CN205920990U - There is not bowl cup LED - Google Patents
There is not bowl cup LED Download PDFInfo
- Publication number
- CN205920990U CN205920990U CN201620976954.0U CN201620976954U CN205920990U CN 205920990 U CN205920990 U CN 205920990U CN 201620976954 U CN201620976954 U CN 201620976954U CN 205920990 U CN205920990 U CN 205920990U
- Authority
- CN
- China
- Prior art keywords
- epoxy resin
- led chip
- led
- table shape
- prismatic table
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Abstract
The utility model discloses a there is not bowl cup LED, be planar substrate including the upper surface to and install the luminous LED chip of side on the substrate, there is an epoxy of the luminous LED chip of encapsulation side at the substrate upper surface, the terrace with edge shape of epoxy for invering, the luminous LED chip of side is located the middle part of the terrace with edge shape epoxy bottom surface of inversion, the terrace with edge shape epoxy's that inverts side and the contained angle between the bottom surface be 55 to 65, and when lighting the luminous LED chip of side, lightmap takes place the total reflection to the terrace with edge shape epoxy's that inverts side, from appear epoxy's top surface outgoing of the terrace with edge of invering, the utility model discloses can collect the ambient light, improve light coupling efficiency, improve the middle dark space of LED facula simultaneously.
Description
Technical field
This utility model is related to led, especially one kind no bowl led.
Background technology
Existing paster led is divided into two classes: a class is the top led with bowl, and a class is the chip led of no bowl.
Top led is the injection light-proof material such as ppa on the good metal basal board of punching press, forms physics bowl, realize collecting ambient light and
Optimize hot spot.But increased material cost and processing cost, and smaller size of paster led cannot be produced.Chip led is led
On the planar insulative base material such as the pcb with line pad, aluminium base or ceramic wafer, bonding then carries out injection cutting to chip die bond
Complete to encapsulate.
Existing chip led is to shelve on planar substrate because of chip, does not have the structures such as physical reflection cup, and light reaches
Directly project during side, cause to collect the light that chip sends from side；In the middle of led chip upper surface, lighttight electrode is easy
Cause dark space in the middle of hot spot, and light extraction efficiency is relatively low.
Utility model content
The technical problems to be solved in the utility model is to provide one kind no bowl led, and it can collect ambient light, improves optocoupler
Close efficiency, improve dark space in the middle of led hot spot simultaneously.
For reaching above-mentioned purpose, the technical solution of the utility model is: provides one kind no bowl led, including upper surface is
The base material of plane, and be arranged on side above base material and light led chip, has package-side to light led chip in substrate upper surface
Epoxy resin, epoxy resin is inverted prismatic table shape, and the side led chip that lights is located at inverted prismatic table shape epoxy resin bottom surface
Middle part；Angle between the side of described inverted prismatic table shape epoxy resin and bottom surface is 55 ° to 65 °, lights the luminous led core in side
During piece, the side that light is irradiated to inverted prismatic table shape epoxy resin is totally reflected, and light is from inverted prismatic table shape asphalt mixtures modified by epoxy resin
The top surface outgoing of fat.
Improve further, the cross section of described inverted prismatic table shape epoxy resin is square, so that side is lighted led chip position
In the middle part of epoxy resin bottom surface, reach distance and the angle symmetrical of side, light can more uniformly project.
Angle between the side of preferably described inverted prismatic table shape epoxy resin and bottom surface is 60 °, can preferably collect
Ambient light, improves coupling efficiency.
Improve further, the refractive index of described epoxy resin is n, n ＞ 1.5, when lighting the luminous led chip in side, light shines
The side being mapped to inverted prismatic table shape epoxy resin is totally reflected.
This utility model is inverted prismatic table shape due to epoxy resin, and side lights led chip positioned at epoxy resin bottom surface
Middle part, light can more uniformly project；Angle between the side of inverted prismatic table shape epoxy resin and bottom surface be 55 ° extremely
65 °, when lighting the luminous led chip in side, ambient light can be collected, the side that light is irradiated to inverted prismatic table shape epoxy resin occurs
Total reflection, from the top surface outgoing of inverted prismatic table shape epoxy resin it is achieved that the collection of ambient light, improves coupling efficiency, with
Dark space in the middle of Shi Gaishan led hot spot.
Brief description
Fig. 1 is this utility model axonometric chart；
Fig. 2 is this utility model top view；
Fig. 3 is the a-a sectional view of Fig. 2；
Fig. 4 is the b-b sectional view of Fig. 2；
Fig. 5 is this utility model light path schematic diagram.
Specific embodiment
With specific embodiment, this utility model is described in further detail below in conjunction with the accompanying drawings.
Shown in Fig. 1 to Fig. 5, one kind no bowl led, it is the base material 1 of plane including upper surface, and be arranged on base material 1
The luminous led chip 2 in the side in face, has the epoxy resin 3 of the luminous led chip 2 of package-side in base material 1 upper surface, and epoxy resin 3 is to fall
The prismatic table shape put or truncated cone-shaped, the cross section of epoxy resin 3 is square or circular, makes side light led chip 2 positioned at asphalt mixtures modified by epoxy resin
The middle part of fat 3 bottom surface, reaches distance and the angle symmetrical of side, and light can more uniformly project；Inverted terrace with edge shape ring
Angle α between the side of oxygen tree fat 3 and bottom surface is 55 ° to 65 °, preferably 60 °, can preferably collect ambient light, improves light
Coupling efficiency, improves dark space in the middle of led hot spot simultaneously.
According to formula refractive index n=1/sinc, c is critical angle, when light is mapped to optically thinner medium by optically denser medium, refraction angle
Will be greater than angle of incidence, when the angle of incidence is larger than a critical angle, there would not be refraction effect, and produce total reflection, it follows that working as
When the refractive index of epoxy resin 3 is n ＞ 1.5, when lighting the luminous led chip 2 in side, light is irradiated to inverted prismatic table shape asphalt mixtures modified by epoxy resin
The side of fat 3 is totally reflected, and light is from the top surface outgoing of inverted prismatic table shape epoxy resin 3.
The above is only one preferred embodiment of this utility model, those skilled in the art presses what claim work was equal to
Change the protection domain both falling within this case.
Claims (4)
1. one kind no bowl led, is the base material of plane including upper surface, and is arranged on the luminous led chip in side above base material,
Substrate upper surface have package-side light led chip epoxy resin it is characterised in that: described epoxy resin be inverted terrace with edge
Shape, the luminous led chip in described side is located at the middle part of inverted prismatic table shape epoxy resin bottom surface；Described inverted prismatic table shape asphalt mixtures modified by epoxy resin
Angle between the side of fat and bottom surface is 55 ° to 65 °, and when lighting the luminous led chip in side, light is irradiated to inverted prismatic table shape
The side of epoxy resin is totally reflected, and light is from the top surface outgoing of inverted prismatic table shape epoxy resin.
2. one kind according to claim 1 no bowl led it is characterised in that: described inverted prismatic table shape epoxy resin
Cross section is square.
3. one kind according to claim 1 no bowl led it is characterised in that: described inverted prismatic table shape epoxy resin
Angle between side and bottom surface is 60 °.
4. no bowl led of the one kind according to any one of claims 1 to 3 it is characterised in that: the refraction of described epoxy resin
Rate is n, n ＞ 1.5.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620976954.0U CN205920990U (en) | 2016-08-29 | 2016-08-29 | There is not bowl cup LED |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620976954.0U CN205920990U (en) | 2016-08-29 | 2016-08-29 | There is not bowl cup LED |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205920990U true CN205920990U (en) | 2017-02-01 |
Family
ID=57869801
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620976954.0U Active CN205920990U (en) | 2016-08-29 | 2016-08-29 | There is not bowl cup LED |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205920990U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107799642A (en) * | 2017-10-23 | 2018-03-13 | 吴香辉 | LED is encapsulated |
| CN109980075A (en) * | 2017-12-28 | 2019-07-05 | 宏碁股份有限公司 | Light emitting device is miniaturized |
| CN110969957A (en) * | 2018-09-28 | 2020-04-07 | 深圳光峰科技股份有限公司 | LED display screen |
| US10665764B2 (en) | 2017-12-19 | 2020-05-26 | Acer Incorporated | Micro lighting device |
-
2016
- 2016-08-29 CN CN201620976954.0U patent/CN205920990U/en active Active
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107799642A (en) * | 2017-10-23 | 2018-03-13 | 吴香辉 | LED is encapsulated |
| US10665764B2 (en) | 2017-12-19 | 2020-05-26 | Acer Incorporated | Micro lighting device |
| CN109980075A (en) * | 2017-12-28 | 2019-07-05 | 宏碁股份有限公司 | Light emitting device is miniaturized |
| CN110969957A (en) * | 2018-09-28 | 2020-04-07 | 深圳光峰科技股份有限公司 | LED display screen |
| CN110969957B (en) * | 2018-09-28 | 2022-02-18 | 深圳光峰科技股份有限公司 | LED display screen |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN205920990U (en) | There is not bowl cup LED | |
| CN202275832U (en) | Optical module packaging structure | |
| CN104952739A (en) | Optical module with light-gathering structure and packaging method thereof | |
| JP2015026804A (en) | Optical module and method for manufacturing the same | |
| CN203038966U (en) | LED preventing fluorescent glue from diffusing | |
| CN203967120U (en) | A kind of LED support and LED device thereof with good humidity resistance | |
| CN202487656U (en) | All-dimensional lighting LED packaging structure | |
| JP2015026799A (en) | Optical module and manufacturing method of the same | |
| CN204328613U (en) | A kind of down straight aphototropism mode set lamp bar | |
| CN104282830B (en) | Light emitting diode module | |
| CN201681927U (en) | High-power LED chip integrated encapsulating structure | |
| CN204271124U (en) | The high heat radiation minute surface composite aluminum substrate of a kind of great power LED | |
| CN203733835U (en) | LED filament and light-emitting device | |
| CN203979910U (en) | COB-LED light source and light fixture | |
| CN207637757U (en) | A kind of cutting blade and lath cutter for cutting substrate | |
| CN208538908U (en) | A kind of luminescent device highlighting high reflection for LED | |
| CN203644773U (en) | A novel COB light source | |
| CN203659929U (en) | Glue-surface-coarsened LED lamp | |
| CN205640660U (en) | Bridge detects and presss from both sides with multi -functional record | |
| CN202503030U (en) | LED packaging structure | |
| CN203553211U (en) | Light-emitting diode support | |
| CN105303178B (en) | Light conducting plate structure for fingerprint collecting light source | |
| CN203036420U (en) | Energy-saving type light-emitting diode (LED) backlight module | |
| CN204879540U (en) | Take LED paster lamp pearl of lens | |
| CN201540903U (en) | Light emitting diode |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| C56 | Change in the name or address of the patentee | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 361000 Fujian Province, Xiamen torch hi tech Industrial Development Zone Hualian electronic building Patentee after: Xiamen Hualian electronic Limited by Share Ltd Address before: 361000 Fujian Province, Xiamen torch hi tech Industrial Development Zone Hualian electronic building Patentee before: Xiamen Hualian Electronics Co., Ltd. |