CN206282857U - LED lamp filament with adjustable light - Google Patents
LED lamp filament with adjustable light Download PDFInfo
- Publication number
- CN206282857U CN206282857U CN201621386184.0U CN201621386184U CN206282857U CN 206282857 U CN206282857 U CN 206282857U CN 201621386184 U CN201621386184 U CN 201621386184U CN 206282857 U CN206282857 U CN 206282857U
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- Prior art keywords
- white
- chip
- several
- chips
- blue
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- Non-Portable Lighting Devices Or Systems Thereof (AREA)
- Led Device Packages (AREA)
- Fastening Of Light Sources Or Lamp Holders (AREA)
Abstract
LED lamp filament with adjustable light, it is related to LED lamp technical field；It includes substrate, blue chip, white chip, crystal-bonding adhesive, bonding wire, coating, positive pole pin, negative pin, white light silica gel；Several blue chips and several white chips are connected with by crystal-bonding adhesive on described substrate, connected by bonding wire between several blue chips, connected also by bonding wire between several white chips, and several blue chips are arranged in parallel with several white chips；The two ends of described substrate are provided with coating, connect positive pole pin and negative pin on the coating at two ends respectively；The periphery of described blue chip, white chip and substrate is coated with white light silica gel.LED lamp filament with adjustable light described in the utility model, applies on Dimmable lighting, reaches colour temperature regulation and color change of the single filament colour temperature from 1500K to 30000K, it is adaptable to SMD paster light sources, LAMP supports light source, filament light sources.
Description
Technical field
The utility model is related to LED lamp technical field, and in particular to LED lamp filament with adjustable light.
Background technology
Existing LED filament is generally monochromatic general light or single color temperature light sources, and filament can only debug light source bright by the control of electric current
The height of degree, filament cannot debug the change of colour temperature.
Utility model content
The purpose of this utility model is the defect and deficiency for prior art, there is provided a kind of simple structure, design are closed
Reason, LED lamp filament with adjustable light easy to use.
To achieve the above object, the technical solution adopted in the utility model is：It includes substrate, blue chip, white light core
Piece, crystal-bonding adhesive, bonding wire, coating, positive pole pin, negative pin, white light silica gel；If being connected with by crystal-bonding adhesive on described substrate
Dry blue chip and several white chips, are connected between several blue chips by bonding wire, several white chips it
Between connected also by bonding wire, and several blue chips are arranged in parallel with several white chips；The two ends of described substrate set
Coating is equipped with, positive pole pin and negative pin is connected on the coating at two ends respectively；Described blue chip, white chip and substrate
On be coated with white light silica gel.
Preferably, described substrate is ceramic substrate, sapphire substrate or reinforced glass substrate.
Preferably, the reference color temperature of described white chip is 1500-20000K.
Preferably, the dominant wavelength ranges of described blue chip are 440-460nm.
Preferably, the height of described crystal-bonding adhesive is 1/3rd of blue chip or white chip height.
Preferably, the maximum height of described white light silica gel is higher than bonding wire peak 1mm-2mm.
Preferably, several described blue chips are arranged in parallel with several white chips replaces with several blue lights
Chip is arranged in series with several white chips.
The utility model operate when, Ceramics or sapphire or safety glass as package support, reach high temperature resistant with
360 ° of luminous effects of filament body of light, the specification of substrate is：1-49cm long, 1-5cm wide, thick 0.2-0.8cm, on support
Corresponding both positive and negative polarity coating treatment is carried out, with iron material or copper material as both positive and negative polarity pin, the specification of pin is two sections of support：
1-2cm long, 1-5cm wide, thick 0.1-0.25cm, respectively by white chip, blue chip die bond on support, with the side of series connection
With blue chip be together in series white chip respectively by formula, then two-way white light is in parallel with blue chip in circuit, in support
White light silica gel, baking-curing shaping are spread in upper painting；After blue chip excited white light glue, reference color temperature is 1500-30000K.
After said structure, what the utility model was produced has the beneficial effect that：Light-adjustable LED lamp described in the utility model
Silk, applies on Dimmable lighting, reaches colour temperature regulation and color change of the single filament colour temperature from 1500K to 30000K, is applicable
In SMD paster light sources, LAMP supports light source, filament light sources, the utility model has simple structure, sets reasonable, cost of manufacture
Low advantage.
Brief description of the drawings
Fig. 1 is structure chart of the present utility model；
Fig. 2 is the top view of Fig. 1.
Description of reference numerals：
It is substrate 1, blue chip 2, white chip 3, crystal-bonding adhesive 4, bonding wire 5, coating 6, positive pole pin 7, negative pin 8, white
Light silica gel 9.
Specific embodiment
In order to illustrate more clearly of the utility model embodiment or technical scheme of the prior art, below will be to embodiment
Or the accompanying drawing to be used needed for description of the prior art is briefly described, it should be apparent that, drawings in the following description are only
It is some embodiments of the present utility model, for those of ordinary skill in the art, before creative labor is not paid
Put, other accompanying drawings can also be obtained according to these accompanying drawings.
Referring to such as Fig. 1 --- shown in Fig. 2, this specific embodiment is adopted the following technical scheme that：It includes substrate 1, blue light
Chip 2, white chip 3, crystal-bonding adhesive 4, bonding wire 5, coating 6, positive pole pin 7, negative pin 8, white light silica gel 9；Described substrate 1
It is upper that several blue chips 2 and several white chips 3 are connected with by crystal-bonding adhesive 4, by weldering between several blue chips 2
Line 5 is connected, and is connected also by bonding wire 5 between several white chips 3, and several blue chips 2 and several white chips 3
It is arranged in parallel；The two ends of described substrate 1 are provided with coating 6, connect positive pole pin 7 respectively on the coating 6 at two ends and negative pole draws
Pin 8；White light silica gel 9 is coated with described blue chip 2, white chip 3 and substrate 1.
Preferably, described substrate 1 is ceramic substrate, sapphire substrate or reinforced glass substrate.
Preferably, the reference color temperature of described white chip is 1500-20000K.
Preferably, the dominant wavelength ranges of described blue chip are 440-460nm.
Preferably, the height of described crystal-bonding adhesive 4 is 1/3rd of blue chip 2 or the height of white chip 3.
Preferably, the maximum height of described white light silica gel 9 is higher than the peak 1mm-2mm of bonding wire 5.
Preferably, several described blue chips 2 are arranged in parallel with several white chips 3 replaces with several indigo plants
Optical chip 2 is arranged in series with several white chips 3.
When this specific embodiment is operated, Ceramics or sapphire or safety glass reach resistance to height as package support
Temperature and 360 ° of luminous effects of filament body of light, the specification of substrate 1 is：1-49cm long, 1-5cm wide, thick 0.2-0.8cm,
Corresponding both positive and negative polarity coating treatment is carried out on support, two sections of support is with iron material or copper material as both positive and negative polarity pin, the specification of pin
Size is：1-2cm long, 1-5cm wide, thick 0.1-0.25cm, respectively by white chip 3, the die bond of blue chip 2 on support,
White chip is together in series respectively with blue chip with the mode of series connection, then two-way white light and blue chip are connected in parallel on circuit
In, applied on support and spread white light silica gel 9, baking-curing shaping；After blue chip excited white light glue, reference color temperature is 1500-
30000K。
After said structure, what this specific embodiment was produced has the beneficial effect that：Described in this specific embodiment can
Dimming LED (Light Emitting Diode) filament, applies on Dimmable lighting, reaches colour temperature regulation and color of the single filament colour temperature from 1500K to 30000K
Change, it is adaptable to SMD paster light sources, LAMP supports light source, filament light sources, this specific embodiment has simple structure, sets
Rationally, the advantages of low manufacture cost.
General principle of the present utility model and principal character and advantage of the present utility model has been shown and described above.This
The technical staff of industry is retouched in above-described embodiment and specification it should be appreciated that the utility model is not restricted to the described embodiments
That states simply illustrates principle of the present utility model, on the premise of the utility model spirit and scope are not departed from, the utility model
Various changes and modifications are also had, these changes and improvements are both fallen within the range of claimed the utility model.This practicality is new
The claimed scope of type is by appending claims and its equivalent thereof.
Claims (7)
1. LED lamp filament with adjustable light, it is characterised in that：It comprising substrate, blue chip, white chip, crystal-bonding adhesive, bonding wire, coating,
Positive pole pin, negative pin, white light silica gel；On described substrate by crystal-bonding adhesive be connected with several blue chips and several
White chip, is connected between several blue chips by bonding wire, is connected also by bonding wire between several white chips, and if
A dry blue chip is arranged in parallel with several white chips；The two ends of described substrate are provided with coating, on the coating at two ends
Positive pole pin and negative pin are connected respectively；White light silica gel is coated with described blue chip, white chip and substrate.
2. LED lamp filament with adjustable light according to claim 1, it is characterised in that：Described substrate is ceramic substrate, sapphire
Substrate or reinforced glass substrate.
3. LED lamp filament with adjustable light according to claim 1, it is characterised in that：The reference color temperature of described white chip is
1500-20000K。
4. LED lamp filament with adjustable light according to claim 1, it is characterised in that：The dominant wavelength ranges of described blue chip
It is 440-460nm.
5. LED lamp filament with adjustable light according to claim 1, it is characterised in that：The height of described crystal-bonding adhesive is blue light core
/ 3rd of piece or white chip height.
6. LED lamp filament with adjustable light according to claim 1, it is characterised in that：The maximum height of described white light silica gel is high
In bonding wire peak 1mm-2mm.
7. LED lamp filament with adjustable light according to claim 1, it is characterised in that：Several described blue chips with it is some
Individual white chip is arranged in parallel and replaces with several blue chips and be arranged in series with several white chips.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621386184.0U CN206282857U (en) | 2016-12-16 | 2016-12-16 | LED lamp filament with adjustable light |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621386184.0U CN206282857U (en) | 2016-12-16 | 2016-12-16 | LED lamp filament with adjustable light |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206282857U true CN206282857U (en) | 2017-06-27 |
Family
ID=59073512
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621386184.0U Active CN206282857U (en) | 2016-12-16 | 2016-12-16 | LED lamp filament with adjustable light |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206282857U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108071954A (en) * | 2017-11-30 | 2018-05-25 | 易美芯光（北京）科技有限公司 | The LED light engine module of the tunable optical toning of annular, preparation method and application |
-
2016
- 2016-12-16 CN CN201621386184.0U patent/CN206282857U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108071954A (en) * | 2017-11-30 | 2018-05-25 | 易美芯光（北京）科技有限公司 | The LED light engine module of the tunable optical toning of annular, preparation method and application |
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