CN207134350U - A kind of novel ball grid array packaging structure - Google Patents

Abstract

The utility model discloses a kind of novel ball grid array packaging structure, the ball bar pad group set including some rectangular arrays, the ball bar pad group includes some ball bar pads arranged with N M array, wherein N is the line number of the ball bar pad, M is the columns of the ball bar pad, and when carrying out BGA Package, the no input of integrated circuit and output pin are removed, correspond to the ball bar pad and be made emptying aperture, covered the emptying aperture with ink when making printed circuit board (PCB).Under the premise of encapsulation overall dimensions are not changed, it is follow-up PCB layout and punching increase space, reduces the PCB layout number of plies, reduce PCB costs.

Description

A kind of novel ball grid array packaging structure

Technical field

It the utility model is related to a kind of encapsulating structure, more particularly to a kind of novel ball grid array packaging structure.

Background technology

In information age today, with the fast development of electronics industry, the product such as computer, mobile phone becomes increasingly popular. Functional requirement of the people to electronic product is more and more, more and more stronger to performance requirement, and volume requirement is less and less, weight It is required that more and more lighter.This just promotes electronic product to develop to multi-functional, high-performance and miniaturization, lightness direction.To realize this One target, the characteristic size of integrated circuit (Integrated Circuit, IC) chip will be less and less, and complexity is continuous Increase, then, IC input/output (input/output, I/O) number of pins will be more and more, the I/O pin densities of encapsulation It will be continuously increased.In order to adapt to this demand for development, some advanced High Density Packaging Technologies are arisen at the historic moment, such as ball bar battle array Row encapsulation (Ball Grid Array, BGA) can just meet such a requirement, and BGA package is the bottom system in encapsulation structure base board Make I/O pin and printed substrate (Printed Circuit Board, PCB) mutual connection of the array soldered ball as IC.

As illustrated in figs. 1A and ib in the prior art, BGA package is by multiple a diameter of 0.25mm (minimum diameter at present) Orange gate pad 101 equidistantly (0.4mm) rearrange, the drilling minimum outer diameter that piece factory can accomplish at present is 0.45mm, And ball bar pads 101 spacing ultimate ranges So 101 maximum spacing of ball bar pad Also punching and cabling demand can not be met, so as to can only be punched on ball bar pad 101, then pass through its of IC I/O pins and PCB Its layer connects with beaten hole, and such a design eventually results in the PCB trace number of plies simultaneously and increased, corresponding PCB cost It can increase.

Utility model content

The purpose of this utility model is to propose a kind of novel ball grid array packaging structure, when using BGA package, by IC No I/O pins remove, i.e., the ball bar pad being not used correspondence position is made emptying aperture, the ink when making PCB The emptying aperture is covered, under the premise of encapsulation overall dimensions are not changed, is follow-up PCB layout and punching increase space, reduces PCB The number of plies is connected up, reduces PCB costs.

To use following technical scheme up to this purpose, the utility model：

According to one side of the present utility model, there is provided a kind of novel ball grid array packaging structure, including some rectangular battle arrays The ball bar pad group set is arranged, the ball bar pad group includes some ball bar pads arranged with N M array, and wherein N is the ball bar pad Line number, M be the ball bar pad columns, when carrying out BGA Package, by integrated circuit it is no input and output draw Pin removes, that is, corresponds to the ball bar pad and be made emptying aperture, is covered the emptying aperture with ink when making printed circuit board (PCB).

Further, the distance of center circle between the two neighboring ball bar pad in the ball bar pad group is not more than 1mm.

Further, each ball bar pad periphery forbids punching distance to be not less than 0.10mm.

Further, the array arrangement all same for the ball bar pad that the ball bar pad group is often gone.

Further, the external diameter of the emptying aperture is not less than 0.45mm, and internal diameter is not less than 0.20mm.

Further, the N and M are the integer more than or equal to 2.

Further, the external diameter of the ink is not less than 0.45mm, and internal diameter is not less than 0.20mm.

Further, a diameter of 0.25mm of ball bar pad.

The beneficial effects of the utility model：By setting the ball bar pad group of rectangular array, the ball bar pad of each ball bar pad group Arranged using N M array, when BGA package, the no I/O pins of IC are removed, that is, corresponds to ball bar pad and is made emptying aperture, used Ink covers the emptying aperture, under the premise of encapsulation overall dimensions are not changed, is PCB layout and punching increase space, reduces cloth The line number of plies, reduce PCB costs.

Brief description of the drawings

Below in conjunction with the accompanying drawings, by the way that specific embodiment of the utility model mode is described in detail, the utility model will be made Technical scheme and other beneficial effects it is apparent.

Fig. 1 a are existing ball grid array package structure overall schematics；

Fig. 1 b are the schematic diagrames of the adjacent four ball bar pads of existing ball grid array package structure；

Fig. 2 is the schematic diagram of novel ball grid array packaging structure emptying aperture of the present utility model；

Fig. 3 a are the schematic diagrames after new array encapsulation structure emptying aperture coating ink of the present utility model；

Fig. 3 b are the schematic diagrames of new four Thursday of array encapsulation structure emptying aperture ball bar pad of the present utility model；

In figure：11st, ball bar pad group；2nd, ink；111st, ball bar pad；1111st, emptying aperture；101st, ball bar pad；10th, ball bar pad group.

