CN206022427U - LED package substrate, LED encapsulation structure and LED lamp - Google Patents
LED package substrate, LED encapsulation structure and LED lamp Download PDFInfo
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- CN206022427U CN206022427U CN201620997078.XU CN201620997078U CN206022427U CN 206022427 U CN206022427 U CN 206022427U CN 201620997078 U CN201620997078 U CN 201620997078U CN 206022427 U CN206022427 U CN 206022427U
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- join domain
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- 239000000758 substrate Substances 0.000 title claims abstract description 156
- 238000005538 encapsulation Methods 0.000 title claims abstract description 40
- 229910052751 metal Inorganic materials 0.000 claims abstract description 61
- 239000002184 metal Substances 0.000 claims abstract description 61
- 238000009413 insulation Methods 0.000 claims abstract description 26
- 239000010410 layer Substances 0.000 claims description 39
- 230000005540 biological transmission Effects 0.000 claims description 19
- 239000012790 adhesive layer Substances 0.000 claims description 14
- 239000000463 material Substances 0.000 claims description 14
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 claims description 9
- 239000003292 glue Substances 0.000 claims description 9
- 239000011241 protective layer Substances 0.000 claims description 7
- 239000008393 encapsulating agent Substances 0.000 claims description 6
- 239000000843 powder Substances 0.000 claims description 3
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- 238000000605 extraction Methods 0.000 abstract description 4
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- 229910052782 aluminium Inorganic materials 0.000 description 7
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 7
- 230000001070 adhesive effect Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 230000012447 hatching Effects 0.000 description 4
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 3
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 3
- 239000010931 gold Substances 0.000 description 3
- 229910052737 gold Inorganic materials 0.000 description 3
- 229920003192 poly(bis maleimide) Polymers 0.000 description 3
- 238000007639 printing Methods 0.000 description 3
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical compound C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 2
- 230000008901 benefit Effects 0.000 description 2
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48135—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip
- H01L2224/48137—Connecting between different semiconductor or solid-state bodies, i.e. chip-to-chip the bodies being arranged next to each other, e.g. on a common substrate
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
Abstract
The utility model is related to a kind of LED package substrate and LED encapsulation structure and LED lamp using this kind of LED package substrate.The LED package substrate includes metal substrate, wiring board and insulation glue-line.The metal substrate upper surface opens up fluted, the insulation glue-line fits in the wiring board in the groove of the metal substrate, the wiring board includes insulating substrate and the conductive layer being arranged on the insulating substrate, the insulating substrate is located between the insulation glue-line and the conductive layer, and the conductive layer includes the weld pad of bonding wire join domain and the electrical connection bonding wire join domain.The utility model can so lift the light extraction efficiency of LED product, increase product stability, reduces substrate thickness and reduce production cost by opening up groove on metallic substrates and the Rotating fields such as wiring board being contained in groove.
Description
Technical field
The utility model is related to LED applied technical fields, more particularly to a kind of LED package substrate, a kind of LED encapsulation structure
And a kind of LED lamp.
Background technology
With COB (Chip On Board, chip on board are encapsulated) the increasingly mature development of module LED, market is to high sexual valence
Also further more urgent than the demand of COB die set light source.Referring to Fig. 1, which is a kind of structure of existing COB specifications LED package substrate
Schematic diagram.As shown in figure 1, it include mirror-surface aluminum base board 11 and the glue-line 13 being sequentially stacked in mirror-surface aluminum base board 11,
Insulating barrier 15, Copper Foil conductive layer 17 and surface white oil layer 19.
From Fig. 1 it is known that due to each layer be to be layered in mirror-surface aluminum base board 11 so that LED package substrate whole
Body thickness is relatively thick, for example 1.02mm and more than, so as to cause poor heat radiation, and due to occupying mirror-surface aluminum base board 11
More upper surface and cause mirror-surface aluminum base board 11 light reflection surface accumulate less so that using this kind of LED package substrate
LED product has that light extraction efficiency is not good.
Utility model content
Therefore, for overcoming shortcomings and deficiencies of the prior art, the utility model proposes a kind of LED package substrate, a kind of LED
Encapsulating structure and a kind of LED lamp.
Specifically, the utility model embodiment propose a kind of LED package substrate, including metal substrate, wiring board and
Insulation glue-line.The metal substrate upper surface open up fluted, described insulation glue-line the wiring board is fitted in the metal
In the groove of substrate, the wiring board includes insulating substrate and the conductive layer being arranged on the insulating substrate, described exhausted
Edge base material is located between the insulation glue-line and the conductive layer, and the conductive layer includes that bonding wire join domain and electrical connection are described
The weld pad of bonding wire join domain.
In one embodiment of the present utility model, the groove includes two parts being separated from each other, each part bag
Bracket bonding wire join domain holding part and the weldering to be formed that stretches out from the outside of the arc bonding wire join domain holding part
Pad holding part, and described two parts surround a die bond region jointly；The bonding wire join domain is located at the arc bonding wire
Join domain holding part, and the weld pad is located at the weld pad holding part.
In one embodiment of the present utility model, the metal substrate is mirror-surface aluminum base board.
In one embodiment of the present utility model, the LED package substrate also includes insulating protective layer, is arranged on described
On insulating substrate and conductive layer described in local complexity is exposing the bonding wire join domain and the weld pad.
In one embodiment of the present utility model, the groove is not through the metal substrate and the weld pad does not run through
The insulating substrate, the insulation glue-line are located on the side wall of the groove and the surface of bottom.
In one embodiment of the present utility model, the groove is through the metal substrate and the weld pad is through described
Insulating substrate, the insulation glue-line are located in the sidewall surfaces of the groove.
Additionally, the utility model embodiment proposes a kind of LED encapsulation structure, including：Any one LED encapsulation base aforementioned
Plate, LED chip and light transmission package；The LED chip routing is connected to the bonding wire join domain, and the light transmission package sets
Put on the metal substrate of the LED package substrate and cover the LED chip and the bonding wire join domain.
In one embodiment of the present utility model, the LED encapsulation structure also includes annular box dam glue, is arranged on described
On the metal substrate of LED package substrate and define an annular region, the bonding wire join domain is located at the annulus
In domain but the weld pad be located at the annular region outside；The light transmission package is filled in the annular region.
In one embodiment of the present utility model, in the die bond region that the groove is surrounded, it is provided with bottom fluorescent glue
Layer, the LED chip is in the die bond region but the corresponding chip bonded areas of the LED chip are not glimmering by the bottom
Light glue-line is covered, and doped with fluorescent material and the phosphor concentration of the bottom fluorescent adhesive layer is less than in the transparent encapsulant body
The phosphor concentration of the light transmission package.
In addition, the utility model embodiment proposes a kind of LED lamp, including LED encapsulation structure, radiating seat and circuit board,
The LED encapsulation structure includes that LED package substrate, LED chip and light transmission package, the LED package substrate include Metal Substrate
Plate, wiring board and insulation glue-line.The metal substrate upper surface offers the groove through the metal substrate, described exhausted
Edge glue-line fits in the wiring board in the groove of the metal substrate, and the wiring board includes insulating substrate and setting
Conductive layer on the insulating substrate, the insulating substrate are located between the insulation glue-line and the conductive layer, described are led
Electric layer includes the weld pad of bonding wire join domain and the electrical connection bonding wire join domain and the weld pad runs through the insulating substrate；
The LED chip is electrically connected to the bonding wire join domain, and the light transmission package is arranged on the described of the LED package substrate
On metal substrate and cover the LED chip and the bonding wire join domain；The radiating seat is arranged on the metal substrate bottom
The side in face, the circuit board are fixed on the radiating seat and electrically connect in the side of the metal substrate bottom surface and be exposed to institute
State the weld pad of the bottom surface of metal substrate.
In one embodiment of the present utility model, the groove includes two parts being separated from each other, each part bag
Bracket bonding wire join domain holding part and the weldering to be formed that stretches out from the outside of the arc bonding wire join domain holding part
Pad holding part, and described two parts surround a die bond region jointly；The bonding wire join domain is located at the arc bonding wire
Join domain holding part, and the weld pad is located at the weld pad holding part；The LED chip is in the die bond region.
