CN206076227U - A kind of side-emitting led device - Google Patents
A kind of side-emitting led device Download PDFInfo
- Publication number
- CN206076227U CN206076227U CN201620994018.2U CN201620994018U CN206076227U CN 206076227 U CN206076227 U CN 206076227U CN 201620994018 U CN201620994018 U CN 201620994018U CN 206076227 U CN206076227 U CN 206076227U
- Authority
- CN
- China
- Prior art keywords
- electrode
- pedestal
- led device
- lens
- luminescent wafer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Led Device Packages (AREA)
Abstract
The utility model discloses a kind of side-emitting led device, pedestal and semicircular lens including strip, lens are fixedly mounted on the upper end centre position of pedestal, the left end of pedestal is enclosed with first electrode, the right-hand member of pedestal is enclosed with second electrode, the lower middle position of pedestal is provided with the 3rd electrode, the inner bottom part of lens is provided with the first luminescent wafer and the second luminescent wafer, first luminescent wafer is electrically connected with first electrode, second luminescent wafer is electrically connected with second electrode, the 3rd electrode ground connection.The side-emitting led device that this utility model is provided, by the change of packing forms, realize LED one sides and go out light, the exiting surface of LED is in side, which is made during application, light can be more efficiently coupled in light-strip by simple design and assembling, it is convenient that this is provided in particular applications such as daytime running lamps, television backlights for light emitting diode, simple structure, while with very strong practicality.
Description
Technical field
This utility model is related to field of photoelectric devices, especially a kind of side-emitting led device.
Background technology
LED chip is lighted by adding forward current, free electron and hole-recombination on PN junction, is directly turned electric energy
Luminous energy is turned to, it is widely used as a kind of new lighting source material, it has, and response speed is fast, shock resistance is good, the longevity
Life is long, energy-conserving and environment-protective the advantages of and it is fast-developing, be widely used in the fields such as beautification of landscape and indoor and outdoor lighting at present.
It is not high in view of traditional formal dress Sapphire Substrate high-power chip P-GaN layer electrical conductivity, need in P-type layer upper table
Face deposits one layer of translucent Ni/Au conductive layer makes electric current more be uniformly distributed, the current-diffusion layer can absorb a part of light and
Light efficiency is reduced, while sapphire thermal conductivity coefficient is low, causes chip thermal resistance high.To overcome above-mentioned deficiency, it is proposed that flip-chip.
And flip LED chips have five faces the characteristics of go out light, but 70% or so light is by sending directly over chip.It is special at some
Different application scenario, such as television backlight, the output route for now needing using light-strip to change light, this kind of method increased product
The complexity that product are designed and assembled.
Therefore, for the problems referred to above are necessary to propose a kind of side-emitting led device.
Utility model content
For above-mentioned the deficiencies in the prior art, the purpose of this utility model is to provide a kind of side-emitting led
Device.
To reach above-mentioned purpose, the technical solution adopted in the utility model is：
A kind of side-emitting led device, including the pedestal and semicircular lens of strip, the lens are fixedly mounted on
The upper end centre position of pedestal, the left end of the pedestal are enclosed with first electrode, and the right-hand member of the pedestal is enclosed with second electrode,
The lower middle position of the pedestal is provided with the 3rd electrode, and the inner bottom part left and right sides of the lens are respectively arranged with first
Luminescent wafer and the second luminescent wafer, first luminescent wafer and first electrode are electrically connected with, second luminescent wafer with
Second electrode is electrically connected with, the 3rd electrode ground connection.
Preferably, the lens include transparent silicon glue-line and fluorescent material glue-line, and the fluorescent material glue-line is wrapped in transparent silicon
On glue-line outer surface.
Preferably, the pedestal include from top to bottom being sequentially distributed the high anti-glue-line of connection, insulating barrier, first substrate layer and
Second substrate layer.
Preferably, the first substrate layer and second substrate layer are made using ceramic material, and the insulating barrier adopts day
So insulating rubber material is made.
Due to adopting above-mentioned technical proposal, the side-emitting led device that this utility model is provided, changing by packing forms
Become, realize LED one sides and go out light, the exiting surface of LED is in side so as to during application, can be by simple design
Light is more efficiently coupled in light-strip with assembling, this is light emitting diode in spies such as daytime running lamps, television backlights
It is convenient that different application scenario provides, simple structure, while with very strong practicality.
Description of the drawings
Fig. 1 is structural representation of the present utility model；
Fig. 2 is schematic cross-section of the present utility model.
Specific embodiment
Embodiment of the present utility model is described in detail below in conjunction with accompanying drawing, but this utility model can be by right
It is required that the multitude of different ways for limiting and covering is implemented.
If Fig. 1 is simultaneously with reference to shown in Fig. 2, a kind of side-emitting led device, including the pedestal 1 of strip and semicircular
Mirror 2, the lens 2 are fixedly mounted on the upper end centre position of pedestal 1, and the left end of the pedestal 1 is enclosed with first electrode 3, institute
The right-hand member for stating pedestal 1 is enclosed with second electrode 4, and the lower middle position of the pedestal 1 is provided with the 3rd electrode 5, the lens 2
Inner bottom part left and right sides be respectively arranged with the first luminescent wafer 6 and the second luminescent wafer 7, first luminescent wafer 6 with
Electrical 3 connection of first electrode, second luminescent wafer 7 are electrically connected with second electrode 4, and the 3rd electrode 5 is grounded.
