CN104282830B - Light emitting diode module - Google Patents
Light emitting diode module Download PDFInfo
- Publication number
- CN104282830B CN104282830B CN201310292390.XA CN201310292390A CN104282830B CN 104282830 B CN104282830 B CN 104282830B CN 201310292390 A CN201310292390 A CN 201310292390A CN 104282830 B CN104282830 B CN 104282830B
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- China
- Prior art keywords
- emitting diode
- light emitting
- piece
- extinction
- light
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Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L33/00—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
- H01L33/48—Semiconductor devices with at least one potential-jump barrier or surface barrier specially adapted for light emission; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof characterised by the semiconductor body packages
- H01L33/58—Optical field-shaping elements
Abstract
A kind of light emitting diode module, the lens of the package structure for LED are set including light emitting diode construction and cover, further comprise the extinction piece below the package structure for LED, the extinction piece is used for the light for absorbing the part forward direction that package structure for LED is sent, so as to weaken the light intensity from the outgoing of lens center region.Compared with prior art, light emitting diode module provided by the invention sets an extinction piece below package structure for LED, the extinction piece is absorbed from reflection from lens to the light of extinction piece, to avoid some light from being reflected to the middle section of lens, reduce the light intensity from the outgoing of lens center region, and then cause through lens peripheral edge margin outgoing light intensity level off to through lens center region be emitted light intensity, the emergent ray of the light emitting diode module is evenly distributed.
Description
Technical field
The present invention relates to a kind of illuminating module, more particularly to a kind of lensed light emitting diode module of tool.
Background technology
Light emitting diode (Light Emitting Diode, light emitting diode) is that one kind can convert the current to certain wave
The semiconductor element of the light of long scope.By its luminous efficiency height, small volume, it is in light weight, environmentally friendly the advantages that, by widely should
Use among current every field.
The rising angle of existing package structure for LED is generally 90 degree to 120 degree, the light in its beam angle center
Intensity is stronger, and the light intensity of surrounding is weaker, and then influences the LED die using this kind of package structure for LED
The overall light-out effect of group.Therefore need to further it improve.
The content of the invention
In view of this, it is necessary to which the light emitting diode module that a kind of emergent ray is evenly distributed is provided.
A kind of light emitting diode module, including light emitting diode construction and cover set the saturating of the package structure for LED
Mirror, further comprises the extinction piece below the package structure for LED, and the extinction piece is used to absorb luminous two
The light for the part forward direction that pole pipe encapsulating structure is sent, so as to weaken the light intensity from the outgoing of lens center region.
A kind of light emitting diode module, including substrate, the package structure for LED and lens that are arranged on substrate, institute
To state lens cap and set the package structure for LED, the package structure for LED is connected with electrical property of substrate, in addition to
The extinction piece being arranged on substrate, the extinction piece is located between the package structure for LED and substrate, for inhaling
The some light that sends of transmitting-receiving optical diode is to avoid some light from being emitted from lens center region.
Compared with prior art, light emitting diode module provided by the invention is set below package structure for LED
One extinction piece, the extinction piece is absorbed from reflection from lens to the light of extinction piece, to avoid some light from being reflected to lens
Middle section, reduce from lens center region outgoing light intensity, and then cause through lens peripheral edge margin be emitted light
Intensity level off to through lens center region be emitted light intensity, the emergent ray of the light emitting diode module is evenly distributed.
Brief description of the drawings
Fig. 1 is the top view for the light emitting diode module that an embodiment of the present invention provides.
Fig. 2 is diagrammatic cross-section of the light emitting diode module along II-II directions in Fig. 1.
Main element symbol description
| Light emitting diode module | 100 |
| Substrate | 10 |
| Reflecting piece | 20 |
| Extinction piece | 30 |
| Package structure for LED | 40 |
| Lens | 50 |
| Upper surface | 11 |
| Lower surface | 12 |
| Conducting wire | 13 |
| Accepting hole | 21 |
| Fixing hole | 22 |
| Exiting surface | 41 |
| Optical section | 51 |
| Fixed part | 52 |
| Bottom surface | 511 |
| Top surface | 513 |
| Optical surface | 55 |
| Boss | 521 |
| Trip | 522 |
Following embodiment will combine above-mentioned accompanying drawing and further illustrate the present invention.
