CN110201893A - A kind of LED wafer automatic fraction collector cleaning head assembly - Google Patents
A kind of LED wafer automatic fraction collector cleaning head assembly Download PDFInfo
- Publication number
- CN110201893A CN110201893A CN201910607441.0A CN201910607441A CN110201893A CN 110201893 A CN110201893 A CN 110201893A CN 201910607441 A CN201910607441 A CN 201910607441A CN 110201893 A CN110201893 A CN 110201893A
- Authority
- CN
- China
- Prior art keywords
- cylinder
- magazine
- compression cylinder
- limiting
- cleaning head
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B07—SEPARATING SOLIDS FROM SOLIDS; SORTING
- B07C—POSTAL SORTING; SORTING INDIVIDUAL ARTICLES, OR BULK MATERIAL FIT TO BE SORTED PIECE-MEAL, e.g. BY PICKING
- B07C5/00—Sorting according to a characteristic or feature of the articles or material being sorted, e.g. by control effected by devices which detect or measure such characteristic or feature; Sorting by manually actuated devices, e.g. switches
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
- B23K37/04—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work
- B23K37/0426—Fixtures for other work
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K37/00—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups
- B23K37/04—Auxiliary devices or processes, not specially adapted to a procedure covered by only one of the preceding main groups for holding or positioning work
- B23K37/0461—Welding tables
Abstract
The invention discloses a kind of LED wafer automatic fraction collector cleaning head assembly, including cleaning head module body, it is fixed with magazine compression cylinder fixed frame in cleaning head module body, is fixed with magazine compression cylinder on magazine compression cylinder fixed frame；It is provided with slot on magazine compression cylinder fixed frame, the magazine compression cylinder movable stand that can be slided along slot is provided in slot, magazine compression cylinder movable stand is moved forward and backward in the slot of magazine compression cylinder fixed frame along Y-direction.
Description
Technical field
The present invention relates to a kind of LED wafer automatic fraction collectors, specifically, are related to a kind of LED wafer automatic fraction collector use
Head assembly is cleaned, LED wafer manufacturing technology field is belonged to.
Background technique
LED sorting machine needs to clamp chip carrier when welding chip, and continues the operation of next step, traditional
The structure for clamping chip carrier is insecure, is easy to damage chip, the yields for causing chip is low, influences the processing efficiency of chip.
Summary of the invention
The problem to be solved in the present invention is against the above deficiency, to provide a kind of LED wafer automatic fraction collector cleaning head group
Part, the cleaning head assembly can easily clamp chip carrier, firm grip.
In order to solve the above technical problems, the invention adopts the following technical scheme: a kind of LED wafer automatic fraction collector cleans
Head assembly, including cleaning head module body, it is characterised in that: be fixed with magazine compression cylinder in cleaning head module body and fix
Frame is fixed with magazine compression cylinder on magazine compression cylinder fixed frame；
It is provided with slot on magazine compression cylinder fixed frame, the magazine compression cylinder movable stand that can be slided along slot is provided in slot,
Magazine compression cylinder movable stand is moved forward and backward in the slot of magazine compression cylinder fixed frame along Y-direction.
It is further improvement to above-mentioned technical proposal below:
When magazine compression cylinder connects gas, magazine compression cylinder is connected with magazine compression cylinder bracket, and magazine compression cylinder pushes material
Box compression cylinder bracket, magazine compression cylinder bracket drive magazine compression cylinder movable stand along the slot of magazine compression cylinder fixed frame
Movement, realizes compression and release in the Y direction.
Magazine compression cylinder one end is fixed on magazine compression cylinder fixed frame, the magazine compression cylinder other end and magazine pressure
Tight air cylinder support connection.
Limiting cylinder connection frame is fixed in cleaning head module body, limiting cylinder fixed frame and limiting cylinder connection frame connect
One is connect, limiting block block fixing seat is fixed on limiting cylinder connection frame.
Cylinder is fixed on limiting cylinder fixed frame, cylinder and cleaning head module body are relatively fixed, the piston rod of cylinder
It is connected with limiting cylinder connecting rod base.
Limiting cylinder connecting rod base connects limiting cylinder connecting rod and limiting block block, and limiting block block connects limiting cylinder and connects
Limiting cylinder link connector pin and limiting cylinder connecting rod base and limiting block block hinge are used in bar, the both ends of limiting cylinder connecting rod respectively
Connection.
It is provided with bearing fixing axle on magazine compression cylinder movable stand, is provided with bearing in bearing fixing axle.
The present invention by adopting the above technical scheme, compared with prior art, has the advantage that the cleaning head assembly can facilitate
Chip carrier is clamped, firm grip, limiting block block is connected with limiting block block fixing seat, limiting block block and limit
Stopper seat fixing seat is connected with limiting block block connecting pin hinge, and when cylinder movement, limit base and limited block are with limited block
90 ° of revolutions are carried out centered on seat connecting pin, thus reliable fixation and X after facilitating wafer rack into cleaning head module body
The clamping in direction.
The present invention is described in detail with reference to the accompanying drawings and examples.
Detailed description of the invention
Attached drawing 1 is the structural schematic diagram of LED wafer automatic fraction collector cleaning head assembly in the embodiment of the present invention；
Attached drawing 2 is sectional view along A-A in attached drawing 1；
Attached drawing 3 is B-B direction cross-sectional view in attached drawing 1；
Attached drawing 4 be in attached drawing 1 C-C to cross-sectional view；
In figure,
1- cleaning head module body, 2- spring leaf maintainance block, 3- upper spring tabletting, spring pressuring plate under 4-, 5- charging tray input sensing
Device bracket, 6- charging tray output transducer bracket, 7- magazine compression cylinder fixed frame, 8- magazine compression cylinder, 9- magazine compress gas
Cylinder movable stand, 10- magazine compression cylinder bracket, 11- magazine fork sensor induction bracket, 13- bearing fixing axle, 14- magnet
Seat, 15- permanent magnet, 16- magnetic receiver (short), 17- limited block, 18- limiting block block, 19- limiting cylinder fixed frame, 20-
Limiting cylinder connection frame, 21- limiting cylinder connecting rod, 22- limiting cylinder connecting rod base, 24- cylinder, 25- limiting block block fixing seat,
26- limiting cylinder link connector pin, 27- limiting block block connecting pin, 28- wafer rack, 30- wafer rack positioning pin, 34- magazine are defeated
Enter sensor stand, 35- optoelectronic switch, 39- bearing.
Specific embodiment
Embodiment, as shown in attached drawing 1, attached drawing 2, attached drawing 3 and attached drawing 4, a kind of LED wafer automatic fraction collector cleaning head group
Part, including cleaning head module body 1 are fixed with spring leaf maintainance block 2, upper spring tabletting 3 and lower bullet in cleaning head module body 1
Spring tabletting 4.
Charging tray input pickup bracket 5 and charging tray output transducer bracket 6 are fixed in cleaning head module body 1.
It is fixed with magazine compression cylinder fixed frame 7 in cleaning head module body 1, is fixed on magazine compression cylinder fixed frame 7
There is magazine compression cylinder 8.
Slot is provided on magazine compression cylinder fixed frame 7, being provided in slot can move along the magazine compression cylinder that slot slides
Moving frame 9, magazine compression cylinder movable stand 9 are moved forward and backward in the slot of magazine compression cylinder fixed frame 7 along Y-direction.
Magazine compression cylinder bracket 10 is provided on compression cylinder movable stand 9, magazine compression cylinder bracket 10 is fixed on material
On box compression cylinder movable stand 9.
8 one end of magazine compression cylinder is fixed on magazine compression cylinder fixed frame 7,8 other end of magazine compression cylinder and material
Box compression cylinder bracket 10 connects.
It is provided with bearing fixing axle 13 on magazine compression cylinder movable stand 9, bearing 39 is provided in bearing fixing axle 13.
When magazine compression cylinder 8 connects gas, magazine compression cylinder 8 pushes magazine compression cylinder bracket 10, magazine compression cylinder
Bracket 10 drives magazine compression cylinder movable stand 9 to move along the slot of magazine compression cylinder fixed frame 7, realizes compression in the Y direction
And release.
Limiting cylinder connection frame 20 is fixed in cleaning head module body 1, limiting cylinder fixed frame 19 and limiting cylinder connect
It connects frame 20 to be integrally connected, limiting block block fixing seat 25 is fixed on limiting cylinder connection frame 20.
Cylinder 24 is fixed on limiting cylinder fixed frame 19, cylinder 24 and cleaning head module body 1 are relatively fixed, cylinder 24
Piston rod be connected with limiting cylinder connecting rod base 22.
