CN205724110U - 光电传感器 - Google Patents

光电传感器 Download PDF

Info

Publication number
CN205724110U
CN205724110U CN201620372574.6U CN201620372574U CN205724110U CN 205724110 U CN205724110 U CN 205724110U CN 201620372574 U CN201620372574 U CN 201620372574U CN 205724110 U CN205724110 U CN 205724110U
Authority
CN
China
Prior art keywords
pedestal
light
lead frame
photo detector
photoelectric sensor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active
Application number
CN201620372574.6U
Other languages
English (en)
Chinese (zh)
Inventor
土田俊司
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Industrial Devices SUNX Co Ltd
Original Assignee
Panasonic Electric Works SUNX Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Panasonic Electric Works SUNX Co Ltd filed Critical Panasonic Electric Works SUNX Co Ltd
Application granted granted Critical
Publication of CN205724110U publication Critical patent/CN205724110U/zh
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01VGEOPHYSICS; GRAVITATIONAL MEASUREMENTS; DETECTING MASSES OR OBJECTS; TAGS
    • G01V8/00Prospecting or detecting by optical means
    • G01V8/10Detecting, e.g. by using light barriers
    • G01V8/12Detecting, e.g. by using light barriers using one transmitter and one receiver
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/08Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof in which radiation controls flow of current through the device, e.g. photoresistors
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L31/00Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof
    • H01L31/12Semiconductor devices sensitive to infrared radiation, light, electromagnetic radiation of shorter wavelength or corpuscular radiation and specially adapted either for the conversion of the energy of such radiation into electrical energy or for the control of electrical energy by such radiation; Processes or apparatus specially adapted for the manufacture or treatment thereof or of parts thereof; Details thereof structurally associated with, e.g. formed in or on a common substrate with, one or more electric light sources, e.g. electroluminescent light sources, and electrically or optically coupled thereto
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02Contact members
    • H01R13/04Pins or blades for co-operation with sockets
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R13/00Details of coupling devices of the kinds covered by groups H01R12/70 or H01R24/00 - H01R33/00
    • H01R13/02Contact members
    • H01R13/10Sockets for co-operation with pins or blades
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • General Physics & Mathematics (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • General Life Sciences & Earth Sciences (AREA)
  • Geophysics (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Switches Operated By Changes In Physical Conditions (AREA)
  • Photo Coupler, Interrupter, Optical-To-Optical Conversion Devices (AREA)
  • Manufacture Of Switches (AREA)
CN201620372574.6U 2015-07-23 2016-04-28 光电传感器 Active CN205724110U (zh)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2015145769A JP6510346B2 (ja) 2015-07-23 2015-07-23 光電センサ、光電センサの製造方法
JP2015-145769 2015-07-23

Publications (1)

Publication Number Publication Date
CN205724110U true CN205724110U (zh) 2016-11-23

Family

ID=57292556

Family Applications (1)

Application Number Title Priority Date Filing Date
CN201620372574.6U Active CN205724110U (zh) 2015-07-23 2016-04-28 光电传感器

Country Status (4)

Country Link
JP (1) JP6510346B2 (ko)
KR (1) KR101844652B1 (ko)
CN (1) CN205724110U (ko)
TW (1) TWI596794B (ko)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP6991463B2 (ja) * 2018-03-15 2022-01-12 オムロン株式会社 光電センサ及びその製造方法

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62149177A (ja) * 1985-12-23 1987-07-03 Sharp Corp コネクタ付光結合素子の製法
US5076801A (en) 1990-06-22 1991-12-31 Xerox Corporation Electronic component including insulation displacement interconnect means
JPH0935594A (ja) * 1995-07-18 1997-02-07 Omron Corp 光センサ
JPH11145505A (ja) * 1997-11-11 1999-05-28 Omron Corp ホトセンサ及びその製造方法
JP2005328082A (ja) * 2005-07-25 2005-11-24 Sharp Corp 光結合半導体の製造方法
JP2008098471A (ja) 2006-10-13 2008-04-24 Sharp Corp 光結合装置およびその製造方法、並びに、光結合装置を用いた電子機器
JP2008135683A (ja) 2006-10-24 2008-06-12 Sharp Corp 光結合装置およびその製造方法、並びに、光結合装置を用いた電子機器
JP5198190B2 (ja) * 2008-09-02 2013-05-15 株式会社タカデン フォトインタラプタ
JP6094361B2 (ja) * 2013-04-24 2017-03-15 オムロン株式会社 フォトセンサ
JP6349809B2 (ja) * 2014-03-15 2018-07-04 オムロン株式会社 フォトセンサ
JP6452978B2 (ja) * 2014-07-30 2019-01-16 パナソニック デバイスSunx株式会社 光電センサ及び光電センサの製造方法

Also Published As

Publication number Publication date
JP2017027811A (ja) 2017-02-02
KR101844652B1 (ko) 2018-04-02
KR20170012007A (ko) 2017-02-02
TWI596794B (zh) 2017-08-21
TW201705512A (zh) 2017-02-01
JP6510346B2 (ja) 2019-05-08

Similar Documents

Publication Publication Date Title
US10012373B2 (en) Mounting base for an electrical component having a housing with a groove with a convergent bottom for crimping an electrical wire
US8727799B2 (en) Seal member and a charging connector provided therewith
US7165995B2 (en) Electromagnetic interference shielded connector and method for assembling the same
EP2456019B1 (en) Fluidproof connector
US8956190B2 (en) Submergible fused receptacle assembly for a vehicle charging inlet
US20170155208A1 (en) Waterproof electrical connector
CN104362451A (zh) 具有双向插接功能的插座连接器
US20070155253A1 (en) Plastic flange with molded-over wire harness
US20160233606A1 (en) Electrical connector assembly having waterproof function and method of manufacturing the same
CN103703626B (zh) 一种具有电缆连接结构的相机模块
CN205790687U (zh) 一种连接器
CN109038000B (zh) 正反插usb插座
CN205724110U (zh) 光电传感器
CN206640013U (zh) 电连接器
CN204179288U (zh) 具有双向插接功能的插座连接器
CN207459272U (zh) 连接器壳体组件、连接器及摄像头组件
CN205642399U (zh) 光电传感器
CN102157828A (zh) 扩充连接装置及其插座
CN207530175U (zh) 插头连接器
CN205790551U (zh) 结构稳固型usb连接器
CN212810137U (zh) 内置电阻的防水微动开关
CN112964891A (zh) 模块化速度传感器
WO2017136122A1 (en) Method for manufacturing a waterproof bus connector and bus connector with overmolded device housing
CN206471602U (zh) 一种高压大电流连接器
CN212751341U (zh) 一种多功能防水型电连接器结构

Legal Events

Date Code Title Description
C14 Grant of patent or utility model
GR01 Patent grant