CN206271690U - A kind of plastics dual-inline package mechanism - Google Patents
A kind of plastics dual-inline package mechanism Download PDFInfo
- Publication number
- CN206271690U CN206271690U CN201621183977.2U CN201621183977U CN206271690U CN 206271690 U CN206271690 U CN 206271690U CN 201621183977 U CN201621183977 U CN 201621183977U CN 206271690 U CN206271690 U CN 206271690U
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- China
- Prior art keywords
- chip
- substrate
- pin
- plastics
- inline package
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Abstract
The utility model provides a kind of plastics dual-inline package mechanism,Including chip,The chip bottom is provided with substrate,The both sides of the substrate are symmetrically arranged with multiple pins,Welded together by many wires between the pin and the chip,Heat adhesive is scribbled between the chip and substrate,Radiator is additionally provided between the substrate and the heat adhesive,Whole device epoxy sealing,Pin,Metal wire and chip,Resin is embedded with around metal wire weld,Can effectively anti-oxidation,Pin is drawn from encapsulation both sides,Encapsulating material has two kinds of plastics and ceramics,It is adapted to PCB (printed circuit board (PCB)) perforation to install,Connect up and operate and be more convenient,It is provided with heat adhesive and radiator,There can be the effective heat by generation during chip use to conduct,Improve the service life of chip,The through hole set on epoxy resin,Material is saved,Further increase heat dispersion.
Description
Technical field
The utility model is related to a kind of plastics dual-inline package mechanism, belongs to technical field of semiconductors.
Background technology
DIP(Dual-In-Line Package):Dual-inline package, refers to the collection using the encapsulation of dual-in-line form
Into circuit chip, most middle small scale integrated circuits (IC) use this packing forms, and its number of pins is usually no more than
100, very popular in the seventies, the pin of this packing forms is drawn from encapsulation both sides, and encapsulating material has plastics and ceramics
Two kinds, be exactly that the perforation for being adapted to PCB is installed the characteristics of DIP is encapsulated, it is easy to PCB layout, and it is of wide application, including standard
Logic IC circuits, microcomputer circuit etc., although some have been out-of-date for DIP encapsulation, but the BIOS chips of many mainboards are also now
This packing forms taken, pin is drawn from encapsulation both sides, and the structure type of DIP encapsulation is varied, including multi-layer ceramics
Dual inline type DIP, single-layer ceramic dual inline type DIP, lead frame posture DIP etc., DIP are most popular cartridge-type encapsulation,
Range of application includes standard logic IC, memory LSI, microcomputer circuit etc., and pin centre-to-centre spacing 2.54mm, number of pins is sealed from 6 to 64
Dress width is usually 15.2mm, and what is had is referred to as skinny DIP and slim the encapsulation that width is 7.52mm and 10.16mm
DIP (narrow build DIP), but in most cases and be not added with distinguishing, only it is collectively referred to simply as DIP, DIP is most popular cartridge-type envelope
Dress, range of application includes that most middle small scale integrated circuits such as standard logic IC, memory LSI, microcomputer circuit are used
This packing forms, its number of pins is usually no more than 100, in addition, being also referred to as with the ceramic DIP that low-melting glass is sealed
The chip of cerdip, DIP encapsulation answers SC when being plugged from chip carrier socket, in order to avoid damage pin.
Plastics dual-inline package (PDIP) is marked as one of the important encapsulation of dual-inline package from wafer
Chip, (also have one layer of radiating in substrate by after test passes, being close to be placed in the substrate of support fixation
Good material), then the metal contact (Pad, pad) on chip is passed through welding with outside pin with many wires
Couple together, then imbed resin, sealed with plastic case, form chip entirety, traditional technology has following defect：
(1) heat sinking function is not provided with, it is not good enough using (2) packaging effect can be damaged to chip for a long time, for a long time using easy
Cause oxidation.
Utility model content
The technical problems to be solved in the utility model overcomes existing defect, there is provided a kind of plastics dual-inline package machine
Structure, packaging effect is good, perfect heat-dissipating, is adapted to the piercing welding on PCB (printed circuit board (PCB)), easy to operate, can effectively solve
The certainly problem in background technology.
In order to solve the above-mentioned technical problem, the utility model provides following technical scheme：
A kind of plastics dual-inline package mechanism, including chip, the chip bottom are provided with substrate, the substrate
Both sides are symmetrically arranged with multiple pins, are welded together by many wires between the pin and the chip, the core
Heat adhesive is scribbled between piece and substrate, radiator is additionally provided between the substrate and the heat adhesive, whole device is used
Epoxy sealing.
Furthermore, it is embedded with tree around the pin, metal wire weld and the chip, metal wire weld
Fat.
Furthermore, the heat adhesive is thermal interfacial material, and the thermal interfacial material is hot adhesion epoxy film, hot adhesion
Any one in epoxy paste, phase-change material (PCM), thermal gels.
Furthermore, the pin is drawn from encapsulation both sides, and encapsulating material has two kinds of plastics and ceramics.
Furthermore, multiple through holes are evenly arranged with the epoxy resin.
The utility model beneficial effect：Tree is embedded with around pin, metal wire weld and chip, metal wire weld
Fat, can effectively anti-oxidation, be provided with heat adhesive and radiator, can have effectively will during chip use produce heat
Conduct, improve the service life of chip, the through hole set on epoxy resin has saved material, further increases scattered
Hot property.
Brief description of the drawings
Accompanying drawing is used for providing being further understood to of the present utility model, and constitutes a part for specification, with this practicality
New embodiment is used to explain the utility model together, does not constitute to limitation of the present utility model.
