CN205723619U - A kind of COB light source secondary sealing adhesive device - Google Patents
A kind of COB light source secondary sealing adhesive device Download PDFInfo
- Publication number
- CN205723619U CN205723619U CN201620593690.0U CN201620593690U CN205723619U CN 205723619 U CN205723619 U CN 205723619U CN 201620593690 U CN201620593690 U CN 201620593690U CN 205723619 U CN205723619 U CN 205723619U
- Authority
- CN
- China
- Prior art keywords
- glue
- light source
- led chip
- box dam
- cob light
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Abstract
The utility model discloses a kind of COB light source secondary sealing adhesive device, it relates to COB light source field, it comprises LED support, LED chip, gold thread, fluorescent glue, box dam glue, transparent adhesive tape, several LED chip it is provided with on LED support, and several LED chip is connected with LED support by several gold threads respectively, fluorescent glue point glue is in the top of LED chip, and box dam glue point glue is in the top of fluorescent glue, and transparent adhesive tape point glue is in fluorescent glue and the top of box dam glue.Its reasonable in design, makes simple, easy to use; it is possible not only to COB light source box dam glue and lamp bead are played a protective role, it is also possible to increase product exiting surface, improves lighting angle; promote light efficiency; and colour consistency is good, light is soft, and colour temperature concentration degree is high; lamp bead heat radiation is more preferably; lamp bead profile is more exquisite, has high cost performance, improves reliability and the life-span of product.
Description
Technical field
This utility model relates to a kind of COB light source secondary sealing adhesive device, belongs to COB light source technical field.
Background technology
COB light source is considered in the industry to integrate various advantage, such as high-density packages volume luminous intensity distribution little, easy, nothing
Needing paster, Reflow Soldering operation, easy to assembly etc., the accreditation the most therefore having obtained the fields such as commercial lighting is sealed with extensively application, LED
Dress industry is in the quickly replacement of new material and new technology all the time, and the sealing adhesive process that existing COB light source uses cannot be to COB
Light source box dam glue and lamp bead shield, and reduce product lighting angle and light efficiency, and colour consistency is poor, and light is the most soft
With, colour temperature concentration degree is low, and lamp bead radiating effect is poor, and service life is short.
Summary of the invention
For the problems referred to above, the technical problems to be solved in the utility model is to provide a kind of COB light source secondary sealing adhesive device.
A kind of COB light source secondary sealing adhesive device of the present utility model, it comprises LED support, LED chip, gold thread, fluorescence
Glue, box dam glue, transparent adhesive tape, LED support is provided with several LED chip, and several LED chip respectively by several gold threads with
LED support connects, and fluorescent glue point glue is in the top of LED chip, and box dam glue point glue is in the top of fluorescent glue, and transparent adhesive tape point glue is in glimmering
Optical cement and the top of box dam glue.
The beneficial effects of the utility model: its reasonable in design, make simple, easy to use, are possible not only to COB light
Source box dam glue and lamp bead play a protective role, it is also possible to increase product exiting surface, improve lighting angle, promote light efficiency, and color
Concordance is good, and light is soft, and colour temperature concentration degree is high, and more preferably, lamp bead profile is more exquisite, has high sexual valence in lamp bead heat radiation
Ratio, improves reliability and the life-span of product.
Accompanying drawing illustrates:
For ease of explanation, this utility model is embodied as and accompanying drawing is described in detail by following.
Fig. 1 is structural representation of the present utility model；
Fig. 2 is the structural representation of LED support in this utility model；
Fig. 3 is top view of the present utility model.
1-LED support；2-LED chip；3-gold thread；4-fluorescent glue；5-box dam glue；6-transparent adhesive tape.
Detailed description of the invention:
As shown in Figure 1-Figure 3, this detailed description of the invention is by the following technical solutions: it comprise LED support 1, LED chip 2,
Gold thread 3, fluorescent glue 4, box dam glue 5, transparent adhesive tape 6, LED support 1 is provided with several LED chip 2, and several LED chip 2 is respectively
Being connected with LED support 1 by several gold threads 3,4 glue of fluorescent glue are in the top of LED chip 2, and 5 glue of box dam glue are in fluorescent glue 4
Top, 6 glue of transparent adhesive tape are in fluorescent glue 4 and the top of box dam glue 5.
