CN203589074U - High-reliability flip LED light source and LED module light source - Google Patents
High-reliability flip LED light source and LED module light source Download PDFInfo
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- CN203589074U CN203589074U CN201320623765.1U CN201320623765U CN203589074U CN 203589074 U CN203589074 U CN 203589074U CN 201320623765 U CN201320623765 U CN 201320623765U CN 203589074 U CN203589074 U CN 203589074U
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Abstract
The utility model discloses a high-reliability flip LED light source and an LED module light source. The high-reliability flip LED light source comprises a flip LED chip and a reflection cup, wherein the reflection cup is composed of a first half cup body, a second half cup body and an insulation base, the first half cup body and the second half cup body are arranged oppositely, and the insulation base is located on the bottom of the reflection cup and is arranged at the position where the two half cup bodies are connected; the LED chip is installed on the bottom of the reflection cup, and the P electrode and the N electrode of the LED chip are electrically connected with the two half cup bodies respectively; the first half cup body and the second half cup body are formed integrally by high-radiating metal materials; the outer side of the first half cup body and the outer side of the second half cup body are wrapped with insulating material layers respectively; and an optical transformation substance layer is further arranged in the reflection cup in a pouring mode. Compared with the prior art, the high-reliability flip LED light source and the LED module light source have the advantages of being more excellent in radiating performance, better in reliability, and good in luminous efficiency.
Description
Technical field
The utility model belongs to LED technical field, is specifically related to more high reliability flip LED light source and LED die set light source thereof of a kind of heat dispersion.
Background technology
Along with LED application is increasingly extensive, competition is also white-hot day by day, thereby high performance-price ratio becomes LED product breakthrough sharp weapon.In order to pursue high performance-price ratio, industry adopts small-sized package body conventionally, increases chip drives electric current, has agreed with to a certain extent current development trend.Along with drive current constantly promotes, the heat that LED chip produces is more and more, and how industry is placed on the thermal endurance aspect of lifting bracket plastic material by attentiveness, and plastic cement material has also experienced the differentiation from PPA, PCT, EMC to SMC.Although above-mentioned plastic cement material heat resistance promotes successively, have the common defects of poor thermal conductivity, and above-mentioned plastic cement is not suitable for needing the special procedures such as the flip chip bonding of high-temperature operation environment and eutectic.
At present, LED product basic structure is all that LED chip is fixed on a substrate.
Wherein, LED chip structure comprises three kinds of positive assembling structure, vertical stratification and inverted structures, and flip LED chips is one very common in LED light source, and its P, N electrode are all at the relative another side of LED chip light-emitting area.
Wherein, LED substrate mostly is aluminium base or copper base copper-clad plate, its structure comprise be positioned at bottom metallic substrates, be positioned at the insulating barrier on described metallic substrates and be positioned at the circuit layer on described insulating barrier, the P of the LED chip of inverted structure, the just electrical connection of the circuit layer directly and on substrate of N electrode, circuit layer is as extraction electrode.The metallic substrates of LED substrate is made by the splendid aluminium of pyroconductivity, copper metal material, the insulating barrier of LED substrate is made by high molecular polymer, because the conductive coefficient of macromolecular material is only 0.2～0.5W/mK, cause the pyroconductivity of metal-based circuit board (MCPCB) also only to have 1W/mK～3W/mK, and then make the heat conductivility of existing LED light source not good.
LED light source heat conductivility is not good, will directly affect the reliabilities such as the useful life of LED light source.Therefore, how to obtain the LED light source of the better high reliability of heat conductivility extremely urgent.
Utility model content
For the above deficiency of prior art, the high reliability flip LED light source that provides a kind of heat dispersion better is provided the first object of the present utility model, and the LED die set light source that provides a kind of heat dispersion better is provided the second object of the present utility model.
In order to realize the first utility model object of the present utility model, technical solution adopted in the utility model is as follows:
A kind of high reliability flip LED light source, comprise the LED chip of inverted structure, this LED light source also comprises a reflector, and the insulator foot of the two halves cup connecting portion of described reflector by the first half cups that are oppositely arranged and the second half cups and at the bottom of being positioned at glass forms; Described LED chip is arranged on the bottom of reflector, and the P electrode of this LED chip and N electrode are electrically connected with half cup respectively; Described the first half cups and the second half cups are one-body molded by high heat radiating metal material; Outside at described the first half cups and the second half cups is also coated with insulation material layer; In described reflector, be also perfused with light transformation substance layer.
Further, between described LED chip and reflector sidewall, be filled with high reflection white glue.
Further, be also perfused with layer of silica gel in described reflector, described layer of silica gel is positioned on LED chip, and described smooth transformation substance layer is positioned in described layer of silica gel.
Further, at described reflector opening, be provided with anti-creep glue step, described anti-creep glue step is concordant with the upper surface of layer of silica gel.
Further, the step surface of described anti-creep glue step is rough interfaces.
Further, at described smooth transformation substance layer, be outside equipped with optical lens.
Further, described insulator foot is convex.
Further, described insulator foot and insulation material layer are made by diamond-film-like (DLC) or diamond film or ceramic membrane.
Further, the inwall of described reflector is through precise polished sphere, parabola or hyperboloid.
Further, on the inwall of described reflector, be also electroplate with high reflecting metal material thin-layer.
In order to realize the second object of the present utility model, technical solution adopted in the utility model is as follows:
A kind of LED die set light source, this die set light source consists of the aforesaid high reliability flip LED of multiple any one light source.
Further, each high reliability flip LED light source arranges separately an optical lens or shares an optical lens.
The utility model is broken through Traditional Thinking in order to improve heat dispersion, removed traditional substrate, but directly reflector is divided into two and half cups, two electrodes of packed LED chip are directly electrically connected with two and half cups, the supporting role of original substrate has been played in the bottom of two and half cups, also have the extraction electrode effect of substrate circuit layer simultaneously concurrently, and can also be used for reflecting LED chip bright dipping to improve light extraction efficiency.Moreover, each half cup is one-body molded by high heat radiating metal material, and the heat that absorbs simultaneously and conduct heat that LED chip bottom produces and gather in reflector when luminous, improves radiating effect of the present utility model greatly.
Certainly, in order to prevent short circuit between LED chip two electrodes, the utility model is provided with insulator foot at two halves cup connecting portion.
And in order further to improve reliability of the present utility model, the utility model is also coated with insulation material layer in the outside of described the first half cups and the second half cups.
Therefore, the utility model LED light source and LED die set light source, with respect to prior art, not only heat dispersion is better, better reliability, and also luminous efficiency is also fine.
Accompanying drawing explanation
The picture that the explanation of this accompanying drawing provides is used for auxiliary to further understanding of the present utility model, forms the application's a part, does not form to improper restriction of the present utility model, in the accompanying drawings:
Fig. 1 is the structural representation of the utility model LED light source embodiment 1;
Fig. 2 is the structural representation of the utility model LED light source embodiment 2;
Fig. 3 is the structural representation of the utility model LED light source embodiment 3;
Fig. 4 is the structural representation of the utility model LED light source embodiment 4;
Fig. 5 is the structural representation of the utility model LED light source embodiment 5;
Fig. 6 is a kind of structural representation of the utility model LED light source embodiment 6;
Fig. 7 is the another kind of structural representation of the utility model LED light source embodiment 7.
In figure:
101, LED chip 102, the first half cups
103, the second half cups 104, insulator foot
105, insulation material layer 106, light transformation substance layer
107, high reflection white glue 108, layer of silica gel
109, anti-creep glue step 110, optical lens
Embodiment
In order to understand fully the purpose of this utility model, feature and effect, below with reference to accompanying drawing and specific embodiment, the technique effect of design of the present utility model, concrete structure and generation is described further.
Embodiment 1:
As shown in Figure 1, the present embodiment discloses a kind of high reliability flip LED light source, comprises the LED chip 101 of inverted structure and the reflector of LED chip is installed, and reflector is the region that the first half cups 102 in figure, the second half cups 103 and insulator foot 104 surround.
Wherein, the insulator foot 104 of two halves cup (102, the 103) connecting portion of reflector by the first half cups 102 that are oppositely arranged and the second half cups 103 and at the bottom of being positioned at glass forms, being equivalent to the utility model unites two into one substrate and reflector, and make the first half cups 102 and the second half cups 103 one-body molded by high heat radiating metal material, improve heat dispersion.So reflector of the present utility model is fixed and supports LED chip and launch LED to go out light action except original, be exactly mainly for heat radiation, because the first half cups 102 and the second half cups 103 are all the moulding of high heat radiating metal material monolithic, its heat dispersion will obviously be promoted.Wherein, high heat radiating metal material is the good metal materials of heat conductivility such as aluminium (Al), copper (Cu), brill copper, gold (Au) or nickel (Ni).Insulator foot 104 of the present utility model is exactly in order to prevent short circuit between LED chip two electrodes.
Wherein, LED chip 101 is arranged on the bottom of reflector, and the P electrode of this LED chip and N electrode are electrically connected with half cup (102,103) respectively, play outside original substrate supporting role, also, as electrode use, therefore simplified structure of the present utility model.
Wherein, in the first half cups 102 of preparation of metals and the second half exposed air of cup 103, easily react generation verdigris with water in air vapour, and exposed airborne metallic reflection cup easily leaks electricity, in order to improve reliability of the present utility model, outside at described the first half cups 102 and the second half cups 103 is also coated with insulation material layer 105
The insulator foot 104 of the present embodiment and insulation material layer 105 are made by diamond-film-like (DLC) or diamond film or ceramic membrane, the good insulating material of thermal conductivity such as diamond-film-like (DLC), diamond film and ceramic membrane, can significantly improve product heat dispersion, especially the introducing of diamond-film-like (DLC), diamond film.Diamond-film-like (DLC) has splendid thermal conductivity (600-1200W/mk), has the remarkable advantages such as 12 times of heat diffusivities to copper material, the high strength of materials, invading property of high resistance.
More firm for the first half cups 102, the second half cups 103 are connected with insulator foot 104, described insulator foot 104 is convex.
In order further to improve the light extraction efficiency of the utility model LED, the inwall of reflector is through precise polished sphere, parabola or hyperboloid, through polishing, makes its interface smooth, and the light that is conducive to LED reflection penetrates reflector through reflector inner counter.
In order further to improve the light extraction efficiency of the utility model LED, on the inwall of described reflector, be also electroplate with high reflecting metal material thin-layer.
For the light that LED chip is sent converts other colors to, in described reflector, be also perfused with light transformation substance layer 106, light transformation substance layer 106 is organic dyestuff, rare earth organic complex, rare earth phosphor, or semiconductor-quantum-point, organic dyestuff specifically can be selected fragrant alkane dyestuff, azo dyes etc., rare earth organic complex specifically can be selected europium doping dibenzoyl methane (DBM:Eu2+), terbium doped P-hydroxybenzoic acid (PHBA:Tb3+) etc., rare earth phosphor specifically can be selected yttrium-aluminium-garnet (YAG), aluminic acid lutetium (LuAG) etc., semiconductor-quantum-point specifically can be selected cadmium sulfide (CdS), indium phosphide (InP) etc.Light transformation substance layer 107, is photochromicly converted into want photochromic for what LED chip 101 was sent, as blue light is converted into white light etc.
Embodiment 2:
As shown in Figure 2, the present embodiment is from the different of embodiment 1: between described LED chip 101 and reflector sidewall, be filled with high reflection white glue 107.
The silica gel base material matter that this white glue 107 is high patience, in the light transmitting meeting chip that this reflection white glue 107 sends LED chip sidewall, thereby promotes LED chip luminous flux.
Embodiment 3:
As shown in Figure 3, the present embodiment is from the different of embodiment 2: in described reflector, be also perfused with layer of silica gel 108, described layer of silica gel 108 is positioned on LED chip 101, and described smooth transformation substance layer 106 is positioned in described layer of silica gel 108.
These layer of silica gel 108 refractive indexes are between 1.4～1.55, and layer of silica gel 108 upper surfaces have light transformation substance layer 106, and this light transformation substance layer 106 is layered arrangement, and concrete is flourescent sheet structure.This embodiment adopts remote fluorescence chip technology, owing to being filled with layer of silica gel 108 between LED chip 101 and light transformation substance layer 106, makes light transformation substance layer 106 away from LED thermal source, and product reliability is good.
Further, in the present embodiment, at described reflector opening, be provided with anti-creep glue step 109, described anti-creep glue step 109 is concordant with the upper surface of layer of silica gel 108, so that processing light transformation substance layer 106.
More excellent, the step surface of described anti-creep glue step 109 is rough interfaces, increases the adhesion between light transformation substance layer 106 and reflector.
Embodiment 4:
As shown in Figure 4, this example is different from embodiment 3 is: the present embodiment is outside equipped with optical lens 110 at light transformation substance layer 106.
This optical lens 110 be shaped as the one in hemisphere, square, oval, Fresnel shape, honeycombed, peanut shape, taper shape, regular hexagon, dried persimmon shape.Different shapes can realize the different light type requirement of this encapsulating structure, and its material is one or several in Merlon (PC), polymethyl methacrylate (PMMA), silica gel (Silicone), polypropylene (EP), polyphenyl dioctyl phthalate glycol ester (PET) and glass.It realizes technique, can be traditional mold injection molding or mould and determines moulding.
Embodiment 5:
As shown in Figure 5, the present embodiment discloses a kind of LED die set light source, and this die set light source consists of Multi-instance to the high reliability flip LED light source described in 1-3 any one.
Embodiment 6:
The present embodiment discloses a kind of LED die set light source, and the present embodiment has increased optical lens on the basis of embodiment 5, and each high reliability flip LED light source arranges separately an optical lens or shares an optical lens 110.
Wherein, be illustrated in figure 7 each high reliability LED light source and arrange separately the situation of an optical lens 110.
Wherein, be illustrated in figure 6 the situation of the shared optical lens 110 of each high reliability LED light source.
This optical lens 100 be shaped as the one in hemisphere, square, oval, Fresnel shape, honeycombed, peanut shape, taper shape, regular hexagon, dried persimmon shape.Different shapes can realize the different light type requirement of this encapsulating structure, and its material is one or several in Merlon (PC), polymethyl methacrylate (PMMA), silica gel (Silicone), polypropylene (EP), polyphenyl dioctyl phthalate glycol ester (PET) and glass.It realizes technique, can be traditional mold injection molding or mould and determines moulding.
More than describe preferred embodiment of the present utility model in detail, should be appreciated that those of ordinary skill in the art just can make many modifications and variations according to design of the present utility model without creative work.Therefore, all technical staff in the art according to the utility model design on prior art basis by logic analysis, reasoning or according to the available technical scheme of limited experiment, all should be among by the determined protection range of these claims.
Claims (12)
1. a high reliability flip LED light source, comprises and it is characterized in that the LED chip of inverted structure:
This LED light source also comprises a reflector, and the insulator foot of the two halves cup connecting portion of described reflector by the first half cups that are oppositely arranged and the second half cups and at the bottom of being positioned at glass forms;
Described LED chip is arranged on the bottom of reflector, and the P electrode of this LED chip and N electrode are electrically connected with half cup respectively;
Described the first half cups and the second half cups are one-body molded by high heat radiating metal material;
Outside at described the first half cups and the second half cups is also coated with insulation material layer;
In described reflector, be also perfused with light transformation substance layer.
2. high reliability flip LED light source according to claim 1, is characterized in that:
Between described LED chip and reflector sidewall, be filled with high reflection white glue.
3. high reliability flip LED light source according to claim 2, is characterized in that:
In described reflector, be also perfused with layer of silica gel, described layer of silica gel is positioned on LED chip, and described smooth transformation substance layer is positioned in described layer of silica gel.
4. high reliability flip LED light source according to claim 3, is characterized in that:
At described reflector opening, be provided with anti-creep glue step, described anti-creep glue step is concordant with the upper surface of layer of silica gel.
5. high reliability flip LED light source according to claim 4, is characterized in that:
The step surface of described anti-creep glue step is rough interfaces.
6. high reliability flip LED light source according to claim 3, is characterized in that:
At described smooth transformation substance layer, be outside equipped with optical lens.
7. according to the high reliability flip LED light source described in claim 1-6 any one, it is characterized in that:
Described insulator foot is convex.
8. according to the high reliability flip LED light source described in claim 1-6 any one, it is characterized in that:
Described insulator foot and insulation material layer are made by diamond-film-like (DLC) or diamond film or ceramic membrane.
9. according to the high reliability flip LED light source described in claim 1-6 any one, it is characterized in that:
The inwall of described reflector is through precise polished sphere, parabola or hyperboloid.
10. according to the high reliability flip LED light source described in claim 1-6 any one, it is characterized in that:
On the inwall of described reflector, be also electroplate with high reflecting metal material thin-layer.
11. 1 kinds of LED die set light sources, is characterized in that: this die set light source consists of the high reliability flip LED light source described in multiple claim 1-10 any one.
12. LED die set light sources according to claim 11, is characterized in that:
Each high reliability flip LED light source arranges separately an optical lens or shares an optical lens.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320623765.1U CN203589074U (en) | 2013-10-10 | 2013-10-10 | High-reliability flip LED light source and LED module light source |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320623765.1U CN203589074U (en) | 2013-10-10 | 2013-10-10 | High-reliability flip LED light source and LED module light source |
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| Publication Number | Publication Date |
|---|---|
| CN203589074U true CN203589074U (en) | 2014-05-07 |
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|---|---|---|---|
| CN201320623765.1U Expired - Lifetime CN203589074U (en) | 2013-10-10 | 2013-10-10 | High-reliability flip LED light source and LED module light source |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103489993A (en) * | 2013-10-10 | 2014-01-01 | 晶科电子（广州）有限公司 | High-reliability flip LED light source and LED module light source |
| CN105720165A (en) * | 2014-12-05 | 2016-06-29 | 晶能光电（江西）有限公司 | White-light LED chip manufacturing method |
-
2013
- 2013-10-10 CN CN201320623765.1U patent/CN203589074U/en not_active Expired - Lifetime
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103489993A (en) * | 2013-10-10 | 2014-01-01 | 晶科电子（广州）有限公司 | High-reliability flip LED light source and LED module light source |
| CN105720165A (en) * | 2014-12-05 | 2016-06-29 | 晶能光电（江西）有限公司 | White-light LED chip manufacturing method |
| CN105720165B (en) * | 2014-12-05 | 2019-08-06 | 晶能光电（江西）有限公司 | A kind of production method of White-light LED chip |
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Address after: 511458 Nansha District, Guangzhou, South Ring Road, No. 33, No. Patentee after: APT ELECTRONICS Co.,Ltd. Address before: 511458 Nansha District, Guangzhou, South Ring Road, No. 33, No. Patentee before: APT ELECTRONICS Ltd. |
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Granted publication date: 20140507 |
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