CN106159063A - A kind of novel inverted chip light emitting device and preparation method thereof - Google Patents
A kind of novel inverted chip light emitting device and preparation method thereof Download PDFInfo
- Publication number
- CN106159063A CN106159063A CN201610736189.XA CN201610736189A CN106159063A CN 106159063 A CN106159063 A CN 106159063A CN 201610736189 A CN201610736189 A CN 201610736189A CN 106159063 A CN106159063 A CN 106159063A
- Authority
- CN
- China
- Prior art keywords
- chip body
- chip
- circuit board
- light emitting
- emitting device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000002360 preparation method Methods 0.000 title claims description 5
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 claims abstract description 8
- 239000006071 cream Substances 0.000 claims abstract description 8
- 239000010410 layer Substances 0.000 claims description 14
- 239000012790 adhesive layer Substances 0.000 claims description 9
- 239000003292 glue Substances 0.000 claims description 7
- 239000007788 liquid Substances 0.000 claims description 4
- 230000004888 barrier function Effects 0.000 claims description 3
- 238000007789 sealing Methods 0.000 claims description 3
- 238000005476 soldering Methods 0.000 claims description 3
- 238000010276 construction Methods 0.000 abstract description 3
- 230000005855 radiation Effects 0.000 abstract description 3
- 230000005611 electricity Effects 0.000 description 2
- 238000005516 engineering process Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000000686 essence Substances 0.000 description 1
- 238000004020 luminiscence type Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/52—Encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices having potential barriers specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/64—Heat extraction or cooling elements
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/005—Processes relating to semiconductor body packages relating to encapsulations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2933/00—Details relating to devices covered by the group H01L33/00 but not provided for in its subgroups
- H01L2933/0008—Processes
- H01L2933/0033—Processes relating to semiconductor body packages
- H01L2933/0075—Processes relating to semiconductor body packages relating to heat extraction or cooling elements
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Power Engineering (AREA)
- Led Device Packages (AREA)
Abstract
The invention discloses a kind of novel inverted chip light emitting device, including chip body, the electrode of described chip body bottom is installed on circuit boards by tin cream, fills full underfill between described chip body and circuit board.Contrast prior art, the flip chip light emitting device of the present invention utilizes underfill to fill the space between chip body and circuit board, makes chip can bear bigger stress after installing, and sound construction is reliable；Underfill connects chip body and circuit board simultaneously, accelerates the heat radiation of chip body, and heat-sinking capability has promoted, and also avoids air to enter space, improves the service life of luminescent device.
Description
Technical field
The present invention relates to LED chip field, be specifically related to a kind of novel inverted chip light emitting device and preparation method thereof.
Background technology
At present, along with the development of science and technology, LED chip application is more and more extensive, and wherein the LED chip of upside-down mounting is owing to avoiding
Luminescence is interfered, is more and more favored by people.But in prior art, the electrode 2 bottom LED flip chip passes through stannum
Cream 3 is installed on the circuit board 4, owing to the electrode 2 in chip slightly protrudes, causes and there is sky between chip body 1 and circuit board 4
Gap 8, as in figure 2 it is shown, this space 8 affects the fastness after LED flip chip is installed；Space 8 has sealed air up for safekeeping, in work simultaneously
Easily gather heat when making, and be difficult to dispel the heat, easily make chip failure.
Summary of the invention
For above-mentioned technical problem, it is an object of the invention to propose a kind of novel inverted chip light emitting device.
The technical solution adopted for the present invention to solve the technical problems is:
A kind of novel inverted chip light emitting device, including chip body, the electrode of described chip body bottom is installed by tin cream
On circuit boards, full underfill is filled between described chip body and circuit board.
Further, described circuit board includes that substrate layer and circuit layer, the electrode of described chip body are arranged on circuit layer
On, described circuit layer is not provided with insulating barrier with chip contact site.
Further, described chip body is outside equipped with adhesive layer.
Further, described adhesive layer is the fluorescent glue encapsulated.
A kind of preparation method preparing above-mentioned flip chip light emitting device, comprises the following steps:
1) electrode of chip body is arranged on the circuit layer of circuit board by tin cream；
2) circuit board being fixed with chip body is carried out Reflow Soldering；
3) arranging the underfill of liquid between circuit board and chip body, underfill upper surface and chip body are
Lower end is contour or is higher than chip body bottom；
4) circuit board obtaining step 3 heats, and makes underfill adhesive curing；
5) carry out sealing operation outside chip body on circuit boards, obtain covering the adhesive layer of chip body.
The invention has the beneficial effects as follows: contrast prior art, the flip chip light emitting device of the present invention utilizes underfill
The space between chip body and circuit board filled by glue, makes chip can bear bigger stress after installing, and sound construction is reliable；With
Time underfill connect chip body and circuit board, accelerate the heat radiation of chip body, heat-sinking capability has promoted, and also avoids sky
Gas enters space, improves the service life of luminescent device.
Accompanying drawing explanation
The present invention is further described with embodiment below in conjunction with the accompanying drawings.
Fig. 1 is the structural representation of the present invention；
The schematic diagram of the common chip of the prior art that Fig. 2 is.
Detailed description of the invention
With reference to Fig. 1, the novel inverted chip light emitting device of one of the present invention, including chip body 1, described chip body 1
The electrode 2 of bottom is installed on the circuit board 4 by tin cream 3, fills full underfill between described chip body 1 and circuit board 4
Glue 5.
Described circuit board 4 includes that Primary layer 41 and circuit layer 42, the electrode 2 of described chip body 1 are arranged on circuit layer 42
On, described circuit layer 42 is not provided with insulating barrier 6 with chip contact site, can prevent from surprisingly leaking electricity during chip operation.
Described chip body 1 is outside equipped with adhesive layer 7, and described adhesive layer 7 is the fluorescent glue in order to encapsulate, described fluorescent glue
It is covered in outside chip, chip can be effectively protected.
The invention also discloses a kind of method preparing above-mentioned flip chip light emitting device, comprise the following steps:
1) electrode 2 of chip body 1 is arranged on the circuit layer 42 of circuit board 4 by tin cream 3；
2) circuit board 4 being fixed with chip body 1 is carried out Reflow Soldering, make chip fixing on the circuit board 4；
3) underfill 5 of liquid, underfill 5 upper surface and chip master are set between circuit board 4 and chip body 1
Body 1 bottom is contour or is higher than chip body 1 bottom, with the underfill 5 of liquid, underfill 5 can be made to be full of core
Space between sheet main body 1 and circuit board 4；
4) circuit board 4 obtained step 3 heats, and makes underfill 5 solidify；
5) carry out sealing 7 outside chip body 1 on the circuit board 4 to operate, obtain covering the adhesive layer 7 of chip body 1.
The flip chip light emitting device of the present invention utilizes underfill 5 to fill the sky between chip body 1 and circuit board 4
Gap, makes chip can bear bigger stress after installing, and sound construction is reliable；Underfill 5 connects chip body 1 and electricity simultaneously
Road plate 4, accelerates the heat radiation of chip body 1, and heat-sinking capability has promoted, and also avoids air to enter space, improves luminescent device
Service life.
The foregoing is only presently preferred embodiments of the present invention, not in order to limit the present invention, all essences in the present invention
Any amendment, equivalent and the improvement etc. made within god and principle, should be included within the scope of the present invention.
Claims (5)
1. a novel inverted chip light emitting device, including chip body (1), the electrode (2) of described chip body (1) bottom leads to
Cross tin cream (3) to be arranged on circuit board (4), it is characterised in that: fill the full end between described chip body (1) and circuit board (4)
Glue (5) is filled in portion.
The novel inverted chip light emitting device of one the most according to claim 1, it is characterised in that: circuit board (4) includes base
Flaggy (41) and circuit layer (42), the electrode (2) of described chip body (1) is arranged on circuit layer (42), described circuit layer
(42) insulating barrier (6) it is not provided with on chip contact site.
The novel inverted chip light emitting device of one the most according to claim 1, it is characterised in that: described chip body (1)
It is outside equipped with adhesive layer (7).
The novel inverted chip light emitting device of one the most according to claim 3, it is characterised in that: described adhesive layer (7) is
In order to the fluorescent glue encapsulated.
5. the preparation method preparing the arbitrary described flip chip light emitting device of claim 1-4, it is characterised in that include
Following steps:
1) electrode of chip body (1) is arranged on the circuit layer (42) of circuit board (4) by tin cream (3)；
2) circuit board (4) being fixed with chip body (1) is carried out Reflow Soldering；
3) underfill (5) of liquid, underfill (5) upper surface are set between circuit board (4) and chip body (1)
Contour with chip body (1) bottom or higher than chip body (1) bottom；
4) circuit board obtaining step 3 heats, and makes underfill (5) solidify；
5) outside of the chip body (1) on circuit board (4) carries out sealing operation, obtains covering the adhesive layer of chip body (1)
(7).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610736189.XA CN106159063A (en) | 2016-08-26 | 2016-08-26 | A kind of novel inverted chip light emitting device and preparation method thereof |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610736189.XA CN106159063A (en) | 2016-08-26 | 2016-08-26 | A kind of novel inverted chip light emitting device and preparation method thereof |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106159063A true CN106159063A (en) | 2016-11-23 |
Family
ID=57342386
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610736189.XA Pending CN106159063A (en) | 2016-08-26 | 2016-08-26 | A kind of novel inverted chip light emitting device and preparation method thereof |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106159063A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109003970A (en) * | 2018-09-14 | 2018-12-14 | 东莞阿尔泰显示技术有限公司 | A kind of LED bilayer packaging technology and its encapsulating structure |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101364626A (en) * | 2007-08-07 | 2009-02-11 | 亿光电子工业股份有限公司 | LED device |
| CN101937950A (en) * | 2009-07-01 | 2011-01-05 | 吕联祥 | Fabrication method of flip chip type gallium nitride light emitting diode |
| CN103943763A (en) * | 2014-03-28 | 2014-07-23 | 晶丰电子封装材料（武汉）有限公司 | Packaging structure and method for flip LED chip |
-
2016
- 2016-08-26 CN CN201610736189.XA patent/CN106159063A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101364626A (en) * | 2007-08-07 | 2009-02-11 | 亿光电子工业股份有限公司 | LED device |
| CN101937950A (en) * | 2009-07-01 | 2011-01-05 | 吕联祥 | Fabrication method of flip chip type gallium nitride light emitting diode |
| CN103943763A (en) * | 2014-03-28 | 2014-07-23 | 晶丰电子封装材料（武汉）有限公司 | Packaging structure and method for flip LED chip |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109003970A (en) * | 2018-09-14 | 2018-12-14 | 东莞阿尔泰显示技术有限公司 | A kind of LED bilayer packaging technology and its encapsulating structure |
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| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| RJ01 | Rejection of invention patent application after publication |
Application publication date: 20161123 |
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| RJ01 | Rejection of invention patent application after publication |