AU2018101058A4

AU2018101058A4 - Double-layer superimposed circuit board

Info

Publication number: AU2018101058A4
Application number: AU2018101058A
Authority: AU
Inventors: Yingjuan Ji; Yao Yao
Original assignee: Kunshan Wanyuantong Electronics Technology Co Ltd
Current assignee: Kunshan Wanyuantong Electronics Technology Co Ltd
Priority date: 2018-06-28
Filing date: 2018-07-31
Publication date: 2018-08-30
Anticipated expiration: 2026-07-31
Also published as: CN208300122U

Abstract

The utility model discloses a double-layer superimposed circuit board, belonging to the technical field of circuit boards. The double-layer superimposed circuit board includes a first substrate and a second substrate, which are superimposed together and are connected and fixed through a plurality of fixing components. The superimposed faces of the first substrate and the second substrate are both wavy surfaces with continuous concave-convex structures and engage with each other when in contact. Insulating buffer stripes are arranged between the first substrate and the second substrate. The insulating buffer strips and the fixing components are alternately arrayed. A buffer layer is arranged between the two circuit substrates which are connected and fixed through the conductive fixing components, so that circuits on the two substrates are connected while a buffer function of the circuit board is realized. 3 0 0) 0 0, AT 7,'IAI

Description

DOUBLE-LAYER SUPERIMPOSED CIRCUIT BOARD

BACKGROUND OF THE UTILITY MODEL

[0001] Technical Field [0002] The utility model belongs to the technical field of circuit boards, and particularly relates to a double-layer circuit board.

[0003] Description of Related Art [0004] Nowadays, the rapid development of the circuit board industry has led to the appearance of ceramic circuit boards, aluminum oxide ceramic circuit boards, aluminum nitride ceramic circuit boards, aluminum-matrix boards, high-frequency boards, thick copper boards, impedance boards, ultrathin circuit boards, printed circuit boards and so on. As important electronic parts, supports of electronic components as well as electrical connection providers of the electronic components, circuit boards can realize miniaturization and visualization of circuits and thus are of great importance for mass production of fixed circuits and for optimization of electrical appliance layout.

[0005] Double-layer circuit boards are so designed that wiring layers are arranged on both sides of a middle dielectric layer. In the current industry, there are common epoxy resin multi-layer boards and ceramic circuit boards with common A12O3 as the main element, but all these double-layer circuit boards are poor in heat conductivity and heat dissipation in spite of the high wiring density and welding easiness of components, and due to the lack of a buffer mechanism, in actual use, the components are likely to be damaged by a vibrating force from the outside, consequentially, shortening the service life and limiting the application range of these double-layer circuit boards.

BRIEF SUMMARY OF THE UTILITY MODEL

[0006] The main technical issue to be settled by the utility model is to provide a double-layer superimposed circuit board, which is provided with a buffer layer between two circuit substrates connected and fixed through conductive fixing components, so that circuits on the two substrates are connected while a buffer function of the circuit board is realized.

[0007] In order to settle the above-mentioned technical issue, one technical scheme adopted by the utility model is as follows: [0008] A double-layer superimposed circuit board includes a first substrate and a second substrate, which are superimposed together and are connected and fixed through a plurality of conductive fixing components. Each fixing component includes a fixing column and two locking flanges, wherein the fixing column penetrates through the first substrate and the second substrate, the two locking flanges are separately arranged at two ends of the fixing column, and at least one of the two locking flanges is detachably connected with the fixing column.

[0009] Superimposed faces of the first substrate and the second substrate are both wavy surfaces with continuous concave-convex structures and engage with each other when in contact. Insulating buffer strips are arranged between the first substrate and the second substrate and have a height of 1.3-2.7 mm. The insulating buffer strips and the fixing components are alternately arrayed.

[0010] Furthermore, the first substrate and the second substrate are at least one selected from ceramic circuit boards and printed circuit boards.

[0011] Furthermore, each fixing component is composed of a copper bolt and a copper nut matched with the copper bolt.

[0012] Furthermore, the insulating buffer strips are nitrile butadiene rubber strips or foamed rubber strips with a hardness of 37-49 HD.

[0013] Furthermore, the circuit board further includes mounting holes, and a mounting sleeve is arranged in each mounting hole and includes two half sleeves connected with one sleeved the other.

[0014] Furthermore, the two half sleeves of each mounting sleeve are iron half sleeves, wherein one of the two half sleeves is a ferromagnetic iron half sleeve, and the two half sleeves are fixed through magnetic attraction when connected with one sleeved with the other.

[0015] Furthermore, the two half sleeves of each mounting sleeve are copper half sleeves and are connected and fixed in a threaded manner.

[0016] Furthermore, a temperature sensor is arranged between the first substrate and the second substrate.

[0017] The utility model has the following beneficial effects: [0018] First, the insulating buffer strips are arranged between the two substrates of the double-layer circuit board and achieve a shockproof buffer effect of the circuit board, so that the service life of the circuit board is effectively prolonged. In addition, the two substrates are connected and fixed through the conductive fixing components, which also realize circuit connection of the double-layer circuit board based on the electrical conductivity of their own.

[0019] Second, the wavy surfaces with the concave-convex structures are arranged on the sides, without circuits, of the two substrates, so that the surface area of the circuit board is enlarged to a certain degree, thus, improving the heat dissipation effect. A hollow structure formed between the two substrates provides an effective heat dissipation space. The wavy surfaces of the two substrates can engage with each other, and the connection stability of the two substrates engaging with each other is greatly improved by decreasing the distance between the substrates and by locking the two substrates with the fixing components.

[0020] Third, The mounting sleeves convenient to assemble and disassemble are arranged in the mounting holes of the circuit board and improve the strength of the mounting holes, and thus, the service life of the circuit board is prolonged. Furthermore, the temperature sensor is arranged between the two substrates of the double-layer circuit board and can monitor the operating temperature of the circuit board in real time.

[0021] The above description is only a summarization of the technical scheme of the utility model. For a better understanding of the technical means of the utility model, implementation can be carried out based on the contents in the specification. A detailed description of preferred embodiments of the utility model is given hereafter in combination with the drawings.

BRIEF DESCRIPTION OF THE SEVERAL VIEWS OF THE DRAWINGS

[0022] FIG. 1 is a structural view of a circuit board of the utility model; [0023] FIG. 2 is a front view of the circuit board of the utility model; [0024] FIG. 3 is a sectional view of part A-A in FIG. 2; [0025] FIG. 4 is a sectional view of part B-B in FIG. 2.

[0026] Reference Signs in the Figures: [0027] First substrate 1, second substrate 2, fixing component 3, fixing column 31, locking flange 32, insulating buffer strip 4, mounting hole 5, mounting sleeve 51, and half sleeve 511.

DETAILED DESCRIPTION OF THE UTILITY MODEL

[0028] A detailed illustration of preferred embodiments of the utility model is given in combination with the drawings as follows. By referring to the following illustration, those skilled in this field can have a better understanding of the advantages and characteristics of the utility model, and thus, the protection scope of the utility model is defined more clearly.

[0029] Embodiment: As shown in FIGs. 1-3, a double-layer superimposed circuit board includes a first substrate 1 and a second substrate 2, which are superimposed together and are connected and fixed through a plurality of conductive fixing components 3. Each fixing component includes a fixing column 31 and two locking flanges 32, wherein the fixing column penetrates through the first substrate and the second substrate, the two locking flanges are separately arranged at two ends of the fixing column, and at least one of the two locking flanges is detachably connected to the fixing column.

[0030] Superimposed faces of the first substrate and the second substrate are both wavy surfaces with continuous concave-convex structures and engage with each other when in contact. Insulating buffer strips 4 are arranged between the first substrate and the second substrate and have a height of 1.3-2.7 mm. The insulating buffer strips and the fixing components are alternately arrayed.

[0031] The first substrate and the second substrate are at least one selected from ceramic circuit boards and printed circuit boards.

[0032] Each fixing component is composed of a copper bolt and a copper nut matched with the copper bolt.

[0033] The insulating buffer strips are nitrile butadiene rubber strips or foamed rubber strips with a hardness of 37-49 HD.