Embodiment
Fig. 1 and Fig. 2 are referred to, for a preferred embodiment of light emitting diode module 100 of the present invention, the LED die
Group includes substrate 10, the reflecting piece being arranged on substrate 10 20 and extinction piece 30, the light emitting diode being arranged on substrate 10 envelope
Assembling structure 40 and cover set the lens 50 of the package structure for LED 40.The reflecting piece 20 is located in lens 50 and substrate
Between 10, the extinction piece 30 is located between the package structure for LED 40 and substrate 10.
Specifically, the substrate 10 includes a upper surface 11 and the lower surface 12 relative with the upper surface 11.The upper surface
11 be the flat surface with conducting wire 13.The substrate 10 can be printed circuit board (PCB), metal substrate, silicon substrate or ceramic base
Plate etc..In the present embodiment, the substrate 10 is printed circuit board (PCB).
The reflecting piece 20 is attached in conducting wire 13.Specifically, the reflecting piece 20 is made up of reflectorized material.This implementation
In example, the reflecting piece 20 is white reflection film.It should be understood that in other embodiment, the reflecting piece also can be suitable by other
Reflectorized material be made.The reflecting piece 20 opens up an accepting hole 21 and some fixing holes being uniformly arranged around the accepting hole 21
22.In the present embodiment, the accepting hole 21 and fixing hole 22 are rounded, and the size of the accepting hole 21 is more than each fixing hole 22
Size.Some fixing holes 22 are spaced.In the present embodiment, the quantity of the fixing hole 22 is three.It should be understood that its
In his embodiment, the other shapes such as the accepting hole 21 and fixing hole 22 or square, polygon, annular.
The extinction piece 30 is arranged in conducting wire 13 upper and is contained in the accepting hole 21 of the reflecting piece 20.The extinction
Piece 30 is adjacent with the reflecting piece 20 and is in close contact.The extinction piece 30 is made up of black light-absorbing material.In the present embodiment, the suction
Mating plate 30 is pitch-dark coating.It is appreciated that other embodiment in, the extinction piece 30 also can be by other suitable light absorbent systems
Into the very thin coating being such as made up of CNT.The upper and lower surface of the reflecting piece 20 upper following table with extinction piece 30 respectively
Face is coplanar.
The package structure for LED 40 is arranged on the extinction piece 30.The package structure for LED 40 passes through
Two pins（It is not shown）It is electrically connected with the conducting wire 13 on the substrate 10 and is fixed to substrate 10 via extinction piece 30
On.The base area of the package structure for LED 40 is less than the area of the extinction piece 30.It should be understood that described luminous two
Chip in pole pipe encapsulating structure 40 can be the chip portfolio of different wave length.The package structure for LED 40 is flat with one
Whole exiting surface 41, the light that the package structure for LED 40 is sent are emitted to the lens 50 from the exiting surface 41.
The lens 50, which are arranged on reflecting piece 20 and the top of extinction piece 30 and covered, sets the package structure for LED
40.Specifically, the lens 50 include an optical section 51 and some fixed parts 52 protruded out from optical section 51.
The section of the optical section 51 is in bat wing.The optical section 51 includes a bottom surface 511 and relative with the bottom surface 511 one
Top surface 513.The bottom surface 511 is plane, and towards top surface 513, further depression forms an optical surface 55 at its middle part.The optics is bent
Face 55 is in dome-like, positioned at the surface of the package structure for LED 40 and right with the package structure for LED 40
Should.The orthographic projection of optical surface 55 on the substrate 10 is fallen into the region of extinction piece 30.The top surface 513 is located at bottom surface 511
Top and remote substrate 10.The top surface 513 is a convex surface.It is specifically, recessed towards the direction of bottom surface 511 at the center of top surface 513
Fall into, and the minimum point being recessed and the connection of the periphery of top surface 513 face away from the direction of substrate 10 and protruded out, so make the top surface 513 be in
" M " shape is set.The light that the package structure for LED 40 is sent enters lens 50 from the optical surface 55, and through the top
Face 513 is emitted.It should be understood that the size of the extinction piece 30 can also be equal to or slightly less than the optical surface 55 on the substrate 10
Projection size.
The 52 spaced setting of some fixed parts.In the present embodiment, the quantity of the fixed part 52 is three, this three
Fixed part 52 is evenly spaced in the periphery of the bottom of optical section 51.Each fixed part 52 includes a boss 521 and vertical from boss 521
The trip 522 extended downwardly.The periphery of boss 521 from the optical section 51 protrudes out the column to be formed, and its upper and lower surface is flat
Whole surface, the boss 521 are integrally formed with the optical section 51.The trip 522 is from the lower surface of boss 521 towards the direction of substrate 10
Extension is formed.The trip 522 is taper column structure, and its diameter is gradually reduced from boss 521 to substrate 10.The trip 522
It is corresponding with the fixing hole 22 in the reflecting piece 20 and be embedded in the fixing hole 22, lens 50 to be connected by colloid
It is fixed on substrate 10.
During work, the light that the package structure for LED 40 is sent is emitted from its exiting surface 41, and through the optics
The optical surface 55 in portion 51 enters lens 50, in the process, when light reaches the optical surface 55 of optical lens 50, part
Some light is reflected to the package structure for LED 40 positioned at the middle section of lens 50, and another part light enters lens
50。
The light for being reflected to the package structure for LED 40 positioned at the middle section of lens 50 reaches light emitting diode
After extinction piece 30 immediately below encapsulating structure 40, it will be absorbed by extinction piece 30 so as to be emitted from the middle section of lens 50.
Into after the light arrival top surface 513 of lens 50, some light is directly emitted from top surface 513, and another part is anti-
It is incident upon the bottom surface 511 of the lens 50.
The light of the bottom surface 511 of lens 50 is reflected onto, again through the periphery area of top surface 513 after partly directly being reflected by bottom surface 511
Domain is emitted, and is reflected onto again after another part beam projecting to reflecting piece 20 inside lens 50 and through the peripheral edge margin of top surface 513
Outgoing.
Therefore the light intensity of the light through the outgoing of the middle section of 50 top surface of lens 513 is reduced, through the periphery of lens 50
The light intensity of region outgoing is increased and leveled off to the light intensity being emitted through the middle section of lens 50, so make this luminous two
The emergent ray of pole pipe module 100 is evenly distributed.
Compared with prior art, light emitting diode module 100 provided by the invention is in substrate 10 and LED package
The extinction piece 30 of sandwiched one, the extinction piece 30 absorb the light that extinction piece 30 is reflexed to from lens 50 between structure 40, to avoid
The some light is reflected to the middle section of lens 50, so as to reduce the light intensity from the outgoing of the middle section of lens 50, together
When the light that reflects of reflecting piece 20 positioned at the periphery of extinction piece 30 be emitted from the periphery of top surface 513 of lens 50, and then cause through saturating
The peripheral edge margin of mirror 50 outgoing light intensity level off to through the middle section of lens 50 be emitted light intensity, make the light emitting diode
The emergent ray of module 100 is evenly distributed.
It is understood that for the person of ordinary skill of the art, it can be conceived with the technique according to the invention and done
Go out other various corresponding changes and deformation, and all these changes and deformation should all belong to the protection model of the claims in the present invention
Enclose.
Claims (9)
1. a kind of light emitting diode module, including light emitting diode construction and cover set the saturating of the package structure for LED
Mirror, it is characterised in that：Further comprise the extinction piece below the package structure for LED, the light emitting diode
Encapsulating structure is directly sticked the extinction piece upper surface, in addition to a reflecting piece for being arranged at extinction piece periphery, the extinction piece
Thickness is equal to the thickness of the reflecting piece and the extinction piece periphery is sticked the reflecting piece, and the extinction piece is used to absorbing luminous
The light for the part forward direction that diode package structure is sent, so as to weaken the light intensity from the outgoing of lens center region.
2. light emitting diode module as claimed in claim 1, it is characterised in that：The extinction of face light emitting diode construction
The size of piece upper surface is more than the bed-plate dimension of the package structure for LED.
3. light emitting diode module as claimed in claim 1, it is characterised in that：The extinction piece is a pitch-dark coating, described
Pitch-dark coating is located at the underface of the package structure for LED.
4. light emitting diode module as claimed in claim 1, it is characterised in that：The reflecting piece center is to should light-emitting diodes
The region of pipe encapsulating structure opens up an accepting hole, and the extinction piece is housed and is arranged in the accepting hole.
5. light emitting diode module as claimed in claim 4, it is characterised in that：The reflecting piece is a white film, described
Reflecting piece also opens up some spaced fixing holes, and some fixing holes are around the accepting hole and uniformly arrange.
6. light emitting diode module as claimed in claim 5, it is characterised in that：The lens include an optical section and from optics
Some fixed parts that portion protrudes out close to the bottom of substrate, the fixed part are locally arranged in the fixing hole.
7. light emitting diode module as claimed in claim 6, it is characterised in that：The optical section include bottom surface and with the bottom surface
Relative top surface, the bottom surface middle part are recessed to form an optical surface towards top surface direction, the optical surface and the light-emitting diodes
Pipe encapsulating structure faces, and the size of the extinction piece is more than orthographic projection size of the optical surface on extinction piece.
8. light emitting diode module as claimed in claim 7, it is characterised in that：The top surface is a convex surface.
9. light emitting diode module as claimed in claim 6, it is characterised in that：The fixed part was included from optical section week
The boss of edge extension and the trip vertically extended from boss towards the reflecting piece direction, the trip, which is embedded, is fixed on corresponding fixation
Kong Zhong.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310292390.XA CN104282830B (en) | 2013-07-12 | 2013-07-12 | Light emitting diode module |
| TW102125606A TWI521749B (en) | 2013-07-12 | 2013-07-17 | Light emitting diode module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310292390.XA CN104282830B (en) | 2013-07-12 | 2013-07-12 | Light emitting diode module |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104282830A CN104282830A (en) | 2015-01-14 |
| CN104282830B true CN104282830B (en) | 2018-01-30 |
Family
ID=52257515
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310292390.XA Active CN104282830B (en) | 2013-07-12 | 2013-07-12 | Light emitting diode module |
Country Status (2)
| Country | Link |
|---|---|
| CN (1) | CN104282830B (en) |
| TW (1) | TWI521749B (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107489891A (en) * | 2016-06-12 | 2017-12-19 | 欧司朗股份有限公司 | Light emitting module and its manufacture method |
| CN107247363B (en) * | 2017-06-30 | 2021-04-02 | 厦门天马微电子有限公司 | Side light type backlight module, light source and display panel thereof |
| CN112394427B (en) * | 2020-09-11 | 2022-05-10 | 禾橙科技股份有限公司 | Optical lens, optical lens forming mold and manufacturing method thereof |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101459211A (en) * | 2007-12-11 | 2009-06-17 | 富士迈半导体精密工业（上海）有限公司 | Solid illuminating device |
| CN101533884A (en) * | 2008-03-12 | 2009-09-16 | 财团法人工业技术研究院 | Light emitting diode packaging structure and manufacturing method thereof |
| CN101626051A (en) * | 2008-07-09 | 2010-01-13 | 光燿科技股份有限公司 | Light emitting diode and brightness control method thereof |
| CN201732533U (en) * | 2010-07-07 | 2011-02-02 | 田艺儿 | LED dot matrix module |
| CN103178190A (en) * | 2011-12-22 | 2013-06-26 | 展晶科技(深圳)有限公司 | Light-emitting diode light source and package method thereof |
-
2013
- 2013-07-12 CN CN201310292390.XA patent/CN104282830B/en active Active
- 2013-07-17 TW TW102125606A patent/TWI521749B/en active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101459211A (en) * | 2007-12-11 | 2009-06-17 | 富士迈半导体精密工业（上海）有限公司 | Solid illuminating device |
| CN101533884A (en) * | 2008-03-12 | 2009-09-16 | 财团法人工业技术研究院 | Light emitting diode packaging structure and manufacturing method thereof |
| CN101626051A (en) * | 2008-07-09 | 2010-01-13 | 光燿科技股份有限公司 | Light emitting diode and brightness control method thereof |
| CN201732533U (en) * | 2010-07-07 | 2011-02-02 | 田艺儿 | LED dot matrix module |
| CN103178190A (en) * | 2011-12-22 | 2013-06-26 | 展晶科技(深圳)有限公司 | Light-emitting diode light source and package method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104282830A (en) | 2015-01-14 |
| TW201503426A (en) | 2015-01-16 |
| TWI521749B (en) | 2016-02-11 |
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