This detailed description of the invention excites fluorescent glue 4 to make its glow color form white light by the blue light that LED chip 2 sends,
Traditional manufacturing process, is made COB light source exiting surface be restricted owing to affecting by box dam glue, thus affects the light of COB light source
Effect, this practicality solves lamp bead by transparent adhesive tape 6 to be affected product and goes out the problem of light because of box dam glue, more traditional encapsulation, raising
The light extraction efficiency of light source, reduce LED heating, improve light-emitting uniformity, reduce aberration, increase the service life.
The technological process of this detailed description of the invention: a, on LED support 1, LED chip 2 is fixed on plan by crystal-bonding adhesive
Position；B, employing gold thread 3 connect LED chip 2, and connect on the both positive and negative polarity of LED support 1；C, product box dam, for the first time sealing
And formed product, as follows: light source presses light-emitting area size box dam, the thickness of box dam glue 5 must not put glue side beyond ± 0.2mm
Formula uses spray, the mode injecting or put, packaging plastic layer thickness between 10um-1.5mm, packaging plastic refractive index 1.0-2.0 it
Between, the temperature range of drying is at 20 DEG C-200 DEG C；The second time sealing of d, product and formed product are as follows: some glue mode is adopted
By the mode sprayed, inject or put, packaging plastic layer thickness is between 1.5mm-3mm, and packaging plastic refractive index, between 1.0-2.0, is dried
Dry temperature range is at 20 DEG C-200 DEG C；E, product light splitting, pack and put in storage.
This detailed description of the invention reasonable in design, makes simple, easy to use, is possible not only to COB light source box dam glue
And lamp bead plays a protective role, it is also possible to increase product exiting surface, improve lighting angle, promote light efficiency, and colour consistency is good,
Light is soft, and colour temperature concentration degree is high, and more preferably, lamp bead profile is more exquisite, has high cost performance, improves product in lamp bead heat radiation
The reliability of product and life-span.
Of the present utility model ultimate principle and principal character and of the present utility model advantage have more than been shown and described.One's own profession
Skilled person will appreciate that of industry, this utility model is not restricted to the described embodiments, described in above-described embodiment and description
Principle of the present utility model is simply described, on the premise of without departing from this utility model spirit and scope, this utility model is also
Have various changes and modifications, in the range of these changes and improvements both fall within claimed this utility model.This utility model
Claimed scope is defined by appending claims and equivalent thereof.
Claims (1)
1. a COB light source secondary sealing adhesive device, it is characterised in that: it comprise LED support (1), LED chip (2), gold thread (3),
Fluorescent glue (4), box dam glue (5), transparent adhesive tape (6), LED support (1) is provided with several LED chip (2), and several LED chip
(2) be connected with LED support (1) by several gold threads (3) respectively, fluorescent glue (4) some glue in the top of LED chip (2), box dam glue
(5) some glue is in the top of fluorescent glue (4), and transparent adhesive tape (6) some glue is in fluorescent glue (4) and the top of box dam glue (5).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620593690.0U CN205723619U (en) | 2016-06-17 | 2016-06-17 | A kind of COB light source secondary sealing adhesive device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620593690.0U CN205723619U (en) | 2016-06-17 | 2016-06-17 | A kind of COB light source secondary sealing adhesive device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205723619U true CN205723619U (en) | 2016-11-23 |
Family
ID=57305987
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620593690.0U Active CN205723619U (en) | 2016-06-17 | 2016-06-17 | A kind of COB light source secondary sealing adhesive device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205723619U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112467009A (en) * | 2020-11-13 | 2021-03-09 | 中山市仟选照明科技有限公司 | Novel full-light-transmission LED processing technology |
-
2016
- 2016-06-17 CN CN201620593690.0U patent/CN205723619U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112467009A (en) * | 2020-11-13 | 2021-03-09 | 中山市仟选照明科技有限公司 | Novel full-light-transmission LED processing technology |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |