainer 160 and restrain the rotation of the snap ring 130 relative to the retainer 160.
As one example, the constraint part 170 includes: a guide hole 139 formed in the snap ring 130; the guide pin 166 has one end fixed to the retainer 160 and the other end accommodated in the guide hole 139.
The guide hole 139 may be preferably formed in a long hole shape capable of moving the guide pin 166 in the up-down direction.
As described above, the end of the guide pin 166 coupled to the retainer 160 is received in the guide hole 139 formed in the retainer ring 130, and thus the rotational force of the carrier head 100 can be efficiently transmitted to the retainer ring 130. In addition, since the end portion of the guide pin 166 is accommodated in the guide hole 139 so as to be movable in the up-down direction, the up-down movement of the retainer ring 130 can be allowed, and thus the pressurizing force can be controlled by the retainer ring 130.
For reference, in the embodiment of the present invention, the example in which the end portion of the guide pin 166 coupled to the retainer 160 is received in the guide hole 139 formed in the retainer 130 has been described, but according to another embodiment of the present invention, the end portion of the guide pin coupled to the retainer may be received in the guide hole formed in the retainer.
While the present invention has been described with reference to the preferred embodiments thereof, those skilled in the art will understand that the present invention can be variously modified and altered without departing from the spirit and scope of the present invention as set forth in the following patent claims.
Claims (16)
1. A carrier head for pressurizing a substrate to a polishing pad in a chemical mechanical polishing process, comprising:
a carrier head body;
a diaphragm mounted below the carrier head body, for pressing the substrate against the polishing pad;
an extension flap including an inclined flap portion formed to be inclined upward toward the outer side of the radius and a horizontal flap portion formed horizontally from an end of the inclined flap portion toward the outer side of the radius, the extension flap being formed to extend around the outer side surface of the diaphragm;
a clasp including an inclined contact surface closely attached to the inclined flap portion and a horizontal contact surface closely attached to the horizontal flap portion, and mounted on the extension flap for restraining a side surface of the substrate;
a clasp pressure chamber for applying a pressurizing force to the clasp at an upper portion of the extension flap,
the pressing force transmitted through the inclined flap portion causes the inclined contact surface to be applied with a force in an inclined direction so as to keep the retainer ring in a state of being abutted against the polishing pad.
2. The carrier head of claim 1, wherein,
the elongate flap comprises:
an upper flap integrally extending on an outer side surface of the diaphragm and coupled to the carrier head body;
a lower flap integrally extending on an outer side surface of the diaphragm in a spaced-apart relation to the upper flap and coupled to the carrier head body;
the clasp pressure chamber is formed between the upper and lower petals.
3. The carrier head of claim 1, wherein,
the extension flap includes a protruding flap portion protruding from the horizontal flap portion,
the snap ring includes a receiving portion for receiving the protruding flap portion.
4. The carrier head of claim 3, wherein,
the protruding petals have a width that increases from an upper end to a lower end.
5. The carrier head of claim 1, wherein,
the retainer ring is formed of a material that is deformable by a force applied in a polishing step.
6. The carrier head of claim 5, wherein,
the clamping ring is made of nonmetallic materials.
7. The carrier head of claim 5, wherein,
the clamping ring is formed by more than one plastic material selected from polyether-ether-ketone (peek) and polyphenylene sulfide (Poly Phenylene Sulfide; PPS).
8. The carrier head of claim 1, wherein,
the retainer is disposed outside the retainer ring in a radial direction of the substrate.
9. The carrier head of claim 8, wherein,
the retainer is coupled to the carrier head body.
10. The carrier head of claim 8, wherein,
the retainer has a lower surface configured to be spaced apart from an upper surface of the polishing pad.
11. The carrier head of claim 8, wherein,
the retainer is configured to be spaced from an outer side surface of the snap ring.
12. The carrier head of claim 8, wherein,
the snap ring includes: forming a vertical outer side portion of an outer side surface of the snap ring; and an inclined outer portion connected to a lower portion of the vertical outer portion and inclined toward the diaphragm,
the retainer includes: a vertical guide portion corresponding to the vertical outer side portion and an inclined guide portion corresponding to the inclined outer side portion.
13. The carrier head of claim 8, wherein,
includes a restraining portion that restrains the snap ring relative to the retainer.
14. The carrier head of claim 13, wherein,
the restraining portion allows up and down movement of the snap ring relative to the retainer and restrains rotation of the snap ring relative to the retainer.
15. The carrier head of claim 14, wherein,
the constraint part includes:
a guide hole formed on the snap ring;
and a guide pin having one end fixed to the retainer and the other end accommodated in the guide hole.
