CN206059424U - A kind of novel inverted chip light emitting device - Google Patents
A kind of novel inverted chip light emitting device Download PDFInfo
- Publication number
- CN206059424U CN206059424U CN201620954566.2U CN201620954566U CN206059424U CN 206059424 U CN206059424 U CN 206059424U CN 201620954566 U CN201620954566 U CN 201620954566U CN 206059424 U CN206059424 U CN 206059424U
- Authority
- CN
- China
- Prior art keywords
- chip
- chip body
- circuit board
- light emitting
- emitting device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model discloses a kind of novel inverted chip light emitting device, including chip body, by tin cream installation on circuit boards, fill between the chip body and circuit board expires underfill to the electrode of the chip body bottom.Contrast prior art, flip chip light emitting device of the present utility model fill the space between chip body and circuit board using underfill, make chip bear bigger stress, sound construction reliability after installing；Underfill gemel connection chip body and circuit board, accelerate the radiating of chip body simultaneously, and heat-sinking capability has been lifted, and also avoid air from entering space, improve the service life of luminescent device.
Description
Technical field
This utility model is related to LED chip field, and in particular to a kind of novel inverted chip light emitting device.
Background technology
At present, as the development of science and technology, LED chip application are more and more extensive, wherein the LED chip of upside-down mounting is due to avoiding
Interfere to luminous, more and more favored by people.But in prior art, the electrode of LED flip chip bottom passes through stannum
Cream is installed on circuit boards, as the electrode in chip slightly protrudes, causes the presence of space between chip body and circuit board, such as
Fastness shown in Fig. 2, after standoff effects LED flip chip installation；Air is sealed up for safekeeping in space simultaneously, operationally easily
Accumulation heat, and be difficult to radiate, easily make chip failure.
The content of the invention
For above-mentioned technical problem, the purpose of this utility model is to propose a kind of novel inverted chip light emitting device.
This utility model solves the technical scheme adopted by its technical problem：
A kind of novel inverted chip light emitting device, including chip body, the electrode of the chip body bottom pass through tin cream
Install on circuit boards, between the chip body and circuit board, fill full underfill.
Further, the circuit board includes substrate layer and circuit layer, and the electrode of the chip body is arranged on circuit layer
On, chip contact site is not provided with insulating barrier on the circuit layer.
Further, adhesive layer is provided with outside the chip body.
Further, the adhesive layer is the fluorescent glue for encapsulating.
The beneficial effects of the utility model are：Contrast prior art, flip chip light emitting device of the present utility model are utilized
Underfill fills the space between chip body and circuit board, makes chip that bigger stress, structure jail can be born after installing
Gu it is reliable；Underfill gemel connection chip body and circuit board, accelerate the radiating of chip body simultaneously, and heat-sinking capability has been carried
Rise, also avoid air from entering space, improve the service life of luminescent device.
Description of the drawings
With reference to the accompanying drawings and examples this utility model is further illustrated.
Fig. 1 is structural representation of the present utility model；
The schematic diagram of the common chip of the prior art that Fig. 2 is.
Specific embodiment
With reference to Fig. 1, a kind of novel inverted chip light emitting device of the present utility model, including chip body 1, the chip master
The electrode 2 of 1 bottom of body is installed on the circuit board 4 by tin cream 3, fills full bottom and fill out between the chip body 1 and circuit board 4
Fill glue 5.
The circuit board 4 includes Primary layer 41 and circuit layer 42, and the electrode 2 of the chip body 1 is arranged on circuit layer 42
On, chip contact site is not provided with insulating barrier 6 on the circuit layer 42, can prevent from surprisingly leaking electricity during chip operation.
It is provided with adhesive layer 7 outside the chip body 1, the adhesive layer 7 is the fluorescent glue for encapsulating, the fluorescent glue
It is covered on the outside of chip, chip can be effectively protected.
Above-mentioned luminescent device is prepared, is comprised the following steps：
1）The electrode 2 of chip body 1 is arranged on the circuit layer 42 of circuit board 4 by tin cream 3；
2）Circuit board 4 to being fixed with chip body 1 carries out Reflow Soldering, chip is fixed on the circuit board 4；
3）The underfill 5 of liquid, 5 upper surface of underfill and core are set between circuit board 4 and chip body 1
1 bottom of piece main body it is contour or be higher than 1 bottom of chip body, with the underfill 5 of liquid, fill can underfill 5
Full space between chip body 1 and circuit board 4；
4）The circuit board 4 obtained to step 3 is heated, and solidifies underfill 5；
5）Sealing 7 is carried out on the outside of chip body 1 on the circuit board 4 to operate, obtains covering the adhesive layer 7 of chip body 1.
Flip chip light emitting device of the present utility model is filled between chip body 1 and circuit board 4 using underfill 5
Space, make chip install after can bear bigger stress, sound construction reliability；The chip body 1 of the connection of underfill 5 simultaneously
With circuit board 4, accelerate the radiating of chip body 1, heat-sinking capability has been lifted, also avoid air from entering space, improve luminous organ
The service life of part.
Preferred embodiment of the present utility model is the foregoing is only, it is not to limit this utility model, all at this
Any modification, equivalent and improvement made within the spirit and principle of utility model etc., should be included in this utility model
Protection domain within.
Claims (4)
1. a kind of novel inverted chip light emitting device, including chip body（1）, the chip body（1）The electrode of bottom（2）It is logical
Cross tin cream（3）Installed in circuit board（4）On, it is characterised in that：The chip body（1）With circuit board（4）Between the full bottom of filling
Fill glue in portion（5）.
2. a kind of novel inverted chip light emitting device according to claim 1, it is characterised in that：Circuit board（4）Including base
Flaggy（41）And circuit layer（42）, the chip body（1）Electrode（2）Installed in circuit layer（42）On, the circuit layer
（42）On chip contact site is not provided with insulating barrier（6）.
3. a kind of novel inverted chip light emitting device according to claim 1, it is characterised in that：The chip body（1）
It is provided with outward adhesive layer（7）.
4. a kind of novel inverted chip light emitting device according to claim 3, it is characterised in that：The adhesive layer（7）For
To the fluorescent glue for encapsulating.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620954566.2U CN206059424U (en) | 2016-08-26 | 2016-08-26 | A kind of novel inverted chip light emitting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620954566.2U CN206059424U (en) | 2016-08-26 | 2016-08-26 | A kind of novel inverted chip light emitting device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206059424U true CN206059424U (en) | 2017-03-29 |
Family
ID=58381861
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620954566.2U Expired - Fee Related CN206059424U (en) | 2016-08-26 | 2016-08-26 | A kind of novel inverted chip light emitting device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206059424U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107507897A (en) * | 2016-06-14 | 2017-12-22 | 三星电子株式会社 | Light emitting device packaging piece and its manufacture method |
-
2016
- 2016-08-26 CN CN201620954566.2U patent/CN206059424U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107507897A (en) * | 2016-06-14 | 2017-12-22 | 三星电子株式会社 | Light emitting device packaging piece and its manufacture method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170329 Termination date: 20180826 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |