CN206164997U - Isolated line is electroplated and is prevented pressing from both sides membrane structure - Google Patents
Isolated line is electroplated and is prevented pressing from both sides membrane structure Download PDFInfo
- Publication number
- CN206164997U CN206164997U CN201621093932.6U CN201621093932U CN206164997U CN 206164997 U CN206164997 U CN 206164997U CN 201621093932 U CN201621093932 U CN 201621093932U CN 206164997 U CN206164997 U CN 206164997U
- Authority
- CN
- China
- Prior art keywords
- copper
- shaped
- isolated line
- isolated
- membrane structure
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Abstract
The utility model provides an isolated line is electroplated and is prevented pressing from both sides membrane structure, including the copper base plate, be formed with isolated line and U -shaped copper metallization portion on the first surface of copper base plate, the free end of isolated line is located the U -shaped opening of U -shaped copper metallization portion, U -shaped copper metallization portion includes the copper conductor that extends along the U -shaped, the first surface of copper base plate be located that isolated line is sentenced with the clearance between the U -shaped copper metallization portion and the region that is located outside the U -shaped copper metallization portion all is provided with the dry film. The utility model discloses can improve the point effect influence of electroplating through the mode to spreading copper around the isolated line under the circumstances of not changing the any wiring of customer, reach the isolated problem of fastener membrane side by side of solving to satisfy quality and clients' requirement.
Description
Technical field
This utility model is related to circuit board manufacturing area, and more particularly to a kind of isolated line electroplates anti-pinch membrane structure.
Background technology
Isolated line refers to parallel lines in line pattern, the flat cable of combination more than two, without which in 200mil beside which
Its line parallel and copper sheet are surrounded.During graphic plating is produced, affected by the point effect electroplated, isolated line often goes out
The quality defects such as existing circuit folder film.Wherein, circuit folder film refers to the thickness of the thickness more than dry film of electro-coppering/tin layers, by dry film
It is clipped between copper and tin, the dry film clamped cannot be returned when alkali etching line is crossed and moves back film section, and in etching under dry film
Copper is protected etching causes short circuit.
It is in order to avoid folder film phenomenon occurs in isolated line, electric using low current long-time generally for the plate of this type in the industry
Plating, although have some improvement to pressing from both sides film problem, but it is very harsh to the required precision of motor-generator set electric current output.
Utility model content
This utility model provides a kind of isolated line and electroplates anti-pinch membrane structure, to solve during isolated line plating in prior art
The problem for easily occurring pressing from both sides film.
To solve the above problems, as one side of the present utility model, there is provided a kind of isolated line plating anti-pinch film knot
Structure, including copper base, are formed with isolated line on the first surface of copper base and U-shaped applies copper portion, and the free end of isolated line is located at U
Shape is applied in the U-shaped opening in copper portion, and U-shaped applies the copper conductor that copper portion includes extending along U-shaped, the first surface of copper base positioned at isolated
The gap location and the region applied on the outside of copper portion positioned at U-shaped that line and U-shaped are applied between copper portion is provided with dry film.
Preferably, the width of copper conductor is 40mil.
Preferably, copper conductor and the spacing of isolated line are 10-20mil.
This utility model can be in the case where any wiring of client not be changed, by the side to spreading copper around isolated line
Formula improves the point effect of plating to be affected, and reaches and solves the problems, such as isolated wire clamp film side by side, so as to meet quality and customer requirement.
Description of the drawings
Fig. 1 schematically shows the isolated line in this utility model and electroplates schematic diagram of the anti-pinch membrane structure in plating；
Fig. 2 schematically shows the wiring diagram that the isolated line in this utility model electroplates anti-pinch membrane structure.
Reference in figure：1st, copper base；2nd, isolated line；3rd, U-shaped applies copper portion；4th, dry film.
Specific embodiment
Embodiment of the present utility model is described in detail below in conjunction with accompanying drawing, but this utility model can be by right
It is required that the multitude of different ways for limiting and covering is implemented.
This utility model provides a kind of isolated line and electroplates anti-pinch membrane structure, including copper base 1, the first table of copper base 1
Isolated line 2 is formed with face and U-shaped applies copper portion 3, the free end of isolated line 2 is located at U-shaped and applies in the U-shaped opening in copper portion 3, U-shaped
Deposited copper portion 3 includes the copper conductor extended along U-shaped, and the first surface of copper base 1 is applied between copper portion 3 positioned at isolated line 2 and U-shaped
Gap location and the region applied on the outside of copper portion 3 positioned at U-shaped are provided with dry film 4.Preferably, the width of copper conductor is 40mil.It is excellent
Selection of land, copper conductor are 10-20mil with the spacing of isolated line 2.
Refer to Fig. 1, isolated line in this utility model plating anti-pinch membrane structure can to isolated line carrying out design, due to
This utility model lays certain copper (i.e. U-shaped applies copper portion 3) along the certain distance around isolated line, therefore, overcome plating
Point effect principle, it is possible to use the Copper uptakie galvanic anode electric current laid, absorb so as to mitigate isolated line current, improve
The generation of folder film defect.
By above-mentioned technical proposal, this utility model can be in the case where any wiring of client not be changed, by orphan
The mode that copper is spread around vertical line improves the point effect impact of plating, reaches and solves the problems, such as isolated wire clamp film side by side, so as to
Meet quality and customer requirement.
Preferred embodiment of the present utility model is the foregoing is only, this utility model is not limited to, for this
For the technical staff in field, this utility model can have various modifications and variations.It is all it is of the present utility model spirit and principle
Within, any modification, equivalent substitution and improvements made etc. are should be included within protection domain of the present utility model.
Claims (3)
1. a kind of isolated line electroplates anti-pinch membrane structure, it is characterised in that including copper base (1), the first table of the copper base (1)
Isolated line (2) is formed with face and U-shaped applies copper portion (3), the free end of the isolated line (2) is located at the U-shaped and applies copper portion (3)
U-shaped opening in, the U-shaped apply copper portion (3) include along U-shaped extend copper conductor, the first surface of the copper base (1)
The gap location applied between copper portion (3) positioned at the isolated line (2) and the U-shaped and be located at the U-shaped and apply on the outside of copper portion (3)
Region be provided with dry film (4).
2. isolated line according to claim 1 electroplates anti-pinch membrane structure, it is characterised in that the width of the copper conductor is
40mil。
3. isolated line according to claim 1 electroplates anti-pinch membrane structure, it is characterised in that the copper conductor is isolated with described
The spacing of line (2) is 10-20mil.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621093932.6U CN206164997U (en) | 2016-09-29 | 2016-09-29 | Isolated line is electroplated and is prevented pressing from both sides membrane structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621093932.6U CN206164997U (en) | 2016-09-29 | 2016-09-29 | Isolated line is electroplated and is prevented pressing from both sides membrane structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206164997U true CN206164997U (en) | 2017-05-10 |
Family
ID=58652320
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621093932.6U Active CN206164997U (en) | 2016-09-29 | 2016-09-29 | Isolated line is electroplated and is prevented pressing from both sides membrane structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206164997U (en) |
-
2016
- 2016-09-29 CN CN201621093932.6U patent/CN206164997U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| TWI329938B (en) | Differential layout | |
| CN103687312B (en) | Gold-plated method for manufacturing circuit board | |
| JP5590223B2 (en) | Ceramic multilayer substrate | |
| WO2017177832A1 (en) | Method for improving corrosion resistance of gold finger | |
| CN103108500B (en) | A kind of method making sectional golden finger | |
| CN103237416A (en) | Pattern fabrication method capable of realizing hard gold electroplating and soft gold electroplating on same surface | |
| CN104661438A (en) | Three-time dry film method gilding process for pad of circuit board | |
| CN206164997U (en) | Isolated line is electroplated and is prevented pressing from both sides membrane structure | |
| CN205305222U (en) | Impedance arrangement structure | |
| CN104105339A (en) | Via hole anti-pad | |
| CN102548207B (en) | Electroplating structure for golden fingers of flexible circuit board | |
| CN205566810U (en) | Printed circuit board's five bread of golden finger gold structure | |
| CN203523143U (en) | Flexible circuit board | |
| CN103225094A (en) | Single-sided current protection method for blind hole plate electroplating | |
| JP2015139051A (en) | antenna device | |
| CN205355310U (en) | Protection shield FPC connecting piece that soft or hard combines | |
| CN107864555B (en) | Flexible circuit board | |
| CN204518212U (en) | The pcb board of current carrying capacity can be increased | |
| CN202841691U (en) | Circuit board with metallized covered edges | |
| CN206894989U (en) | A kind of Upper conductive layer of net substrate | |
| CN110278664A (en) | Welding resistance fenestration before printed circuit board electronickelling gold | |
| JP2016134597A (en) | Wiring board and method for manufacturing the same | |
| CN205336650U (en) | A PCB structure for broadband impedance match | |
| CN205546177U (en) | Impedance board | |
| CN203774183U (en) | Solid-state relay housing with multi-layered nickel plating layer |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |