CN206024397U - A kind of heat pipe for thermal conductivity panel assembly - Google Patents
A kind of heat pipe for thermal conductivity panel assembly Download PDFInfo
- Publication number
- CN206024397U CN206024397U CN201621035163.4U CN201621035163U CN206024397U CN 206024397 U CN206024397 U CN 206024397U CN 201621035163 U CN201621035163 U CN 201621035163U CN 206024397 U CN206024397 U CN 206024397U
- Authority
- CN
- China
- Prior art keywords
- heat
- heat pipe
- conducting plate
- thermal conductivity
- panel assembly
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a kind of heat pipe for thermal conductivity panel assembly, is characterized in that, if the device includes that dry heat pipe and heat-conducting plate, heat-conducting plate one side arrange groove, in the embedded groove of heat pipe, the heat pipe is consolidated with heat-conducting plate by full weld welding manner；The big double dominant of the characteristics of a kind of heat pipe for thermal conductivity panel assembly disclosed in the utility model has merged big heat pipe heat flux, heat conduction distance and heat-conducting plate contact heat-absorbent surface, have that heat conduction is fast, heat-transfer area big, heat transfer direction is not limited by device angles, simple structure, convenient processing and the features such as install, compress beneficial to batch production and cost, is particularly well-suited to that heat point source is more, space is narrow, need heat transfer over long distances and the occasion for radiating.
Description
Technical field
The utility model is related to a kind of heat pipe for thermal conductivity panel assembly, belongs to technical field of mechanical design.
Background technology
Air cooling or air-cooled under the conditions of, power device is carried out by way of directly laminating radiator with general after cavity package
Radiating, so that enough spaces are supplied to the high radiator of enough teeth.For integrated level requires higher and higher power amplifier battle array
Row, do not have such large space and directly radiate configuring suitable radiator between power amplifier and power amplifier.
With the continuous expansion of application of the superfrequency radiofrequency signal in sophisticated weapons system, high-frequency electromagnetic wave transmitting device
Just constantly develop towards directions such as high, the big, microminaturizations of signal strength signal intensity of integrated level.This is just to the equipment for carrying related power device
Design put forward higher requirement.On the one hand, bogey needs to meet wanting in its function, performance by densely arranged
Ask, i.e., unit will accomplish lightweight, miniaturization；On the other hand, high-power component produce heat must shed as early as possible with
The long-time normal work of guarantee equipment.Therefore, it is necessary to designing, one kind can be installed in narrow space, heat-absorbent surface is big and heat conduction
The strong heat conducting and heat radiating device of ability is mating the development need of such power amplification device.
Content of the invention
For solving the deficiencies in the prior art, the utility model devises a kind of heat pipe for thermal conductivity panel assembly.
The technical solution of the utility model is：A kind of heat pipe for thermal conductivity panel assembly, is characterized in that, the device include heat-conducting plate and
If dry heat pipe, heat-conducting plate one side opens up fluted, and in the embedded groove of heat pipe, the heat pipe is by full weld welding manner and heat-conducting plate
Consolidation.
In the embedded groove of heat pipe, fit with the bottom surface and side of groove through flattening processing, the heat pipe is welded by full weld
Connect mode and heat-conducting plate to consolidate, after heat pipe is through flattening processing, heat pipe upper surface is not higher by heat conduction plate surface, such heat-conducting plate with
The parameters such as heat exchange heat pipe quantity, diameter can be sufficiently carried out between heat pipe can be according to heat conduction such as thermal source distribution and amount of heat
Demand carries out reasonable Arrangement, is beneficial to raising heat transfer efficiency.
Further, the heat-conducting plate is aluminium sheet or copper coin.
Further, the heat-conducting plate is big planar sheet, is provided with groove of some depth less than width thereon
Further, the heat pipe is cylinder, and heat pipe length is suitable with heat-conducting plate fovea superior slot length, and heat pipe diameter is bigger
In depth of groove and less than recess width, heat pipe after repressed processing, can be made to fit in the bottom surface and side of groove well.
Further, the heat-conducting plate is provided with radiator back to heat pipe side
Further, heat-conducting plate side or middle installation power amplifier box, radiator is installed in power amplifier box one or both sides；Institute
State power amplifier box and be packaged with power device, the power device is thermal source, and the groove location on the heat-conducting plate is near thermal source position
Put, the length of groove covers thermal source and radiator.During actually used, heat pipe for thermal conductivity plate side or middle installation encapsulation are active
Rate device（That is thermal source）Power amplifier box, close to power amplifier box one or both sides install radiator（Or can be direct by radiator
Form on heat-conducting plate）.The heat of thermal source side is rapidly conducted to radiator side by heat pipe for thermal conductivity plate, by dissipating
Heat is distributed by hot device.
Further, the heat-conducting plate is provided with temperature sensor, and temperature sensor is connected with alarm.
The beneficial effects of the utility model are：A kind of heat pipe for thermal conductivity panel assembly disclosed in the utility model has merged heat pipe heat
Flux is big, heat conduction distance the characteristics of and the big double dominant of heat-conducting plate contact heat-absorbent surface, with heat conduction fast, heat-transfer area is big, hot
Conduction orientation is not limited by device angles, simple structure, conveniently process and install, compress beneficial to batch production and cost etc.
