CN202259299U - Light-emitting diode (LED) copper wire lamp string - Google Patents
Light-emitting diode (LED) copper wire lamp string Download PDFInfo
- Publication number
- CN202259299U CN202259299U CN2011203910176U CN201120391017U CN202259299U CN 202259299 U CN202259299 U CN 202259299U CN 2011203910176 U CN2011203910176 U CN 2011203910176U CN 201120391017 U CN201120391017 U CN 201120391017U CN 202259299 U CN202259299 U CN 202259299U
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- China
- Prior art keywords
- led
- lamp string
- copper
- lead
- led chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45117—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 400°C and less than 950°C
- H01L2224/45124—Aluminium (Al) as principal constituent
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45147—Copper (Cu) as principal constituent
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Abstract
The utility model discloses a light-emitting diode (LED) copper wire lamp string which comprises a plurality of LED chips. As an improvement, the LED copper wire lamp string further comprises two lead wires which are flattened in corresponding positions to form a plurality of flat welding areas respectively, the positive pole ends of the LED chips are welded in the welding areas of one lead wire, and the negative pole ends of the LED chips are electrically connected with the corresponding welding areas of the other lead wire through a connecting wire. In the utility model, copper enameled wires are adopted to replace the brackets of the traditional LED chips, and the copper enameled wires can be electrically connected with a plurality of LED chips in sequence to form the whole LED lamp string. The LED copper wire lamp string has a simple fabricating process and a simple structure and can be used flexibly and conveniently. The secondary processing and other complicated treating processes for fabricating the traditional LED lamps into the LED lamp string are omitted.
Description
[technical field]
The utility model relates to the lamp string, particularly a kind of LED copper cash lamp string.
[background technology]
LED is fast-developing in recent years a kind of new type light source, and advantages such as volume is little because of having for the LED lamp, low-power consumption, long service life, high brightness, low in calories, environmental protection are widely used.Along with the development of LED technology, the form of LED lamp is more and more, and the LED lamp string in the LED product not only is applied to the decoration of doing something for the occasion in various red-letter days such as Christmas Day; And be applied to house decoration and city lighting engineering and various recreations place, LED lamp string and traditional incandescent lamp string have incomparable advantage, have beautiful in colour; Can realize the multiple variation of color, and effectively reduce energy consumption that seven color Color-changing lamp strings of composition can not only play the effect of illumination; Its decoration function lets different programs and different occasions increase celebrating atmosphere especially, yet, with reference to shown in Figure 1; Traditional LED is the fixing led chip 1 that electrically connects on single support 2, promptly adopts two electrodes of copper sheet as LED, and the LED product that this technology is come out also is single; A plurality of if desired product mixes become LED lamp string, then must rely on secondary operations to realize, for example; Through lead the electrode copper sheet of each LED lamp such as is coupled together at mode, and its volume size is restricted also.
[utility model content]
The purpose of the utility model is to provide a kind of can effectively overcome above-mentioned deficiency, one-time formed LED copper cash lamp string, and it is simple in structure, and is flexible and convenient to use.
The purpose of the utility model is to realize like this: it comprises a plurality of led chips; Its improvement is: also comprise two leads; Correspondence position on said two leads is through flattening a plurality of flat weld zones of each self-forming; The positive terminal of led chip is welded in wherein the weld zone on the lead, and the negative pole end of led chip is through the corresponding weld zone electric connection on a connecting line and another root lead;
In the said structure, the external packets that said led chip and led chip and two wire interconnecting pieces divide is covered with transparent sealed colloid;
In the said structure, said lead is the copper enamelled wire;
In the said structure, said connecting line is an aluminum steel;
In the said structure, said sealed colloid is an epoxy resin.
The beneficial effect of the utility model is: the utility model adopts the copper enamelled wire to replace the support of traditional led chip, and led chip is electrically connected on the copper enamelled wire, can electrically connect some led chips on this copper enamelled wire successively and form complete LED lamp string; In the process of making, on special mould, need put the copper enamelled wire position coating removal of led chip then to the copper enamelled wire; Flatten to form the weld zone, two electrode tip correspondences of led chip are welded on the flat weld zone of two bronze medal enamelled wires get final product again, owing to the copper enamelled wire on mould is a coiling; So process behind the finished product demoulding a string complete LED; Manufacturing process is simple, need advance complex process such as secondary operations when having avoided traditional LED lamp to be made into the lamp string, in addition; It is simple in structure, and is flexible and convenient to use.
