CN205960023U - Compound white light LED - Google Patents
Compound white light LED Download PDFInfo
- Publication number
- CN205960023U CN205960023U CN201620822879.2U CN201620822879U CN205960023U CN 205960023 U CN205960023 U CN 205960023U CN 201620822879 U CN201620822879 U CN 201620822879U CN 205960023 U CN205960023 U CN 205960023U
- Authority
- CN
- China
- Prior art keywords
- quantum dot
- white light
- light
- dot film
- led
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Abstract
The utility model discloses a compound white light LED, including base plate, LED chip and printing opacity casing, LED chip bottom is fixed in the substrate surface, base plate upper portion cover has a printing opacity casing, and it has the phosphor powder colloid to cover on LED chip upper portion, printing opacity casing internal surface adheres to there is the quantum dot film, be air gap between quantum dot film and phosphor powder colloid. Owing to leave air gap between fluorescence arogel and quantum dot casing, this air gap can prevent the absorption effect between quantum dot transmission light and the phosphor powder transmission light, and the quantum dot film is the curved surface appearance with fluorescent powder layer, more does benefit to taking out of light energy to show the luminous efficacy who improves compound white light LED.
Description
Technical field
This utility model belongs to LED encapsulation field, more particularly, to a kind of recombined white light LED.
Background technology
Semiconductor lighting is a kind of novel illumination technology based on efficient white light light emitting diode.Compare traditional lighting light
Source, has the advantages that luminous efficiency is high, power consumption is few, reliability is high and life-span length, is acknowledged as 21 century most with prospects
One of high-tech sector.Meanwhile, the flat panel display based on white light LEDs backlight develops rapidly in recent years, it has also become new
Point of economic increase.Expect the year two thousand twenty China white light LEDs correlation output value to be expected to reach trillion yuan.
Business-like white light LEDs are to excite yellow fluorescent powder using blue-light LED chip at present, transmission blue light with excite gold-tinted
It is mixed to get white light.Yet with lacking red color light component in spectrum, therefore traditional white light LEDs have that color rendering index is low, color
Undersaturated defect.Based on this, Chinese scholars and industrial circle propose to add new light to change material in conventional white light LED
Material --- quantum dot.Quantum dot is a kind of semi-conducting material, and size is between 2~20nm.Because the emission wavelength of quantum dot is permissible
With size regulation and control, and there are wide absorption spectra and narrow emission spectra, therefore simultaneously compound white mixed with fluorescent material and quantum dot
Light LED has outstanding color developing, and color saturation is high.But in existing recombined white light LED encapsulation structure, quantum dot layer
It is mostly planar shaped with the pattern of phosphor powder layer, without particular design, be unfavorable for the taking-up of light energy;And quantum dot with glimmering
Mutual Absorption between light bisque leads to energy loss, leads to recombined white light LED luminous efficiency not high.
Content of the invention
For the disadvantages described above of prior art, this utility model aims to provide a kind of recombined white light improving luminous efficiency
LED.
For reaching above-mentioned purpose, this utility model employs the following technical solutions:
A kind of recombined white light LED, including substrate, LED chip and light-permeable shell, described LED chip bottom is fixed on described
Substrate surface, described substrate top is cased with light-permeable shell, is coated with fluorescent powder colloid on LED chip top, described light-permeable shell
Inner surface is attached with quantum dot film, is the air gap between described quantum dot film and fluorescent powder colloid.
Further, the thickness of described quantum dot film is 0.05~3mm, and described quantum dot film includes quantum dot granule
And polymer matrix.
Further, the emission wavelength of described quantum dot granule is 450~700nm.
Mass fraction in quantum dot film for the described quantum dot granule is 0.1~10%.
Further, described quantum dot granule is core-shell structure particles, the stratum nucleare of described core-shell structure particles is cadmium selenide,
Cadmium sulfoselenide, indium phosphide, indium sulphur or perovskite, the shell of described core-shell structure particles is zinc sulfide, cadmium sulfide or sulfur zinc impregnation
Cadmium;Described polymer matrix is polymethyl methacrylate.
Further, centered on the edge thickness of described quantum dot film thickness 50~100%.
The particle diameter of quantum dot granule is 2~30nm.
Further, the material of described light-permeable shell is silica gel, polymethyl methacrylate, Merlon or glass;Institute
That states light-permeable shell is shaped as hemispherical or segment-shaped.
The light transmittance of light-permeable shell is more than 90%;A diameter of 1~30mm of light-permeable shell inner surface.
Further, the pattern of described fluorescent powder colloid is hemispherical or segment-shaped, and bottom surface radius is 0.7~1.5mm, high
Degree is less than bottom surface radius.
Further, described fluorescent powder colloid includes fluorescent powder grain and silica gel, the emission wavelength of described fluorescent powder grain
For 450~700nm.
The mass fraction of described fluorescent powder grain is 5~30%, and the particle diameter of fluorescent powder grain is 12~20 μm.
Further, described LED chip is vertical electrode chip or horizontal electrode chip, and its substrate is sapphire or silicon.
In general, compared with prior art, this utility model is by being fabricated to fluorescent powder colloid and quantum dot housing
Curved surface, and leave the air gap between fluorescent powder colloid and quantum dot housing, thus having following beneficial effect:
1st, by fluorescent powder colloid and quantum dot housing being fabricated to the structure of curved surface, light energy can be reduced in colloid with outward
The total reflection at interface, thus improve recombined white light LED efficiency of light extraction.
2nd, pass through to leave the air gap between fluorescent powder colloid and quantum dot housing, fluorescent material can be reduced with quantum dot to that
The mutual absorption of this light energy, thus reducing absorption loss water, improves recombined white light LED efficiency of light extraction.
3rd, due to directly preparing curved surface quantum dot film, and the edge-light of quantum dot film inside light-permeable shell
Sliding, thus without cutting quantum dot film, thus save quanta point material, reduce production cost.
4th, operational approach of the present utility model is simple, and low cost can flexibly control the thickness of phosphor gel and quantum dot film
Degree, pattern and composition, thus obtain high-color rendering can recombined white light LED it is adaptable to large-scale production.
Brief description
Fig. 1 is the LED structure schematic diagram of this utility model embodiment 1;
The flow chart that Fig. 2 prepares LED for this utility model;
Fig. 3 is the LED structure schematic diagram of this utility model embodiment 2;
Fig. 4 is the LED structure schematic diagram of this utility model comparative example 1;
Fig. 5 is the spectral distribution graph of sample test;
In all of the figs, identical reference is used for representing identical element or structure, wherein:1001- substrate,
1002-LED chip, 1003- fluorescent powder colloid, 1004- the air gap, 1005- quantum dot film, 1006- light-permeable shell,
1007- spot gluing equipment, 1008- packaging plastic.
Specific embodiment
In order that the purpose of this utility model, technical scheme and advantage become more apparent, below in conjunction with accompanying drawing and enforcement
Example, is further elaborated to this utility model.It should be appreciated that specific embodiment described herein is only in order to explain
This utility model, is not used to limit this utility model.Additionally, institute in each embodiment of this utility model disclosed below
As long as the technical characteristic being related to does not constitute conflict each other just can be mutually combined.
This utility model provides a kind of recombined white light LED, including substrate 1001, LED chip 1002, fluorescent powder colloid
1003, quantum dot film 1005 and light-permeable shell 1006, described substrate 1001 table is fixed in described LED chip 1002 bottom
Face, described substrate 1001 top is cased with light-permeable shell 1006, is coated with fluorescent powder colloid 1003, institute on LED chip 1002 top
State light-permeable shell 1006 inner surface and be attached with quantum dot film 1005, described quantum dot film 1005 and fluorescent powder colloid 1004 it
Between leave the air gap 1004, as shown in Figure 1.
The light transmittance of described light-permeable shell is more than 90%, and material can adopt silica gel, polymethyl methacrylate (PMMA), gather
The hard material of the heat-resisting printing opacity such as carbonic ester (PC) or glass, it is shaped as hemispherical, a diameter of 1~30mm of inner surface.
The thickness of described quantum dot film is 0.05~3mm, the quantum dot granule being 2~30nm by particle diameter and polymer-based
Matter forms, and wherein, the mass fraction of described quantum dot granule is 0.1~10%, and the emission wavelength of described quantum dot granule is
450nm~700nm.Described quantum dot granule is core-shell structure particles, and the stratum nucleare of described core-shell structure particles is cadmium selenide
(CdSe), cadmium sulfoselenide (CdSSe), indium phosphide (InP), indium sulphur (CuInS2) or perovskite (CsPbX3, wherein X=Cl, Br,
I), the shell of described core-shell structure particles is zinc sulfide (ZnS), cadmium sulfide (CdS) or sulfur zinc impregnation cadmium (CdZnS);Described high score
Subbase matter is polymethyl methacrylate.The thickness of quantum dot film is according to the size of prepared recombined white light LED and performance
Depending on, its composition then selects according to prepared white light LEDs.
Colloid in described phosphor gel is silica gel, one or more of epoxy resin and liquid glass, and pattern is half
Spherical or segment-shaped, bottom surface radius is 0.7~1.5mm, is highly less than bottom surface radius, the fluorescent material being 12~20 μm by particle diameter
Granule and silica gel composition, wherein, the mass fraction of described fluorescent powder grain is 5~30%, the luminous ripple of described fluorescent powder grain
A length of 450~700nm.
Described LED chip is vertical electrode chip or horizontal electrode chip, and its substrate is sapphire or silicon.
The preparation method of this recombined white light LED, comprises the following steps, as shown in Figure 2:
S1, spot printing phosphor gel.Described fluorescent powder colloid 1003 is coated in described LED chip at 1007 points by spot gluing equipment
Directly over 1002, cover LED chip 1002, form the pattern of hemispherical or segment-shaped, place in baking oven, 150 DEG C of heating 1 are little
When, so that phosphor gel is solidified;
S2, prepare quantum dot light-permeable shell.Take 2mL methyl methacrylate solution and 0.01g azodiisobutyronitrile powder
After mixing, add quantum dot, ultrasonic vibration 10 minutes, subsequently by mixed solution at 70 DEG C water-bath 10 minutes, then from mix molten
Draw 3~40 μ L in liquid, inject light-permeable shell 1006 inner surface, place into 12 hours in 45 DEG C of heater box and so that solution is solidified;
S3, the encapsulation of recombined white light LED.Light-permeable shell 1006 obtained by S2 is arranged on substrate 1001, completes multiple
Close the encapsulation of white light LEDs.
Embodiment 1
S1, spot printing phosphor gel.The present embodiment adopts particle diameter to be 12 μm, and emission wavelength is the fluorescent powder grain of 555nm, glimmering
The colloid of light arogel adopts A/B part heat cure type silica gel, and solidification temperature is 150 DEG C.Chip used a size of 0.5mm ×
0.5mm×0.1mm.First 0.1g fluorescent powder grain and 0.5g A glue, 0.5g B glue are mixed and stirred for uniformly, placing into vacuum
Evacuation 30 minutes in case;Subsequently the fluorescent powder colloid point of preparation is coated in above described LED, forms radius for 1.5mm half
Spherical morphology;Place in baking oven, 150 DEG C are heated 1 hour, so that fluorescent powder colloid is solidified;
S2, prepare quantum dot housing.The present embodiment adopts the light-permeable shell of a diameter of 30mm, and its material is Merlon
(PC), light transmittance is 95%.Quantum dot compositions are CdSe/ZnS, and emission wavelength is 630nm.Take 2mL methyl methacrylate first
After ester solution is mixed with 0.01g azodiisobutyronitrile powder, add 3mg quantum dot, ultrasonic vibration 10 minutes, subsequently will mix molten
Liquid water-bath 10 minutes at 70 DEG C, then draw 20 μ L from mixed solution, inject opening up light-permeable shell inner surface, then put
Enter 12 hours in 45 DEG C of heater box to make solution to solidify;The thick middle of quantum dot film in the quantum dot housing finally preparing
Degree and edge thickness are each about 0.9mm;
S3, the encapsulation of recombined white light LED.Quantum dot housing obtained by S2 is arranged on substrate, completes recombined white light
The encapsulation of LED.Its preparation process is as shown in Fig. 2 the recombined white light LED obtaining is as shown in Figure 1.
Embodiment 2
Repeat embodiment 1 with described same steps, difference is, fluorescent material adopts mean diameter to be 18 μm, luminous ripple
The fluorescent material of a length of 540nm, quantum dot adopts the CdSSe/ZnS quantum dot that emission wavelength is 630nm;By 0.2g fluorescent powder grain
It is hybridly prepared into fluorescent powder colloid with 0.5g A glue, 0.5g B glue, subsequently the fluorescent powder colloid point of preparation is coated on described LED
Side, forming bottom surface radius is 1.5mm, the segment-shaped pattern highly for 1.2mm;Take 2mL methyl methacrylate solution and 0.01g
After the mixing of azodiisobutyronitrile powder, add 5mg quantum dot to be prepared into mixed solution, take 30 μ L mixed solution injection light-permeable shell
In, the interior thickness finally giving quantum dot film in quantum dot housing is about 1.2mm, and edge thickness is about 0.9mm.Obtain
Recombined white light LED is as shown in Figure 3.
Embodiment 3
Repeat embodiment 1 with described same steps, difference is, using the hemispherical light-permeable shell of a diameter of 20mm,
Its material is polymethyl methacrylate, and light transmittance is 98%.
Fluorescent powder grain adopts mean diameter to be 15 μm, and emission wavelength is the fluorescent powder grain of 580nm, fluorescent powder grain
Mass fraction is 20%.It is 1.0mm that phosphor gel forms bottom surface radius, the segment-shaped pattern highly for 0.8mm.
Quantum dot adopts the CuInS that emission wavelength is 520nm2/ ZnS quantum dot, quantum dot granule is in quantum dot film
Mass fraction be 1%, the interior thickness of quantum dot film is about 3mm, and edge thickness is about 1.5mm.
Embodiment 4
Repeat embodiment 1 with described same steps, difference is, using the hemispherical light-permeable shell of a diameter of 25mm,
Its material is glass, and light transmittance is 90%.
Fluorescent powder grain adopts mean diameter to be 16 μm, and emission wavelength is the fluorescent powder grain of 650nm, fluorescent powder grain
Mass fraction is 30%.It is 1.2mm that phosphor gel forms bottom surface radius, the segment-shaped pattern highly for 1.0mm.
Quantum dot adopts the CsPbBr that emission wavelength is 650nm3/ CdZnS quantum dot, quantum dot granule is in quantum dot film
In mass fraction be 10%, the interior thickness of quantum dot film is about 1.5mm, and edge thickness is about 0.9mm.
Embodiment 5
Repeat embodiment 1 with described same steps, difference is, fluorescent powder grain adopts mean diameter to be 12 μm, sends out
The fluorescent powder grain of a length of 500nm of light wave, the mass fraction of fluorescent powder grain is 10%.Phosphor gel forms bottom surface radius
The hemispherical pattern of 1.2mm.
Quantum dot adopts the InP/CdS quantum dot that emission wavelength is 550nm, matter in quantum dot film for the quantum dot granule
Amount fraction is 5%, and the interior thickness of quantum dot film and edge thickness are each about 1.0mm.
Embodiment 6
Repeat embodiment 1 with described same steps, difference is, phosphor gel forms the hemispherical that radius is 1.2mm
Pattern;The interior thickness of quantum dot film is about 1.2mm, and edge thickness is about 1.0mm.
Comparative example 1
Group as a comparison, fills up encapsulation between the phosphor gel of the recombined white light LED that embodiment 6 obtains and quantum dispensing
Glue (self-curing type silica gel), LED is inverted, and standing makes encapsulation adhesive curing in two hours, and the recombined white light LED obtaining, as Fig. 4 institute
Show, 1001 is substrate, 1002 is LED chip, 1003 is fluorescent powder colloid, 1005 is quantum dot film, 1006 is light-permeable shell,
1008 is packaging plastic.
The optical property of the recombined white light LED of testing example 6 (being designated as sample 1) and comparative example 1 (being designated as sample 2).
Test equipment is integrating sphere (a Hangzhou distant place, ATA-500), and test electric current is 20mA.Test result is as follows:
The test result of 1 liang of group sample of table
Sample sequence number | Colour temperature (K) | Luminous power (mW) | Light efficiency (1m/W) | Ra | R9 |
Sample 1 | 4651 | 14.20 | 84.71 | 94.7 | 75 |
Sample 2 | 4840 | 13.64 | 75.19 | 85.3 | 30 |
As can be seen that sample 1 (encapsulating structure that this utility model is used) is than sample 2 (comparative example from test result
The encapsulating structure being used) higher outgoing luminous power can be obtained, and compare sample 2, its light efficiency improves 12.66%.
Analysis reason, is in the encapsulating structure being used by this utility model, between phosphor gel and quantum dispensing
There is air layer, this air layer can reduce fluorescent material and the mutual absorption to light energy each other for the quantum dot, thus reducing absorption loss water,
Improve recombined white light LED efficiency of light extraction.Can also significantly find out spectral distribution contrast shown in from Fig. 5, the fluorescent material of sample 1
Emission spectrum and quantum dot emission spectral energy are apparently higher than sample 2.Therefore, this results show, this utility model is made
Encapsulating structure truly has the raising beneficial to white light LEDs efficiency of light extraction.
Above-described embodiment only illustrative principle of the present utility model and its effect are new not for limiting this practicality
Type.Any person skilled in the art all can repair to examples detailed above without prejudice under spirit and scope of the present utility model
Decorations or change.Therefore, such as those of ordinary skill in the art without departing from the spirit disclosed in this utility model
With all equivalent modifications being completed under technological thought or change, must be covered by claim of the present utility model.
Claims (6)
1. a kind of recombined white light LED, including substrate, LED chip and light-permeable shell, described base is fixed in described LED chip bottom
Plate surface, described substrate top is cased with light-permeable shell it is characterised in that being coated with fluorescent powder colloid on LED chip top, described
Light-permeable shell inner surface is attached with quantum dot film, is the air gap between described quantum dot film and fluorescent powder colloid.
2. recombined white light LED according to claim 1 it is characterised in that described quantum dot film thickness be 0.05~
3mm, described quantum dot film includes quantum dot granule and polymer matrix.
3. recombined white light LED according to claim 1 is it is characterised in that during the edge thickness of described quantum dot film is
The 50%~100% of heart thickness.
4. recombined white light LED according to claim 1 is it is characterised in that the material of described light-permeable shell is silica gel, poly- first
Base acrylic acid methyl ester., Merlon or glass;Described light-permeable shell be shaped as hemispherical or segment-shaped.
5. recombined white light LED according to claim 1 is it is characterised in that the pattern of described fluorescent powder colloid is hemispherical
Or segment-shaped, bottom surface radius is 0.7~1.5mm, is highly less than bottom surface radius.
6. recombined white light LED according to claim 1 is it is characterised in that described LED chip is vertical electrode chip or water
Flat electrodes chip, its substrate is sapphire or silicon.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201620822879.2U CN205960023U (en) | 2016-07-27 | 2016-07-27 | Compound white light LED |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
CN201620822879.2U CN205960023U (en) | 2016-07-27 | 2016-07-27 | Compound white light LED |
Publications (1)
Publication Number | Publication Date |
---|---|
CN205960023U true CN205960023U (en) | 2017-02-15 |
Family
ID=57973192
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
CN201620822879.2U Active CN205960023U (en) | 2016-07-27 | 2016-07-27 | Compound white light LED |
Country Status (1)
Country | Link |
---|---|
CN (1) | CN205960023U (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106058012A (en) * | 2016-07-27 | 2016-10-26 | 天津市中环量子科技有限公司 | Composite white light LED and preparation method |
KR102480272B1 (en) * | 2022-09-28 | 2022-12-22 | (주)피엘티 | Signs using LEDs |
-
2016
- 2016-07-27 CN CN201620822879.2U patent/CN205960023U/en active Active
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN106058012A (en) * | 2016-07-27 | 2016-10-26 | 天津市中环量子科技有限公司 | Composite white light LED and preparation method |
KR102480272B1 (en) * | 2022-09-28 | 2022-12-22 | (주)피엘티 | Signs using LEDs |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
CN106058012A (en) | Composite white light LED and preparation method | |
CN105449078A (en) | White light LED and preparation method thereof | |
CN105870303B (en) | Full-spectrum LED light source | |
CN205069681U (en) | High temperature resistant anti vulcanization SMD LED device | |
CN101702421A (en) | Manufacturing method of white light LED | |
CN202094175U (en) | Far fluorescent powder LED encapsulating structure | |
CN102623621A (en) | Packaging process for light-emitting diode (LED) with fluorescent glue film and LED packaging | |
CN107973527A (en) | A kind of preparation method of double layer phosphor | |
CN102800794A (en) | Optical wavelength conversion device and application thereof in white light emitting device | |
CN106972092B (en) | A kind of quantum spot white light LED of high-luminous-efficiency and preparation method thereof | |
CN101338865A (en) | Low attenuation high light efficiency LED illuminating apparatus and preparation method | |
CN205960023U (en) | Compound white light LED | |
CN103325926B (en) | LED packaging structure used in on-board chip and fluorescent powder coating method thereof | |
CN105226146A (en) | Liquid quantum dot LED and preparation method thereof | |
CN201282151Y (en) | High power light-emitting diode device | |
CN203631607U (en) | High-reliability LED light source and LED module light source | |
CN202513204U (en) | Packaging structure with white light surface attached with light emitting diode | |
CN101980385A (en) | Method for encapsulating light-emitting diode (LED), LED and LED illumination device | |
CN207097855U (en) | A kind of quantum dot LED encapsulation structure | |
CN207162165U (en) | A kind of new integrated lamp just assembled | |
CN111341897A (en) | LED packaging structure, manufacturing method thereof and LED flash lamp | |
CN205900592U (en) | LED wafer packaging hardware | |
CN111341898A (en) | LED packaging structure, manufacturing method thereof and LED flash lamp | |
CN209344122U (en) | A kind of quantum dot LED packaging | |
CN203589074U (en) | High-reliability flip LED light source and LED module light source |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
C14 | Grant of patent or utility model | ||
GR01 | Patent grant |