Feature, is particularly well-suited to the occasion that heat point source is more, space is narrow, need heat transfer and radiating over long distances.
Description of the drawings
Fig. 1 is the utility model structural representation；
Fig. 2 is one structural representation of the utility model embodiment；
Fig. 3 is two structure chart of the utility model embodiment.
Specific embodiment
Below in conjunction with the accompanying drawings the utility model is done and is further explained.
As depicted in figs. 1 and 2, if the device includes that dry heat pipe 4 and heat-conducting plate 3,3 one side of heat-conducting plate arrange groove, heat pipe 4
In embedded groove；Power amplifier box 2 is installed in 3 side of heat-conducting plate, and radiator 1 is installed in 2 side of power amplifier box.
The heat-conducting plate 3 is aluminium sheet；The heat pipe is that cylinder, the heat pipe 4, its diameter are slightly larger than depth of groove and summary
Less than recess width, it is positioned in groove, after flattening processing heat pipe wall can be made preferably to fit in the bottom surface and side of groove,
And consolidated with heat-conducting plate 3 by full weld welding manner, heat exchange between such heat-conducting plate 3 and heat pipe 4, can be sufficiently carried out, heat
The parameters such as the quantity of pipe 4, heat flux can carry out reasonable Arrangement according to heat conduction demands such as thermal source distribution and amount of heat；Through flattening
After processing, the upper surface of affiliated heat pipe 4 is not higher by heat-conducting plate 3, thus can reduce space waste.The heat-conducting plate 3 is provided with temperature
Sensor, temperature sensor are connected with alarm, and when heat conduction plate temperature is outside setting regions scope, temperature sensor is by information
Send to alarm；The power amplifier box is packaged with power device.
As shown in figure 3, be each power amplifier unit integrating device, integrated along array direction, respectively for being put down perpendicular to heat-conducting plate greatly
Array on the direction of face, is cannot directly to carry on the back the high radiator of patch proper tooth to thermal source, and on heat pipe bearing of trend, radiating
Device size is then unrestricted.
The above is only preferred embodiment of the present utility model, it is noted that for the common skill of the art
For art personnel, on the premise of without departing from the utility model principle, some improvements and modifications can also be made, these improvement and
Retouching also should be regarded as protection domain of the present utility model.
Claims (10)
1. a kind of heat pipe for thermal conductivity panel assembly, is characterized in that, if the device includes that dry heat pipe and heat-conducting plate, heat-conducting plate one side are offered
Groove, in the embedded groove of heat pipe, the heat pipe is consolidated with heat-conducting plate by full weld welding manner.
2. a kind of heat pipe for thermal conductivity panel assembly according to claim 1, is characterized in that, in the embedded groove of heat pipe, through flattening
Processing is fitted with the bottom surface and side of groove, and the heat pipe is consolidated with heat-conducting plate by full weld welding manner.
3. a kind of heat pipe for thermal conductivity panel assembly according to claim 2, is characterized in that, after heat pipe is through flattening processing, heat pipe
Upper surface is not higher by heat conduction plate surface.
4. a kind of heat pipe for thermal conductivity panel assembly according to claim 1, is characterized in that, the heat-conducting plate is aluminium sheet or copper
Plate.
5. a kind of heat pipe for thermal conductivity panel assembly according to claim 1, is characterized in that, the heat-conducting plate is big planar sheet,
Some depth groove less than width is provided with thereon.
6. a kind of heat pipe for thermal conductivity panel assembly according to claim 5, is characterized in that, the heat pipe is cylinder, and heat pipe is long
Degree is suitable with heat-conducting plate fovea superior slot length, and heat pipe diameter slightly larger than depth of groove and is less than recess width.
7. a kind of heat pipe for thermal conductivity panel assembly according to claim 1, is characterized in that, the heat-conducting plate is set back to heat pipe side
It is equipped with radiator.
8. a kind of heat pipe for thermal conductivity panel assembly according to claim 1, is characterized in that, heat-conducting plate is provided with temperature sensor, temperature
Degree sensor connection alarm.
9. a kind of heat pipe for thermal conductivity panel assembly according to claim 1, is characterized in that, power amplifier is installed in heat-conducting plate side or centre
Radiator installed by box, power amplifier box one or both sides, and the power amplifier box is packaged with some power devices, the power device
For thermal source.
10. a kind of heat pipe for thermal conductivity panel assembly according to claim 9, is characterized in that, the groove location on the heat-conducting plate
Near heat source position, the length of groove covers thermal source and radiator.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621035163.4U CN206024397U (en) | 2016-08-31 | 2016-08-31 | A kind of heat pipe for thermal conductivity panel assembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621035163.4U CN206024397U (en) | 2016-08-31 | 2016-08-31 | A kind of heat pipe for thermal conductivity panel assembly |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206024397U true CN206024397U (en) | 2017-03-15 |
Family
ID=58258816
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621035163.4U Expired - Fee Related CN206024397U (en) | 2016-08-31 | 2016-08-31 | A kind of heat pipe for thermal conductivity panel assembly |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206024397U (en) |
-
2016
- 2016-08-31 CN CN201621035163.4U patent/CN206024397U/en not_active Expired - Fee Related
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170315 Termination date: 20190831 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |