CN204332954U - A kind of brand-new COB light source packaging system - Google Patents
A kind of brand-new COB light source packaging system Download PDFInfo
- Publication number
- CN204332954U CN204332954U CN201420840645.1U CN201420840645U CN204332954U CN 204332954 U CN204332954 U CN 204332954U CN 201420840645 U CN201420840645 U CN 201420840645U CN 204332954 U CN204332954 U CN 204332954U
- Authority
- CN
- China
- Prior art keywords
- light source
- led chip
- support
- cob light
- fluorescent glue
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/44—Structure, shape, material or disposition of the wire connectors prior to the connecting process
- H01L2224/45—Structure, shape, material or disposition of the wire connectors prior to the connecting process of an individual wire connector
- H01L2224/45001—Core members of the connector
- H01L2224/45099—Material
- H01L2224/451—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof
- H01L2224/45138—Material with a principal constituent of the material being a metal or a metalloid, e.g. boron (B), silicon (Si), germanium (Ge), arsenic (As), antimony (Sb), tellurium (Te) and polonium (Po), and alloys thereof the principal constituent melting at a temperature of greater than or equal to 950°C and less than 1550°C
- H01L2224/45144—Gold (Au) as principal constituent
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Abstract
The utility model discloses a kind of brand-new COB light source packaging system, it relates to LED technical field.Mould top tool (1) is positioned at the top of LED chip (5), mould top tool (1) is connected by fluorescent glue (3) with support (4), and LED chip (5) is fixed in support (4), connected by gold thread (2) between two adjacent LED chips (5), and be connected by gold thread (2) between outermost two panels LED chip (5) and the both positive and negative polarity of support (4).COB light source uses transparent adhesive tape or fluorescent glue moulding process, cancels COB light source box dam technique, makes light-emitting area more accurate, stable, add product exiting surface, improve lighting angle, colloid resistance to elevated temperatures is good, and the colour consistency of light is good, and light is soft, colour temperature concentration degree is high, product lighting angle is large, and light efficiency is high, has high cost performance, and product is reliable, the life-span is long.
Description
Technical field
The utility model relates to a kind of brand-new COB light source packaging system, belongs to LED technical field.
Background technology
COB light source is thought in the industry to integrate various advantage, little, the easy luminous intensity distribution of such as high-density packages volume, without the need to paster, Reflow Soldering operation, easy to assembly etc., also accreditation and the extensive use in the fields such as commercial lighting is therefore obtained, LED industry is in the quick replacement of new material and new technology all the time, at present, all adopt box dam technique in traditional LED industry, the thickness of box dam glue and make product light-emitting area accurate not, unified, luminescence has aberration, and box dam technique, also makes the heat dispersion of LED poor, shortens the useful life of LED.Therefore need ceaselessly to develop new product and could meet industry requirement.
Summary of the invention
For the problems referred to above, the technical problems to be solved in the utility model is to provide a kind of brand-new COB light source packaging system.
The COB light source packaging system that the utility model is brand-new, it comprises mould top tool 1, gold thread 2, fluorescent glue 3, support 4 and LED chip 5, mould top tool 1 is positioned at the top of LED chip 5, mould top tool 1 is connected by fluorescent glue 3 with support 4, and LED chip 5 is fixed in support 4, connected by gold thread 2 between two adjacent LED chips 5, and be connected by gold thread 2 between outermost two panels LED chip 5 and the both positive and negative polarity of support 4.
As preferably, described fluorescent glue 3 can be replaced transparent adhesive tape.
As preferably, the blue-light excited fluorescent glue 3 that described LED chip 5 sends makes its glow color form white light, decreases traditional box dam technique in the fabrication process, avoids box dam glue thickness and makes product light-emitting area accurate not, unified.
The production technology of COB light source packaging system of the present utility model is: a, on support 4, by fixing glue, LED chip 5 is fixed on planning location; B, connect LED chip 5 with gold thread 2, and be communicated on the both positive and negative polarity of support 4; C, successively some fluorescent glue 3, then dry, from mold forming after oven dry.
As preferably, described some glue mode adopts the mode of spray, injection or point.
As preferably, the thickness of described fluorescent glue 3 is between 10um-2mm.
As preferably, the refractive index of described fluorescent glue 3 is between 1.0-2.0.
As preferably, the temperature range of described oven dry: 20 DEG C-200 DEG C.
