CN210745840U - Heat pipe radiator applied to 5G base station - Google Patents

Abstract

A heat pipe radiator applied to a 5G base station belongs to the field of antennas. Comprises a heat conduction flat plate, a heat pipe and a heat radiating fin; one side of the heat conduction flat plate is connected with an MIMO chip, the heat conduction flat plate is provided with a plurality of pipe grooves, the evaporation section in the middle of the heat pipe is positioned in the pipe grooves, the condensation sections at the two ends of the heat pipe are bent towards the other side of the heat conduction flat plate, and the condensation sections are connected with the radiating fins. The utility model discloses a heat that the phase transition of working medium sent the MIMO chip is from copper heat conduction flat board in the high-speed transmission to the air of evaporation zone and condensation zone, effectively reduces the temperature of MIMO chip to improve the slow problem of MIMO antenna heat dissipation.

Description

A heat pipe radiator applied to 5G base stations

technical field

The utility model relates to the field of antennas, in particular to a heat pipe radiator applied to a 5G base station.

Background technique

As a new generation of mobile communication network, 5G will not only greatly change people's existing way of life and work, improve communication efficiency, but also increase the possibility of the implementation of many cutting-edge technologies and products; 5G base stations need to be more efficient than traditional mobile networks. More antennas, i.e. with hundreds of antenna ports, with more antennas on a single antenna array, a base station can simultaneously transmit and receive signals to more users, thereby increasing the capacity of the mobile network by a factor of 22 or more, this The technology becomes Massive MIMO implementing dozens of antennas on an array. However, since the MIMO antenna is connected to a small power amplifier after each sub-array, the power of the small power amplifier is much lower than the efficiency of the large power amplifier, and the invalid power will be converted into heat energy; taking 38GHz as an example, the power of the power amplifier at the compression point of 1dB power gain The added efficiency is about 18%, but after rewinding 10dB, the power added efficiency is only 2-3%, which means that only 2-3% of the DC power is converted into the transmission signal power, and the remaining 97-98% of the DC power is converted into Thermal energy increases the difficulty of heat dissipation, is not conducive to environmental protection, and is not conducive to the miniaturization of antennas. Therefore, the heat dissipation of base station antennas has become a key problem that needs to be solved urgently for the widespread application and cost pressure of 5G.

Utility model content

In order to solve the problem that the existing radiator cannot meet the heat dissipation requirements of the 5G base station antenna, the utility model provides a heat pipe radiator applied to the 5G base station.

In order to achieve the above purpose, the technical scheme adopted by the present invention is: a heat pipe radiator applied to a 5G base station, comprising a heat conduction flat plate, a heat pipe and a heat sink; one side of the heat conduction flat plate is connected with a MIMO chip, and the heat conduction flat plate is provided with multiple The evaporating section in the middle of the heat pipe is located in the tube groove, the condensing section at both ends of the heat pipe is bent to the other side of the heat conducting plate, and the condensing section is connected with the heat sink.

Further, the heat-conducting plate material is copper, and one side of the heat-conducting flat plate is provided with a mounting groove, and a MIMO chip is soldered in the mounting groove, and the MIMO chip is arranged in a 4×8 array.

Further, the material of the heat pipe is copper, the working medium in the heat pipe is methanol, the bending angle of the evaporation section and the condensation section is 90-120 degrees, the bending radius is 9-18 mm, and the evaporation section and the pipe groove are bonded by thermally conductive glue. catch.

Further, the cooling fins are "S" shaped and include three horizontal sections, adjacent horizontal sections are connected by bending sections, the horizontal sections are provided with holes for passing through the condensation sections, and the curved sections are provided with cooling holes.

Further, the length of the heat conducting plate is 1.2-1.5 times the length of the chip array, the width is 1.2-1.5 times the width of the chip array, and the height is 1.2-1.5 times the diameter of the heat pipe, and the distance between the adjacent pipe grooves is between the radius of the heat pipe and the diameter of the heat pipe. between.

The beneficial effect of the utility model is: through the phase change of the working medium in the heat pipe, the heat emitted by the MIMO chip is transferred from the copper heat-conducting plate to the air at a high speed through the evaporation section and the condensation section, thereby effectively reducing the temperature of the MIMO chip, thereby improving the MIMO antenna. The problem of slow heat dissipation; meanwhile, the utility model has the advantages of simple structure, reliable operation, small size, light weight and low cost.

Description of drawings

Fig. 1 is the structural representation of the utility model;

Fig. 2 is the partial structure schematic diagram of the present utility model;

Fig. 3 is the structural representation of the heat pipe of the utility model;

Fig. 4 is the structural representation of the utility model thermally conductive flat plate;

FIG. 5 is a schematic structural diagram of a heat sink of the present invention.

In the figure, 1. Thermal plate, 2. Heat pipe, 3. Evaporation section, 4. Condensation section, 5. MIMO chip, 6. Tube groove, 7. Heat sink, 8. Horizontal section, 9. Bending section, 10. Heat dissipation hole.

Detailed ways

A heat pipe radiator applied to a 5G base station, comprising a heat conduction plate 1, a heat pipe 2 and a heat sink 7; a MIMO chip 5 is connected to one side of the heat conduction plate 1, the heat conduction plate 1 is provided with a plurality of pipe grooves 6, and the middle part of the heat pipe 2 The evaporation section 3 is located in the tube groove 6, the condensation section 4 at both ends of the heat pipe 2 is bent on the other side of the heat conduction plate 1, the condensation section 4 is connected with the heat sink 7 through the fin process, and the heat pipe 2 and the heat sink are connected by the dip plating method. The gap between 7 is sealed, and the metal plated by immersion plating is mainly zinc and tin.

The thermal conductive plate 1 is made of copper, and a mounting slot is provided on one side of the mounting slot. The MIMO chip 5 is soldered in the mounting slot, and the MIMO chips 5 are arranged in a 4×8 array; the size of the thermal conductive plate 1 is preferably 50mm*26mm*5mm, and its length is The length of the chip array is 1.2-1.5 times, the width is 1.2-1.5 times the width of the chip array, and the height is 1.2-1.5 times the diameter of the selected heat pipe 2; the interval of the pipe groove 6 is between the heat pipe radius and the heat pipe diameter; Solder the MIMO chip 5 On the copper heat-conducting plate 1, the dissipated heat can be quickly transferred to the surface of the heat pipe 2; in addition, copper has the advantages of good ductility, easy processing, recyclability, atmospheric corrosion resistance, high cost performance and low price, etc. Use in complex working conditions.

The material of the heat pipe 2 is copper, a cylindrical heat pipe is used, the working medium in the heat pipe 2 is methanol, the diameter of the heat pipe 2 is 3-9mm, the bending angle of the evaporation section 3 and the condensation section 4 is 90-120 degrees, and the bending radius is 9 -18mm, the bending of heat pipe 2 has an impact on the thermal conductivity. The smaller the bending angle, the worse the thermal conductivity. The minimum bending radius is 3 times the pipe diameter, and the minimum bending angle is 90 degrees. The evaporation section 3 and The pipe groove 6 is bonded by thermal conductive glue; the heat pipe 2 is composed of three parts, the main body is a closed metal pipe (tube shell), and the inner cavity has a working medium (working fluid) and a liquid absorbing core (tube core), and the inner cavity of the pipe is composed of three parts. The air and other sundries must be excluded; the heat pipe 2 uses the phase change process of the working medium evaporated in the evaporation section 3 and condensed in the condensation section 4 (that is, using the latent heat of evaporation and condensation latent heat of the liquid) to quickly conduct heat, and the inside of the heat pipe 2 It is pumped into a negative pressure state and filled with an appropriate liquid working medium. The working medium needs to have a low boiling point and is easy to volatilize, preferably methanol. There is a liquid absorbing core on the tube wall, which is composed of capillary porous materials. The internal capillary structure of the micro heat pipe is processed by the ploughing (spinning)-drawing composite molding method. It is composed of sintered metal. When the evaporation section 3 of the heat pipe is heated, the working medium is rapidly vaporized, and the steam flows to the condensation section 4 under the power of thermal diffusion, and condenses in the condensation section 4 to release heat, and the working medium flows along the wick by capillary action. Return to evaporation section 3, and cycle in turn until the temperature of heat pipe 2 evaporation section 3 and condensation section 4 are equal, at which time the thermal diffusion of steam stops, this cycle is carried out rapidly, heat can be continuously conducted, and heat pipe 2 is fully Using the principle of heat conduction and the fast heat transfer properties of the phase change medium, the heat of the heating object is quickly transferred to the outside of the heat source through the heat pipe 2, and its thermal conductivity exceeds that of metal by several orders of magnitude, and its thermal conductivity can reach 20000W/m. ℃; The processing flow of heat pipe 2 is: cutting tube → shrinking tube → welding head → powder filling → sintering → water injection → vacuuming → fixing length → welding tail → forming → surface treatment → destructive test → performance test → packaging.

The heat sink 7 is in the shape of "S" and includes three horizontal sections 8. The adjacent horizontal sections 8 are connected by a bending section 9. The horizontal section 8 is provided with a hole for the condensation section 4 to pass through, and the bending section 9 is provided with a heat dissipation section. hole 10.

The other side of the heat-conducting plate 1 is provided with an inlay groove, and the heat pipe 2 is placed in the pipe groove 6 through the inlaid groove, and then the inlaid groove is welded.

The above are only the preferred specific embodiments of the present invention, but the protection scope of the present invention is not limited to this. Equivalent replacement or modification of the new technical solution and its utility model concept shall be included within the protection scope of the present utility model.

Claims (5)

1. A heat pipe radiator applied to a 5G base station, characterized in that it comprises a heat-conducting flat plate (1), a heat pipe (2) and a heat sink (7); one side of the heat-conducting flat plate (1) is connected with a MIMO chip (5 ), the heat-conducting plate (1) is provided with a plurality of pipe grooves (6), the evaporation section (3) in the middle of the heat pipe (2) is located in the pipe groove (6), and the condensation sections (4) at both ends of the heat pipe (2) are directed to the heat-conducting plate (1) The other side is bent, and the condensation section (4) is connected to the heat sink (7). 2. A heat pipe radiator applied to a 5G base station according to claim 1, characterized in that, the heat-conducting flat plate (1) is made of copper, one side of which is provided with a mounting groove, and MIMO is soldered in the mounting groove The chip (5) and the MIMO chip (5) are arranged in a 4×8 array. 3. A heat pipe radiator applied to a 5G base station according to claim 1, wherein the material of the heat pipe (2) is copper, the working medium in the heat pipe (2) is methanol, and the evaporation section (3) The bending angle of the condensation section (4) is 90-120 degrees, the bending radius is 9-18 mm, and the evaporation section (3) and the pipe groove (6) are bonded by thermally conductive glue. 4. A heat pipe radiator applied to a 5G base station according to claim 1, characterized in that the heat sink (7) is in an "S" shape, comprising three horizontal sections (8), adjacent horizontal The sections (8) are connected by a bent section (9), the horizontal section (8) is provided with a hole for the condensation section (4) to pass through, and the bent section (9) is provided with a heat dissipation hole (10). 5. A heat pipe radiator applied to a 5G base station according to claim 2, characterized in that the length of the heat conducting plate (1) is 1.2-1.5 times the length of the chip array, and the width is 1.2-1.5 times the width of the chip array , the height is 1.2-1.5 times the diameter of the heat pipe (2), and the distance between the adjacent pipe grooves (6) is between the radius of the heat pipe and the diameter of the heat pipe.

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