CN206226829U - A kind of multilayer circuit board - Google Patents

A kind of multilayer circuit board Download PDF

Info

Publication number
CN206226829U
CN206226829U CN201621338319.6U CN201621338319U CN206226829U CN 206226829 U CN206226829 U CN 206226829U CN 201621338319 U CN201621338319 U CN 201621338319U CN 206226829 U CN206226829 U CN 206226829U
Authority
CN
China
Prior art keywords
plate
wiring board
circuit board
multilayer circuit
threaded portion
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
CN201621338319.6U
Other languages
Chinese (zh)
Inventor
刘冠尉
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Star Technology (huizhou) Co Ltd
Original Assignee
Star Technology (huizhou) Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Star Technology (huizhou) Co Ltd filed Critical Star Technology (huizhou) Co Ltd
Priority to CN201621338319.6U priority Critical patent/CN206226829U/en
Application granted granted Critical
Publication of CN206226829U publication Critical patent/CN206226829U/en
Expired - Fee Related legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Landscapes

  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

The utility model is related to a kind of multilayer circuit board, it includes first line plate, the second wiring board, tertiary circuit plate and bolt assembly, first line plate, the second wiring board and tertiary circuit plate are sequentially stacked, the upper surface of the second wiring board has the first lubricating layer, the lower surface of the second wiring board has the second lubricating layer, corresponding mounting hole is respectively provided with first line plate, the second wiring board and tertiary circuit plate, bolt assembly is arranged at mounting hole;And bolt assembly includes head, screw rod and insulation sleeve, the lower surface of head connects the upper surface of first line plate, and screw rod is arranged at mounting hole, and insulation sleeve is sheathed on screw rod, and sequentially connection first line plate, the second wiring board and tertiary circuit plate.The simple structure of multilayer circuit board of the present utility model, it is easy to make, increased the surface area of multilayer circuit board, it is ensured that more electric elements can complete in multilayer circuit board.

