CN206282883U - The integrated filaments of plant lamp LED - Google Patents
The integrated filaments of plant lamp LED Download PDFInfo
- Publication number
- CN206282883U CN206282883U CN201621386183.6U CN201621386183U CN206282883U CN 206282883 U CN206282883 U CN 206282883U CN 201621386183 U CN201621386183 U CN 201621386183U CN 206282883 U CN206282883 U CN 206282883U
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
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- Non-Portable Lighting Devices Or Systems Thereof (AREA)
Abstract
The integrated filaments of plant lamp LED, it is related to LED lamp technical field;Several red light chips, several purple light chips and several blue chips are connected with by crystal-bonding adhesive on safety glass support, several red light chips, several purple light chips and several blue chips are connected in series by bonding wire;The two ends of described safety glass support are provided with coating, and the coating at two ends is connected to pin;Silica gel is coated with described safety glass support, red light chips, purple light chip and blue chip;The dominant wavelength of described red light chips is 630 670nm, and the dominant wavelength of blue chip is 450 475nm, and the dominant wavelength of purple light chip is 370 430nm.The integrated filaments of plant lamp LED described in the utility model, lighting angle is 360 °, and light rational and efficient use, uniformity of temperature profile can be applied on all kinds of luminous class products.
Description
Technical field
The utility model is related to LED lamp technical field, and in particular to the integrated filaments of plant lamp LED.
Background technology
Existing LED filament is generally monochromatic source, applies the light of the LED light source mostly SMD pasters encapsulation in plant lamp
Source, this light source defect is that lighting angle is 120 °, fails to reach the effective and reasonable utilization of light, and temperature on TOP directions compared with
Height, has an impact to the regionality of plant production, it is necessary to pass through external condensation system so that uniformity of temperature profile.
Utility model content
The purpose of this utility model is the defect and deficiency for prior art, there is provided a kind of simple structure, design are closed
Reason, the integrated filaments of plant lamp LED easy to use.
To achieve the above object, the technical solution adopted in the utility model is:It includes safety glass support, feux rouges core
Piece, purple light chip, blue chip, crystal-bonding adhesive, bonding wire, coating, pin, silica gel;Pass through die bond on described safety glass support
Gemel connection has several red light chips, several purple light chips and several blue chips, several red light chips, several purples
Optical chip and several blue chips are connected in series by bonding wire;The two ends of described safety glass support are provided with coating, two
The coating at end is connected to pin;It is coated with described safety glass support, red light chips, purple light chip and blue chip
Silica gel;The dominant wavelength of described red light chips is 630-670nm, and the dominant wavelength of blue chip is 450-475nm, purple light chip
Dominant wavelength is 370-430nm.
Preferably, the dominant wavelength of described red light chips is 660nm, the dominant wavelength of blue chip is 460nm, purple light core
The dominant wavelength of piece is 430nm.
Preferably, described pin is made of copper material.
Preferably, the height of described crystal-bonding adhesive for red light chips, purple light chip or blue chip height three/
One.
Preferably, the maximum height of described silica gel is higher than bonding wire peak 1mm-2mm.
Operating principle of the present utility model is:From safety glass support as the package support of filament, product is reached resistance to
High temperature and 360 ° of luminous effects of filament body of light, the specification of safety glass support is 1-49cm long, 1-5cm wide, thick 0.2-
0.8cm, carries out corresponding both positive and negative polarity coating treatment on support, and support two ends copper material is used as pin, the specification of pin
It is 1-2cm long, 1-5cm wide, thick 0.1-0.25cm, respectively by purple light, blue light, red light chips die bond on support, with series connection
Mode the chip of each wave band is respectively welded together, applied on support and spread transparent silica gel, baking-curing shaping.
After said structure, what the utility model was produced has the beneficial effect that:Plant lamp LED collection described in the utility model
Into filament, lighting angle is 360 °, and light rational and efficient use, uniformity of temperature profile can be applied on all kinds of luminous class products,
The utility model has the advantages that simple structure, sets reasonable, low manufacture cost.
Brief description of the drawings
Fig. 1 is structure chart of the present utility model;
Fig. 2 is the top view of Fig. 1.
Description of reference numerals:
Safety glass support 1, red light chips 2, purple light chip 3, blue chip 4, crystal-bonding adhesive 5, bonding wire 6, coating 7, pin
8th, silica gel 9.
Specific embodiment
In order to illustrate more clearly of the utility model embodiment or technical scheme of the prior art, below will be to embodiment
Or the accompanying drawing to be used needed for description of the prior art is briefly described, it should be apparent that, drawings in the following description are only
It is some embodiments of the present utility model, for those of ordinary skill in the art, before creative labor is not paid
Put, other accompanying drawings can also be obtained according to these accompanying drawings.
Referring to such as Fig. 1 --- shown in Fig. 2, this specific embodiment is adopted the following technical scheme that:It includes safety glass branch
Frame 1, red light chips 2, purple light chip 3, blue chip 4, crystal-bonding adhesive 5, bonding wire 6, coating 7, pin 8, silica gel 9;Described tempering
Several red light chips 2, several purple light chips 3 and several blue chips 4 are connected with by crystal-bonding adhesive 5 on glass supporter 1,
Several red light chips 2, several purple light chips 3 and several blue chips 4 are connected in series by bonding wire 6;Described tempering
The two ends of glass supporter 1 are provided with coating 7, and the coating 7 at two ends is connected to pin 8;It is described safety glass support 1, red
Silica gel 9 is coated with optical chip 2, purple light chip 3 and blue chip 4;The dominant wavelength of described red light chips 2 is 630-670nm,
The dominant wavelength of blue chip 4 is 450-475nm, and the dominant wavelength of purple light chip 3 is 370-430nm.
Preferably, the dominant wavelength of described red light chips 2 is 660nm, the dominant wavelength of blue chip 4 is 460nm, purple light
The dominant wavelength of chip 3 is 430nm.
Preferably, described pin 8 is made of copper material.
Preferably, the height of described crystal-bonding adhesive 5 is the three of red light chips 2, purple light chip 3 or the height of blue chip 4
/ mono-.
Preferably, the maximum height of described silica gel 9 is higher than the peak 1mm-2mm of bonding wire 6.
The operating principle of this specific embodiment is:From safety glass support as the package support of filament, product is reached
Product high temperature resistant and 360 ° of luminous effects of filament body of light, the specification of safety glass support 1 is 1-49cm long, 1-5cm wide, thickness
0.2-0.8cm, carries out corresponding both positive and negative polarity coating treatment on support, and support two ends copper material is used as pin, the specification of pin
Size is 1-2cm long, 1-5cm wide, thick 0.1-0.25cm, respectively by purple light, blue light, red light chips die bond on support, is used
Be respectively welded the chip of each wave band together by the mode of series connection, is applied on support and spreads transparent silica gel, baking-curing into
Type.
After said structure, what this specific embodiment was produced has the beneficial effect that:Plant described in this specific embodiment
The integrated filaments of thing lamp LED, lighting angle is 360 °, light rational and efficient use, uniformity of temperature profile, be can be applied to all kinds of luminous
On class product, this specific embodiment has the advantages that simple structure, sets reasonable, low manufacture cost.
General principle of the present utility model and principal character and advantage of the present utility model has been shown and described above.This
The technical staff of industry is retouched in above-described embodiment and specification it should be appreciated that the utility model is not restricted to the described embodiments
That states simply illustrates principle of the present utility model, on the premise of the utility model spirit and scope are not departed from, the utility model
Various changes and modifications are also had, these changes and improvements are both fallen within the range of claimed the utility model.This practicality is new
The claimed scope of type is by appending claims and its equivalent thereof.
Claims (5)
1. integrated filaments of plant lamp LED, it is characterised in that:It includes safety glass support, red light chips, purple light chip, blue light
Chip, crystal-bonding adhesive, bonding wire, coating, pin, silica gel;Several are connected with by crystal-bonding adhesive on described safety glass support red
Optical chip, several purple light chips and several blue chips, several red light chips, several purple light chips and several indigo plants
Optical chip is connected in series by bonding wire;The two ends of described safety glass support are provided with coating, and the coating at two ends is connected respectively
There is pin;Silica gel is coated with described safety glass support, red light chips, purple light chip and blue chip;Described feux rouges
The dominant wavelength of chip is 630-670nm, and the dominant wavelength of blue chip is 450-475nm, and the dominant wavelength of purple light chip is 370-
430nm。
2. integrated filaments of plant lamp LED according to claim 1, it is characterised in that:The dominant wavelength of described red light chips
It is 660nm, the dominant wavelength of blue chip is 460nm, and the dominant wavelength of purple light chip is 430nm.
3. integrated filaments of plant lamp LED according to claim 1, it is characterised in that:Described pin uses copper material system
Into.
4. integrated filaments of plant lamp LED according to claim 1, it is characterised in that:The height of described crystal-bonding adhesive is red
/ 3rd of optical chip, purple light chip or blue chip height.
5. integrated filaments of plant lamp LED according to claim 1, it is characterised in that:The maximum height of described silica gel is high
In bonding wire peak 1mm-2mm.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201621386183.6U CN206282883U (en) | 2016-12-16 | 2016-12-16 | The integrated filaments of plant lamp LED |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201621386183.6U CN206282883U (en) | 2016-12-16 | 2016-12-16 | The integrated filaments of plant lamp LED |
Publications (1)
Publication Number | Publication Date |
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CN206282883U true CN206282883U (en) | 2017-06-27 |
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CN201621386183.6U Active CN206282883U (en) | 2016-12-16 | 2016-12-16 | The integrated filaments of plant lamp LED |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108022922A (en) * | 2017-11-10 | 2018-05-11 | 江苏稳润光电科技有限公司 | One kind is suitable for plant illumination LED light source |
-
2016
- 2016-12-16 CN CN201621386183.6U patent/CN206282883U/en active Active
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN108022922A (en) * | 2017-11-10 | 2018-05-11 | 江苏稳润光电科技有限公司 | One kind is suitable for plant illumination LED light source |
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