Limiting cylinder connecting rod base 22 connects limiting cylinder connecting rod 21 and limiting block block 18, the connection limit of limiting block block 18
Air cylinder connecting rod 21, the both ends of limiting cylinder connecting rod 21 use respectively limiting cylinder link connector pin 26 and limiting cylinder connecting rod base 22 and
The connection of 18 hinge of limiting block block.
Limiting block block 18 is connected with limiting block block fixing seat 25, limiting block block 18 and limiting block block fixing seat 25
It is connected with 27 hinge of limiting block block connecting pin.
When cylinder 24 acts, limit base 18 and limited block 17 are carried out 90 ° centered on limiting block block connecting pin 27 and returned
Turn.
To make wafer rack 28 facilitate the clamping into reliable fixation and X-direction rear in cleaning head module body 1.
Wafer rack positioning pin 30 and cleaning head module body 1 are interference fitted, and are seen on the way " B " at two, wafer rack positioning pin 30
Limit the X-direction of wafer rack 28；1 interference fit of cleaning head module body has magnetic receiver 14 and magnetic receiver (short) 16.
It is provided with permanent magnet 15 on magnetic receiver 14 and magnetic receiver (short) 16, permanent magnet 15 is fixed on magnetic receiver 14 and magnetic
On iron seat (short) 16, in figure everywhere " A ".
Permanent magnet 15 can make wafer rack 28 according to centainly adsorption capacity being required to be adsorbed in cleaning head module body 1 everywhere,
Structure at two guarantees to be adsorbed in cleaning head module body 1 after wafer rack 28 positions according to necessarily required adsorption capacity.
Finally, it should be noted that the foregoing is only a preferred embodiment of the present invention, it is not intended to restrict the invention,
Although the present invention is described in detail referring to the foregoing embodiments, for those skilled in the art, still may be used
To modify the technical solutions described in the foregoing embodiments or equivalent replacement of some of the technical features.
All within the spirits and principles of the present invention, any modification, equivalent replacement, improvement and so on should be included in of the invention
Within protection scope.
Claims (7)
1. a kind of LED wafer automatic fraction collector cleaning head assembly, including cleaning head module body (1), it is characterised in that: cleaning
It is fixed with magazine compression cylinder fixed frame (7) in head assembly main body (1), is fixed with magazine on magazine compression cylinder fixed frame (7)
Compression cylinder (8)；
Slot is provided on magazine compression cylinder fixed frame (7), being provided in slot can move along the magazine compression cylinder that slot slides
Frame (9),
Magazine compression cylinder movable stand (9) is moved forward and backward in the slot of magazine compression cylinder fixed frame (7) along Y-direction.
2. a kind of LED wafer automatic fraction collector cleaning head assembly as described in claim 1, it is characterised in that: when magazine pressure
Tight cylinder (8) connects gas, and magazine compression cylinder 8 is connected with magazine compression cylinder bracket (10), and magazine compression cylinder (8) pushes magazine
Compression cylinder bracket (10), magazine compression cylinder bracket (10) drive magazine compression cylinder movable stand (9) along magazine compression cylinder
The slot of fixed frame (7) moves, and realizes compression and release in the Y direction.
3. a kind of LED wafer automatic fraction collector cleaning head assembly as claimed in claim 2, it is characterised in that: magazine compresses
Cylinder (8) one end is fixed on magazine compression cylinder fixed frame (7), magazine compression cylinder (8) other end and magazine compression cylinder
Bracket (10) connection.
4. a kind of LED wafer automatic fraction collector cleaning head assembly as claimed in claim 3, it is characterised in that: cleaning head group
It is fixed in part main body (1) limiting cylinder connection frame (20), limiting cylinder fixed frame (19) and limiting cylinder connection frame (20) are even
One is connect, limiting block block fixing seat (25) is fixed on limiting cylinder connection frame (20).
5. a kind of LED wafer automatic fraction collector cleaning head assembly as claimed in claim 4, it is characterised in that: limiting cylinder
It is fixed on fixed frame (19) cylinder (24), cylinder (24) and cleaning head module body (1) are relatively fixed, the piston of cylinder (24)
Bar is connected with limiting cylinder connecting rod base (22).
6. a kind of LED wafer automatic fraction collector cleaning head assembly as claimed in claim 5, it is characterised in that: limiting cylinder
Connecting rod base (22) connects limiting cylinder connecting rod (21) and limiting block block (18), and limiting block block (18) connects limiting cylinder connecting rod
(21), the both ends of limiting cylinder connecting rod (21) use respectively limiting cylinder link connector pin (26) and limiting cylinder connecting rod base (22) and
The connection of limiting block block (18) hinge.
