CN205861837U - PCB pressure resistant testing device - Google Patents

PCB pressure resistant testing device Download PDF

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Publication number
CN205861837U
CN205861837U CN201620686181.2U CN201620686181U CN205861837U CN 205861837 U CN205861837 U CN 205861837U CN 201620686181 U CN201620686181 U CN 201620686181U CN 205861837 U CN205861837 U CN 205861837U
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China
Prior art keywords
voltage
withstand test
layer
testing device
pcb
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Active
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CN201620686181.2U
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Chinese (zh)
Inventor
崔蜀巍
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Shenzhen Zhongfu circuit Co.,Ltd.
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SHENZHEN JOVE ENTERPRISE Ltd
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Priority to CN201620686181.2U priority Critical patent/CN205861837U/en
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Abstract

This utility model provides a kind of PCB pressure resistant testing device, is included between effective unit of every layer of pcb board the one group of voltage-withstand test hole and network line arranged, and the most each voltage-withstand test hole is connected with a network line of respective layer respectively.When the pressure performance tested between different medium layer, two dielectric layers needing test select a voltage-withstand test hole respectively, the pressure voltage between two voltage-withstand test holes selected by test.When test is with the pressure performance between layer heterogeneous networks, test the pressure voltage between this layer of corresponding two voltage-withstand test hole.Compared with prior art, pcb board 100% all standing can be tested by described PCB pressure resistant testing device, and can reduce the scrappage of effectively unit after test.

Description

PCB pressure resistant testing device
Technical field
This utility model relates to PCB production test field, particularly relates to a kind of PCB pressure resistant testing device.
Background technology
There is the pcb board of resistance to pressure request currently for some, typically require before shipment finished product, carry out the most pressure survey Examination, detects the pressure performance of pcb board different medium interlayer and with the pressure performance between layer heterogeneous networks.Due to voltage-withstand test Voltage generally at 1500V-2500V, pcb board can be caused damage by test itself, affects follow-up reliability, therefore can only be by Take a sample test according to certain proportion.
Pcb board 100% all standing can not be tested by this traditional test mode, it is impossible to ensures that product the most all meets Requirement.Further, through the pcb board of voltage-withstand test because there is integrity problem, generally doing and scrapping process, bringing the rising of cost.
Therefore, pcb board voltage-withstand test needs to propose a kind of novel pressure resistant testing device, can not only 100% all standing survey Examination, and scrappage can be reduced.
Utility model content
The purpose of this utility model is to provide a kind of PCB pressure resistant testing device, to solve current pcb board voltage-withstand test not Problem that can be high to effective unit scrappage of pcb board after pcb board 100% all standing and test.
The purpose of this utility model is achieved through the following technical solutions.
A kind of PCB pressure resistant testing device, is included on every layer of pcb board the one group of voltage-withstand test hole and network line arranged, The most each voltage-withstand test hole is connected with a network line of respective layer respectively.
Preferably, described voltage-withstand test hole and network line are arranged between effective unit of every layer of pcb board.
Preferably, the quantity in described one group of voltage-withstand test hole is two, and the quantity of described one group of network line is two.
Preferably, said two network line intersects, and line length is 15mm, and line width is 15mil, circuit it Between spacing be in unit minimum line away from.
Preferably, the aperture in described voltage-withstand test hole is 1.0mm.
Preferably, each voltage-withstand test hole is correspondingly arranged a testing weld pad.
Preferably, a diameter of 1.5mm of described testing weld pad.
During voltage-withstand test, when the pressure performance tested between different medium layer, at two media needing test A voltage-withstand test hole is selected respectively, the pressure voltage between two voltage-withstand test holes selected by test on layer.When testing same layer During pressure performance between heterogeneous networks, test the pressure voltage between this layer of corresponding two voltage-withstand test hole.
The beneficial effects of the utility model are: described PCB pressure resistant testing device designs between effective unit of pcb board, Voltage-withstand test process will not damage effective unit, the scrappage of effective unit after therefore can reducing test, thus effectively reduces Cost.And pcb board 100% all standing can be tested by this device, it is ensured that the reliability of product.
Accompanying drawing explanation
Fig. 1 is the schematic diagram of the TOP layer of this utility model PCB pressure resistant testing device preferred embodiment.
Fig. 2 is the schematic diagram of the L1 layer of this utility model PCB pressure resistant testing device preferred embodiment.
Fig. 3 is the schematic diagram of the L2 layer of this utility model PCB pressure resistant testing device preferred embodiment.
Fig. 4 is the schematic diagram of the BOT layer of this utility model PCB pressure resistant testing device preferred embodiment.
Detailed description of the invention
In order to make the purpose of this utility model, technical scheme and advantage clearer, below in conjunction with accompanying drawing and enforcement Example, is further elaborated to this utility model.Should be appreciated that specific embodiment described herein is only in order to explain This utility model, is not used to limit this utility model.
The utility model proposes a kind of PCB pressure resistant testing device, between effective unit of every layer of pcb board, arrange one group Voltage-withstand test hole.Such as, 4 layers of pcb board arrange 4 groups of voltage-withstand test holes, and 6 layers of pcb board arrange 6 groups of voltage-withstand test holes.Often organize pressure The quantity of instrument connection is two, and the aperture in each voltage-withstand test hole is 1.0mm.A corresponding test weldering on each voltage-withstand test hole Dish, a diameter of 1.5mm of this testing weld pad.
Often two voltage-withstand test holes in group are connected with the two of respective layer single network lines respectively.Said two Network line intersects, and line length is 15mm, and line width is 15mil, and the spacing between circuit is minimum line in unit Away from.
Illustrate as a example by 4 layers of pcb board below:
Wherein, described 4 layers of pcb board include TOP layer, L1 layer, L2 layer and BOT layer.
Refering to shown in Fig. 1, for the schematic diagram of the TOP layer of this utility model PCB pressure resistant testing device preferred embodiment.Described First group of voltage-withstand test hole it is provided with, including voltage-withstand test hole A1 and A2 on TOP layer.On described voltage-withstand test hole A1 and A2 respectively Corresponding testing weld pad 11 and 12.Described voltage-withstand test hole A1 with A2 is connected with two network lines 13 and 14 of TOP layer respectively, Said two network line 13 and 14 intersects.
Refering to shown in Fig. 2, for the schematic diagram of the L1 layer of this utility model PCB pressure resistant testing device preferred embodiment.Described Second group of voltage-withstand test hole it is provided with, including voltage-withstand test hole B1 and B2 on L1 layer.On described voltage-withstand test hole B1 and B2 respectively Corresponding testing weld pad 21 and 22.Described voltage-withstand test hole B1 with B2 is connected with two network lines 23 and 24 of L1 layer respectively, Said two network line 23 and 24 intersects.
Refering to shown in Fig. 3, for the schematic diagram of the L2 layer of this utility model PCB pressure resistant testing device preferred embodiment.Described The 3rd group of voltage-withstand test hole it is provided with, including voltage-withstand test hole C1 and C2 on L2 layer.On described voltage-withstand test hole C1 and C2 respectively Corresponding testing weld pad 31 and 32.Described voltage-withstand test hole C1 with C2 is connected with two network lines 33 and 34 of L2 layer respectively, Said two network line 33 and 34 intersects.
Refering to shown in Fig. 4, for the schematic diagram of the BOT layer of this utility model PCB pressure resistant testing device preferred embodiment.Described The 4th group of voltage-withstand test hole it is provided with, including voltage-withstand test hole D1 and D2 on BOT layer.On described voltage-withstand test hole D1 and D2 respectively Corresponding testing weld pad 41 and 42.Described voltage-withstand test hole D1 with D2 is connected with two network lines 43 and 44 of BOT layer respectively, Said two network line 43 and 44 intersects.
When using the pressure performance between PCB pressure resistant testing device of the present utility model test different medium layer, needing A voltage-withstand test hole is selected respectively, resistance between two voltage-withstand test holes selected by test on two dielectric layers to be tested Pressure value.When test is with pressure performance between layer heterogeneous networks, that tests between this layer of corresponding two voltage-withstand test hole is resistance to Pressure value.
Such as, if desired measure the pressure performance between TOP layer and L1 layer, then measure voltage-withstand test hole A1 Yu B1 or B2 it Between pressure voltage, it is also possible to measure the pressure voltage between voltage-withstand test hole A2 and B1 or B2.If desired the same layer network of TOP layer is measured Between pressure performance, then measure the pressure voltage between A1 and A2 of voltage-withstand test hole.The rest may be inferred for the test mode of other layers.
The foregoing is only embodiment of the present utility model, not thereby limit the scope of the claims of the present utility model, every Utilize equivalent structure or equivalence flow process conversion that this utility model description and accompanying drawing content made, or be directly or indirectly used in Other relevant technical fields, are the most in like manner included in scope of patent protection of the present utility model.

Claims (7)

1. a PCB pressure resistant testing device, is included on every layer of pcb board the one group of voltage-withstand test hole and network line arranged, its In each voltage-withstand test hole be connected with a network line of respective layer respectively.
2. PCB pressure resistant testing device as claimed in claim 1, it is characterised in that described voltage-withstand test hole and network line set Put between effective unit of every layer of pcb board.
3. PCB pressure resistant testing device as claimed in claim 1, it is characterised in that the quantity in described one group of voltage-withstand test hole is Two, the quantity of described one group of network line is two.
4. PCB pressure resistant testing device as claimed in claim 3, it is characterised in that said two network line intersects, line The a length of 15mm in road, line width is 15mil, the spacing between circuit be in unit minimum line away from.
5. PCB pressure resistant testing device as claimed in claim 3, it is characterised in that the aperture in described voltage-withstand test hole is 1.0mm。
6. PCB pressure resistant testing device as claimed in claim 5, it is characterised in that be correspondingly arranged on each voltage-withstand test hole Individual testing weld pad.
7. PCB pressure resistant testing device as claimed in claim 6, it is characterised in that a diameter of 1.5mm of described testing weld pad.
CN201620686181.2U 2016-07-01 2016-07-01 PCB pressure resistant testing device Active CN205861837U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201620686181.2U CN205861837U (en) 2016-07-01 2016-07-01 PCB pressure resistant testing device

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Application Number Priority Date Filing Date Title
CN201620686181.2U CN205861837U (en) 2016-07-01 2016-07-01 PCB pressure resistant testing device

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CN205861837U true CN205861837U (en) 2017-01-04

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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107703425A (en) * 2017-09-26 2018-02-16 郑州云海信息技术有限公司 A kind of method of testing and device of detection CCL materials proof voltage energy
CN110672999A (en) * 2019-10-21 2020-01-10 胜宏科技(惠州)股份有限公司 High-voltage-resistant detection structure and detection method for coil plate
CN110824340A (en) * 2019-10-29 2020-02-21 胜宏科技(惠州)股份有限公司 Coil plate hole to line and hole high-voltage resistance detection method

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN107703425A (en) * 2017-09-26 2018-02-16 郑州云海信息技术有限公司 A kind of method of testing and device of detection CCL materials proof voltage energy
CN110672999A (en) * 2019-10-21 2020-01-10 胜宏科技(惠州)股份有限公司 High-voltage-resistant detection structure and detection method for coil plate
CN110824340A (en) * 2019-10-29 2020-02-21 胜宏科技(惠州)股份有限公司 Coil plate hole to line and hole high-voltage resistance detection method

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GR01 Patent grant
CP01 Change in the name or title of a patent holder
CP01 Change in the name or title of a patent holder

Address after: 518000, Guangdong, Shenzhen province Baoan District manhole street and a community and two industrial zone Xingye Road, No. 8

Patentee after: Shenzhen Zhongfu circuit Co.,Ltd.

Address before: 518000, Guangdong, Shenzhen province Baoan District manhole street and a community and two industrial zone Xingye Road, No. 8

Patentee before: SHENZHEN JOVE ENTERPRISE Co.,Ltd.