CN206271671U - A kind of ultrahigh speed precisely automates LED bonders - Google Patents
A kind of ultrahigh speed precisely automates LED bonders Download PDFInfo
- Publication number
- CN206271671U CN206271671U CN201621348199.8U CN201621348199U CN206271671U CN 206271671 U CN206271671 U CN 206271671U CN 201621348199 U CN201621348199 U CN 201621348199U CN 206271671 U CN206271671 U CN 206271671U
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- Prior art keywords
- led
- sucker
- support
- automates
- precisely
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Abstract
LED bonders are precisely automated the utility model discloses a kind of ultrahigh speed, including base, support and clamp mechanism, operating desk is provided with the base, baffle plate is mounted with the operating desk, the upper end of the baffle plate is provided with display screen and warning light, the base is internally provided with the first chip chamber, the inside of the first chip chamber is provided with wafer rack, the lower end of the wafer rack is connected with retractor device, the lower end of the LED support platform is connected with expansion link, glue applying mechanism is provided between first sucker and the second sucker, the inside of the clamp mechanism is provided with infrared positioning device, and it is arranged on guide rail, the rear end of the operating desk is provided with stock guide, the wafer rack is placed with LED wafer.The utility model ultrahigh speed precisely automates two groups of feeding machanisms of LED bonders and can not only quickly be fed, and can improve the speed being placed on LED wafer on LED support, improves operating efficiency, reduces artificial operation, improves Machine automated.
Description
Technical field
The utility model is related to LED wafer processing technique field, and specially a kind of ultrahigh speed precisely automates LED die bonds
Machine.
Background technology
Light emitting diode be it is a kind of can convert electrical energy into luminous energy can light-emitting component.With the maturation of LED technology, LED
Product such as is progressively applied to illuminate, shows at the field, and LED bonders are a kind of LED chips to be fixed on into setting on LED support
It is standby.Existing LED bonders are normally only designed with one for fixing the jig platform of LED support, and one be used for it is right
LED support on jig platform carries out the die bond mechanism of die bond treatment.After supply part completes to feed, jig platform coordinates solid
Brilliant mechanism carries out LED wafer binding operation, waits after the completion of a LED support die bond, and receiving part can just receive die bond completion
LED support, and next LED support can be just sent to jig platform and carry out next round bonding operation, traditional LED by supply part
Bonder is provided with LED support pick device, and the pick device is mainly directly to be released support along guide rail hopper by cylinder expects
Box or push-in magazine.
Existing LED bonders are generally single supply part, so cause operating efficiency low, while by LED wafer
When being placed into LED support, because chip and support size are not fixed, so needing to adjust machine, can otherwise cause a deviation.
Utility model content
The purpose of this utility model is to provide a kind of ultrahigh speed precisely to automate LED bonders, to solve above-mentioned background
Propose that existing LED bonders are generally single supply part in technology, so cause operating efficiency low, while LED is brilliant
When piece is placed into LED support, because chip and support size are not fixed, so needing to adjust machine, can otherwise cause a deviation
Problem.
To achieve the above object, the utility model provides following technical scheme：A kind of ultrahigh speed precisely automates LED die bonds
Machine, including base, support and clamp mechanism, are provided with operating desk on the base, baffle plate is mounted with the operating desk, described
The upper end of baffle plate is provided with display screen and warning light, and the base is internally provided with the first chip chamber, first chip
The inside of chamber is provided with wafer rack, and its right-hand member is mounted with LED support platform, and the lower end of the wafer rack is connected with flexible dress
Put, the lower end of the LED support platform is connected with expansion link, and its right-hand member is mounted with the second eyeglass chamber, installed on the support
There are the first sucker and the second sucker, glue applying mechanism is provided between first sucker and the second sucker, the clamp mechanism
Inside is provided with infrared positioning device, and it is arranged on guide rail, and the rear end of the operating desk is provided with stock guide, the crystalline substance
Horse is placed with LED wafer.
Preferably, the setting angle of the stock guide is 45 °.
Preferably, the front end of the LED support platform is mounted with push pedal.
Preferably, first sucker and the second sucker are head.
Preferably, detection sensor is installed on the support.
Compared with prior art, the beneficial effects of the utility model are：The utility model ultrahigh speed precisely automates LED and consolidates
Brilliant machine uses two groups of feeding machanisms, and is placed in the both sides of LED support platform, and two groups of feeding machanisms can not only quickly be fed, and
The speed being placed on LED wafer on LED support can be improved, operating efficiency is improve, while pacifying on two groups of clamp mechanisms
Infrared positioning device is filled, LED wafer has been placed in the groove of LED support exactly using infrared positioning device
Portion, prevents position from skew occur, causes finished product effect poor, while increasing push pedal, realizes that quick treatment LED support is consolidated using push pedal
Crystalline substance completes part, reduces artificial operation, improves Machine automated.
Brief description of the drawings
Fig. 1 is the utility model structural representation；
Fig. 2 is the utility model chassis interior structural representation；
Fig. 3 is the utility model operating desk overlooking the structure diagram.
In figure：1st, base, 2, operating desk, 3, baffle plate, 4, warning light, 5, display screen, the 6, first chip chamber, 7, chip
Frame, 8, retractor device, the 9, second chip chamber, 10, LED trestle tables, 11, expansion link, 12, support, the 13, first sucker, 14,
Second sucker, 15, glue applying mechanism, 16, clamp mechanism, 17, infrared positioning device, 18, guide rail, 19, stock guide, 20, push pedal,
21st, LED wafer, 22, detection sensor.
Specific embodiment
Below in conjunction with the accompanying drawing in the utility model embodiment, the technical scheme in the utility model embodiment is carried out
Clearly and completely describe, it is clear that described embodiment is only a part of embodiment of the utility model, rather than whole
Embodiment.Based on the embodiment in the utility model, those of ordinary skill in the art are not under the premise of creative work is made
The every other embodiment for being obtained, belongs to the scope of the utility model protection.
Fig. 1-3 are referred to, the utility model provides a kind of technical scheme：A kind of ultrahigh speed precisely automates LED bonders,
Including base 1, operating desk 2, baffle plate 3, warning light 4, display screen 5, the first chip chamber 6, wafer rack 7, retractor device 8, second
Chip chamber 9, LED trestle tables 10, expansion link 11, support 12, the first sucker 13, the second sucker 14, glue applying mechanism 15, fixture
Mechanism 16, infrared positioning device 17, guide rail 18, stock guide 19, push pedal 20, LED wafer 21 and detection sensor 22, base 1
On be provided with operating desk 2, baffle plate 3 is mounted with operating desk 2, the upper end of baffle plate 3 is provided with display screen 5 and warning light 4, base 1
Be internally provided with the first chip chamber 6, the inside of the first chip chamber 6 is provided with wafer rack 7, and its right-hand member is mounted with LED
Trestle table 10, the front end of LED support platform 10 is mounted with push pedal 20, and the lower end of wafer rack 7 is connected with retractor device 8, LED support platform
10 lower end is connected with expansion link 11, and its right-hand member is mounted with the second eyeglass chamber 9, and the He of the first sucker 13 is provided with support 12
Second sucker 14, is provided with detection sensor 22 on support 12, quickly treatment LED support die bond is complete can to automatically control push pedal 20
Member, reduces artificial operation, improves operating efficiency, and glue applying mechanism 15 is provided between the first sucker 13 and the second sucker 14, the
One sucker 13 and the second sucker 14 are head, and the inside of clamp mechanism 16 is provided with infrared positioning device 17, and it is pacified
On the track 18, the rear end of operating desk 2 is provided with stock guide 19 to dress, and the setting angle of stock guide 19 is 45 °, is easy to LED is brilliant
Plate rack is derived, and wafer rack 7 is placed with LED wafer 21.
