CN206834177U - A kind of LED filament - Google Patents
A kind of LED filament Download PDFInfo
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- CN206834177U CN206834177U CN201720237171.5U CN201720237171U CN206834177U CN 206834177 U CN206834177 U CN 206834177U CN 201720237171 U CN201720237171 U CN 201720237171U CN 206834177 U CN206834177 U CN 206834177U
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- support
- led
- die bond
- led chip
- led filament
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Abstract
The utility model provides a kind of LED filament, including multiple LED chips, first support and second support, the LED chip are connected with the first support and/or the second support, and the first support and the second support are made of metal；The LED chip both ends electrically connect with the first support and the second support respectively, or multiple LED chips are divided into multigroup LED chip being serially connected, the LED chip both ends being serially connected described in every group electrically connect with the first support and the second support respectively.
Description
Technical field
Filament field is the utility model is related to, particularly a kind of LED filament.
Background technology
There is revolutionary new light sources LED from 20th century, by feat of energy-conserving and environment-protective, rapid much more popular illumination the advantages that long lifespan
Market, LED turn into the lighting source of following main flow, are widely used in commercial lighting, industrial lighting, outdoor lighting etc..But in the people
With the development in terms of illumination than slow, for many people, LED is a new type light source having never heard of. 2008
Year, Japanese oxtail light source is released has reversed this with the appearance of incandescent lamp prototype configuration LED bulb-type light fixture " LED filament bulb "
One phenomenon, " traditional external form ", ' formula ' of upgrading, it is seen that it is exactly to be familiar with that the LED lamp that it makes, which just can figure out it,
Illuminator.Then the candle lamp, Crystal lamp, bulb lamp using LED filament as light source start a large amount of to occur and more and more
Consumer received.
Publication No. CN104241501A discloses a kind of omnidirectional's plant growth lamp LED filament, including strip transparency carrier,
The metallic support at transparency carrier both ends is fixed on, multiple blue-light LED chips, multiple blue-light LED chips are fixed with transparency carrier
LED strip of at least one row through transparency carrier is formed, connects into series connection using wire between the blue-light LED chip of each LED strip
Form；Blue-light LED chip positioned at transparency carrier both ends is wired to support respectively；Also wrapped up outside the transparency carrier
There is Red phosphor layer, the Red phosphor layer is mixed by red fluorescence powder and glue crosslinking agent.
Existing LED filament, miniature deformation may result in gold thread fracture or LED chip damage, and one in LED filament at gold thread
Fracture or LED chip damage may result in LED filament damage.
Utility model content
In order to overcome above mentioned problem, the utility model provides the LED filament being less likely to be damaged.
In order to achieve the above-mentioned advantages, the utility model provides a kind of LED filament, including multiple LED chips, first support and the
Two supports, the LED chip are connected with the first support and/or the second support, the first support and described
Second support is made of metal；The LED chip both ends electrically connect with the first support and the second support respectively, or more
The individual LED chip is divided into multigroup LED chip being serially connected, the LED chip both ends being serially connected described in every group respectively with institute
State first support and second support electrical connection.
In one embodiment of the present utility model, the first support includes die bond portion, and the die bond portion includes interval
The die bond region of arrangement and join domain, the area of section in the die bond region are more than the area of section of the join domain, institute
State LED chip and be fixed on the die bond region.
In one embodiment of the present utility model, the area of section in the die bond portion is gradual from the middle part of the die bond region
Tapered into the middle part of towards the join domain.
In one embodiment of the present utility model, the die bond region and the join domain are platy structure, described
Die bond region and the join domain fix the LED chip close to the first edge of the second support with the die bond region
Surface it is vertical, the section line that the surface of the LED chip is fixed in the first edge and the die bond region is sine curve.
In one embodiment of the present utility model, there is gap between the first support and the second support.
In one embodiment of the present utility model, the first support and the second support are wrapped with photic zone.
In one embodiment of the present utility model, the first support and the second support are outside from the photic zone
Extend the first pin and second pin.
In one embodiment of the present utility model, the second pin is located at the second support and drawn close to described first
One end of pin.
In one embodiment of the present utility model, the first support and the second support are mutually solid by insulator
It is fixed.
In one embodiment of the present utility model, the insulator is made up of epoxy resin.
Even if in the utility model due to LED chip or the damage of every group of LED chip part LED chip parallel with one another or
Harness damage will not result in LED filament and damage completely.
Brief description of the drawings
Fig. 1 show the structural representation of the LED filament of the utility model first embodiment.
Fig. 2 show the first support of Fig. 1 LED filament and the structural representation of second support.
Fig. 3 show the partial enlarged drawing in the middle part of Fig. 2 first support and second support.
Fig. 4 show the sectional view at Fig. 3 1-1.
Fig. 5 show the sectional view at Fig. 3 2-2.
Fig. 6 show the structural representation of the LED filament of the utility model second embodiment.
Fig. 7 show the structural representation of the LED filament of the utility model 3rd embodiment.
