CN210745840U - Heat pipe radiator applied to 5G base station - Google Patents
Heat pipe radiator applied to 5G base station Download PDFInfo
- Publication number
- CN210745840U CN210745840U CN201921752062.2U CN201921752062U CN210745840U CN 210745840 U CN210745840 U CN 210745840U CN 201921752062 U CN201921752062 U CN 201921752062U CN 210745840 U CN210745840 U CN 210745840U
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- heat
- pipe
- flat plate
- heat pipe
- base station
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Abstract
A heat pipe radiator applied to a 5G base station belongs to the field of antennas. Comprises a heat conduction flat plate, a heat pipe and a heat radiating fin; one side of the heat conduction flat plate is connected with an MIMO chip, the heat conduction flat plate is provided with a plurality of pipe grooves, the evaporation section in the middle of the heat pipe is positioned in the pipe grooves, the condensation sections at the two ends of the heat pipe are bent towards the other side of the heat conduction flat plate, and the condensation sections are connected with the radiating fins. The utility model discloses a heat that the phase transition of working medium sent the MIMO chip is from copper heat conduction flat board in the high-speed transmission to the air of evaporation zone and condensation zone, effectively reduces the temperature of MIMO chip to improve the slow problem of MIMO antenna heat dissipation.
Description
Technical Field
The utility model relates to an antenna field especially relates to a be applied to heat pipe radiator of 5G basic station.
Background
As a new generation of mobile communication network, 5G can not only greatly change the existing life and working modes of people, improve the communication efficiency, but also increase a plurality of leading-edge technologies and the possibility of falling on the ground of products; the 5G base station needs to use more antennas than the conventional mobile network, i.e. several hundred antenna ports, and there are more antennas on a single antenna array, and one base station can simultaneously transmit and receive signals to more users, thereby increasing the capacity of the mobile network by 22 times or more, which becomes massive MIMO to implement several tens of antennas on one array. However, because the MIMO antenna is connected with a small power amplifier behind each subarray, the power of the small power amplifier is far lower than the efficiency of a large power amplifier, and invalid power is converted into heat energy; taking 38GHz as an example, the power added efficiency of the power amplifier at the 1dB power gain compression point is about 18%, but the power added efficiency is only 2-3% after being inverted to 10dB, which means that only 2-3% of the dc power is converted into the transmission signal power, and the remaining 97-98% of the dc power is converted into heat energy, which increases the difficulty of heat dissipation, is not favorable for environmental protection and antenna miniaturization, so that the heat dissipation of the base station antenna becomes a key problem to be solved urgently by 5G wide application and cost pressure at present.
SUMMERY OF THE UTILITY MODEL
For solving the problem that current radiator can't satisfy 5G basic station antenna heat dissipation demand, the utility model provides a be applied to 5G basic station's heat pipe radiator.
In order to achieve the above object, the utility model adopts the following technical scheme: a heat pipe radiator applied to a 5G base station comprises a heat conduction flat plate, a heat pipe and a radiating fin; one side of the heat conduction flat plate is connected with an MIMO chip, the heat conduction flat plate is provided with a plurality of pipe grooves, the evaporation section in the middle of the heat pipe is positioned in the pipe grooves, the condensation sections at the two ends of the heat pipe are bent towards the other side of the heat conduction flat plate, and the condensation sections are connected with the radiating fins.
Furthermore, the heat conducting flat plate is made of copper, one side of the heat conducting flat plate is provided with a mounting groove, MIMO chips are soldered in the mounting groove, and the MIMO chips are arranged in a 4X8 array.
Furthermore, the heat pipe is made of copper, the working medium in the heat pipe is methanol, the bending angle of the evaporation section and the condensation section is 90-120 degrees, the bending radius is 9-18mm, and the evaporation section and the pipe groove are bonded through heat conducting glue.
Furthermore, the fin is "S" shape, including three horizontal segment, and adjacent horizontal segment links to each other by the bending segment, and the horizontal segment is equipped with the hole that is used for the condensation segment to pass, and the bending segment is equipped with the louvre.
Furthermore, the length of the heat conducting flat plate is 1.2-1.5 times of the length of the chip array, the width of the heat conducting flat plate is 1.2-1.5 times of the width of the chip array, the height of the heat conducting flat plate is 1.2-1.5 times of the diameter of the heat pipe, and the distance length between adjacent pipe grooves is between the radius of the heat pipe and the diameter of the heat pipe.
