CN110377978A - The method and system of 0402 resistor-capacitor unit is placed in a kind of PCB design under BGA package - Google Patents
The method and system of 0402 resistor-capacitor unit is placed in a kind of PCB design under BGA package Download PDFInfo
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- CN110377978A CN110377978A CN201910580800.8A CN201910580800A CN110377978A CN 110377978 A CN110377978 A CN 110377978A CN 201910580800 A CN201910580800 A CN 201910580800A CN 110377978 A CN110377978 A CN 110377978A
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Abstract
The invention proposes the method and systems that 0402 resistor-capacitor unit is placed under BGA package in a kind of PCB design, the origin that first function obtains PCB is first carried out in this method, select any via hole of BGA area in sheet frame, it executes second function and obtains the coordinate (x of selected via hole, y), and coordinate (x, y) is changed to by the second origin (0,0) by third function；According to the specification of BGA, grid point is set, finally capacitor is moved on grid point.Based on method proposed by the present invention, it is also proposed that place the system of 0402 resistor-capacitor unit in a kind of PCB design under BGA package.The present invention is based on the spacing halved between via hole, it does not need to place capacitor under conditions of measurement, guarantee pad to adjacent vias be it is equidistant, instead of artificial spacing and calculating and the operation that adjusts back and forth of the measurement pad to via hole one by one of engineer, raising positioning efficiency.
Description
Technical field
The invention belongs to PCB (Printed Circuit Board, printed circuit board) design fields, in particular to
The method and system of 0402 resistor-capacitor unit is placed in a kind of PCB design under BGA package.
Background technique
In printed circuit board (Printed Circuit Board, PCB) board R & D design, the setting of highly dense board
That designs in research and development of products is more and more, and many small pitch packages are largely applied in design of electronic products, mostly ball
Shape matrix arrangement (Ball Grid Array, BGA) encapsulation, currently, spacing (pitch) value is 1.0mm, 0.8mm and 1.27mm's
Chip package has been widely used.The decoupling filter capacitor that power pin can be more in PCB principle diagram design, to guarantee
The power good that BGA is output and input.Common BGA package its decouple filter capacitor and be normally placed at BGA in the following, the i.e. back side.
But because BGA package pin densities are big, Kong Houruo is fanned out in BGA and places capacitance positions inaccuracy, capacitor pad
Distance to adjacent vias not can guarantee equalization, lead to capacitor pad to the hypotelorism of via hole, cause technological problems, reduce life
Produce yield.Therefore how accurately to put capacitor guarantees that positioning efficiency guarantees that reasonable spacing is particularly important again.
Summary of the invention
The invention proposes the method and systems that 0402 resistor-capacitor unit is placed under BGA package in a kind of PCB design, use
Skill tool, can be for placement 0402 resistor-capacitor unit simple and easy in 1.0mm, 0.8mm and 1.27mm in BGA specification.
To achieve the goals above, the invention proposes the sides that 0402 resistor-capacitor unit is placed under BGA package in a kind of PCB design
Method and system, method includes the following steps:
S1: by execute first function, traverse sheet frame where level and calculate the length of sheet frame and the width of sheet frame；With plate
The length of frame and the width of sheet frame establish plane right-angle coordinate, and the long place X-axis of sheet frame extends and Y where the width of sheet frame toward negative semiaxis
Axis extends toward negative semiaxis to intersect, and the intersection point of the intersection is the first origin, is defined as coordinate (0,0)；
S2: selecting any via hole of BGA area in the sheet frame, executes second function and obtains the coordinate that selected via hole generates
(x, y), and the coordinate (x, y) is inputed into third function；The coordinate (x, y) is changed to the second original by the third function
Point (0,0)；
S3: according to the specification of BGA, X-axis and Y-axis raster width are inputed into the 4th function, generating the overall situation is X-axis and Y
The grid point of axis raster width；
S4: 0402 resistor-capacitor unit is moved on grid point.
Further, the distance of a length of sheet frame horizontal direction line segment of the sheet frame；The width of the sheet frame is that sheet frame is vertical
The distance of direction line segment.
Further, the specification of the BGA includes 1mmBGA, 0.8mmBGA and 1.27mmBGA.
Further, when the specification of BGA is 1mmBGA, the X-axis and Y-axis raster width are 39.37/2, i.e.,
19.685；
When the specification of BGA is 0.8mmBGA, the X-axis and Y-axis raster width are 39.37*0.8/2, i.e., 15.748；
When the specification of BGA is 1.27mmBGA, the X-axis and Y-axis raster width are 39.37*1.27/2, i.e., 24.999.
A kind of system for placing 0402 resistor-capacitor unit in PCB design under BGA package, including determine the first origin module, determination
Second origin module, setting grid point module, mobile capacitance module；
Determination the first origin module is used for the level by executing first function, where traversal sheet frame and calculates ejecting plate
The length of frame and the width of sheet frame；Plane right-angle coordinate, the long place X-axis past negative half of sheet frame are established with the width of the length of sheet frame and sheet frame
Axis extends and the wide place Y-axis of sheet frame intersects toward the extension of negative semiaxis, and the intersection point of the intersection is the first origin, is defined as coordinate
(0,0)；
Determination the second origin module is used to select any via hole of BGA area in the sheet frame, executes second function
The coordinate (x, y) that selected via hole generates is obtained, and the coordinate (x, y) is inputed into third function；The third function is by institute
It states coordinate (x, y) and is changed to the second origin (0,0)；
The setting grid module is used for the specification according to BGA, and X-axis and Y-axis raster width are inputed to the 4th function, raw
It is the grid point of X-axis and Y-axis raster width at the overall situation；
The mobile capacitance module is used to 0402 resistor-capacitor unit being moved to grid point.
Further, the spider module is used to traverse the level where sheet frame by executing first function；
The computing module is used for by calculating the length of sheet frame and the width of sheet frame after the level where traversal sheet frame；With
The length of sheet frame and the width of sheet frame establish plane right-angle coordinate, and the long place X-axis of sheet frame extends toward negative semiaxis and the wide institute of sheet frame
Extend in Y-axis toward negative semiaxis and intersect, the intersection point of the intersection is the first origin, is defined as coordinate (0,0).
Further, the second origin of determination module includes via hole coordinate determining module and change module；
The via hole coordinate determining module is used to select any via hole of BGA area in the sheet frame, executes second function
Obtain the coordinate (x, y) that selected via hole generates；
The change module is used to the coordinate (x, y) that the selected via hole generates inputing to third function；The third
The coordinate (x, y) is changed to the second origin (0,0) by function.
Further, the setting grid module includes determining gauge modules and the global grid module of generation；
Specification of the determining gauge modules for BGA determines X-axis and Y-axis raster width；
The global grid module of the generation is used to inputing to X-axis and Y-axis raster width into the 4th function, generates the overall situation and is
The grid point of X-axis and Y-axis raster width.
The effect provided in summary of the invention is only the effect of embodiment, rather than invents all whole effects, above-mentioned
A technical solution in technical solution have the following advantages that or the utility model has the advantages that
The embodiment of the present invention proposes the method and system for placing 0402 resistor-capacitor unit in a kind of PCB design under BGA package, should
Method passes through execution first function first, and the level where traversal sheet frame simultaneously calculates the length of sheet frame and the width of sheet frame；With sheet frame
Length and the width of sheet frame establish plane right-angle coordinate, sheet frame it is long where X-axis toward negative semiaxis extend and sheet frame it is wide where Y-axis
Extend intersection toward negative semiaxis, the intersection point of intersection is the first origin, is defined as coordinate (0,0)；Select times of BGA area in sheet frame
Meaning via hole executes the 2nd t function and obtains the coordinate (x, y) that selected via hole generates, and coordinate (x, y) is inputed to third function；
Coordinate (x, y) is changed to the second origin (0,0) by third function；According to the specification of BGA, X-axis and Y-axis raster width are inputed to
4th function generates the grid point that the overall situation is X-axis and Y-axis raster width；Finally 0402 resistor-capacitor unit is moved on grid point.
Based on the method for placing 0402 resistor-capacitor unit under BGA package in a kind of PCB design proposed by the present invention, it is also proposed that a kind of PCB is set
The system of 0402 resistor-capacitor unit is placed in meter under BGA package.Between this method can be halved between via hole based on skill tool
Away from, directly place 0402 resistor-capacitor unit under conditions of not needing measurement, and guarantee pad to adjacent vias be it is equidistant, substitute
Artificial spacing and calculating and the operation that adjusts back and forth of the measurement pad to via hole one by one of engineer, substantially saves operation
Time improves the positioning efficiency of PCB.
Detailed description of the invention
Attached drawing 1 is to place 0402 resistor-capacitor unit spacing schematic diagram under the BGA package that the embodiment of the present invention 1 proposes；
Attached drawing 2 is the method for placing 0402 resistor-capacitor unit in a kind of PCB design of the proposition of the embodiment of the present invention 1 under BGA package
Flow chart；
Attached drawing 3 be place 0402 resistor-capacitor unit under BGA package in a kind of PCB design that the embodiment of the present invention 1 proposes be
System schematic diagram.
Specific embodiment
Following will be combined with the drawings in the embodiments of the present invention, and technical solution in the embodiment of the present invention carries out clear, complete
Site preparation description, it is clear that described embodiments are only a part of the embodiments of the present invention, instead of all the embodiments.It is based on
Embodiment in the present invention, it is obtained by those of ordinary skill in the art without making creative efforts every other
Embodiment shall fall within the protection scope of the present invention.
In the description of the present invention, it is to be understood that, term " longitudinal direction ", " transverse direction ", "upper", "lower", "front", "rear",
The orientation or positional relationship of the instructions such as "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outside" is based on attached drawing institute
The orientation or positional relationship shown is merely for convenience of the description present invention, rather than the device or element of indication or suggestion meaning must
There must be specific orientation, be constructed and operated in a specific orientation, therefore be not considered as limiting the invention.
Embodiment 1
The invention proposes the method for 0402 resistor-capacitor unit is placed under BGA package in a kind of PCB design, firstly, passing through execution
The origin of axlExtentLayout function acquisition PCB.AxlExtentLayout function can traverse the level where frame first,
The attribute of sheet frame is line segment, and axlExtentLayout function calculates the length of sheet frame and the width of sheet frame；Then with the length of sheet frame and
The width of sheet frame establishes plane right-angle coordinate, and the long place X-axis of sheet frame bears half toward Y-axis where the width of the extension of negative semiaxis and sheet frame is past
Axis extends intersection, and the intersection point of intersection is the first origin, is defined as coordinate (0,0)；The as origin of PCB.The wherein length of sheet frame
For the distance of sheet frame horizontal direction line segment；The width of sheet frame is the distance of sheet frame vertical direction line segment.
Wherein axlExtentLayout function is one of them in AXL function, for traversing and calculating size.
Any one via hole that BGA area is clicked with mouse is obtained selected by execution axlAddSelectPoint function
The position of via hole generates (x, y) coordinate, (x, y) coordinate is then inputed to function axlDBChangeDesingOrigin,
(x, y) coordinate is changed to the second origin (0,0) by middle function axlDBChangeDesingOrigin, the second origin
It is defined as new origin.
Wherein axlAddSelectPoint function is to click to click increase object function in AXL function,
AxlDBChangeDesingOrigin function is that original point design function is modified in AXL function.
It is according to the specification of BGA, X-axis and Y-axis grid is wide by SetGridsDisplayMain function setup grid point
Degree inputs to function SetGridsDisplayMain, generates the grid point that the overall situation is X-axis and Y-axis raster width；In the present invention
The specification of middle BGA includes 1mmBGA, 0.8mmBGA and 1.27mmBGA.
Wherein SetGridsDisplayMain is setting grid point function.
When the specification of BGA is 1mmBGA, X-axis and Y-axis raster width are 39.37/2, i.e., 19.685；
When the specification of BGA is 0.8mmBGA, X-axis and Y-axis raster width are 39.37*0.8/2, i.e., 15.748；
When the specification of BGA is 1.27mmBGA, the X-axis and Y-axis raster width are 39.37*1.27/2, i.e., 24.999.
Fig. 1 gives and places 0402 resistor-capacitor unit spacing schematic diagram under the BGA package that the embodiment of the present invention 1 proposes, wherein justifying
Circle is region via hole, and origin is grid point, and distance is a grid point width between two dots, is determined first above in sheet frame
The origin of PCB.By taking 1mmBGA as an example, the spacing between via hole is halved, wherein 1mm=39.37mil.39.37/2 is
19.685.0402 resistor-capacitor unit is directly placed under conditions of being not required to measurement, and can guarantee that pad to adjacent vias is equidistant.
Finally, carrying out moving distance in skill tool with the mobile capacitor of mouse with the width of grid point, so capacitor is certainly
Moving and being placed on the overall situation is to meet equidistant purpose on the grid point of X-axis and Y-axis raster width.
Attached drawing 2 is the method for placing 0402 resistor-capacitor unit in a kind of PCB design of the proposition of the embodiment of the present invention 1 under BGA package
Flow chart；
In step s 201, the origin of PCB is obtained by executing axlExtentLayout function, is executed
AxlExtentLayout function, traverse sheet frame where level and calculate the length of sheet frame and the width of sheet frame；With the length of sheet frame and
The width of sheet frame establishes plane right-angle coordinate, and the long place X-axis of sheet frame bears half toward Y-axis where the width of the extension of negative semiaxis and sheet frame is past
Axis extends intersection, and the intersection point of intersection is the first origin, is defined as coordinate (0,0)；The as origin of PCB.
In step S202, any via hole of BGA area in sheet frame is selected, executes axlAddSelectPoint function call
The coordinate (x, y) generated to selected via hole, and coordinate (x, y) is inputed into function axlDBChangeDesingOrigin；Function
Coordinate (x, y) is changed to the second origin (0,0) by axlDBChangeDesingOrigin.
In step S203, by SetGridsDisplayMain function setup grid point, according to the specification of BGA, by X
Axis and Y-axis raster width input to function SetGridsDisplayMain, generate the grid that the overall situation is X-axis and Y-axis raster width
Lattice point.
In step S204,0402 resistor-capacitor unit is moved on grid point.
Based on the method for placing 0402 resistor-capacitor unit under BGA package in a kind of PCB design proposed by the present invention, it is also proposed that one
The system of 0402 resistor-capacitor unit is placed in kind PCB design under BGA package.Attached drawing 3 gives one kind of the proposition of the embodiment of the present invention 1
The system schematic of 0402 resistor-capacitor unit is placed in PCB design under BGA package.
The system includes the first origin module, determines the second origin module, setting grid point module, mobile capacitance module；
Determine the first origin module for determine the first origin module for by execute first function, traversal sheet frame place
Level and calculate the length of sheet frame and the width of sheet frame；Plane right-angle coordinate, sheet frame are established with the width of the length of sheet frame and sheet frame
It is long where X-axis toward negative semiaxis extend and sheet frame it is wide where Y-axis extend toward negative semiaxis and intersect, the intersection point of the intersection is first
Origin is defined as coordinate (0,0)；
The second origin module is determined for selecting any via hole of BGA area in sheet frame, execution second function obtains selected
The coordinate (x, y) that via hole generates, and coordinate (x, y) is inputed into third function；The coordinate (x, y) is changed to by third function
Second origin (0,0)；
Grid module is set for the specification according to BGA, X-axis and Y-axis raster width are inputed into the 4th function, is generated complete
Office is the grid point of X-axis and Y-axis raster width；
Mobile capacitance module is used to 0402 resistor-capacitor unit being moved to grid point.