Description

A kind of multilayer circuit board
Technical field
The utility model belongs to wiring board art, more particularly, to a kind of multilayer circuit board.
Background technology
Wiring board is important electronic unit, is the supporter of electronic component, is the load of electronic component electrical connection Body.It is growing with modern electronic technology, it is also more and more higher for the requirement of wiring board, the electric elements on wiring board Be also more and more, it is necessary to which the wiring board of larger area carries electric elements, but due to some environment in, wiring board makes Limiting wiring board with environment can not take larger area, limit the application of wiring board.
Utility model content
In view of the shortcomings of the prior art, the purpose of this utility model is to provide a kind of multilayer circuit board, multilayer circuit board Including first line plate, the second wiring board, tertiary circuit plate and bolt assembly, first line plate, the second wiring board and the 3rd line Road plate is sequentially stacked, and the lower surface that the upper surface of the second wiring board has the first lubricating layer, the second wiring board has second Lubricating layer, corresponding mounting hole is respectively provided with first line plate, the second wiring board and tertiary circuit plate, and bolt assembly is arranged at Mounting hole;And bolt assembly includes head, screw rod and insulation sleeve, the lower surface of head connects the upper surface of first line plate, Screw rod is arranged at mounting hole, and insulation sleeve is sheathed on screw rod, and sequentially connection first line plate, the second wiring board and tertiary circuit Plate.
According to an implementation method of the present utility model, above-mentioned screw rod includes non-threaded portion and threaded portion, and non-threaded portion is set In head, more than or equal to first line plate and the thickness sum of the second wiring board, threaded portion is arranged at the length in non-threaded portion The bottom in non-threaded portion, threaded portion is bolted in tertiary circuit plate.
According to an implementation method of the present utility model, above-mentioned bolt assembly also includes pad, and pad is sheathed on screw rod, and position In between head and first line plate.
According to an implementation method of the present utility model, above-mentioned pad is dielectric resilience pad.
According to an implementation method of the present utility model, above-mentioned insulation sleeve is fixed and is bonded in non-threaded portion.
According to an implementation method of the present utility model, above-mentioned first lubricating layer and the second lubricating layer are polytetrafluoroethylene (PTFE) oil Ink.
Compared with prior art, the utility model can be obtained including following technique effect:
The simple structure of multilayer circuit board of the present utility model, it is easy to make, reduce the production cost of enterprise, and this reality With the new surface area that increased multilayer circuit board, it is ensured that more electric elements can complete in multilayer circuit board. Also, multilayer circuit board is fixed using bolt assembly, prevent the short circuit phenomenon between multilayer circuit board from occurring, it is ensured that the peace of product Full performance and service life.
Brief description of the drawings
Accompanying drawing described herein is used for providing being further understood to of the present utility model, constitutes of the present utility model one Point, schematic description and description of the present utility model is used to explain the utility model, does not constitute to of the present utility model Improper restriction.In the accompanying drawings:
Fig. 1 is the schematic diagram of the multilayer circuit board of the embodiment of the utility model one.
Specific embodiment
Implementation method of the present utility model is described in detail below in conjunction with drawings and Examples, thereby to the utility model How application technology means can fully understand and implement according to this to solve technical problem and reach the implementation process of technology effect.
Fig. 1 is referred to, is the schematic diagram of the multilayer circuit board 1 of the embodiment of the utility model one.As shown in the figure, this practicality is new Type discloses a kind of multilayer circuit board 1, and multilayer circuit board 1 includes first line plate 11, the second wiring board 12, tertiary circuit plate 13 And bolt assembly 14, first line plate 11, the second wiring board 12 and tertiary circuit plate 13 be sequentially stacked, the second wiring board 12 Upper surface there is the first lubricating layer 121, the lower surface of the second wiring board 12 has the second lubricating layer 122, first line plate 11, Corresponding mounting hole (sign) is respectively provided with second wiring board 12 and tertiary circuit plate 13, bolt assembly 14 is arranged at installation Hole.Bolt assembly 14 includes head 141, screw rod 142 and insulation sleeve 143, the lower surface connection first line plate 11 of head 141 Upper surface, screw rod 142 is arranged at mounting hole, and insulation sleeve 143 is sheathed on screw rod 142, and insulation sleeve 143 sequentially connects first line plate 11st, the second wiring board 12 and tertiary circuit plate 13.
Further, screw rod 142 includes non-threaded portion 1421 and threaded portion 1422, and non-threaded portion 1421 is arranged at head 141, the thickness sum of the length more than or equal to the wiring board 12 of first line plate 11 and second in non-threaded portion 1421.Threaded portion 1422 bottoms for being arranged at non-threaded portion 1421, threaded portion 1422 is bolted in tertiary circuit plate 13.
Further, bolt assembly 14 also includes pad 144, and pad 144 is sheathed on screw rod 142, and pad 144 is located at head Between 141 and first line plate 11.Specifically, pad 144 is dielectric resilience pad.Pad 144 uses dielectric resilience pad, can enter One step improves fastness when the fixed first line plate 11 of the assembling of bolt assembly 14, the second wiring board 12 and tertiary circuit plate 13, And it is possible to prevent the head 141 of bolt assembly 14 to be connected with first line plate 11, the short circuit of multilayer circuit board 1 is caused.
Further, insulation sleeve 143 be hollow circuit cylinder, the inwall glue coating of insulation sleeve 143, and be arranged be bonded in it is non-threaded Portion 1421.Insulation sleeve 143 is effective to ensure that electrical exhausted between first line plate 11, the second wiring board 12 and tertiary circuit plate 13 Edge, prevents from being electrically connected with and causing multilayer circuit board 1 to damage between first line plate 11, the second wiring board 12 and tertiary circuit plate 13 It is bad.
Further, the first lubricating layer 121 and the second lubricating layer 122 are polytetrafluoroethylene (PTFE) ink.Polytetrafluoroethylene (PTFE) is added Ink is added in, and is stirred, be then printed on upper surface and the lower surface of the second wiring board 12, form the first lubricating layer 121 And second lubricating layer 122.Polytetrafluoroethylene (PTFE) ink increases the smoothness of the upper surface of the second wiring board 12 and lower surface, reduces many Coefficient of friction between sandwich circuit board 1, extends the service life of multilayer circuit board 1.Also, polytetrafluoroethylene (PTFE) ink has outstanding Insulating properties, the first lubricating layer 121 can play a part of insulating first thread road plate 11 and the second wiring board 12, the second lubrication Layer 122 can play a part of the second wiring board of insulation 12 and tertiary circuit plate 13.
In sum, in one or more implementation methods of the present utility model, the structure of multilayer circuit board of the present utility model Simply, it is easy to make, the production cost of enterprise is reduced, and the utility model increased the surface area of multilayer circuit board, it is ensured that More electric elements can complete in multilayer circuit board.Also, multilayer circuit board is fixed using bolt assembly, prevent Short circuit phenomenon between multilayer circuit board occurs, it is ensured that the security performance and service life of product.
Also, it should be noted that term " including ", "comprising" or its any other variant be intended to nonexcludability Comprising, so that commodity or system including a series of key elements not only include those key elements, but also including without clear and definite Other key elements listed, or it is this commodity or the intrinsic key element of system also to include.In the feelings without more limitations Under condition, the key element limited by sentence "including a ...", it is not excluded that in the commodity or system including the key element also There is other identical element.
The upper only implementation method of the present utility model, is not limited to the utility model.For this area For technical staff, the utility model can have various modifications and variations.All interior institutes in spiritual and principle of the present utility model Any modification, equivalent substitution and improvements of work etc., all should be included within right of the present utility model.

Claims (6)

1. a kind of multilayer circuit board, it is characterised in that the multilayer circuit board includes first line plate, the second wiring board, the 3rd Wiring board and bolt assembly, the first line plate, the second wiring board and tertiary circuit plate are sequentially stacked, second line The lower surface that the upper surface of road plate has the first lubricating layer, second wiring board has the second lubricating layer, the first line Corresponding mounting hole is respectively provided with plate, the second wiring board and tertiary circuit plate, the bolt assembly is arranged at the mounting hole; And
The bolt assembly includes head, screw rod and insulation sleeve, and the lower surface of the head connects the upper of the first line plate Surface, the screw rod is arranged at the mounting hole, and the insulation sleeve is sheathed on the screw rod, and sequentially connects the first line Plate, the second wiring board and tertiary circuit plate.
2. multilayer circuit board as claimed in claim 1, it is characterised in that the screw rod includes non-threaded portion and threaded portion, institute State non-threaded portion and be arranged at the head, the length in the non-threaded portion is more than or equal to the first line plate and the second circuit The thickness sum of plate, the threaded portion is arranged at the bottom in the non-threaded portion, and the threaded portion is bolted in the tertiary circuit Plate.
3. multilayer circuit board as claimed in claim 2, it is characterised in that the bolt assembly also includes pad, the pad The screw rod is sheathed on, and positioned between the head and first line plate.
4. multilayer circuit board as claimed in claim 3, it is characterised in that the pad is dielectric resilience pad.
5. multilayer circuit board as claimed in claim 2, it is characterised in that the insulation sleeve fix be bonded in it is described non-threaded Portion.
6. multilayer circuit board as claimed in claim 1, it is characterised in that first lubricating layer and the second lubricating layer are poly- four PVF ink.
CN201621338319.6U 2016-12-07 2016-12-07 A kind of multilayer circuit board Expired - Fee Related CN206226829U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201621338319.6U CN206226829U (en) 2016-12-07 2016-12-07 A kind of multilayer circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN201621338319.6U CN206226829U (en) 2016-12-07 2016-12-07 A kind of multilayer circuit board

Publications (1)

Publication Number Publication Date
CN206226829U true CN206226829U (en) 2017-06-06

Family

ID=58784740

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201621338319.6U Expired - Fee Related CN206226829U (en) 2016-12-07 2016-12-07 A kind of multilayer circuit board

Country Status (1)

Country Link
CN (1) CN206226829U (en)

Similar Documents

Publication Publication Date Title
WO2012013546A1 (en) An electronic heating module and a method for manufacturing the same
CN206226829U (en) A kind of multilayer circuit board
CN104968138A (en) Printed circuit board
CN203482489U (en) Multilayer printed circuit board (PCB)
AU2018101058A4 (en) Double-layer superimposed circuit board
CN206323645U (en) A kind of PCB multilayer board for preventing layer from offseting
CN206323646U (en) A kind of circuit board and electronic equipment
CN209882214U (en) Flexible printed circuit board with rapid heat dissipation
CN207783285U (en) A kind of integral type HDI wiring boards
CN205546174U (en) Circuit board structure
CN207410581U (en) A kind of preferable Double-layer flexible circuit board of thermal diffusivity
CN209105497U (en) PCBA board component and electronic equipment
CN201742640U (en) Printed wiring board capable of carrying heavy current
CN207097572U (en) A kind of high-speed switch type series compensation device metal oxide pressure-limiting device component
CN206314065U (en) A kind of panel computer high density interconnection line plate
CN203666056U (en) High-flexibility high-conductivity copper-clad plate
CN205755031U (en) A kind of high-efficient heat-dissipating pcb board
CN205830134U (en) Multilayer circuit board
CN220108309U (en) Flexible circuit board with copper-aluminum structure
CN104144560A (en) Fixedly installed PCB
CN205029963U (en) Wide wiring printed circuit board improves structure
CN208509372U (en) High-accuracy impedance circuit plate
CN205232565U (en) Anti printed circuit board that tears
CN204090272U (en) A kind of high heat radiation pcb board
CN206958629U (en) A kind of novel electron laminate

Legal Events

Date Code Title Description
GR01 Patent grant
GR01 Patent grant
CF01 Termination of patent right due to non-payment of annual fee
CF01 Termination of patent right due to non-payment of annual fee

Granted publication date: 20170606

Termination date: 20191207