Fig. 8 show the structural representation of the LED filament of the utility model fourth embodiment.
Fig. 9 show the structural representation of the LED filament of the embodiment of the utility model the 5th.
Figure 10 show the structural representation of the LED filament of the utility model sixth embodiment.
Figure 11 show the structural representation of the LED filament of the utility model sixth embodiment.
Figure 12 show the structural representation of the LED filament of the embodiment of the utility model the 7th.
Figure 13 show the sectional view at Figure 11 3-3.
Embodiment
Further to illustrate that the utility model is to reach the technological means and effect that predetermined purpose of utility model taken,
Below in conjunction with accompanying drawing and preferred embodiment, to according to the utility model proposes embodiment, structure, feature and its effect,
Describe in detail as after.
Refer to Fig. 1, the LED filament of the present embodiment, including first support 10, second support 20, for fixing first
Frame 10 and the insulator of second support 20 30, wrap up the photic zone 40 at first support 10 and the middle part of second support 20.Insulator 30
Near the end of first support 10 and second support 20.Insulator 30 is preferably made of epoxy resin, certainly insulation
Body 30 can also use plastics or rubber to be made.
Fig. 2 is referred to, first support 10 is divided is located at die bond portion 12 for the first pin 11 and die bond portion 12, the first pin 11
Both ends, second support 20 includes second pin 21 and power supply 22, and second pin 21 is located at the both ends of power supply 22.First draws
Pin 11 is used to connect with power supply circuit with second pin 21.There is gap, i.e., first between first support 10 and second support 20
Support 10 and the open circuit of second support 20, it should be noted that the gap between first support 10 and second support 20 is filled with printing opacity
Layer 40.First support 10LED filaments also include multiple LED chips 50, and multiple LED chips 50 are uniformly fixed on the upper table of die bond portion 12
Face forms a line.In other embodiments, the lower surface of the first power supply is also fixed with multiple LED chips 50.Photic zone can be with
It is layer of silica gel, epoxy resin layer, silica gel and fluorescent adhesive layer made of fluorescent material.
Refer to Fig. 3,4,5 die bond portions 12 are spaced apart die bond region A and join domain, die bond region A section
Area is more than the area of section of join domain, and die bond region A width is more than the width of join domain.(width is x side in Fig. 3
To length) LED chips 50 are fixed on die bond region A upper surface.Area of section in the middle part of preferable die bond region A is gradual
Area of section in the middle part of towards join domain gradually continuously diminishes, first edge of the specific die bond portion 12 towards power supply 22
120 be waveform face, and the surface that first edge 120 fixes LED chip 50 with die bond portion 12 is vertical, first edge 120 and die bond
The section line that the surface of LED chip 50 is fixed in portion 12 is sine curve x=A1sin(ωπy+ φ)+k1.Die bond region and connection
Region is platy structure.
X is first edge 120 in the variable perpendicular to one end of the first power supply towards another extreme direction；
A1For amplitude, A1Can be 0.5mm.
Φ is first phase, phase during x=0；Then moving up and down for curve is reflected on coordinate system；
k1, k2For offset distance, then moving left and right for curve is reflected on coordinate system；
ω is angular speed, the vibration frequency of controlling curve.
Power supply 22 is spaced apart 3rd region C and the 4th region D, and the 3rd region C area of section is less than the 4th
Region D area of section, the 3rd region C width are less than the 4th region D width.Section in the middle part of preferable 3rd region C
The area of section that area is increasingly towards in the middle part of the 4th region D gradually continuously becomes big.Die bond region A is corresponding with the 3rd region C,
The width of join domain such LED filament corresponding with the 4th region D can be with smaller, and LED chip 50 is led to respectively in the present embodiment
Cross wire 50a and die bond portion 12 die bond region A, the 3rd region C of power supply 22 is electrically connected, LED core in other embodiments
Piece 50 is electrically connected by wire 50a with the die bond region A in die bond portion 12, the 4th region D of power supply 22 respectively.
The second edge 220 of power supply 22 towards the first power supply 22 is also waveform face, second edge 220 and die bond portion
The surface of 12 fixation LED chips 50 is vertical, and the section line on the surface of second edge 220 and the fixation of die bond portion 12 LED chip 50 is
Sine curve x=A2sin(ωπy+ φ)+k2, wherein y be first edge 120 in one end of the first power supply towards other end side
To variable.
X is first edge 120 in the variable perpendicular to one end of the first power supply towards another extreme direction；
A2For amplitude, A1More than A2；A2Can be 0.25mm.
Φ is first phase, phase during x=0；Then moving up and down for curve is reflected on coordinate system；
k1, k2For offset distance, then moving left and right for curve is reflected on coordinate system；
ω is angular speed, the vibration frequency of controlling curve.
The both ends of LED chip 50 are connected by wire 50a with die bond portion 12 and power supply 22.
Refer to Fig. 6, in the present embodiment, the first pin 11 is located at one end of the first power supply, and second pin 21 is positioned at supplying
The one end of electric portion away from the first pin 11.