In one embodiment of the present utility model, bottom fluorescent adhesive layer, the LED core in the die bond region, is provided with
Piece is located in the die bond region but the corresponding chip bonded areas of the LED chip are not covered by the bottom fluorescent adhesive layer,
And the transparent encapsulant body in doped with fluorescent material and the bottom fluorescent adhesive layer phosphor concentration less than the printing opacity envelope
The phosphor concentration of dress body.
From the foregoing, it will be observed that the utility model embodiment by surface on metallic substrates open up groove (through or not through gold
Category substrate) and the Rotating fields such as wiring board are fixed in groove, that can so reduce metal substrate upper surface occupies rate,
Light reflection surface size is increased, such that it is able to lift the light extraction efficiency of LED product；Furthermore whole LED encapsulation knot can be caused
The thickness of structure is able to thinning, and heat dispersion more preferably, more will stablize by properties of product.Additionally, the utility model embodiment also has
The advantages of structure simplification, material and process optimization, such that it is able to be greatly reduced production cost.
By the detailed description below with reference to accompanying drawing, other side of the present utility model and feature become obvious.But should
When knowing, the accompanying drawing is only the purpose design that explains, not as the restriction of scope of the present utility model.Should also know
Road, unless otherwise noted, it is not necessary to scale accompanying drawing, they only try hard to structure described herein is conceptually described.
Description of the drawings
Below in conjunction with accompanying drawing, specific embodiment of the present utility model is described in detail.
Fig. 1 is a kind of structural representation of LED package substrate of the prior art.
Fig. 2 is a kind of structural representation of LED package substrate that the utility model embodiment is proposed.
Fig. 3 is the structural representation of the metal substrate in LED package substrate shown in Fig. 2
Fig. 4 is the insulating substrate and the structural representation of conductive layer of wiring board in LED package substrate shown in Fig. 2.
Fig. 5 a are that LED package substrate shown in Fig. 2 implements kenel along a kind of of the cross-section structure of V-V hatchings.
Fig. 5 b are that LED package substrate shown in Fig. 2 implements kenel along the another kind of of the cross-section structure of V-V hatchings.
Fig. 6 is a kind of structural representation of the LED encapsulation structure using LED package substrate shown in Fig. 2.
Fig. 7 is a kind of partial structural diagram of the LED lamp using LED encapsulation structure shown in Fig. 6.
A kind of LED encapsulation knot of LED package substrate shown in employing Fig. 2 that Fig. 8 is proposed for the utility model other embodiments
Status architecture schematic diagram of the structure before die bond.
Specific embodiment
Understandable for enabling above-mentioned purpose of the present utility model, feature and advantage to become apparent from, below in conjunction with the accompanying drawings to this
The specific embodiment of utility model is described in detail.
Fig. 2 to Fig. 4 is referred to, wherein Fig. 2 is that a kind of structure of LED package substrate that the utility model embodiment is proposed is shown
It is intended to, structural representations of the Fig. 3 for the metal substrate in LED package substrate shown in Fig. 2, and Fig. 4 is that LED shown in Fig. 2 is encapsulated
The structural representation of the insulating substrate and conductive layer of wiring board in substrate.
Specifically, the LED package substrate 20 of the present embodiment includes：Metal substrate 21, insulation glue-line 23, insulating substrate 25,
The composition part of conductive layer 27 and insulating protective layer 29, wherein insulating substrate 25 and conductive layer 27 as the wiring board of the present embodiment
Citing.As an example, the metal substrate 21 of the present embodiment is preferably mirror-surface aluminum base board, and its reflectivity is, for example, 99%, insulation
Glue-line 23 is, for example, D/A glue-lines (Die-attach, crystal-bonding adhesive play adhesive action), and insulating substrate 25 is, for example, BT
(Bismaleimide Triazine, Bismaleimide Triazine, its material be by BMI (Bismaleimide,
BMI) it is obtained with cyanate (Cyanate Ester, CE) resins synthesis, is important for PCB (Printed Circuit
Board, printed circuit board (PCB)) a kind of high-performance baseplate material) insulating substrate, conductive layer 27 be, for example, Copper Foil conductive layer, insulation
Protective layer 29 is, for example, white oil layer, but the utility model is not limited thereto.
More specifically, e.g. pass through to be stamped and formed out as shown in figure 3, forming fluted 211 on metal substrate 21, and groove
211 include specular (but the utility model is not limited thereto, namely can be that lacks mirror-symmetry is arranged) and are separated from each other
Two parts, each part includes arc bonding wire join domain holding part 2110 and from arc bonding wire join domain holding part
Stretch out on the outside of 2110 two weld pad (pad) holding parts 2112 to be formed, and the region conduct being located between the two parts
Die bond region, namely two parts surround a generally circular die bond region jointly.Herein it is understood that each portion
The quantity of the weld pad holding part 2112 being divided to is not limited to two, and which can also be one, and simply two is modular design mode.
Furthermore, as shown in figure 4, the shape of the shape of the insulating substrate 25 of wiring board and the groove 211 on metal substrate 21
Match and equally include be separated from each other two parts in order to the metal substrate 21 that can be fixed on shown in Fig. 3
In groove 211.The conductive layer 27 of each part is formed in the upper surface of insulating substrate 25 and including arc bonding wire join domain 271
With weld pad 273, and arc bonding wire join domain 271 and weld pad 273 electrically connect；For more specifically, weld pad 273 is from arc
The outside of bonding wire join domain 271 stretches out the end of the extension to be formed.Additionally, can also in the upper surface of insulating substrate 25
Insulating protective layer 29 (referring to Fig. 2) is set and 29 local complexity conductive layer 27 of the insulating protective layer is exposing arc bonding wire bonding pad
Domain 271 and weld pad 273；Specifically, insulating protective layer 29 is for example formed in the upper surface of insulating substrate 25 and is not provided with conduction
The region of layer 27 and the coupling part of arc bonding wire join domain 271 and weld pad 273.
Hold above-mentioned, in order to will be provided with conductive layer 27 (including arc bonding wire join domain 271 and weld pad 273) and insulation protect
The combining structure of the insulating substrate 25 of sheath 29 (not drawing in Fig. 4, can be found in Fig. 2), namely wiring board is fixed on metal
On substrate 21, insulating cement can be set on the surface of the groove 211 of metal substrate 21 first, then the combining structure is placed on groove
In 211, subsequently toasted after the combining structure can be adhesively fixed with metal substrate 21, and the insulating substrate 25 of assist side
The insulation glue-line 23 shown in Fig. 2 is formed between groove 211.
In addition, referring to Fig. 5 a, which is that LED package substrate shown in Fig. 2 is implemented along one kind of the cross-section structure of V-V hatchings
Kenel.In fig 5 a, the groove 211 of metal substrate 21 does not run through metal substrate 21 and the weld pad 273 of conductive layer 27 does not run through line
The insulating substrate 25 of road plate, and the glue-line 23 that insulate is then on the side wall and lower surface of groove 211.Also, from Fig. 5 a
It can also be seen that：The wiring board being made up of insulating substrate 25 and conductive layer 27 is fitted in the recessed of metal substrate 21 by insulation glue-line 23
In groove 211, and insulating substrate 25 is located between insulation glue-line 23 and conductive layer 27.
Fig. 5 b are referred to, which is another kind of implementation type of the LED package substrate shown in Fig. 2 along the cross-section structure of V-V hatchings
State.In figure 5b, the groove 211 of metal substrate 21 runs through the weld pad 273 of metal substrate 21 and conductive layer 27 through wiring board
Insulating substrate 25, and the glue-line 23 that insulate is then in the sidewall surfaces of groove 211.Also, from Fig. 5 b it is also seen that：Absolutely
Edge glue-line 23 fits in the wiring board being made up of insulating substrate 25 and conductive layer 27 in the groove 211 of metal substrate 21 and insulate
Base material 25 is located between insulation glue-line 23 and conductive layer 27.
Fig. 6 is referred to, which is a kind of structural representation of the LED encapsulation structure using LED package substrate shown in Fig. 2.Such as
Shown in Fig. 6, LED encapsulation structure 60 includes LED package substrate 20, LED chip 62, annular box dam glue 64 and light transmission package
66.LED chip 62 is arranged in the die bond region of the upper surface of the metal substrate 21 (referring to Fig. 2) of LED package substrate 20, its example
Die bond region is bonded and fixed at by crystal-bonding adhesive in this way and connects the arc bonding wire connection of LED package substrate 20 by routing mode
Region 271, furthermore the quantity of LED chip be shown in Figure 6 for multiple, its can be using in parallel, series connection or its combine and formed
Electrical connection.Annular box dam glue 64 is arranged on the upper surface of the metal substrate 21 of LED package substrate 20, and which can effectively prevent steam
Die bond region is entered, the arc bonding wire join domain 271 of LED package substrate 20 is located at the annular region of annular 64 definition of box dam glue
Interior, but weld pad 273 is outside annular region.Light transmission package 66 is filled in the annular region of the annular definition of box dam glue 64 simultaneously
The arc bonding wire join domain 271 of LED chip 62 and LED package substrate 20 is covered, consequently, it is possible to LED chip 62 is welded with arc
Metal connecting line of the metal connecting line between line join domain 271 even between LED chip 62 is light transmission package 66 and covers
And protected.Herein, it is to be understood that light transmission package 66 can be epoxy resin of the inner surface with phosphor powder layer
Layer, or inside are specially which kind of structure here is not limited, as long as can realize doped with the epoxy resin layer of fluorescent material
Wavelength convert and the purpose of printing opacity.
Furthermore, it is worth mentioning at this point that, the LED encapsulation structure shown in Fig. 6 be a kind of COB types LED product, its outgoing being related to
Light can be black light (360-380nm), purple light (380-410nm), blue light (460-480nm), green glow (490-530nm and
565-580nm), gold-tinted (580-600nm), orange-colored light (600-620nm), ruddiness (620-770nm), infrared light (850nm/
880nm/940nm) and serial white light (1700k-25000k reference color temperatures) etc., namely the LED package substrate 20 of the present embodiment
The product scope that can be applied is widely.
In addition, referring to Fig. 7, which is that a kind of partial structurtes of the LED lamp using LED encapsulation structure shown in Fig. 6 are illustrated
Figure.As shown in fig. 7, LED lamp 70 is included such as LED encapsulation structure, radiating seat 71 and circuit board 73；Wherein, LED encapsulation structure example
The groove 211 of LED encapsulation structure 60 and metal substrate 21 as shown in using Fig. 6 is passed through through metal substrate 21 and weld pad 273
Wear insulating substrate 25 (referring to Fig. 5 b)；Radiating seat 71 is arranged on lower section (namely the bottom surface of metal substrate 21 of LED encapsulation structure
210 side) and circuit board 73 be fixed on radiating seat 71, and circuit board 73 be by electrical connection be exposed to LED encapsulation knot
The weld pad 273 of the bottom surface 210 of the metal substrate 21 of structure realizing the electrical connection with LED encapsulation structure, so as to LED encapsulation structure
Power supply is provided.Herein, LED lamp 70 can be bulb lamp, lamp affixed to the ceiling etc., and it is to be appreciated that LED lamp 70 is except upper
State outside structure, also have other accessories and for example house lamp housing of LED encapsulation structure, radiating seat 71 and circuit board 73 etc..
Finally, referring to Fig. 8, which is that one kind that the utility model other embodiments are proposed adopts LED package substrate shown in Fig. 2
Status architecture schematic diagram of the LED encapsulation structure before die bond.As shown in figure 8, the LED encapsulation structure 80 of the present embodiment and figure
It is in place of the main difference of the LED encapsulation structure 60 shown in 6 which is additionally provided with bottom fluorescent adhesive layer 83, and bottom fluorescent adhesive layer
Yellow fluorescent powder or silver powder is for example mixed with 83, but the utility model is not limited thereto.More specifically, in LED package substrate
Printing in the die bond region 81 surrounded by groove 211 on 20 metal substrate 21 forms bottom fluorescent adhesive layer 83, and bottom fluorescence
Each chip bonded areas that glue-line 83 is avoided representing with dotted line frame in die bond region 81 85 (namely chip bonded areas 85 not by
Bottom fluorescent adhesive layer 83 is covered).LED chip is bonded and fixed in each chip bonded areas 85 by extended meeting by crystal-bonding adhesive afterwards
Wherein, made between each LED chip by routing mode again afterwards and LED chip and LED encapsulation structure 20 arc bonding wire
Electrical connection (can be found in Fig. 6) is formed between join domain 271, light transmission package is then re-formed and (is referred to the transparent encapsulant of Fig. 6
Body 66) to cover LED chip, such that it is able to obtain the LED encapsulation structure 80 of the present embodiment.LED encapsulation structure 80 herein can
To arrange annular box dam glue similar to Fig. 6, naturally it is also possible to be not provided with annular box dam glue.