7. a kind of LED wafer automatic fraction collector cleaning head assembly as claimed in claim 6, it is characterised in that: magazine compresses
It is provided on cylinder movable stand (9) bearing fixing axle (13), bearing (39) is provided in bearing fixing axle (13).
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910369770 | 2019-05-06 | ||
| CN2019103697706 | 2019-05-06 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN110201893A true CN110201893A (en) | 2019-09-06 |
Family
ID=67796542
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201910607441.0A Pending CN110201893A (en) | 2019-05-06 | 2019-07-08 | A kind of LED wafer automatic fraction collector cleaning head assembly |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN110201893A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114472189A (en) * | 2022-04-02 | 2022-05-13 | 山东泓瑞光电科技有限公司 | Method and device for controlling LED and semiconductor laser chip placing workbench |
Citations (10)
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|---|---|---|---|---|
| CN1219453A (en) * | 1997-11-05 | 1999-06-16 | 阿普莱克斯公司 | Modular wafer polishing apparatus and method |
| CN1480986A (en) * | 2002-08-06 | 2004-03-10 | 尼康株式会社 | Bearing appts. its mfg. method, bearing table appts, and exposure appts. |
| TW200409317A (en) * | 2002-11-27 | 2004-06-01 | Siliconware Precision Industries Co Ltd | Semiconductor package with chip-supporting member |
| CN201590410U (en) * | 2009-12-15 | 2010-09-22 | 中芯国际集成电路制造(上海)有限公司 | Wafer box |
| WO2014002535A1 (en) * | 2012-06-29 | 2014-01-03 | シャープ株式会社 | Semiconductor device manufacturing method |
| CN204053321U (en) * | 2014-06-30 | 2014-12-31 | 北汽福田汽车股份有限公司 | Automobile front wall clamping structure |
| US20160240415A1 (en) * | 2015-02-12 | 2016-08-18 | Disco Corporation | Wafer processing system |
| CN206271671U (en) * | 2016-12-09 | 2017-06-20 | 江西迈赛特电子科技有限公司 | A kind of ultrahigh speed precisely automates LED bonders |
| CN106898683A (en) * | 2017-04-12 | 2017-06-27 | 东莞职业技术学院 | A kind of LED wafer support packaging system and method for packing |
| CN210022870U (en) * | 2019-05-06 | 2020-02-07 | 山东泓瑞光电科技有限公司 | Cleaning head assembly for automatic sorting machine of LED (light-emitting diode) wafers |
-
2019
- 2019-07-08 CN CN201910607441.0A patent/CN110201893A/en active Pending
Patent Citations (10)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1219453A (en) * | 1997-11-05 | 1999-06-16 | 阿普莱克斯公司 | Modular wafer polishing apparatus and method |
| CN1480986A (en) * | 2002-08-06 | 2004-03-10 | 尼康株式会社 | Bearing appts. its mfg. method, bearing table appts, and exposure appts. |
| TW200409317A (en) * | 2002-11-27 | 2004-06-01 | Siliconware Precision Industries Co Ltd | Semiconductor package with chip-supporting member |
| CN201590410U (en) * | 2009-12-15 | 2010-09-22 | 中芯国际集成电路制造(上海)有限公司 | Wafer box |
| WO2014002535A1 (en) * | 2012-06-29 | 2014-01-03 | シャープ株式会社 | Semiconductor device manufacturing method |
| CN204053321U (en) * | 2014-06-30 | 2014-12-31 | 北汽福田汽车股份有限公司 | Automobile front wall clamping structure |
| US20160240415A1 (en) * | 2015-02-12 | 2016-08-18 | Disco Corporation | Wafer processing system |
| CN206271671U (en) * | 2016-12-09 | 2017-06-20 | 江西迈赛特电子科技有限公司 | A kind of ultrahigh speed precisely automates LED bonders |
| CN106898683A (en) * | 2017-04-12 | 2017-06-27 | 东莞职业技术学院 | A kind of LED wafer support packaging system and method for packing |
| CN210022870U (en) * | 2019-05-06 | 2020-02-07 | 山东泓瑞光电科技有限公司 | Cleaning head assembly for automatic sorting machine of LED (light-emitting diode) wafers |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114472189A (en) * | 2022-04-02 | 2022-05-13 | 山东泓瑞光电科技有限公司 | Method and device for controlling LED and semiconductor laser chip placing workbench |
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