Refer to Fig. 7, in the present embodiment, the first pin 11 is located at one end of the first power supply, and second pin 21 is positioned at supplying
Electric portion is close to one end of the first pin 11.
Refer to Fig. 8, in the present embodiment, photic zone 40 is flame-shaped structure.
Refer to Fig. 9, in the present embodiment, first power supply and power supply at first support 10 and the middle part of second support 20 are
Arc.
Referring to Figure 10, in the present embodiment, each two LED chip is connected into one group of LED chip, and the two of every group of LED chip
End electrically connects with first support 10 and second support 20 respectively.Can be able to be thus 6V according to power supply.
Referring to Figure 11, in the present embodiment, every three LED chips are connected into one group of LED chip, and the two of every group of LED chip
End electrically connects with first support 10 and second support 20 respectively.Can be able to be thus 9V according to power supply.
Refer to Figure 12, Figure 13, in the present embodiment, first support 10 is identical with the structure of second support 20, first support
10 die bond region A is boss shape, is respectively and fixedly provided with multiple LED chips in first support 10 and second support 20, the two of LED chip
End electrically connects with first support 10 and second support 20 respectively.
To sum up, LED filament of the present utility model at least has the following advantages that:
Area of section due to die bond region in the utility model is more than join domain, so when LED filament stress
The deformation of join domain is big, and the deformation in die bond region is small, and LED chips are just less likely to be damaged.
Even if in the utility model due to LED chip or the damage of every group of LED chip part LED chip parallel with one another or
Harness damage will not result in LED filament and damage completely.
More than, only it is preferred embodiment of the present utility model, not makees any formal limit to the utility model
System, although the utility model is disclosed above with preferred embodiment, but is not limited to the utility model, any to be familiar with sheet
Technical professional, do not departing from the range of technical solutions of the utility model, when the technology contents work using the disclosure above
Go out a little change or be modified to the equivalent embodiments of equivalent variations, as long as be without departing from the content of the technical scheme of the utility model, according to
Any simple modification, equivalent variations and the modification made according to the technical essence of the utility model to above example, still fall within
In the range of technical solutions of the utility model.
Claims (10)
- A kind of 1. LED filament, it is characterised in that including multiple LED chips, first support and second support, the LED chip with The first support and/or the second support are connected, and the first support and the second support are made of metal；The LED chip both ends electrically connect with the first support and the second support respectively, or multiple LED chips point Into multigroup LED chip being serially connected, the LED chip both ends being serially connected described in every group respectively with the first support and described Second support electrically connects.
- 2. LED filament according to claim 1, it is characterised in that the first support includes die bond portion, the die bond portion Including spaced apart die bond region and join domain, the area of section in the die bond region is more than the section of the join domain Area, the LED chip are fixed on the die bond region.
- 3. LED filament according to claim 2, it is characterised in that the area of section in the die bond portion is from the crystal bonding area It is increasingly towards in the middle part of the join domain and tapers into the middle part of domain.
- 4. LED filament according to claim 3, it is characterised in that the die bond region and the join domain are tabular Structure, the die bond region and the join domain fix institute close to the first edge of the second support with the die bond region State that the surface of LED chip is vertical, the section line on the surface that the LED chip is fixed in the first edge and the die bond region is Sine curve.
- 5. LED filament according to claim 4, it is characterised in that have between the first support and the second support There is gap.
- 6. LED filament according to claim 1, it is characterised in that the first support and the second support outer wrapping There is photic zone.
- 7. according to the LED filament described in claim 6 any one, it is characterised in that the first support and described second Frame extends outward the first pin and second pin from the photic zone.
- 8. according to the LED filament described in claim 6 any one, it is characterised in that the second pin is located at described second Support is close to one end of first pin.
- 9. according to the LED filament described in claim 1-8 any one, it is characterised in that the first support and described second Support is interfixed by insulator.
- 10. LED filament according to claim 9, it is characterised in that the insulator is made up of epoxy resin.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720237171.5U CN206834177U (en) | 2017-03-13 | 2017-03-13 | A kind of LED filament |
| US15/664,039 US10014342B1 (en) | 2017-03-13 | 2017-07-31 | LED filament and lamp |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201720237171.5U CN206834177U (en) | 2017-03-13 | 2017-03-13 | A kind of LED filament |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206834177U true CN206834177U (en) | 2018-01-02 |
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ID=60780826
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201720237171.5U Active CN206834177U (en) | 2017-03-13 | 2017-03-13 | A kind of LED filament |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206834177U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106653740A (en) * | 2017-03-13 | 2017-05-10 | 浙江鼎鑫工艺品有限公司 | LED lamp filament |
-
2017
- 2017-03-13 CN CN201720237171.5U patent/CN206834177U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106653740A (en) * | 2017-03-13 | 2017-05-10 | 浙江鼎鑫工艺品有限公司 | LED lamp filament |
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