Luminous LED device is installed on circuit boards, after energization, electric current is transferred to first by first electrode 3 respectively
Be transferred on the second luminescent wafer 7 on light chip 6 and by second electrode 4, the first luminescent wafer 6 and the second luminescent wafer 7 it
Between connect after just produce light source, the light source of generation is mapped to air from lens 2, and refraction angle is bigger than angle of incidence, due to the first luminous crystalline substance
The edge of piece 6 and the second luminescent wafer 7 close to lens 2, the angle of incidence of the light of part is big upwards, when angle of incidence is greatly to a journey
Degree, refraction angle are first close to 90 degree, and 90 degree of refraction angle is critical, now incident ray total reflection, and light will not be projected upwards, saturating
2 internal reflection of mirror, now equal to angle of reflection, reflection light will be reflected angle of incidence from 2 side of lens, therefore the light of side is able to
Strengthen.
Further, lens 1 include transparent silicon glue-line 8 and fluorescent material glue-line 9, and the fluorescent material glue-line 9 is wrapped in transparent
On 8 outer surface of layer of silica gel, pedestal 1 includes from top to bottom being sequentially distributed the high anti-glue-line 10 of connection, insulating barrier 11, first substrate layer
12 and second substrate layer 13.
Further, first substrate layer 12 and second substrate layer 13 are made using ceramic material, ceramic material thermal insulation
Preferably, the insulating barrier 11 is made using natural insulation elastomeric material.
The side-emitting led device that this utility model is provided, by the change of packing forms, realizes LED one sides and goes out light,
The exiting surface of LED is in side so as to during application, by simple design and can assemble light is more efficient
It is coupled in light-strip, this provides convenient, knot for light emitting diode in particular applications such as daytime running lamps, television backlights
Structure is simple, while with very strong practicality.
Preferred embodiment of the present utility model is the foregoing is only, the scope of the claims of the present utility model is not thereby limited,
Equivalent structure or equivalent flow conversion that every utilization this utility model description and accompanying drawing content are made, or directly or indirectly transport
Used in other related technical fields, it is included in the same manner in scope of patent protection of the present utility model.
Claims (4)
1. a kind of side-emitting led device, it is characterised in that：Pedestal and semicircular lens including strip, the lens
The upper end centre position of pedestal is fixedly mounted on, the left end of the pedestal is enclosed with first electrode, the right-hand member parcel of the pedestal
The lower middle position for having second electrode, the pedestal is provided with the 3rd electrode, the inner bottom part left and right sides point of the lens
First luminescent wafer and the second luminescent wafer be not provided with, first luminescent wafer is electrically connected with first electrode, described the
Two luminescent wafers are electrically connected with second electrode, the 3rd electrode ground connection.
2. a kind of side-emitting led device according to claim 1, it is characterised in that：The lens include transparent silica gel
Layer and fluorescent material glue-line, the fluorescent material glue-line are wrapped on transparent silicon glue-line outer surface.
3. a kind of side-emitting led device according to claim 1, it is characterised in that：The pedestal is included from top to bottom
It is sequentially distributed high anti-glue-line, insulating barrier, first substrate layer and the second substrate layer of connection.
4. a kind of side-emitting led device according to claim 3, it is characterised in that：The first substrate layer and second
Substrate layer is made using ceramic material, and the insulating barrier is made using natural insulation elastomeric material.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620994018.2U CN206076227U (en) | 2016-08-30 | 2016-08-30 | A kind of side-emitting led device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620994018.2U CN206076227U (en) | 2016-08-30 | 2016-08-30 | A kind of side-emitting led device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206076227U true CN206076227U (en) | 2017-04-05 |
Family
ID=58434990
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620994018.2U Expired - Fee Related CN206076227U (en) | 2016-08-30 | 2016-08-30 | A kind of side-emitting led device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206076227U (en) |
-
2016
- 2016-08-30 CN CN201620994018.2U patent/CN206076227U/en not_active Expired - Fee Related
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN203277485U (en) | Light-emitting device, light-emitting diode chip for forming multi-directional light emission and sapphire substrate thereof | |
| WO2014201774A1 (en) | Led bulb lamp capable of emitting lights in all directions | |
| CN102593304B (en) | High-power light-emitting diode (LED) light using ceramic for radiating | |
| CN204857783U (en) | Side -emitting's LED | |
| CN204289531U (en) | Full-color LED encapsulation structure and LED show module | |
| CN104465895A (en) | Led chip and manufacturing method thereof | |
| CN203192852U (en) | Led packaging structure | |
| CN206076227U (en) | A kind of side-emitting led device | |
| CN103456866B (en) | Inverted LED chip capable of emitting light omni-directionally | |
| CN203503701U (en) | Flexible led light source filament | |
| CN102544294A (en) | LED (Light Emitting Diode) chip capable of improving current transmission | |
| CN206558532U (en) | A kind of LED of high light-emitting efficiency wide-angle outgoing uniform light | |
| CN203521458U (en) | Flip-chip LED chip capable of emitting light omnibearingly | |
| CN103489995A (en) | Flexible LED (light-emitting diode) light source filament | |
| CN202855794U (en) | Direct insert type LED packaging structure | |
| CN207353246U (en) | A kind of COB packaged light sources | |
| CN107123713A (en) | A kind of device architecture of suitable monochromatic light LED die level encapsulation | |
| CN202259437U (en) | Multi-reflection cup integrated type LED (light emitting diode) packaging structure | |
| CN201689906U (en) | Gallium-nitride-based high-brightness light emitting diode with projection structures | |
| TWI568016B (en) | Semiconductor light-emitting device | |
| CN205752221U (en) | A kind of high efficiency gallium nitride LED chip | |
| CN204927338U (en) | Paster LED packaging structure | |
| CN202487644U (en) | LED chip capable of improving current transmission | |
| CN202601714U (en) | Combined electrode suitable for high-power GaN-based LED chip | |
| CN203215559U (en) | Multiple-lamp-strip light-emitting diode (LED) light source encapsulation structure |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170405 Termination date: 20170830 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |