CN205667011U

CN205667011U - Electron circuit board structure that easy film was counterpointed

Info

Publication number: CN205667011U
Application number: CN201620570571.3U
Authority: CN
Inventors: 吴子坚; 邬通芳; 刘镇权; 张卫
Original assignee: Guangdong Chengde Electronic Technology Co Ltd
Current assignee: Guangdong Chengde Electronic Technology Co Ltd
Priority date: 2016-06-14
Filing date: 2016-06-14
Publication date: 2016-10-26
Anticipated expiration: 2026-06-14

Abstract

The utility model discloses an electron circuit board structure that easy film was counterpointed belongs to printed circuit board manufacturing field, including circuit board body, shaping district, BGA to the site, the circuit board body includes long limit of circuit board and minor face, and the shaping district is including shaping head of district limit and minor face, BGA to the site include BGA to site no. 1, BGA to site no. 2, every BGA of group sets up between circuit board long limit and the shaping head of district limit site no. 1, every BGA of group to two settings in the site between circuit board minor face and shaping district minor face, BGA to site no. 1 and BGA to site no. 2 respectively including being nine bumps that the three rows rule was arranged, BGA to site no. 1 including the short row point of first long line point, second and the third long line point that are parallel to each other in proper order, BGA is to the site two including the fourth long line point, the 5th long line point and the 6th long line point that are parallel to each other in proper order. This electronics circuit board structure makes things convenient for the operator to discern the site, counterpoint efficient, the precision good.

Description

A kind of electronic circuit board structure being prone to film aligning

Technical field

This utility model relates to a kind of electronic circuit board, is specifically related to a kind of electronic circuit being prone to film aligning and hardens Structure, belongs to field of printed circuit board fabrication.

Background technology

In electronic circuit board manufacturing process, need before exposure electronic circuit board and the film are carried out para-position, then by right The electronic circuit board that position completes is put into exposure machine with the film and is exposed.

Existing alignment mode typically uses film aligning machine to automatically control para-position or artificial para-position, but uses aligning machine Carrying out automatically controlling para-position, equipment price costliness is not said, structure is the most considerably complicated, and uses pneumatic element absorption and put Put the film, easily produce bit errors, cause aligning accuracy low；And manually para-position, efficiency is low, and aligning accuracy is the most poor.

Summary of the invention

The problem existed for above-mentioned prior art, this utility model provides a kind of electronic circuit board being prone to film aligning Structure, convenient identification para-position, para-position efficiency is high, precision is good.

To achieve these goals, this utility model uses a kind of electronic circuit board structure being prone to film aligning, including Wiring board body, shaping area and be positioned at the BGA loci that shaping area is peripheral；

Described wiring board body includes the area folded by Ban Chang limit, two lines road and two lines road plate minor face, described shaping area Including the area folded by two molding head of district limits and two shaping area minor faces；

Described BGA loci includes the BGA loci one symmetrical no less than two groups and is no less than two groups symmetrical BGA pair Site two, often group BGA loci one is between the long limit of wiring board and molding head of district limit, and often group BGA loci two is positioned at circuit Between plate minor face and shaping area minor face；

Described BGA loci one and BGA loci two is respectively nine salient points of three row, and BGA loci one is followed successively by phase The most parallel the first long line point, the second short row are put and the 3rd long line point, and BGA loci two includes being followed successively by the 4th be parallel to each other Long line point, the 5th long line point and the 6th long line point.

As improvement, the spacing that described first long line point, the second short row point adjacent with in the 3rd long line point two arrange is identical.

As improvement, the length of described first long line point and the 3rd long line point is identical, and described second short row point length is less than The length of the first long line point.

As improvement, described 4th long line point and the 5th long line dot spacing are from less than between the 5th long line point and the 6th long line point Distance.

As improvement, the identical length of described 4th long line point, the 5th long line point and the 6th long line point is same.

As improvement, described BGA loci one is 3mm with the distance on adjacent molding head of district limit.

As improvement, described BGA loci two is 3mm with the distance of adjacent shaping area minor face.

Compared with prior art, this utility model is by wiring board body, increase BGA loci is as reference, each BGA loci all uses nine salient points, improves integrated level and the performance of wiring board semiconductor-on-insulator, operator can be facilitated to know simultaneously Other loci, it is ensured that para-position is the quickest；On conventional design wiring board, loci is other figures and alignment film is windowed monolateral More than 2mils, using BGA loci of the present utility model to design, alignment film is windowed only 1mils-1.5mils, to level Really, improving production efficiency, promote 30%-50% than traditional method, effectively reduce and cause because traditional design method para-position is inaccurate High-volume is returned and is washed, and also reduces the batch caused because pad para-position is irregular simultaneously and returns goods or scrap situation.

Accompanying drawing explanation

Fig. 1 is structural representation of the present utility model；

Fig. 2 is the structural representation of BGA loci one in Fig. 1；

Fig. 3 is the structural representation of BGA loci two in Fig. 1；

In figure: 1, wiring board body, 2, the long limit of wiring board, 3, BGA loci one, the 31, first long line point, 32, second is short Row point, the 33, the 3rd long line point, 4, wiring board minor face, 5, shaping area minor face, 6, BGA loci two, the 61, the 4th long line point, 62, 5th long line point, the 63, the 6th long line point, 7, molding head of district limit, 8, shaping area.

Detailed description of the invention

For making the purpose of this utility model, technical scheme and advantage of greater clarity, below by drawings and Examples, This utility model is described in further detail.However, it should be understood that specific embodiment described herein is only in order to explain This utility model, is not limited to scope of the present utility model.

Unless otherwise defined, all technical terms used herein and scientific terminology contain with this utility model technical field Justice is the most identical, is intended merely to describe concrete reality at term used in the description of the present utility model herein Execute the purpose of example, it is not intended that in limiting this utility model.

As shown in Figure 1, Figure 2 and Figure 3, a kind of electronic circuit board structure being prone to film aligning, including wiring board body 1, The shaping area 8 that is arranged on wiring board body 1 and be arranged on wiring board body 1 the BGA loci being positioned at periphery, shaping area 8；

Described wiring board body 1 includes Ban Chang limit, two lines road 2 and two lines road plate minor face 4, and described shaping area 8 includes two Bar molding head of district limit 7 and two shaping area minor faces 5；

Described BGA loci includes no less than two groups and symmetrical BGA loci 1 and no less than two groups and phase The most symmetrical BGA loci 26, often group BGA loci 1 is arranged between the long limit of described wiring board 2 and molding head of district limit 7, Often group BGA loci 26 is arranged between described wiring board minor face 4 and shaping area minor face 5；

Described BGA loci one 3 and BGA loci 26 includes nine salient points in three row regular arrangement respectively, described BGA loci 1 includes the first long line point 31, second short row point 32 and the 3rd long line point 33, the described BGA being parallel to each other successively Loci 26 includes the 4th long line point the 61, the 5th long line point 62 and the 6th long line point 63 being parallel to each other successively.

As the improvement of embodiment, in described first long line point 31, second short row point 32 and the 3rd long line point 33 adjacent two The spacing of row is identical, easy to process, and is easy to the distance calculating BGA loci 1 with shaping area 8.

As improving further, described first long line point 31 is identical with the length of the 3rd long line point 33, described second short row Point 32 length are less than the length of the first long line point 31.

As the improvement of embodiment, the spacing of described 4th long line point 61 and the 5th long line point 62 is less than the 5th long line point 62 and the 6th distances between long line point 63, it is simple to the BGA point that simulation is printed onto on plate.

As improving further, described 4th long line point the 61, the 5th long line point 62 and the identical length of the 6th long line point 63 With.The structure different from BGA loci 1 is used to design, it is ensured that operator in use, will not obscure BGA loci 1 He BGA loci 26, so, just reduces film aligning error rate.

As improving further, described BGA loci 1 is 3mm with the distance on adjacent molding head of district limit 7, uses BGA pair In site 1, the vertical spacing on salient point and molding head of district limit 7 closest to molding head of district limit 7 is 3mm, uses BGA para-position simultaneously In point 26, the horizontal range of salient point and adjacent shaping area minor face 5 closest to shaping area minor face 5 is 3mm.Above-mentioned size is used to set Meter, can window alignment film and be contracted to 1mils-1.5mils, and in such event, aligning accuracy improves, and production efficiency is also than biography System method improves 30%-50%.

During use, the film can be directed on wiring board body 1 BGA the loci one 3 and BGA loci two at certain angle, one end 6, the position being then fine-tuning to the film under the upper left right or up of wiring board body 1 need gets final product (i.e. in shaping area), needs note Meaning, when silk screen printing, it is necessary to the film presses BGA loci to plate, and when block, it is necessary to reserve BGA loci not Cross oil.

This utility model is by wiring board body, increase BGA loci is as reference, and each BGA loci uses nine Individual salient point, improves integrated level and the performance of wiring board semiconductor-on-insulator, operator can be facilitated to identify loci, it is ensured that para-position simultaneously The most quickly；On conventional design wiring board, loci is other figures and alignment film is windowed monolateral more than 2mils, uses this reality With novel BGA loci design, can be windowed by alignment film and narrow down to 1mils-1.5mils, aligning accuracy improves, efficiency Also improve 30%-50% than traditional method, use this technology, can effectively reduce and make because traditional design method para-position is inaccurate Become high-volume to return to wash, do over again, can also effectively reduce the batch caused because pad para-position is irregular simultaneously and return goods or scrap situation.

The foregoing is only preferred embodiment of the present utility model, not in order to limit this utility model, all at this Any amendment, equivalent or the improvement etc. made within the spirit of utility model and principle, should be included in this utility model Protection domain within.

Claims

1. the electronic circuit board structure being prone to film aligning, it is characterised in that include wiring board body (1), arrange online Shaping area (8) on road plate body (1) and be arranged on wiring board body (1) and be positioned at the BGA loci that shaping area (8) is peripheral；

Described wiring board body (1) includes Ban Chang limit, two lines road (2) and two lines road plate minor face (4), and described shaping area (8) wrap Include two molding head of district limits (7) and two shaping area minor faces (5)；

Described BGA loci includes no less than two groups and symmetrical BGA loci one (3) and no less than two groups and mutually Symmetrical BGA loci two (6), often group BGA loci one (3) is arranged on the long limit of described wiring board (2) and molding head of district limit (7) Between, often group BGA loci two (6) is arranged between described wiring board minor face (4) and shaping area minor face (5)；

Described BGA loci one (3) and BGA loci two (6) include nine salient points in three row regular arrangement respectively, described BGA loci one (3) includes the first long line point (31), the second short row point (32) and the 3rd long line point being parallel to each other successively (33), described BGA loci two (6) includes the 4th long line point (61), the 5th long line point (62) and the 6th being parallel to each other successively Long line point (63).

A kind of electronic circuit board structure being prone to film aligning the most according to claim 1, it is characterised in that described first The spacing that long line point (31), the second short row point (32) adjacent with in the 3rd long line point (33) two arrange is identical.

A kind of electronic circuit board structure being prone to film aligning the most according to claim 1 and 2, it is characterised in that described First long line point (31) is identical with the length of the 3rd long line point (33), and described second short row point (32) length is less than the first long line point (31) length.

A kind of electronic circuit board structure being prone to film aligning the most according to claim 1 and 2, it is characterised in that described 4th long line point (61) and the 5th long line point (62) spacing are less than the 5th long line point (62) and the 6th long line point (63) spacing.

A kind of electronic circuit board structure being prone to film aligning the most according to claim 4, it is characterised in that the described 4th The identical length of long line point (61), the 5th long line point (62) and the 6th long line point (63) is same.

A kind of electronic circuit board structure being prone to film aligning the most according to claim 1, it is characterised in that described BGA Loci one (3) is 3mm with the distance of adjacent molding head of district limit (7).

7. according to a kind of electronic circuit board structure being prone to film aligning described in claim 1 or 6, it is characterised in that described BGA loci two (6) is 3mm with the distance of adjacent shaping area minor face (5).