[description of drawings]
Fig. 1 is the structural representation of the utility model LED copper cash lamp string
Fig. 2 is the structural representation of LED lamp in the prior art
Fig. 3 is the structural representation of the single led lamp of the utility model
Fig. 4 is the cutaway view of the single led lamp of the utility model
Among the figure: 1, led chip 2, support 3, lead 4, weld zone 5, connecting line 6, sealed colloid 7, scolder
[embodiment]
Below in conjunction with accompanying drawing and concrete execution mode the utility model is described further:
With reference to Fig. 1, Fig. 3 and shown in Figure 4; The utility model is a kind of LED copper cash lamp string; It comprises a plurality of led chips 1 and two leads 3; Correspondence position on said two leads 3 is through flattening a plurality of flat weld zones 4 of each self-forming; The positive terminal of each led chip 1 is welded in wherein the weld zone 4 on the lead 3 through scolder 7, and the negative pole end of led chip 1 electrically connects with corresponding weld zone 4 on another root lead through a connecting line 5, promptly two of each led chip 1 electrode tips respectively correspondence be electrically connected at two weld zones on the lead 3; External packets in said led chip 1 and led chip 1 and two leads, 3 coupling parts is covered with transparent sealed colloid 6, and the upper surface of sealing colloid 6 is curved.In the present embodiment, said lead 3 adopts the copper enamelled wire; Said connecting line 5 is an aluminum steel; Said sealed colloid 6 is an epoxy resin.
Because the utility model adopts the copper enamelled wire to replace the support 2 of traditional led chip 1, and led chip 1 is electrically connected on the copper enamelled wire, can electrically connect some led chips 1 on this copper enamelled wire successively and form complete LED lamp string; In the process of making, on special mould, then the copper enamelled wire need be put the position coating removal of led chip 1 to the copper enamelled wire; Flatten to form weld zone 4, two electrode tip correspondences of led chip 1 are welded on the flat weld zone 4 of two bronze medal enamelled wires get final product again, owing to the copper enamelled wire on mould is a coiling; So process behind the finished product demoulding a string complete LED lamp string; Manufacturing process is simple, need advance complex process such as secondary operations when having avoided traditional LED lamp to be made into the lamp string, in addition; It is simple in structure, and is flexible and convenient to use.
According to the announcement and the instruction of above-mentioned specification, the utility model those skilled in the art can also carry out suitable change and modification to above-mentioned execution mode.Therefore, the embodiment that discloses and describe above the utility model is not limited to is in the protection range of the claim that also should fall into the utility model to some modifications and the change of the utility model.In addition, although used some specific terms in this specification, these terms are explanation for ease just, the utility model is not constituted any restriction.
Claims (5)
1. LED copper cash lamp string; It comprises a plurality of led chips; It is characterized in that: also comprise two leads; Correspondence position on said two leads is through flattening a plurality of flat weld zones of each self-forming, and the positive terminal of led chip is welded in wherein the weld zone on the lead, and the negative pole end of led chip is through the corresponding weld zone electric connection on a connecting line and another root lead.
2. LED copper cash lamp string according to claim 1 is characterized in that: the external packets that said led chip and led chip and two wire interconnecting pieces divide is covered with transparent sealed colloid.
3. LED copper cash lamp string according to claim 1, it is characterized in that: said lead is the copper enamelled wire.
4. LED copper cash lamp string according to claim 1, it is characterized in that: said connecting line is an aluminum steel.
5. LED copper cash lamp string according to claim 2, it is characterized in that: said sealed colloid is an epoxy resin.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2011203910176U CN202259299U (en) | 2011-10-14 | 2011-10-14 | Light-emitting diode (LED) copper wire lamp string |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN2011203910176U CN202259299U (en) | 2011-10-14 | 2011-10-14 | Light-emitting diode (LED) copper wire lamp string |
Publications (1)
Publication Number | Publication Date |
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CN202259299U true CN202259299U (en) | 2012-05-30 |
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Family Applications (1)
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CN2011203910176U Expired - Fee Related CN202259299U (en) | 2011-10-14 | 2011-10-14 | Light-emitting diode (LED) copper wire lamp string |
Country Status (1)
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CN (1) | CN202259299U (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104390169A (en) * | 2014-11-13 | 2015-03-04 | 许国大 | Manufacturing process of LED (Light Emitting Diode) copper wire lamp |
-
2011
- 2011-10-14 CN CN2011203910176U patent/CN202259299U/en not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN104390169A (en) * | 2014-11-13 | 2015-03-04 | 许国大 | Manufacturing process of LED (Light Emitting Diode) copper wire lamp |
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Legal Events
Date | Code | Title | Description |
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C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20120530 Termination date: 20141014 |
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EXPY | Termination of patent right or utility model |