[0034] As shown in FIG. 4, the double-layer superimposed circuit board further includes mounting holes 5. A mounting sleeve 51 is arranged in each mounting hole and includes two half sleeves 511 connected with one sleeved with the other.

[0035] The two half sleeves of each mounting sleeve are iron sleeves, wherein one of the two half sleeves is a ferromagnetic iron half sleeve, and the two half sleeves are fixed through magnetic attraction when connected with one sleeved with the other.

[0036] The two half sleeves of each mounting sleeve are copper half sleeves and are connected and fixed in a threaded manner.

[0037] A temperature sensor is arranged between the first substrate and the second substrate and connected to a main unit where the circuit board is assembled. The operating temperature of the circuit board can be observed in real time through the temperature sensor.

[0038] The operating process and operating principle of the utility model is as follows: [0039] The insulating buffer strips used for insulation are arranged between the two substrates of the circuit board and achieve a shockproof buffer effect of the circuit board, so that the service life of the circuit board is effectively prolonged. In addition, the two substrates are connected and fixed through the conductive fixing components, which also realize circuit connection of the double-layer circuit board based on the electrical conductivity of their own. Moreover, the wavy surfaces with the concave-convex structures are arranged on the sides, without circuits, of the two substrates, so that the surface area of the circuit board is enlarged to a certain degree, thus, improving the heat dissipation effect. A hollow structure formed between the two substrates provides an effective heat dissipation space. The wavy surfaces of the two substrates can engage with each other, and the connection stability of the two substrates engaging with each other is greatly improved by decreasing the distance between the substrates and by locking the two substrates with the fixing components.

[0040] The mounting sleeves convenient to assemble and disassemble are arranged in the mounting holes of the circuit board and improve the strength of the mounting holes, and thus, the service life of the circuit board is prolonged. Furthermore, the temperature sensor is arranged between the two substrates of the double-layer circuit board and can monitor the operating temperature of the circuit board in real time.

[0041] The above description is only used for explaining the embodiments of the utility model and is not used for limiting the patent scope of the utility model. All equivalent structural transformations based on the contents of the specification and drawings of the utility model, or direct or indirect applications to other relevant technical fields should also fall within the patent protection scope of the utility model.

Claims

What is claimed is:

1. A double-layer superimposed circuit board, characterized by including a first substrate (1) and a second substrate (2), which are superimposed together and are connected and fixed through a plurality of conductive fixing components (3), wherein each said fixing component includes a fixing column (31) penetrating through the first substrate and the second substrate and two locking flanges (32) separately arranged at two ends of the fixing column, and at least one of the two locking flanges of each said fixing component is detachably connected with the corresponding fixing column; and superimposed faces of the first substrate and the second substrate are both wavy surfaces with continuous concave-convex structure and engage with each other when in contact, insulating buffer strips (4) are arranged between the first substrate and the second substrate and have a height of 1.3-2.7 mm, and the insulating buffer strips and the fixing components are alternately arrayed.
2. The double-layer superimposed circuit board according to Claim 1, wherein the first substrate and the second substrate are at least one selected from ceramic circuit boards and printed circuit boards.
3. The double-layer superimposed circuit board according to Claim 1, wherein each said fixing component is composed of a copper bolt and a copper nut matched with the copper bolt.
4. The double-layer superimposed circuit board according to Claim 1, wherein the insulating buffer strips are nitrile butadiene rubber strips or foamed rubber strips.
5. The double-layer superimposed circuit board according to Claim 1, wherein the circuit board further includes mounting holes (5), and a mounting sleeve (51) is arranged in each said mounting hole and includes two half sleeves (511) connected with one sleeved with the other.
6. The double-layer superimposed circuit board according to Claim 5, wherein the two half sleeves of each said mounting sleeve are iron half sleeves, wherein one of the two half sleeves is a ferromagnetic iron half sleeve, and the two half sleeves are fixed through magnetic attraction when connected with one sleeved with the other.
7. The double-layer superimposed circuit board according to Claim 5, wherein the two half sleeves of each said mounting sleeve are copper half sleeves and are connected and fixed in a threaded manner.
8. The double-layer superimposed circuit board according to Claim 1, wherein a temperature sensor is arranged between the first substrate and the second substrate.