Furthermore, it is worth mentioning at this point that, in the embodiment shown in Fig. 8 is relevant to, it is preferable that the transparent encapsulant for eventually forming
Body is internal dense less than the fluorescent material in light transmission package doped with the phosphor concentration in fluorescent material, and bottom fluorescent adhesive layer 83
Degree.Additionally, the LED encapsulation structure in LED lamp shown in Fig. 7 can also be substituted for the LED encapsulation structure shown in Fig. 8.
In sum, the utility model above-described embodiment by open up on metallic substrates groove (through or not through gold
Category substrate) and the Rotating fields such as wiring board are fixed in groove, can so reduce the rate that occupies of metallic substrate surfaces, light
Reflecting surface size is increased, such that it is able to lift the light extraction efficiency of LED product；Furthermore whole LED encapsulation structure can be caused
Thickness be able to thinning such as whole thickness and be about 0.8mm, heat dispersion more preferably, more will stablize by properties of product.Additionally, this reality
Also there is structure simplification, material and process optimization with new embodiment, such that it is able to production cost is greatly reduced.
Finally, it is worth mentioning at this point that, previous embodiment is only section Example of the present utility model and not all enforcement
Example, those skilled in the art can carry out appropriate conversion or combination to obtain other embodiment with previous embodiment, such as gold
The groove of category substrate can also be an entirety rather than two parts being separated from each other, phase in the case where metal substrate is not run through
Ying Di, insulating substrate are also an entirety rather than two parts being separated from each other etc.；These by appropriate conversion or combine
To other embodiment should be included in protection domain of the present utility model.
The above, is only preferred embodiment of the present utility model, not the utility model is made any formal
Restriction, although the utility model is disclosed above with preferred embodiment, but is not limited to the utility model, any ripe
Professional and technical personnel is known, in the range of without departing from technical solutions of the utility model, when in the technology using the disclosure above
Hold the Equivalent embodiments that makes a little change or be modified to equivalent variations, as long as being without departing from technical solutions of the utility model
Hold, any simple modification, equivalent variations and the modification that above example is made according to technical spirit of the present utility model, still
Belong in the range of technical solutions of the utility model.
Claims (11)
1. a kind of LED package substrate, including metal substrate, wiring board and insulation glue-line；Characterized in that, the Metal Substrate
Plate upper surface open up fluted, described insulation glue-line the wiring board is fitted in the groove of the metal substrate, institute
Stating wiring board includes that insulating substrate and the conductive layer being arranged on the insulating substrate, the insulating substrate are located at the insulating cement
Between layer and the conductive layer, the conductive layer includes the weld pad of bonding wire join domain and the electrical connection bonding wire join domain.
2. LED package substrate as claimed in claim 1, it is characterised in that the groove includes two parts being separated from each other,
Each part includes arc bonding wire join domain holding part and the outer epitaxial lateral overgrowth from the arc bonding wire join domain holding part
The weld pad holding part to be formed is stretched, and described two parts surround a die bond region jointly；The bonding wire join domain is located at institute
Arc bonding wire join domain holding part is stated, and the weld pad is located at the weld pad holding part.
3. LED package substrate as claimed in claim 1, it is characterised in that also include insulating protective layer, be arranged on the insulation
On base material and conductive layer described in local complexity is exposing the bonding wire join domain and the weld pad.
4. LED package substrate as claimed in claim 1, it is characterised in that the groove is through the metal substrate and institute
Weld pad is stated not through the insulating substrate, the insulation glue-line is located on the side wall of the groove and the surface of bottom.
5. LED package substrate as claimed in claim 1, it is characterised in that the groove is through the metal substrate and described
Weld pad runs through the insulating substrate, and the insulation glue-line is located in the sidewall surfaces of the groove.
6. a kind of LED encapsulation structure, including：LED package substrate, LED chip as described in claim 1 to 5 any one and
Light transmission package；The LED chip routing is connected to the bonding wire join domain, and the light transmission package is arranged on the LED
On the metal substrate of base plate for packaging and cover the LED chip and the bonding wire join domain.
7. LED encapsulation structure as claimed in claim 6, it is characterised in that also include annular box dam glue, be arranged on the LED
On the metal substrate of base plate for packaging and define an annular region, the bonding wire join domain is located at the annular region
Interior but described weld pad is located at outside the annular region；The light transmission package is filled in the annular region.
8. LED encapsulation structure as claimed in claim 6, it is characterised in that arrange in the die bond region that the groove is surrounded
Have a bottom fluorescent adhesive layer, the LED chip in the die bond region but the corresponding chip bonded areas of the LED chip not
By the bottom fluorescent adhesive layer cover, and the transparent encapsulant body in doped with fluorescent material and the bottom fluorescent adhesive layer glimmering
Phosphor concentration of the light powder concentration less than the light transmission package.
9. a kind of LED lamp, including LED encapsulation structure, radiating seat and circuit board, the LED encapsulation structure includes LED encapsulation bases
Plate, LED chip and light transmission package, the LED package substrate include metal substrate, wiring board and insulation glue-line；Its feature
It is, the metal substrate upper surface offers the groove through the metal substrate, the insulation glue-line is by the wiring board
Fit in the groove of the metal substrate, the wiring board includes insulating substrate and is arranged on the insulating substrate
Conductive layer, the insulating substrate are located between the insulation glue-line and the conductive layer, and the conductive layer includes bonding wire bonding pad
The weld pad and the weld pad of domain and the electrical connection bonding wire join domain is through the insulating substrate；The LED chip electrical connection
To the bonding wire join domain, the light transmission package is arranged on the metal substrate of the LED package substrate and covers
The LED chip and the bonding wire join domain；The radiating seat is arranged on the side of the metal substrate bottom surface, the circuit
Plate is fixed on the radiating seat and electrically connects in the side of the metal substrate bottom surface and is exposed to described in the metal substrate
The weld pad of bottom surface.
10. LED lamp as claimed in claim 9, it is characterised in that the groove includes two parts being separated from each other, per
Individual part includes arc bonding wire join domain holding part and stretches out from the outside of the arc bonding wire join domain holding part
The weld pad holding part of formation, and described two parts surround a die bond region jointly；The bonding wire join domain is located at described
Arc bonding wire join domain holding part, and the weld pad is located at the weld pad holding part；The LED chip is in the crystal bonding area
In domain.
11. LED lamps as claimed in claim 10, it is characterised in that be provided with bottom fluorescent adhesive layer in the die bond region,
The LED chip is in the die bond region but the corresponding chip bonded areas of the LED chip are not by the bottom fluorescence
Glue-line cover, and the transparent encapsulant body in doped with fluorescent material and the bottom fluorescent adhesive layer phosphor concentration be less than institute
State the phosphor concentration of light transmission package.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620997078.XU CN206022427U (en) | 2016-08-30 | 2016-08-30 | LED package substrate, LED encapsulation structure and LED lamp |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620997078.XU CN206022427U (en) | 2016-08-30 | 2016-08-30 | LED package substrate, LED encapsulation structure and LED lamp |
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| Publication Number | Publication Date |
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| CN206022427U true CN206022427U (en) | 2017-03-15 |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110265536A (en) * | 2019-06-28 | 2019-09-20 | 深圳光台实业有限公司 | A kind of encapsulating structure and packaging technology of paster type light emitting type |
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2016
- 2016-08-30 CN CN201620997078.XU patent/CN206022427U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110265536A (en) * | 2019-06-28 | 2019-09-20 | 深圳光台实业有限公司 | A kind of encapsulating structure and packaging technology of paster type light emitting type |
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Inventor after: Zhang Shaofeng Inventor before: Zhang Shaofeng |
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| CP03 | Change of name, title or address |
Address after: 361101 No. 101, Xiang Xing Road, Xiamen torch high tech Zone (Xiangan) Industrial Zone, Xiamen, Fujian Patentee after: Purui Optoelectronics (Xiamen) Co.,Ltd. Country or region after: China Address before: 361101 No. 101, Xiang Xing Road, Xiamen torch high tech Zone (Xiangan) Industrial Zone, Xiamen, Fujian Patentee before: KAISTAR LIGHTING (XIAMEN) Co.,Ltd. Country or region before: China |