The utility model has the advantages that: the heat emitted by the MIMO chip is transferred from the copper heat conducting flat plate to the air at a high speed through the evaporation section and the condensation section through the phase change of the working medium in the heat pipe, so that the temperature of the MIMO chip is effectively reduced, and the problem of slow heat dissipation of the MIMO antenna is solved; simultaneously the utility model discloses simple structure, reliable operation, small light in weight, with low costs.
Drawings
Fig. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic view of a part of the structure of the present invention;
FIG. 3 is a schematic structural view of the heat pipe of the present invention;
fig. 4 is a schematic structural view of the heat conducting plate of the present invention;
fig. 5 is a schematic structural diagram of the heat sink of the present invention.
In the figure, 1, a heat conduction flat plate, 2, a heat pipe, 3, an evaporation section, 4, a condensation section, 5, an MIMO chip, 6, a pipe groove, 7, a radiating fin, 8, a horizontal section, 9, a bending section and 10 radiating holes are arranged.
Detailed Description
A heat pipe radiator applied to a 5G base station comprises a heat conduction flat plate 1, a heat pipe 2 and a radiating fin 7; the heat pipe is characterized in that an MIMO chip 5 is connected to one side of the heat conducting flat plate 1, the heat conducting flat plate 1 is provided with a plurality of pipe grooves 6, an evaporation section 3 in the middle of the heat pipe 2 is located in the pipe grooves 6, condensation sections 4 at two ends of the heat pipe 2 are bent towards the other side of the heat conducting flat plate 1, the condensation sections 4 are connected with the radiating fins 7 through a fin penetrating process, a gap between the heat pipe 2 and the radiating fins 7 is sealed through a dip-plating method, and plating metal is mainly zinc and tin through the dip-plating method.
The heat conducting flat plate 1 is made of copper, one side of the heat conducting flat plate is provided with a mounting groove, MIMO chips 5 are soldered in the mounting groove, and the MIMO chips 5 are arranged in a 4X8 array; the size of the heat conducting flat plate 1 is preferably 50mm 26mm 5mm, the length of the heat conducting flat plate is 1.2-1.5 times of the length of the chip array, the width of the heat conducting flat plate is 1.2-1.5 times of the width of the chip array, and the height of the heat conducting flat plate is 1.2-1.5 times of the diameter of the selected heat pipe 2; the pipe grooves 6 are arranged between the radius of the heat pipe and the diameter of the heat pipe at intervals; the MIMO chip 5 is soldered on the copper heat conducting flat plate 1, so that the emitted heat can be rapidly transferred to the surface of the heat pipe 2; in addition, the copper has the advantages of good ductility, easy processing, recoverability, atmospheric corrosion resistance, high cost performance, low price and the like, and can be used under complex working conditions such as outdoor and the like.
The heat pipe 2 is made of copper, a cylindrical heat pipe is adopted, a working medium in the heat pipe 2 is methanol, the diameter of the heat pipe 2 is 3-9mm, the bending angle of the evaporation section 3 and the condensation section 4 is 90-120 degrees, the bending radius is 9-18mm, the bending of the heat pipe 2 has influence on the heat conduction capability, the smaller the bending angle is, the poorer the heat conduction capability is, the minimum bending radius is 3 times of the pipe diameter, the minimum bending angle is 90 degrees, and the evaporation section 3 and the pipe groove 6 are bonded through heat conduction glue; the heat pipe 2 is composed of three parts, the main body is a closed metal pipe (pipe shell), a working medium (working liquid) and a liquid absorption core (pipe core) are arranged in an internal cavity, and air and other impurities in the pipe must be excluded; the heat pipe 2 is characterized in that heat is rapidly conducted by utilizing a phase change process (namely, the phase change process of condensing a working medium in a condensing section 4 after the working medium is evaporated in an evaporating section 3 (namely, the phase change process of evaporating latent heat and condensing latent heat of liquid are utilized), the inside of the heat pipe 2 is pumped into a negative pressure state and is filled with a proper liquid working medium, the working medium needs low boiling point and is easy to volatilize, preferably methanol, a liquid absorption core is arranged on the pipe wall and is made of a capillary porous material, a capillary structure in the micro heat pipe is processed by a plowing (spinning) -drawing composite forming method through a pipe inner wall groove processing process, preferably a multilayer metal wire mesh or fiber, cloth and the like is tightly attached to the inner wall in a lining form to reduce contact thermal resistance, the lining can also be made of porous ceramics or sintered metal, when the evaporating section 3 of the heat pipe is heated, the working, the working medium flows back to the evaporation section 3 along the liquid absorption core by virtue of capillary action, and circulates sequentially until the temperatures of the evaporation section 3 and the condensation section 4 of the heat pipe 2 are equal, at the moment, the steam heat diffusion stops, the circulation is performed rapidly, heat can be conducted continuously by a source, the heat pipe 2 fully utilizes the heat conduction principle and the rapid heat transfer property of the phase change medium, the heat of a heating object is rapidly transferred to the outside of a heat source through the heat pipe 2, the heat conduction capability of the heat pipe exceeds the heat conduction capability of metal by several orders of magnitude, and the heat conduction rate of the heat pipe can reach 20000W/m DEG C; the processing flow of the heat pipe 2 is as follows: cutting tube → shrinking tube → welding head → filling powder → sintering → injecting water → vacuumizing → fixing length → welding tail → shaping → surface treatment → destructive test → performance test → packaging.
The radiating fins 7 are S-shaped and comprise three horizontal sections 8, the adjacent horizontal sections 8 are connected through bent sections 9, the horizontal sections 8 are provided with holes for the condensation sections 4 to pass through, and the bent sections 9 are provided with radiating holes 10.
The other side of the heat conduction flat plate 1 is provided with an embedding groove, the heat pipe 2 is arranged in the pipe groove 6 through the embedding groove, and then the embedding groove is welded.
The above description is only the specific implementation manner of the preferred embodiment of the present invention, but the protection scope of the present invention is not limited thereto, and any person skilled in the art can substitute or change the technical solution of the present invention and the design of the present invention within the technical scope of the present invention.
Claims (5)
1. A heat pipe radiator applied to a 5G base station is characterized by comprising a heat conduction flat plate (1), a heat pipe (2) and a radiating fin (7); the heat conduction flat plate is characterized in that one side of the heat conduction flat plate (1) is connected with an MIMO chip (5), the heat conduction flat plate (1) is provided with a plurality of pipe grooves (6), an evaporation section (3) in the middle of the heat pipe (2) is positioned in the pipe grooves (6), condensation sections (4) at two ends of the heat pipe (2) are bent towards the other side of the heat conduction flat plate (1), and the condensation sections (4) are connected with radiating fins (7).
2. The heat pipe radiator applied to the 5G base station as claimed in claim 1, wherein the heat conducting flat plate (1) is made of copper, one side of the heat conducting flat plate is provided with a mounting groove, MIMO chips (5) are soldered in the mounting groove, and the MIMO chips (5) are arranged in a 4X8 array.
3. The heat pipe radiator applied to the 5G base station is characterized in that the heat pipe (2) is made of copper, the working medium in the heat pipe (2) is methanol, the bending angle of the evaporation section (3) and the condensation section (4) is 90-120 degrees, the bending radius is 9-18mm, and the evaporation section (3) and the pipe groove (6) are bonded through heat conducting glue.
4. The heat pipe radiator applied to the 5G base station is characterized in that the radiating fins (7) are S-shaped and comprise three horizontal sections (8), adjacent horizontal sections (8) are connected by bent sections (9), the horizontal sections (8) are provided with holes for the condensation sections (4) to pass through, and the bent sections (9) are provided with radiating holes (10).
5. The heatpipe radiator applied to a 5G base station as claimed in claim 2, wherein the length of the heat-conducting flat plate (1) is 1.2-1.5 times of the length of the chip array, the width of the heat-conducting flat plate is 1.2-1.5 times of the width of the chip array, the height of the heat-conducting flat plate is 1.2-1.5 times of the diameter of the heatpipe (2), and the distance length between the heat-pipe radius and the heat-pipe diameter of the adjacent pipe groove (6) is between the heat-pipe radius and the heat-pipe diameter.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921752062.2U CN210745840U (en) | 2019-10-18 | 2019-10-18 | Heat pipe radiator applied to 5G base station |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921752062.2U CN210745840U (en) | 2019-10-18 | 2019-10-18 | Heat pipe radiator applied to 5G base station |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210745840U true CN210745840U (en) | 2020-06-12 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921752062.2U Expired - Fee Related CN210745840U (en) | 2019-10-18 | 2019-10-18 | Heat pipe radiator applied to 5G base station |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210745840U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022145205A1 (en) * | 2020-12-28 | 2022-07-07 | 京セラ株式会社 | Antenna device |
-
2019
- 2019-10-18 CN CN201921752062.2U patent/CN210745840U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022145205A1 (en) * | 2020-12-28 | 2022-07-07 | 京セラ株式会社 | Antenna device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200612 Termination date: 20201018 |