CN206250176U - A kind of vibration prevention system of integrated antenna package - Google Patents
A kind of vibration prevention system of integrated antenna package Download PDFInfo
- Publication number
- CN206250176U CN206250176U CN201621380546.5U CN201621380546U CN206250176U CN 206250176 U CN206250176 U CN 206250176U CN 201621380546 U CN201621380546 U CN 201621380546U CN 206250176 U CN206250176 U CN 206250176U
- Authority
- CN
- China
- Prior art keywords
- fixedly connected
- ceramic layer
- pin
- rubber spacer
- integrated antenna
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
- 230000002265 prevention Effects 0.000 title claims abstract description 12
- 239000000919 ceramic Substances 0.000 claims abstract description 35
- 125000006850 spacer group Chemical group 0.000 claims abstract description 23
- 239000000758 substrate Substances 0.000 claims abstract description 17
- 239000012212 insulator Substances 0.000 claims description 3
- 239000007787 solid Substances 0.000 claims 1
- 210000000056 organ Anatomy 0.000 description 3
- 238000000034 method Methods 0.000 description 2
- 101100520142 Caenorhabditis elegans pin-2 gene Proteins 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Landscapes
- Waveguide Aerials (AREA)
Abstract
The utility model discloses a kind of vibration prevention system of integrated antenna package,Its structure includes shell body,Pin,Connecting line,Chip,Tack coat,Anti-seismic structure,Substrate,The shell body both sides are fixed and are equiped with pin,The pin is fixedly connected with one end of connecting line,The other end of the connecting line is fixedly connected with chip,The chip is fixedly connected with tack coat,The tack coat is fixedly connected with the top of anti-seismic structure,The bottom of the anti-seismic structure is fixedly connected with substrate,The substrate is fixedly connected with shell body,The anti-seismic structure is by the first ceramic layer,First rubber spacer,Second ceramic layer,Second rubber spacer,3rd ceramic layer is constituted,First ceramic layer is fixedly connected with the first rubber spacer,First rubber spacer is fixedly connected with the second ceramic layer,The utility model is equiped with anti-seismic structure,Anti seismic efficiency is good,Play a part of protection circuit.
Description
Technical field
The utility model is a kind of vibration prevention system of integrated antenna package, belongs to circuit package equipment technical field.
Background technology
Encapsulation, is the process for integrated circuit being assembled into chip final products, briefly, exactly Foundry is produced
Integrated circuit die out is placed on one piece of substrate for playing carrying effect, and pin is extracted, and then fixing and packaging turns into
One entirety.
Prior art discloses a kind of integrated antenna package of Application No. 201480057243.7, the integrated antenna package
Including：Integrated circuit；It is connected to the outer connecting element (3) of integrated circuit；Surround the encapsulating material (2) of integrated circuit；And
Other element is allowed to be mechanically attached to the mechanical organ (5,6,7) of integrated antenna package (1).As a example by mechanical organ (5,6,7)
Such as：Attachment element (5)；Alternatively has threaded mechanical organ (5)；Casing component；Bearing element (7)；Electric connector (6).
But the integrated circuit anti seismic efficiency is poor.
Utility model content
In view of the shortcomings of the prior art, the utility model purpose is to provide a kind of antidetonation system of integrated antenna package
System, to solve the problems, such as that anti seismic efficiency is poor.
To achieve these goals, the utility model is to realize by the following technical solutions：A kind of integrated circuit envelope
The vibration prevention system of dress, its structure includes shell body, pin, connecting line, chip, tack coat, anti-seismic structure, substrate, the shell
Body both sides are fixed and are equiped with pin, and the pin is fixedly connected with one end of connecting line, the other end and chip of the connecting line
It is fixedly connected, the chip is fixedly connected with tack coat, the tack coat is fixedly connected with the top of anti-seismic structure, the antidetonation
The bottom of structure is fixedly connected with substrate, and the substrate is fixedly connected with shell body, and the anti-seismic structure is by the first ceramic layer,
One rubber spacer, the second ceramic layer, the second rubber spacer, the 3rd ceramic layer composition, first ceramic layer and the first rubber blanket
Layer is fixedly connected, and first rubber spacer is fixedly connected with the second ceramic layer, second ceramic layer and the second rubber spacer
It is fixedly connected, second rubber spacer is fixedly connected with the 3rd ceramic layer.
Further, the top of first ceramic layer is fixedly connected with tack coat.
Further, the bottom of the 3rd ceramic layer is fixedly connected with substrate.
Further, the pin is wing pin.
Further, the anti-seismic structure is all insulator composition.
The utility model is equiped with anti-seismic structure, and anti seismic efficiency is good, plays a part of protection circuit, transport of being more convenient for, and prolongs
Long life, simple structure is practical, is easy to promote.
Brief description of the drawings
The detailed description made to non-limiting example with reference to the following drawings by reading, other spies of the present utility model
Levy, objects and advantages will become more apparent upon：
Fig. 1 is a kind of structural representation of the vibration prevention system of integrated antenna package of the utility model；
Fig. 2 is a kind of internal structure schematic diagram of the vibration prevention system of integrated antenna package of the utility model；
Fig. 3 is anti-seismic structure structural representation of the present utility model.
In figure：Shell body -1, pin -2, connecting line -3, chip -4, tack coat -5, anti-seismic structure -6, substrate -7, first
Ceramic layer -601, the first rubber spacer -602, the second ceramic layer -603, the second rubber spacer -604, the 3rd ceramic layer -605.
Specific embodiment
For technological means, creation characteristic, reached purpose and effect for realizing the utility model are easy to understand, below
With reference to specific embodiment, the utility model is expanded on further.
Fig. 1, Fig. 2 and Fig. 3 are referred to, the utility model provides a kind of technical scheme：A kind of antidetonation of integrated antenna package
System, its structure includes shell body 1, pin 2, connecting line 3, chip 4, tack coat 5, anti-seismic structure 6, substrate 7, the shell body
1 both sides are fixed and are equiped with pin 2, and the pin 2 is fixedly connected with one end of connecting line 3, the other end and core of the connecting line 3
Piece 4 is fixedly connected, and the chip 4 is fixedly connected with tack coat 5, and the tack coat 5 is fixedly connected with the top of anti-seismic structure 6,
The bottom of the anti-seismic structure 6 is fixedly connected with substrate 7, and the substrate 7 is fixedly connected with shell body 1, the anti-seismic structure 6 by
First ceramic layer 601, the first rubber spacer 602, the second ceramic layer 603, the second rubber spacer 604,605 groups of the 3rd ceramic layer
Into first ceramic layer 601 is fixedly connected with the first rubber spacer 602, the ceramic layer of first rubber spacer 602 and second
603 are fixedly connected, and second ceramic layer 603 is fixedly connected with the second rubber spacer 604, second rubber spacer 604 with
3rd ceramic layer 605 is fixedly connected, and the top of first ceramic layer 601 is fixedly connected with tack coat 5, the 3rd ceramic layer
605 bottom is fixedly connected with substrate 7, and the pin 2 is wing pin, and the anti-seismic structure 6 is all insulator composition, this reality
Anti-seismic structure is equiped with new, anti seismic efficiency is good, plays a part of protection circuit, transport of being more convenient for increases the service life, and ties
Structure is simple, practical, is easy to promote.
When being used, two-layer rubber spacer plays more preferable anti seismic efficiency.
General principle of the present utility model and principal character and advantage of the present utility model has been shown and described above, for
For those skilled in the art, it is clear that the utility model is not limited to the details of above-mentioned one exemplary embodiment, and without departing substantially from this
In the case of the spirit or essential attributes of utility model, the utility model can be in other specific forms realized.Therefore, no matter
From the point of view of which point, embodiment all should be regarded as exemplary, and be nonrestrictive, scope of the present utility model is by institute
Attached claim is limited rather than described above, it is intended that will fall in the implication and scope of the equivalency of claim
All changes are included in the utility model.Any reference in claim should not be considered as the right involved by limitation
It is required that.
Moreover, it will be appreciated that although the present specification is described in terms of embodiments, not each implementation method is only wrapped
Containing an independent technical scheme, this narrating mode of specification is only that for clarity, those skilled in the art should
Specification an as entirety, the technical scheme in each embodiment can also be formed into those skilled in the art through appropriately combined
May be appreciated other embodiment.
Claims (5)
1. a kind of vibration prevention system of integrated antenna package, it is characterised in that：Its structure includes shell body (1), pin (2), connection
Line (3), chip (4), tack coat (5), anti-seismic structure (6), substrate (7), shell body (1) both sides are fixed and are equiped with pin
(2), the pin (2) is fixedly connected with one end of connecting line (3), and the other end of the connecting line (3) is fixed with chip (4) to be connected
Connect, the chip (4) is fixedly connected with tack coat (5), the tack coat (5) is fixedly connected with the top of anti-seismic structure (6), institute
The bottom for stating anti-seismic structure (6) is fixedly connected with substrate (7), and the substrate (7) is fixedly connected with shell body (1), the antidetonation
Structure (6) by the first ceramic layer (601), the first rubber spacer (602), the second ceramic layer (603), the second rubber spacer (604),
3rd ceramic layer (605) is constituted, and first ceramic layer (601) is fixedly connected with the first rubber spacer (602), first rubber
Rubber cushion layer (602) is fixedly connected with the second ceramic layer (603), and second ceramic layer (603) is solid with the second rubber spacer (604)
Fixed connection, second rubber spacer (604) is fixedly connected with the 3rd ceramic layer (605).
2. the vibration prevention system of a kind of integrated antenna package according to claim 1, it is characterised in that：First ceramic layer
(601) top is fixedly connected with tack coat (5).
3. the vibration prevention system of a kind of integrated antenna package according to claim 1, it is characterised in that：3rd ceramic layer
(605) bottom is fixedly connected with substrate (7).
4. the vibration prevention system of a kind of integrated antenna package according to claim 1, it is characterised in that：The pin (2) is
Wing pin.
5. the vibration prevention system of a kind of integrated antenna package according to claim 1, it is characterised in that：The anti-seismic structure
(6) it is all insulator composition.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621380546.5U CN206250176U (en) | 2016-12-15 | 2016-12-15 | A kind of vibration prevention system of integrated antenna package |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621380546.5U CN206250176U (en) | 2016-12-15 | 2016-12-15 | A kind of vibration prevention system of integrated antenna package |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206250176U true CN206250176U (en) | 2017-06-13 |
Family
ID=59007820
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621380546.5U Active CN206250176U (en) | 2016-12-15 | 2016-12-15 | A kind of vibration prevention system of integrated antenna package |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206250176U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113488440A (en) * | 2021-09-08 | 2021-10-08 | 江苏矽时代材料科技有限公司 | High-strength semiconductor packaging shell and packaging method thereof |
-
2016
- 2016-12-15 CN CN201621380546.5U patent/CN206250176U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113488440A (en) * | 2021-09-08 | 2021-10-08 | 江苏矽时代材料科技有限公司 | High-strength semiconductor packaging shell and packaging method thereof |
| CN113488440B (en) * | 2021-09-08 | 2021-11-05 | 江苏矽时代材料科技有限公司 | High-strength semiconductor packaging shell and packaging method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2018535541A5 (en) | ||
| JP2016535462A (en) | Integrated circuit package having wire bonded multi-die stack | |
| CN106571344A (en) | Packaging colloid wrapped package substrate | |
| TW200713551A (en) | Packages, methods for fabricating the same, anisotropic conductive films, and conductive particles utilized therein | |
| CN206250176U (en) | A kind of vibration prevention system of integrated antenna package | |
| CN105957842A (en) | High efficiency reconfigurable three-dimensional packaging structure | |
| CN103400845B (en) | Image sensor package method | |
| CN104347600A (en) | Package assembly configurations for multiple dies and associated techniques | |
| CN106225945B (en) | A kind of waterproof and dampproof temperature sensor and preparation method thereof | |
| WO2017034589A1 (en) | Multi-die package | |
| CN108459262A (en) | A kind of unitized SiP chip test systems and test method | |
| CN106133905A (en) | Integrated antenna package substrate | |
| CN204516748U (en) | A kind of QFN encapsulating structure of power device | |
| CN205692697U (en) | A kind of mold pressing Surface Mount pulse power capacitor device | |
| CN110534438A (en) | A kind of solid-state storage IC dilatation packaging method and structure | |
| CN207217512U (en) | A kind of SOT encapsulating structures | |
| CN206401187U (en) | A kind of super capacitor module | |
| CN201796878U (en) | Packaging structure of chip with 20 base pin | |
| CN206149582U (en) | Circuit board heat dissipation structure | |
| CN204303820U (en) | Silicon radiation detector encapsulating structure | |
| CN204550044U (en) | The encapsulating structure of the module containing sensor unit | |
| CN201984958U (en) | Ceramic capacitor | |
| CN207250492U (en) | A kind of vibration prevention system of integrated antenna package | |
| CN204271072U (en) | Lead-frame packages structure | |
| CN207052612U (en) | Photovoltaic component encapsulating structure |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20190506 Address after: 350000 Floor 3 of Building 5, No. 59 Yangqi Road, Gaishan Town, Cangshan District, Fuzhou City, Fujian Province (Block 3, Fuwan Garden, Jinshan Industrial Concentration Area, Fuzhou City) Patentee after: Fuzhou Zhongwei Electronic Technology Co., Ltd. Address before: 362600 Junducun 252, Penghu Town, Yongchun County, Quanzhou City, Fujian Province Patentee before: Lv Zhiqing |
|
| TR01 | Transfer of patent right |