Fig. 1 is a kind of plastics dual-inline package mechanism structure figure of the utility model.
Fig. 2 is a kind of plastics dual-inline package mechanism partial enlarged drawing of the utility model.
Fig. 3 is the utility model crystal circle structure figure.
Fig. 4 is a kind of plastics dual-inline package mechanism front view of the utility model.
Fig. 5 is a kind of plastics dual-inline package mechanism top view of the utility model.
Label in figure：1st, chip；2nd, wafer；3rd, substrate；4th, metal wire；5th, pin；6th, radiator；7th, heat adhesive；8、
Epoxy resin.
Specific embodiment
Preferred embodiment of the present utility model is illustrated below in conjunction with accompanying drawing, it will be appreciated that described herein excellent
Select embodiment to be merely to illustrate and explain the utility model, be not used to limit the utility model.
As Figure 1-Figure 5, a kind of plastics dual-inline package mechanism, including chip 1, the bottom of the chip 1 is set
There is substrate 3, chip 1 is close to be connected in substrate 3, the both sides of the substrate 3 are symmetrically arranged with multiple pins 5, and the pin 5 is used
It is connected in mainboard, is welded together by many wires 4 between the pin 5 and the chip 1, the chip 1 and base
Heat adhesive 7 is scribbled between bottom 3, for the radiating of whole encapsulation, is additionally provided between the substrate and the heat adhesive scattered
Hot device 6, for the radiating of whole encapsulation, whole device epoxy resin 8 is sealed, it is ensured that packaging effect.
The chip 1 marked from wafer 2, the base by after test passes, being close to be placed in support fixation
(also have one layer of good material of radiating in substrate) on bottom 3, then with many wires 4 on chip 1 metal contact (Pad,
Pad) pass through to be welded to connect with outside pin 5, resin is then imbedded, sealed with plastic case, form chip whole
Body, resin is embedded with around the pin, metal wire weld and the chip, metal wire weld, can effectively anti-oxidation,
The heat adhesive 7 includes：Thermal interfacial material, the thermal interfacial material includes：Hot adhesion epoxy film, hot adhesion epoxy paste or its group
The combination of conjunction, phase-change material (PCM), thermal gels or above-mentioned material, can high efficiency and heat radiation, the chip 1 and base by above-mentioned material
Heat adhesive 7 and radiator 6 are provided between bottom 3, there can be the effective heat by generation during the use of chip 1 to transfer out
Go, improve the service life of chip 1, the pin 5 is drawn from encapsulation both sides, and encapsulating material has two kinds of plastics and ceramics, fits
Close PCB (printed circuit board (PCB)) perforation to install, connect up and operate more convenient, to be set on epoxy resin 8 multiple through holes, save
Material, further increases heat dispersion, and packaging effect is preferable.
The utility model improve in：Pin 5 and metal wire 4, resin is embedded with around chip 1 and the weld of metal wire 4, can
Effective anti-oxidation, is provided with heat adhesive 7 and radiator 6, can there is effective by the heat produced during the use of chip 1 biography
Derivation is gone, and improves the service life of chip 1, and the pin 5 is drawn from encapsulation both sides, and encapsulating material has plastics and ceramics two
Kind, it is adapted to PCB (printed circuit board (PCB)) perforation and installs, more convenient, to be set on epoxy resin 8 through hole is connected up and operates, save
Material, further increases heat dispersion, and packaging effect is good.
It is above the utility model preferably implementation method, the utility model those skilled in the art can also be to upper
Implementation method is stated to be changed and changed, therefore, the utility model is not limited to above-mentioned specific embodiment, every ability
Field technique personnel made on the basis of the utility model it is any conspicuously improved, replace or modification belong to this practicality
New protection domain.
Claims (5)
1. a kind of plastics dual-inline package mechanism, including chip (1), it is characterised in that：Chip (1) bottom is provided with
Substrate (3), the both sides of the substrate (3) are symmetrically arranged with multiple pins (5), lead between the pin (5) and the chip (1)
Excessive wires (4) weld together, and heat adhesive (7), the substrate (3) are scribbled between the chip (1) and substrate (3)
Radiator (6) is additionally provided between the heat adhesive (7), whole device is sealed with epoxy resin (8).
2. a kind of plastics dual-inline package mechanism according to claim 1, it is characterised in that：The pin (5), metal
Resin is embedded with around line (4) weld and the chip (1), metal wire (4) weld.
3. a kind of plastics dual-inline package mechanism according to claim 1, it is characterised in that：The heat adhesive (7)
It is thermal interfacial material, the thermal interfacial material is any in hot adhesion epoxy film, hot adhesion epoxy paste, phase-change material or thermal gels
Kind.
4. a kind of plastics dual-inline package mechanism according to claim 1, it is characterised in that：The pin (5) is from envelope
Dress both sides are drawn, and encapsulating material has two kinds of plastics and ceramics.
5. a kind of plastics dual-inline package mechanism according to claim 1, it is characterised in that：The epoxy resin (8)
On be evenly arranged with multiple through holes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621183977.2U CN206271690U (en) | 2016-10-28 | 2016-10-28 | A kind of plastics dual-inline package mechanism |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621183977.2U CN206271690U (en) | 2016-10-28 | 2016-10-28 | A kind of plastics dual-inline package mechanism |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206271690U true CN206271690U (en) | 2017-06-20 |
Family
ID=59038827
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621183977.2U Active CN206271690U (en) | 2016-10-28 | 2016-10-28 | A kind of plastics dual-inline package mechanism |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206271690U (en) |
-
2016
- 2016-10-28 CN CN201621183977.2U patent/CN206271690U/en active Active
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