Embodiment

Further to illustrate that the utility model is to reach the technological means and effect that predetermined purpose of utility model taken, Below in conjunction with accompanying drawing and preferred embodiment, to according to the utility model proposes ball grid array package structure specific embodiment party Formula, structure, feature and its effect, describe in detail as after.For the sake of clarity, the various pieces in accompanying drawing are not drawn to paint System.

Fig. 2 is the schematic diagram of novel ball grid array packaging structure emptying aperture of the present utility model；Fig. 3 a are of the present utility model Schematic diagram after new array encapsulation structure emptying aperture coating ink；Fig. 3 b are new array encapsulation structure emptying apertures of the present utility model The schematic diagram of four Thursday ball bar pads；As shown in Fig. 2 to Fig. 3 b, some rectangular array structure settings of ball bar pad group 11, each Ball bar pad group 11 includes some ball bar pads 111 arranged with N M array, and wherein N is the line number of ball bar pad 111, and M is ball bar The columns of pad 111, and one in N and M is the integer not less than 2, another is the integer not less than 1, it is preferable that this implementation N and M are disposed as the integer more than or equal to 2 by example.And in the present embodiment, each ball bar pad group 11 can be identical structure (i.e. N and M all sames) or different structure (i.e. N and M are differed).When carrying out BGA package, by the no I/O of IC Pin removes, that is, corresponds to ball bar pad 111 and be made emptying aperture 1111, when making printed circuit board (PCB) with ink 2 by the emptying aperture 1111 Cover, facilitate PCB trace while increase punching space.

Specifically, the diameter of ball bar pad 11 is set as 0.25mm, and the distance of center circle of two neighboring ball bar pad 11 is 0.40mm, The no pins of IC are removed as emptying aperture 1111 during BGA package, distance GH between four ball bar pads 11 of the periphery of emptying aperture 1111 =IJ=0.55mm, the demand for being 0.45mm more than drilling minimum outer diameter, i.e., ball bar, which pads 111 spacing, can meet drilling and cabling Demand.

This uses N × M battle arrays using the new ball bar pad group by setting rectangular array, the ball bar pad of each ball bar pad group Row arrangement, when BGA package, the no I/O pins of IC is removed, that is, corresponds to ball bar pad and is made emptying aperture, with ink by the sky Port lid is lived, and under the premise of encapsulation overall dimensions are not changed, is PCB layout and punching increase space, is reduced the wiring number of plies, reduce PCB costs.

It is described above, only it is preferred embodiment of the present utility model, not the utility model is made any formal Limitation, although the utility model is disclosed above with preferred embodiment, but be not limited to the utility model, it is any ripe Professional and technical personnel is known, is not being departed from the range of technical solutions of the utility model, when in the technology using the disclosure above Hold the equivalent embodiment made a little change or be modified to equivalent variations, as long as being without departing from technical solutions of the utility model Hold, any simple modification, equivalent change and modification made according to the technical essence of the utility model to above example, still Belong in the range of technical solutions of the utility model.

Claims (8)

1. A kind of 1. novel ball grid array packaging structure, it is characterised in that the ball bar pad group set including some rectangular arrays (11), the ball bar pad group (11) includes some ball bar pads (111) arranged with N M array, and wherein N is the ball bar pad (111) line number, M is the columns of the ball bar pad (111), when carrying out BGA Package, integrated circuit is no defeated Enter and remove with output pin, that is, correspond to the ball bar pad (111) and be made emptying aperture (1111), the ink when making printed circuit board (PCB) (2) emptying aperture (1111) is covered.
2. 2. novel ball grid array packaging structure according to claim 1, it is characterised in that in the ball bar pad group (11) Distance of center circle between the two neighboring ball bar pad (111) is not more than 1mm.
3. 3. novel ball grid array packaging structure according to claim 1, it is characterised in that each ball bar pad (111) Punching distance is forbidden to be not less than 0.10mm in periphery.
4. 4. novel ball grid array packaging structure according to claim 1, it is characterised in that the ball bar pad group (11) is often gone The ball bar pad (111) array arrangement all same.
5. 5. novel ball grid array packaging structure according to claim 1, it is characterised in that the external diameter of the emptying aperture (1111) Not less than 0.45mm, internal diameter is not less than 0.20mm.
6. 6. novel ball grid array packaging structure according to claim 1, it is characterised in that the N and M are to be more than or equal to 2 integer.
7. 7. novel ball grid array packaging structure according to claim 1, it is characterised in that the external diameter of the ink (2) is not Less than 0.45mm, internal diameter is not less than 0.20mm.
8. 8. novel ball grid array packaging structure according to claim 1, it is characterised in that ball bar pad (111) diameter For 0.25mm.