CN206226829U - A kind of multilayer circuit board - Google Patents
A kind of multilayer circuit board Download PDFInfo
- Publication number
- CN206226829U CN206226829U CN201621338319.6U CN201621338319U CN206226829U CN 206226829 U CN206226829 U CN 206226829U CN 201621338319 U CN201621338319 U CN 201621338319U CN 206226829 U CN206226829 U CN 206226829U
- Authority
- CN
- China
- Prior art keywords
- plate
- wiring board
- circuit board
- multilayer circuit
- threaded portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The utility model is related to a kind of multilayer circuit board, it includes first line plate, the second wiring board, tertiary circuit plate and bolt assembly, first line plate, the second wiring board and tertiary circuit plate are sequentially stacked, the upper surface of the second wiring board has the first lubricating layer, the lower surface of the second wiring board has the second lubricating layer, corresponding mounting hole is respectively provided with first line plate, the second wiring board and tertiary circuit plate, bolt assembly is arranged at mounting hole;And bolt assembly includes head, screw rod and insulation sleeve, the lower surface of head connects the upper surface of first line plate, and screw rod is arranged at mounting hole, and insulation sleeve is sheathed on screw rod, and sequentially connection first line plate, the second wiring board and tertiary circuit plate.The simple structure of multilayer circuit board of the present utility model, it is easy to make, increased the surface area of multilayer circuit board, it is ensured that more electric elements can complete in multilayer circuit board.
Description
Technical field
The utility model belongs to wiring board art, more particularly, to a kind of multilayer circuit board.
Background technology
Wiring board is important electronic unit, is the supporter of electronic component, is the load of electronic component electrical connection
Body.It is growing with modern electronic technology, it is also more and more higher for the requirement of wiring board, the electric elements on wiring board
Be also more and more, it is necessary to which the wiring board of larger area carries electric elements, but due to some environment in, wiring board makes
Limiting wiring board with environment can not take larger area, limit the application of wiring board.
Utility model content
In view of the shortcomings of the prior art, the purpose of this utility model is to provide a kind of multilayer circuit board, multilayer circuit board
Including first line plate, the second wiring board, tertiary circuit plate and bolt assembly, first line plate, the second wiring board and the 3rd line
Road plate is sequentially stacked, and the lower surface that the upper surface of the second wiring board has the first lubricating layer, the second wiring board has second
Lubricating layer, corresponding mounting hole is respectively provided with first line plate, the second wiring board and tertiary circuit plate, and bolt assembly is arranged at
Mounting hole;And bolt assembly includes head, screw rod and insulation sleeve, the lower surface of head connects the upper surface of first line plate,
Screw rod is arranged at mounting hole, and insulation sleeve is sheathed on screw rod, and sequentially connection first line plate, the second wiring board and tertiary circuit
Plate.
According to an implementation method of the present utility model, above-mentioned screw rod includes non-threaded portion and threaded portion, and non-threaded portion is set
In head, more than or equal to first line plate and the thickness sum of the second wiring board, threaded portion is arranged at the length in non-threaded portion
The bottom in non-threaded portion, threaded portion is bolted in tertiary circuit plate.
According to an implementation method of the present utility model, above-mentioned bolt assembly also includes pad, and pad is sheathed on screw rod, and position
In between head and first line plate.
According to an implementation method of the present utility model, above-mentioned pad is dielectric resilience pad.
According to an implementation method of the present utility model, above-mentioned insulation sleeve is fixed and is bonded in non-threaded portion.
According to an implementation method of the present utility model, above-mentioned first lubricating layer and the second lubricating layer are polytetrafluoroethylene (PTFE) oil
Ink.
Compared with prior art, the utility model can be obtained including following technique effect:
The simple structure of multilayer circuit board of the present utility model, it is easy to make, reduce the production cost of enterprise, and this reality
With the new surface area that increased multilayer circuit board, it is ensured that more electric elements can complete in multilayer circuit board.