The beneficial effects of the utility model: it can overcome the drawback of prior art, COB light source uses transparent adhesive tape or fluorescent glue moulding process, cancels COB light source box dam technique, make light-emitting area more accurate, stable, add product exiting surface, improve lighting angle, colloid resistance to elevated temperatures is good, and the colour consistency of light is good, light is soft, and colour temperature concentration degree is high, and product lighting angle is large, light efficiency is high, have high cost performance, and product is reliable, the life-span is long.
accompanying drawing illustrates:
For ease of illustrating, the utility model is described in detail by following concrete enforcement and accompanying drawing.
Fig. 1 is the utility model structural representation.
embodiment:
As shown in Figure 1, this embodiment is by the following technical solutions: it comprises mould top tool 1, gold thread 2, fluorescent glue 3, support 4 and LED chip 5, mould top tool 1 is positioned at the top of LED chip 5, mould top tool 1 is connected by fluorescent glue 3 with support 4, and LED chip 5 is fixed in support 4, connected by gold thread 2 between two adjacent LED chips 5, and be connected by gold thread 2 between outermost two panels LED chip 5 and the both positive and negative polarity of support 4.
As preferably, described fluorescent glue 3 can be replaced transparent adhesive tape.
As preferably, the blue-light excited fluorescent glue 3 that described LED chip 5 sends makes its glow color form white light, decreases traditional box dam technique in the fabrication process, avoids box dam glue thickness and makes product light-emitting area accurate not, unified.
The production technology of the COB light source packaging system of this embodiment is: a, on support 4, by fixing glue, LED chip 5 is fixed on planning location; B, connect LED chip 5 with gold thread 2, and be communicated on the both positive and negative polarity of support 4; C, successively some fluorescent glue 3, then dry, from mold forming after oven dry.
As preferably, described some glue mode adopts the mode of spray, injection or point.
As preferably, the thickness of described fluorescent glue 3 is between 10um-2mm.
As preferably, the refractive index of described fluorescent glue 3 is between 1.0-2.0.
As preferably, the temperature range of described oven dry is 20 DEG C-200 DEG C.
More than show and describe general principle of the present utility model and principal character and advantage of the present utility model.The technical staff of the industry should understand; the utility model is not restricted to the described embodiments; what describe in above-described embodiment and specification just illustrates principle of the present utility model; under the prerequisite not departing from the utility model spirit and scope; the utility model also has various changes and modifications, and these changes and improvements all fall within the scope of claimed the utility model.The claimed scope of the utility model is defined by appending claims and equivalent thereof
.
Claims (2)
1. a brand-new COB light source packaging system, it is characterized in that: it comprises mould top tool (1), gold thread (2), fluorescent glue (3), support (4) and LED chip (5), mould top tool (1) is positioned at the top of LED chip (5), mould top tool (1) is connected by fluorescent glue (3) with support (4), and LED chip (5) is fixed in support (4), connected by gold thread (2) between two adjacent LED chips (5), and be connected by gold thread (2) between outermost two panels LED chip (5) and the both positive and negative polarity of support (4).
2. a kind of brand-new COB light source packaging system according to claim 1, is characterized in that: described fluorescent glue (3) can be replaced transparent adhesive tape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420840645.1U CN204332954U (en) | 2014-12-26 | 2014-12-26 | A kind of brand-new COB light source packaging system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420840645.1U CN204332954U (en) | 2014-12-26 | 2014-12-26 | A kind of brand-new COB light source packaging system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204332954U true CN204332954U (en) | 2015-05-13 |
Family
ID=53169279
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420840645.1U Active CN204332954U (en) | 2014-12-26 | 2014-12-26 | A kind of brand-new COB light source packaging system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204332954U (en) |
-
2014
- 2014-12-26 CN CN201420840645.1U patent/CN204332954U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee | ||
| CP01 | Change in the name or title of a patent holder |
Address after: Baoan District Shiyan street Shenzhen city Guangdong province 518000 White Pine Road in Yuntai technology industrial plant building 6, 8, 9 floor, four floor 1 Patentee after: SHENZHEN SMALITE OPTO-ELECTRONIC CO., LTD. Address before: Baoan District Shiyan street Shenzhen city Guangdong province 518000 White Pine Road in Yuntai technology industrial plant building 6, 8, 9 floor, four floor 1 Patentee before: Shenzhen Smalite Optoelectronics Co., Ltd. |