CN201185511Y

CN201185511Y - BGA encapsulation locating structure

Info

Publication number: CN201185511Y
Application number: CNU2008200576228U
Authority: CN
Inventors: 孔祥业
Original assignee: YUDA COMPUTERS (SHANGHAI) CO Ltd
Current assignee: YUDA COMPUTERS (SHANGHAI) CO Ltd
Priority date: 2008-04-22
Filing date: 2008-04-22
Publication date: 2009-01-21
Anticipated expiration: 2018-04-22

Abstract

The utility model relates to a BGA packaging positioning structure which comprises a BGA body; wherein, the bottom part of the BGA body is provided with a plurality of BGA tin balls; the opposite angles of the BGA body are respectively provided with a plurality of conical structure positioning pins which are longer than the BGA tin balls; by matching with the BGA body, the BGA body packaging structure also comprises a mother board; the mother board corresponds to the positioning pins on the BGA body, and a plurality of conical structure positioning holes are arranged on the corresponding positions of the mother board; the positioning is conveniently and rapidly realized through the positioning pins to be inserted into the positioning holes on the mother board.

Description

BGA encapsulates location structure

[technical field]

The utility model relates to a kind of BGA (Ball Grid Array Package) encapsulation location structure, and is particularly related to a kind of encapsulation of BGA efficiently location structure.

[background technology]

In information age today, along with the fast development of electronics industry, products such as computer, mobile phone are universal day by day.People are more and more, more and more stronger to performance requirement to the functional requirement of electronic product, and volume requirement is more and more littler, weight requires more and more lighter.This just impels electronic product to develop to multi-functional, high-performance and miniaturization, lightness direction.For realizing this goal, worker C chip feature size will be more and more littler, and complexity constantly increases, so the I/O number of circuit will get more and more, the I/O density of encapsulation will constantly increase.In order to adapt to this demand for development, some advanced High Density Packaging Technology are just arisen at the historic moment, and BGA (Ball Grid Array Package) encapsulation technology is exactly one of them.

BGA (Ball Grid Array Package) Chinese contains and means BGA Package, and it is a kind of surface-mounted encapsulation technology of integrated circuit.In the bottom of encapsulation, external pin (solder sphere) is arranged with the form of grid array, thus called after BGA.Though the I/O number of pins of BGA encapsulation increases, the distance between the pin has improved rate of finished products greater than the QFP packaged type.Though and the power consumption of BGA increases, but because employing is the welding of control collapsed chip method, thereby can improve electric heating property, in addition, its signal transmission delay is little, adapts to frequency and improves greatly, the available coplane welding of its assembling, reliability improves greatly, so BGA is applied in the High Density Packaging Technology widely.

As everyone knows, when using the BGA encapsulation technology, need corresponding motherboard to carry out contraposition.Yet in the prior art, hold in factory, mainly, chip mounter realizes the location of chip mounter and motherboard by being programmed, location efficiency is lower, at the maintenance end of serving after sale, contraposition all is by naked eyes and experience, so just keeps away the generation of the situation of unavoidable off normal, and spends a large amount of time and efforts in the work of location.

As from the foregoing, be necessary to provide a kind of BGA encapsulation location structure in fact, this BGA encapsulation location structure not only has higher location efficiency, and is easy to realize that the location accurately.

[summary of the invention]

Therefore, main purpose of the present utility model is to provide a kind of BGA encapsulation location structure, and the bga structure of this efficient location is easy to realize, and has higher location efficiency.

For reaching above-mentioned purpose, the utility model provides a kind of BGA encapsulation location structure, this BGA encapsulation location structure comprises a BGA body, some BGA tin balls are arranged at the bottom of this BGA body, and on a diagonal angle of BGA body, be respectively arranged with some location pins longer slightly than BGA tin ball, cooperate described this bga structure of BGA body also to comprise a motherboard, location pin on the corresponding described BGA body of this motherboard, position corresponding on motherboard offers some location holes, realizes locating fast by the location hole that the location pin on the BGA body injects on the motherboard.

Especially, the location pin that is provided with on the described BGA body is the pin of conical structure;

Especially, the cooperation of the location hole on described motherboard location pin is the location hole of conical structure.

Compared to prior art, the utility model not only has higher location efficiency, and is easy to realize, the location accurately.

For making the purpose of this utility model, structural feature and function thereof there are further understanding, cooperate diagram to be described in detail as follows now:

[description of drawings]

Fig. 1 is the schematic top plan view of the utility model one preferred embodiment;

Fig. 2 is the generalized section of the utility model one preferred embodiment.

[embodiment]

See also Figure 1 and Figure 2, be the schematic top plan view of the utility model one preferred embodiment, Fig. 2 is the generalized section of the utility model one preferred embodiment.

The utility model BGA encapsulation location structure comprises a BGA body 10, some BGA tin balls 101 are arranged at the bottom of this BGA body 10, and on a diagonal angle of BGA body 10, be respectively arranged with a location pin 102 longer slightly than BGA tin ball 101, in present embodiment, location pin 102 is for being conical structure; Cooperate described BGA body 10 these bga structures also to comprise a motherboard 20, location pin 102 on these motherboard 20 corresponding described BGA bodies 10, on the position that needs to encapsulate on the motherboard 20, offer two location holes 201, in present embodiment, location hole 201 is a conical structure, realizes locating fast by the location hole 201 that the location pin on the BGA body 10 102 injects on the motherboard 20.

See also shown in Figure 2ly, when specifically using,, during the location, only need location efficiency has been improved in the location of programming of two location holes 201 on the motherboard 20 at factory end; And at the maintenance end of serving after sale, during the location, only need two location holes 201 that two on the BGA body 10 location pins 102 insert on the motherboards 20 are got final product, alleviated maintenance personal's burden.

BGA encapsulation locating structure provided by the utility model compared with prior art has following good effect:

1. at factory end, during the location, only need the location of programming of two locating holes on the motherboard, and to subsides Machine wood body is programmed and is compared partially, has improved the efficient of location;

2. at the maintenance end, during the location, only need two positioning pins on the BGA body are inserted two on the motherboard Individual locating hole gets final product, and positions with experience and compares by naked eyes, has not only improved the precision of location, and And alleviated the burden of maintenance personal's eyes.

Claims

1. a BGA encapsulates location structure, this BGA encapsulation location structure comprises a BGA body and a motherboard, some BGA tin balls are arranged at the bottom of this BGA body, it is characterized in that: be respectively arranged with some location pins longer slightly on the diagonal angle of this BGA body, and cooperate this location pin correspondence on position corresponding on the motherboard to offer some location holes than BGA tin ball.

2. BGA encapsulation location structure according to claim 1, it is characterized in that: the location pin that is provided with on the described BGA body is the pin of conical structure.

3. BGA encapsulation location structure according to claim 1, it is characterized in that: it is the location hole of conical structure that the location hole on the described motherboard cooperates the location pin.