Wherein determine that the first origin module includes spider module and computing module；
Spider module is used to traverse the level where sheet frame by executing first function；
Computing module is used for by calculating the length of sheet frame and the width of sheet frame after the level where traversal sheet frame；With sheet frame
Length and the width of sheet frame establish plane right-angle coordinate, sheet frame it is long where X-axis toward negative semiaxis extend and sheet frame it is wide where Y-axis
Extend intersection toward negative semiaxis, the intersection point of intersection is the first origin, is defined as coordinate (0,0).
Determine that the second origin module includes via hole coordinate determining module and change module；
Via hole coordinate determining module is used to select any via hole of BGA area in sheet frame, and execution second function obtains selected
The coordinate (x, y) that via hole generates；
Change module is used to the coordinate (x, y) that selected via hole generates inputing to third function；Third function by coordinate (x,
Y) it is changed to the second origin (0,0).
It includes determining gauge modules and the global grid module of generation that grid module, which is arranged,；
Determine that specification of the gauge modules for BGA determines X-axis and Y-axis raster width；
It generates global grid module to be used to inputing to X-axis and Y-axis raster width into the 4th function, generating the overall situation is X-axis
With the grid point of Y-axis raster width.
First function is axlExtentLayout function, is one of them in AXL function, for traversal and slide ruler
It is very little；Second function is axlAddSelectPoint function, is to click to click increase object function in AXL function；Third function
AxlDBChangeDesingOrigin function is modification original point design function in AXL function；4th function
SetGridsDisplayMain is setting grid point function.
Above content is only to structure example of the invention and explanation, affiliated those skilled in the art
It makes various modifications or additions to the described embodiments or is substituted in a similar manner, without departing from invention
Structure or beyond the scope defined by this claim, be within the scope of protection of the invention.
Claims (8)
1. the method for 0402 resistor-capacitor unit is placed in a kind of PCB design under BGA package, which comprises the following steps:
S1: by execute first function, traverse sheet frame where level and calculate the length of sheet frame and the width of sheet frame；With sheet frame
Long and sheet frame width establishes plane right-angle coordinate, and X-axis where the length of sheet frame extends toward negative semiaxis and the wide place Y-axis of sheet frame is past
Negative semiaxis extends intersection, and the intersection point of the intersection is the first origin, is defined as coordinate (0,0)；
S2: selecting any via hole of BGA area in the sheet frame, execute second function obtain coordinate that selected via hole generates (x,
Y), and by the coordinate (x, y) input to third function；The coordinate (x, y) is changed to the second origin by the third function
(0,0)；
S3: according to the specification of BGA, X-axis and Y-axis raster width are inputed into the 4th function, generating the overall situation is X-axis and Y-axis grid
The grid point of lattice width；
S4: 0402 resistor-capacitor unit is moved on grid point.
2. the method for placing 0402 resistor-capacitor unit in a kind of PCB design according to claim 1 under BGA package, feature exist
In the distance of a length of sheet frame horizontal direction line segment of the sheet frame；The width of the sheet frame is the distance of sheet frame vertical direction line segment.
3. the method for placing 0402 resistor-capacitor unit in a kind of PCB design according to claim 1 under BGA package, feature exist
In the specification of the BGA includes 1mmBGA, 0.8mmBGA and 1.27mmBGA.
4. the method for placing 0402 resistor-capacitor unit in a kind of PCB design according to claim 3 under BGA package, feature exist
In when the specification of BGA is 1mmBGA, the X-axis and Y-axis raster width are 39.37/2, i.e., 19.685；
When the specification of BGA is 0.8mmBGA, the X-axis and Y-axis raster width are 39.37*0.8/2, i.e., 15.748；
When the specification of BGA is 1.27mmBGA, the X-axis and Y-axis raster width are 39.37*1.27/2, i.e., 24.999.
5. the system of 0402 resistor-capacitor unit is placed in a kind of PCB design under BGA package, which is characterized in that including determining the first origin
Module determines the second origin module, setting grid point module, mobile capacitance module；
Determination the first origin module is used for the level by executing first function, where traversal sheet frame and calculates sheet frame
Long and sheet frame width；Plane right-angle coordinate is established with the width of the length of sheet frame and sheet frame, the long place X-axis of sheet frame is prolonged toward negative semiaxis
Long and sheet frame wide place Y-axis extends toward negative semiaxis to intersect, and the intersection point of the intersection is the first origin, is defined as coordinate (0,0)；
Determination the second origin module is used to select any via hole of BGA area in the sheet frame, executes second function and obtains
The coordinate (x, y) that selected via hole generates, and the coordinate (x, y) is inputed into third function；The third function is by the seat
Mark (x, y) is changed to the second origin (0,0)；
The setting grid module is used for the specification according to BGA, and X-axis and Y-axis raster width are inputed to the 4th function, generates complete
Office is the grid point of X-axis and Y-axis raster width；
The mobile capacitance module is used to 0402 resistor-capacitor unit being moved to grid point.
6. the system for placing 0402 resistor-capacitor unit in a kind of PCB design according to claim 5 under BGA package, feature exist
In the first origin of determination module includes spider module and computing module；
The spider module is used to traverse the level where sheet frame by executing first function；
The computing module is used for by calculating the length of sheet frame and the width of sheet frame after the level where traversal sheet frame；With sheet frame
Length and the width of sheet frame establish plane right-angle coordinate, sheet frame it is long where X-axis toward negative semiaxis extend and sheet frame it is wide where Y-axis
Extend intersection toward negative semiaxis, the intersection point of the intersection is the first origin, is defined as coordinate (0,0).
7. the system for placing 0402 resistor-capacitor unit in a kind of PCB design according to claim 5 under BGA package, feature exist
In the second origin of determination module includes via hole coordinate determining module and change module；
The via hole coordinate determining module is used to select any via hole of BGA area in the sheet frame, executes second function and obtains
The coordinate (x, y) that selected via hole generates；
The change module is used to the coordinate (x, y) that the selected via hole generates inputing to third function；The third function
The coordinate (x, y) is changed to the second origin (0,0).
8. the system for placing 0402 resistor-capacitor unit in a kind of PCB design according to claim 5 under BGA package, feature exist
In the setting grid module includes determining gauge modules and the global grid module of generation；
Specification of the determining gauge modules for BGA determines X-axis and Y-axis raster width；
The global grid module of the generation is used to inputing to X-axis and Y-axis raster width into the 4th function, and generating the overall situation is X-axis
With the grid point of Y-axis raster width.
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112069761A (en) * | 2020-08-20 | 2020-12-11 | 之江实验室 | BGA packaging design method combined with decoupling capacitor |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103678771A (en) * | 2013-11-13 | 2014-03-26 | 北京工业大学 | Automatic layout method for power/ground TSV positions in 3D integrated circuit |
| CN104200024A (en) * | 2014-09-01 | 2014-12-10 | 山东超越数控电子有限公司 | Server PCB packaging coordinate setting method |
-
2019
- 2019-06-29 CN CN201910580800.8A patent/CN110377978B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103678771A (en) * | 2013-11-13 | 2014-03-26 | 北京工业大学 | Automatic layout method for power/ground TSV positions in 3D integrated circuit |
| CN104200024A (en) * | 2014-09-01 | 2014-12-10 | 山东超越数控电子有限公司 | Server PCB packaging coordinate setting method |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112069761A (en) * | 2020-08-20 | 2020-12-11 | 之江实验室 | BGA packaging design method combined with decoupling capacitor |
| CN112069761B (en) * | 2020-08-20 | 2022-10-11 | 之江实验室 | BGA packaging design method combined with decoupling capacitor |
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