Also, multilayer circuit board is fixed using bolt assembly, prevent the short circuit phenomenon between multilayer circuit board from occurring, it is ensured that the peace of product
Full performance and service life.
Brief description of the drawings
Accompanying drawing described herein is used for providing being further understood to of the present utility model, constitutes of the present utility model one
Point, schematic description and description of the present utility model is used to explain the utility model, does not constitute to of the present utility model
Improper restriction.In the accompanying drawings:
Fig. 1 is the schematic diagram of the multilayer circuit board of the embodiment of the utility model one.
Specific embodiment
Implementation method of the present utility model is described in detail below in conjunction with drawings and Examples, thereby to the utility model
How application technology means can fully understand and implement according to this to solve technical problem and reach the implementation process of technology effect.
Fig. 1 is referred to, is the schematic diagram of the multilayer circuit board 1 of the embodiment of the utility model one.As shown in the figure, this practicality is new
Type discloses a kind of multilayer circuit board 1, and multilayer circuit board 1 includes first line plate 11, the second wiring board 12, tertiary circuit plate 13
And bolt assembly 14, first line plate 11, the second wiring board 12 and tertiary circuit plate 13 be sequentially stacked, the second wiring board 12
Upper surface there is the first lubricating layer 121, the lower surface of the second wiring board 12 has the second lubricating layer 122, first line plate 11,
Corresponding mounting hole (sign) is respectively provided with second wiring board 12 and tertiary circuit plate 13, bolt assembly 14 is arranged at installation
Hole.Bolt assembly 14 includes head 141, screw rod 142 and insulation sleeve 143, the lower surface connection first line plate 11 of head 141
Upper surface, screw rod 142 is arranged at mounting hole, and insulation sleeve 143 is sheathed on screw rod 142, and insulation sleeve 143 sequentially connects first line plate
11st, the second wiring board 12 and tertiary circuit plate 13.
Further, screw rod 142 includes non-threaded portion 1421 and threaded portion 1422, and non-threaded portion 1421 is arranged at head
141, the thickness sum of the length more than or equal to the wiring board 12 of first line plate 11 and second in non-threaded portion 1421.Threaded portion
1422 bottoms for being arranged at non-threaded portion 1421, threaded portion 1422 is bolted in tertiary circuit plate 13.
Further, bolt assembly 14 also includes pad 144, and pad 144 is sheathed on screw rod 142, and pad 144 is located at head
Between 141 and first line plate 11.Specifically, pad 144 is dielectric resilience pad.Pad 144 uses dielectric resilience pad, can enter
One step improves fastness when the fixed first line plate 11 of the assembling of bolt assembly 14, the second wiring board 12 and tertiary circuit plate 13,
And it is possible to prevent the head 141 of bolt assembly 14 to be connected with first line plate 11, the short circuit of multilayer circuit board 1 is caused.
Further, insulation sleeve 143 be hollow circuit cylinder, the inwall glue coating of insulation sleeve 143, and be arranged be bonded in it is non-threaded
Portion 1421.Insulation sleeve 143 is effective to ensure that electrical exhausted between first line plate 11, the second wiring board 12 and tertiary circuit plate 13
Edge, prevents from being electrically connected with and causing multilayer circuit board 1 to damage between first line plate 11, the second wiring board 12 and tertiary circuit plate 13
It is bad.
Further, the first lubricating layer 121 and the second lubricating layer 122 are polytetrafluoroethylene (PTFE) ink.Polytetrafluoroethylene (PTFE) is added
Ink is added in, and is stirred, be then printed on upper surface and the lower surface of the second wiring board 12, form the first lubricating layer 121
And second lubricating layer 122.Polytetrafluoroethylene (PTFE) ink increases the smoothness of the upper surface of the second wiring board 12 and lower surface, reduces many
Coefficient of friction between sandwich circuit board 1, extends the service life of multilayer circuit board 1.Also, polytetrafluoroethylene (PTFE) ink has outstanding
Insulating properties, the first lubricating layer 121 can play a part of insulating first thread road plate 11 and the second wiring board 12, the second lubrication
Layer 122 can play a part of the second wiring board of insulation 12 and tertiary circuit plate 13.
In sum, in one or more implementation methods of the present utility model, the structure of multilayer circuit board of the present utility model
Simply, it is easy to make, the production cost of enterprise is reduced, and the utility model increased the surface area of multilayer circuit board, it is ensured that
More electric elements can complete in multilayer circuit board.Also, multilayer circuit board is fixed using bolt assembly, prevent
Short circuit phenomenon between multilayer circuit board occurs, it is ensured that the security performance and service life of product.
Also, it should be noted that term " including ", "comprising" or its any other variant be intended to nonexcludability
Comprising, so that commodity or system including a series of key elements not only include those key elements, but also including without clear and definite
Other key elements listed, or it is this commodity or the intrinsic key element of system also to include.In the feelings without more limitations
Under condition, the key element limited by sentence "including a ...", it is not excluded that in the commodity or system including the key element also
There is other identical element.
The upper only implementation method of the present utility model, is not limited to the utility model.For this area
For technical staff, the utility model can have various modifications and variations.All interior institutes in spiritual and principle of the present utility model
Any modification, equivalent substitution and improvements of work etc., all should be included within right of the present utility model.
Claims (6)
1. a kind of multilayer circuit board, it is characterised in that the multilayer circuit board includes first line plate, the second wiring board, the 3rd
Wiring board and bolt assembly, the first line plate, the second wiring board and tertiary circuit plate are sequentially stacked, second line
The lower surface that the upper surface of road plate has the first lubricating layer, second wiring board has the second lubricating layer, the first line
Corresponding mounting hole is respectively provided with plate, the second wiring board and tertiary circuit plate, the bolt assembly is arranged at the mounting hole;
And
The bolt assembly includes head, screw rod and insulation sleeve, and the lower surface of the head connects the upper of the first line plate
Surface, the screw rod is arranged at the mounting hole, and the insulation sleeve is sheathed on the screw rod, and sequentially connects the first line
Plate, the second wiring board and tertiary circuit plate.
2. multilayer circuit board as claimed in claim 1, it is characterised in that the screw rod includes non-threaded portion and threaded portion, institute
State non-threaded portion and be arranged at the head, the length in the non-threaded portion is more than or equal to the first line plate and the second circuit
The thickness sum of plate, the threaded portion is arranged at the bottom in the non-threaded portion, and the threaded portion is bolted in the tertiary circuit
Plate.
3. multilayer circuit board as claimed in claim 2, it is characterised in that the bolt assembly also includes pad, the pad
The screw rod is sheathed on, and positioned between the head and first line plate.
4. multilayer circuit board as claimed in claim 3, it is characterised in that the pad is dielectric resilience pad.
5. multilayer circuit board as claimed in claim 2, it is characterised in that the insulation sleeve fix be bonded in it is described non-threaded
Portion.
6. multilayer circuit board as claimed in claim 1, it is characterised in that first lubricating layer and the second lubricating layer are poly- four
PVF ink.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201621338319.6U CN206226829U (en) | 2016-12-07 | 2016-12-07 | A kind of multilayer circuit board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201621338319.6U CN206226829U (en) | 2016-12-07 | 2016-12-07 | A kind of multilayer circuit board |
Publications (1)
Publication Number | Publication Date |
---|---|
CN206226829U true CN206226829U (en) | 2017-06-06 |
Family
ID=58784740
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201621338319.6U Expired - Fee Related CN206226829U (en) | 2016-12-07 | 2016-12-07 | A kind of multilayer circuit board |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN206226829U (en) |
-
2016
- 2016-12-07 CN CN201621338319.6U patent/CN206226829U/en not_active Expired - Fee Related
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
GR01 | Patent grant | ||
GR01 | Patent grant | ||
CF01 | Termination of patent right due to non-payment of annual fee | ||
CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170606 Termination date: 20191207 |