CN206282854U - A kind of system in package module and electronic installation - Google Patents
A kind of system in package module and electronic installation Download PDFInfo
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- CN206282854U CN206282854U CN201620891918.4U CN201620891918U CN206282854U CN 206282854 U CN206282854 U CN 206282854U CN 201620891918 U CN201620891918 U CN 201620891918U CN 206282854 U CN206282854 U CN 206282854U
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Abstract
The utility model discloses a kind of system in package module and electronic installation.The system in package module includes：It is stacked between multiple SIP modules, multiple SIP modules；Flexible printed circuit board, is electrically interconnected two SIP modules being disposed adjacent；Antifreeze plate, is arranged between two SIP modules being disposed adjacent；Adhesive, is arranged between antifreeze plate and SIP module.By above-mentioned module, being stacked between multiple SIP modules, the area that plane is shared is saved, therefore, it is possible to the further intensive setting of highly integrated SIP module, realize that multiple SIP module integral layouts save space；And antifreeze plate at least is set between one group of two SIP module being disposed adjacent so that further it is space-saving and meanwhile between SIP module can also being improved electromagnetic interference problem.Further help in lightening, the miniaturization for realizing electronic installation.
Description
Technical field
The utility model is related to circuit board fabrication and chip package field, more particularly to a kind of system in package module and electricity
Sub-device.
Background technology
With the development trend that electronic product is more and more lightening, more intelligent electronic device modules use SIP
(System In a Package, system in package) technology, i.e., concentrate on one by system in package by some functional units
Encapsulation in module.Such that it is able to realize the over all Integration of circuit, chip, element etc..But due to electromagnetic interference, circuit arrangement etc.
The influence of factor, not all functional unit can be integrated in same SIP module.Therefore may need in electronics
Multiple SIP modules are arranged in equipment.It is many at present that multiple SIP modules are arranged using plane formula, but it is big to take up room, electromagnetic interference
Problem still can not be solved at all.
Utility model content
The utility model can be solved mainly solving the technical problems that provide a kind of system in package module and electronic installation
Certainly arrange in the prior art multiple SIP modules take up room greatly, the problem of electromagnetic interference.
In order to solve the above-mentioned technical problem, a technical scheme of the utility model use is：A kind of system-level envelope is provided
Die-filling group, including：It is stacked between multiple SIP modules, multiple SIP modules；Flexible printed circuit board, is electrically interconnected two adjacent
The SIP module of setting；Antifreeze plate, is arranged between two SIP modules being disposed adjacent；Adhesive, is arranged at antifreeze plate and SIP moulds
Between block.
Each SIP module of multiple SIP modules is with the first face and the second face being disposed opposite to each other and shape is consistent.
Multiple SIP modules are stacked according to same direction, or rightabout is stacked two-by-two.
Further, each SIP module includes：Substrate layer, chip and element layer, encapsulated layer.Chip and element layer are set
In on substrate layer, substrate layer is arranged on the inside of encapsulated layer with chip and element layer；Flexible printed circuit board have first end and
The substrate layer of the second end, first end and the second end SIP module neighbouring with two respectively is connected.
Further, substrate layer with corresponding golden finger is respectively arranged with flexible printed circuit board, both golden fingers
Circuit connection is carried out by welding.
In order to solve the above-mentioned technical problem, another technical scheme of the utility model use is：A kind of electronics dress is provided
Put, including：Body；At least one system in package module as implied above, system in package module is electrically connected with body.
Body includes at least an electronic module, housing and circuit board.
Further, electronic module and system in package module are all arranged on circuit board, electronic module, system in package
Module and circuit board are all disposed within the inside of the housing.
The beneficial effects of the utility model are：By being stacked between multiple SIP modules, saving what plane was shared
Area, therefore, it is possible to the further intensive setting of highly integrated SIP module, realize that multiple SIP module integral layouts are saved
Space；And antifreeze plate at least is set between one group of two SIP module being disposed adjacent so that further it is space-saving simultaneously
The problem of electromagnetic interference between SIP module can also be improved.
Brief description of the drawings
Fig. 1 is the module schematic diagram of the utility model system in package module first embodiment；
Fig. 2 is the module schematic diagram of the utility model system in package module second embodiment；
Fig. 3 is the module schematic diagram of the embodiment of the utility model electronic installation one.
Specific embodiment
Below in conjunction with the accompanying drawing in the utility model embodiment, the technical scheme in the utility model embodiment is carried out
Clearly and completely describe.
As shown in figure 1, the module schematic diagram of the utility model system in package module first embodiment, including：SIP module
(label is respectively 11,15,16,17), flexible printed circuit board 14, antifreeze plate 12 and the convenient description of adhesive 13., below
It is illustrated by taking 4 SIP modules as an example, but the utility model is obviously not intended to limit the quantity of SIP module.
Four SIP modules (label is respectively 11,15,16,17) are respectively SIP module 11, SIP module 15, SIP module
16th, SIP module 17, and SIP module 11, SIP module 15, SIP module 16, SIP module 17 sequentially carry out layer according to same direction
It is folded to set.
Flexible printed circuit board 14 is electrically interconnected two SIP modules being disposed adjacent, i.e., SIP module 11 and SIP are electrically interconnected respectively
Module 15, SIP module 15 and SIP module 16, SIP module 16 and SIP module 17.
Antifreeze plate 12 is arranged between two SIP modules being disposed adjacent；And adhesive 13 be then arranged at antifreeze plate 12 with it is each
Between SIP module.
Antifreeze plate 12 is the logical exotic material of magnetic conductance high, for avoiding each SIP module between interference；Adhesive 13 is exhausted
Edge Resin adhesive, for bonding antifreeze plate 12 with each SIP module.
For the ease of lamination, with the first face and the second face being disposed opposite to each other and shape is consistent, thickness can for each SIP module
With difference.
Each SIP module includes：Substrate layer 112, chip and element layer 111, encapsulated layer 110.Chip and element layer 111 set
It is placed on substrate layer 112, substrate layer 112 is arranged on the inside of encapsulated layer 110 with chip and element layer 111.
Flexible printed circuit board 14 has first end and the second end, first end and the second end SIP moulds neighbouring with two respectively
The substrate layer 112 of block is connected.
Further, substrate layer 112 has first end and the second end, for save space and avoids flexible print circuit
The waste of the manufacture material of plate 14, it is preferable that end is attached flexible printed circuit board 14 in the same direction.It is with SIP module 11,15,16
Example explanation, in two adjacent SIP modules 11,15, one end (right-hand member in figure) of SIP module 11 passes through a flexible printed circuit board 14
One end in the same direction (right-hand member in figure) of SIP module 15 is connected, in two adjacent SIP modules 15,16, the other end (figure of SIP module 15
Middle left end) pass through one end in the same direction (left end in figure) that a flexible printed circuit board 14 connects SIP module 16, by that analogy.
Further, golden finger 1120 and 1121, flexibility print are respectively arranged with the first end of substrate layer 112 and the second end
The first end of printed circuit board 14 prints with corresponding golden finger 141 and 142, substrate layer 112 is respectively arranged with the second end with flexible
Golden finger (1120/1121,141/142) on printed circuit board 14 carries out circuit connection by welding.
The position of substrate layer golden finger 1120 and 1121 and size in figure, flexible printed circuit board golden finger 141 and 142
The annexation of size and the SIP module adjacent with two of flexible print circuit 13 is only to illustrate with link position, and practical application can
Determine as needed.In other embodiments, system in package module can be by multiple SIP modules (two or more than two) structure
Into, and antifreeze plate 12 is set at least between one group of two SIP module being disposed adjacent.
By the implementation of above-described embodiment, being stacked between multiple SIP modules, to highly integrated SIP module
Further intensive setting, realizes that multiple SIP module integral layouts save space, and at least in one group of two SIP being disposed adjacent
The problem of electromagnetic interference between antifreeze plate, improvement SIP module is set between module.
As shown in Fig. 2 the module schematic diagram of the utility model system in package module second embodiment, including：SIP module
(label is respectively 11,15,16,17), flexible printed circuit board 14, antifreeze plate 12 and the convenient description of adhesive 13., below
It is illustrated by taking 4 SIP modules as an example, but the utility model is obviously not intended to limit the quantity of SIP module.
Four SIP modules (label is respectively 11,15,16,17) are respectively SIP module 11, SIP module 15, SIP module
16th, SIP module 17, and SIP module 11, SIP module 15, SIP module 16, SIP module 17 sequentially enter according to rightabout two-by-two
Row is stacked.
The function and structure of various pieces specifically refer to this practicality in the utility model system in package module embodiment
Description in novel system level encapsulation module first embodiment, is not repeated herein.
The position of substrate layer golden finger 1120 and 1121 and size in figure, flexible printed circuit board golden finger 141 and 142
The annexation of size and the SIP module adjacent with two of flexible print circuit 13 is only to illustrate with link position, and practical application can
Determine as needed.In other embodiments, system in package module can be by multiple SIP modules (two or more than two) structure
Into, and antifreeze plate 12 is set at least between one group of two SIP module being disposed adjacent.
As shown in figure 3, the module schematic diagram of the embodiment of the utility model electronic installation one, including：Body 31；At least just like
Upper described system in package module 32, system in package module 32 is electrically connected with body 31.
System in package module 32 is consistent with the system in package module shown in Fig. 1 or Fig. 2, including：Multiple SIP modules,
It is stacked between multiple SIP modules；Flexible printed circuit board 14, is electrically interconnected two SIP modules being disposed adjacent；Antifreeze plate
12, it is arranged between two SIP modules being disposed adjacent；Adhesive 13, is arranged between antifreeze plate 12 and SIP module.
Each SIP module can be stacked according to same direction in system in package module 32, it is also possible to according to two-by-two
Rightabout is stacked.System in package module 32 can be made up of multiple SIP modules (two or more than two), and at least
Antifreeze plate 12 is set between one group of two SIP module being disposed adjacent.
Body 31 includes at least an electronic module 311, housing 312 and circuit board 313.Wherein, electronic module 311 be
Irrespective of size encapsulation module 32 is all arranged on circuit board 313, and electronic module 311, system in package module 32 and circuit board 313 all set
Put in the inside of the housing 312.
Circuit board 313 can be motherboard, and electronic module 311 can be control process device, e.g. central processing unit
(Central Processing Unit, CPU), and electronic module 311 can be electrically connected with system in package via circuit board 312
Module 32, in this way, the running of the energy control system level encapsulation module 32 of electronic module 311.
In other embodiments, system in package module 32 can be control process device (such as central processing unit), and electronics
Module 311 can be data storage device, image processor or wireless module etc., and can receive controlling for system in package module 32
Make and operate.Additionally, electronic module 311 can also be a kind of system in package module 32, so being included by electronic installation
The quantity of irrespective of size encapsulation module 32 can be only one or two or more than two.
By above-mentioned implementation method, system in package module 32 is further intensive to highly integrated SIP module to be set
Put, help to realize lightening, the miniaturization of electronic installation.
On this basis, embodiment of the present utility model is the foregoing is only, not thereby limits of the present utility model special
Sharp scope, the equivalent module conversion that every utilization the utility model book and accompanying drawing content are made, such as technology between each embodiment
Feature be combined with each other, or is directly or indirectly used in other related technical fields, is similarly included in of the present utility model
In scope of patent protection.
Claims (8)
1. a kind of system in package module, it is characterised in that including：
It is stacked between multiple SIP modules, the multiple SIP module；
Flexible printed circuit board, is electrically interconnected two SIP modules being disposed adjacent；
Antifreeze plate, is arranged between two SIP modules being disposed adjacent；
Adhesive, is arranged between the antifreeze plate and the SIP module.
2. system in package module according to claim 1, it is characterised in that
Each SIP module of the multiple SIP module is with the first face and the second face being disposed opposite to each other and shape is consistent.
3. system in package module according to claim 1, it is characterised in that
The multiple SIP module is stacked according to same direction, or rightabout is stacked two-by-two.
4. system in package module according to claim 1, it is characterised in that
Each described SIP module includes：Substrate layer, chip and element layer, encapsulated layer；The chip and element layer are arranged at described
On substrate layer, the substrate layer and the chip and element layer are arranged on the inside of the encapsulated layer；
The flexible printed circuit board has first end and the second end, described in the first end and the second end are neighbouring with two respectively
The substrate layer connection of SIP module.
5. system in package module according to claim 4, it is characterised in that
The substrate layer leads to corresponding golden finger, both golden fingers is respectively arranged with the flexible printed circuit board
Crossing welding carries out circuit connection.
6. a kind of electronic installation, it is characterised in that including：
Body；
At least just like the system in package module described in claim any one of 1-5, the system in package module is electrically connected with
The body.
7. electronic installation according to claim 6, it is characterised in that the body includes at least an electronic module, housing
And circuit board.
8. electronic installation according to claim 7, it is characterised in that including：
The electronic module and the system in package module are all arranged on the circuit board, the electronic module, the system
Irrespective of size encapsulation module and the circuit board are all disposed within the inside of the housing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620891918.4U CN206282854U (en) | 2016-08-17 | 2016-08-17 | A kind of system in package module and electronic installation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620891918.4U CN206282854U (en) | 2016-08-17 | 2016-08-17 | A kind of system in package module and electronic installation |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206282854U true CN206282854U (en) | 2017-06-27 |
Family
ID=59084321
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620891918.4U Active CN206282854U (en) | 2016-08-17 | 2016-08-17 | A kind of system in package module and electronic installation |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206282854U (en) |
-
2016
- 2016-08-17 CN CN201620891918.4U patent/CN206282854U/en active Active
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| GR01 | Patent grant | ||
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| CP02 | Change in the address of a patent holder |
Address after: 518000 floors 1-3 and 4 of buildings 4 and 8, zone 2, Zhongguan honghualing Industrial South Zone, No. 1213 Liuxian Avenue, Pingshan community, Taoyuan Street, Nanshan District, Shenzhen, Guangdong Patentee after: BIWIN STORAGE TECHNOLOGY Co.,Ltd. Address before: 518055 1st floor, 2nd floor, 4th floor, 5th floor, No.4 factory building, tongfuyu industrial city, Taoyuan Street, Nanshan District, Shenzhen City, Guangdong Province Patentee before: BIWIN STORAGE TECHNOLOGY Co.,Ltd. |