16. The carrier head of claim 15, wherein,
the guide hole is formed in a long hole shape capable of moving the guide pin in the up-down direction.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR20180155031 | 2018-12-05 | ||
| KR10-2018-0155031 | 2018-12-05 |
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| Publication Number | Publication Date |
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| CN111266993A CN111266993A (en) | 2020-06-12 |
| CN111266993B true CN111266993B (en) | 2023-06-30 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201811580191.8A Active CN111266993B (en) | 2018-12-05 | 2018-12-24 | Clamping ring of bearing head for chemical mechanical polishing device and bearing head with clamping ring |
Country Status (2)
| Country | Link |
|---|---|
| KR (2) | KR20200068561A (en) |
| CN (1) | CN111266993B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR102705970B1 (en) * | 2023-09-14 | 2024-09-11 | 부재필 | wafer polishing head of CMP device |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6241593B1 (en) * | 1999-07-09 | 2001-06-05 | Applied Materials, Inc. | Carrier head with pressurizable bladder |
| KR101387921B1 (en) * | 2013-01-02 | 2014-04-29 | 주식회사 케이씨텍 | Membrane of carrier head in chemical mechanical polishing apparatus and carrier head using same |
| KR20150129197A (en) * | 2014-05-09 | 2015-11-19 | 주식회사 케이씨텍 | Retainer ring in carrier head for chemical mechanical polishing apparatus and carrier head with the same |
Family Cites Families (18)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3428566B2 (en) * | 1995-02-28 | 2003-07-22 | 三菱マテリアル株式会社 | Wafer polishing method |
| KR100475845B1 (en) * | 1997-04-04 | 2005-06-17 | 도쿄 세이미츄 코퍼레이션 리미티드 | Polishing device |
| JP3614666B2 (en) * | 1998-06-30 | 2005-01-26 | 株式会社荏原製作所 | Wafer polishing head |
| US6244942B1 (en) * | 1998-10-09 | 2001-06-12 | Applied Materials, Inc. | Carrier head with a flexible membrane and adjustable edge pressure |
| US6422927B1 (en) * | 1998-12-30 | 2002-07-23 | Applied Materials, Inc. | Carrier head with controllable pressure and loading area for chemical mechanical polishing |
| US6361419B1 (en) * | 2000-03-27 | 2002-03-26 | Applied Materials, Inc. | Carrier head with controllable edge pressure |
| US20040005842A1 (en) * | 2000-07-25 | 2004-01-08 | Chen Hung Chih | Carrier head with flexible membrane |
| JP2003025217A (en) * | 2001-07-13 | 2003-01-29 | Tokyo Seimitsu Co Ltd | Wafer polishing device |
| KR200395968Y1 (en) * | 2005-06-16 | 2005-09-15 | 주식회사 윌비에스엔티 | Retainer ring of chemical mechanical polishing apparatus |
| DE602008002445D1 (en) * | 2007-01-30 | 2010-10-28 | Ebara Corp | polisher |
| JP5464820B2 (en) * | 2007-10-29 | 2014-04-09 | 株式会社荏原製作所 | Polishing equipment |
| JP5199691B2 (en) * | 2008-02-13 | 2013-05-15 | 株式会社荏原製作所 | Polishing equipment |
| JP5922965B2 (en) * | 2012-03-29 | 2016-05-24 | 株式会社荏原製作所 | Substrate holding apparatus, polishing apparatus, and polishing method |
| JP2015062956A (en) * | 2012-09-19 | 2015-04-09 | 株式会社荏原製作所 | Polishing device |
| KR101629161B1 (en) * | 2013-04-18 | 2016-06-21 | 주식회사 케이씨텍 | Carrier head of chemical mechanical apparatus and membrane used therein |
| KR101558852B1 (en) * | 2014-06-23 | 2015-10-13 | 주식회사 케이씨텍 | Membrane in carrier head |
| KR102173323B1 (en) * | 2014-06-23 | 2020-11-04 | 삼성전자주식회사 | Carrier head, chemical mechanical polishing apparatus and wafer polishing method |
| KR101685914B1 (en) * | 2014-11-17 | 2016-12-14 | 주식회사 케이씨텍 | Membrane in carrier head for chemical mechanical polishing apparatus |
-
2018
- 2018-12-24 CN CN201811580191.8A patent/CN111266993B/en active Active
-
2019
- 2019-08-29 KR KR1020190106343A patent/KR20200068561A/en active Application Filing
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- 2024-07-18 KR KR1020240095348A patent/KR20240116441A/en active Application Filing
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6241593B1 (en) * | 1999-07-09 | 2001-06-05 | Applied Materials, Inc. | Carrier head with pressurizable bladder |
| KR101387921B1 (en) * | 2013-01-02 | 2014-04-29 | 주식회사 케이씨텍 | Membrane of carrier head in chemical mechanical polishing apparatus and carrier head using same |
| KR20150129197A (en) * | 2014-05-09 | 2015-11-19 | 주식회사 케이씨텍 | Retainer ring in carrier head for chemical mechanical polishing apparatus and carrier head with the same |
Also Published As
| Publication number | Publication date |
|---|---|
| CN111266993A (en) | 2020-06-12 |
| KR20240116441A (en) | 2024-07-29 |
| KR20200068561A (en) | 2020-06-15 |
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