Operation principle：, it is necessary to the knot of whole device before LED bonders are precisely automated using the novel ultra-high-speed
Structure is simply understood, and the batch of LED wafer 21 is placed on into the first chip chamber 6 and the second chip chamber 9, by LED support
It is placed on LED support platform 10, retractor device 8 and expansion link 11 control wafer rack 7 and LED support platform 10 to move upwards respectively,
When in LED support transport to the plane of operating desk 2, clamp mechanism 16 is moved on the track 18, and close to LED support, until
LED support is clamped, the first sucker 13 and the second sucker 14 are drawn the chip in the first chip chamber 6 and the second chip chamber 9, inhaled
After taking chip, infrared positioning device 17 sends infrared ray and LED support upper groove is sensed, and the first sucker 13 and second is inhaled
Disk 14 is placed the wafer in groove, and after the completion of LED support die bond, push pedal 20 pushes it into stock guide 19, then carries out down
One workflow.
While there has been shown and described that embodiment of the present utility model, for the ordinary skill in the art,
It is appreciated that these embodiments can be carried out various changes in the case where principle of the present utility model and spirit is not departed from, repaiies
Change, replace and modification, scope of the present utility model is defined by the appended claims and the equivalents thereof.
Claims (5)
1. a kind of ultrahigh speed precisely automates LED bonders, including base (1), support (12) and clamp mechanism (16), its feature
It is：Operating desk (2) is provided with the base (1), baffle plate (3) is mounted with the operating desk (2), the baffle plate (3)
Upper end is provided with display screen (5) and warning light (4), and the base (1) is internally provided with the first chip chamber (6), described
The inside of one chip chamber (6) is provided with wafer rack (7), and its right-hand member is mounted with LED support platform (10), the wafer rack (7)
Lower end be connected with retractor device (8), the lower end of the LED support platform (10) is connected with expansion link (11), and its right-hand member is disposed
There is the second eyeglass chamber (9), the first sucker (13) and the second sucker (14), first sucker are installed on the support (12)
(13) glue applying mechanism (15) is provided with and the second sucker (14) between, the inside of the clamp mechanism (16) is provided with infrared ray and determines
Position device (17), and it is arranged on guide rail (18), the rear end of the operating desk (2) is provided with stock guide (19), the chip
Frame (7) is placed with LED wafer (21).
2. a kind of ultrahigh speed according to claim 1 precisely automates LED bonders, it is characterised in that：The stock guide
(19) setting angle is 45 °.
3. a kind of ultrahigh speed according to claim 1 precisely automates LED bonders, it is characterised in that：The LED support
The front end of platform (10) is mounted with push pedal (20).
4. a kind of ultrahigh speed according to claim 1 precisely automates LED bonders, it is characterised in that：Described first inhales
Disk (13) and the second sucker (14) are head.
5. a kind of ultrahigh speed according to claim 1 precisely automates LED bonders, it is characterised in that：The support
(12) detection sensor (22) is installed on.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621348199.8U CN206271671U (en) | 2016-12-09 | 2016-12-09 | A kind of ultrahigh speed precisely automates LED bonders |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621348199.8U CN206271671U (en) | 2016-12-09 | 2016-12-09 | A kind of ultrahigh speed precisely automates LED bonders |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206271671U true CN206271671U (en) | 2017-06-20 |
Family
ID=59043918
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621348199.8U Expired - Fee Related CN206271671U (en) | 2016-12-09 | 2016-12-09 | A kind of ultrahigh speed precisely automates LED bonders |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206271671U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107906392A (en) * | 2017-11-17 | 2018-04-13 | 江门市上庆自动化设备有限公司 | A kind of round LED lamp panel pasting method based on automatic double-head patch device |
| CN110201893A (en) * | 2019-05-06 | 2019-09-06 | 山东泓瑞光电科技有限公司 | A kind of LED wafer automatic fraction collector cleaning head assembly |
-
2016
- 2016-12-09 CN CN201621348199.8U patent/CN206271671U/en not_active Expired - Fee Related
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107906392A (en) * | 2017-11-17 | 2018-04-13 | 江门市上庆自动化设备有限公司 | A kind of round LED lamp panel pasting method based on automatic double-head patch device |
| CN107906392B (en) * | 2017-11-17 | 2019-11-08 | 江门市上庆自动化设备有限公司 | A kind of round LED lamp panel pasting method based on automatic double-head patch device |
| CN110201893A (en) * | 2019-05-06 | 2019-09-06 | 山东泓瑞光电科技有限公司 | A kind of LED wafer automatic fraction collector cleaning head assembly |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170620 Termination date: 20171209 |