CN203536437U - Thick film hybrid integrated circuit module - Google Patents
Thick film hybrid integrated circuit module Download PDFInfo
- Publication number
- CN203536437U CN203536437U CN201320739622.7U CN201320739622U CN203536437U CN 203536437 U CN203536437 U CN 203536437U CN 201320739622 U CN201320739622 U CN 201320739622U CN 203536437 U CN203536437 U CN 203536437U
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- Prior art keywords
- thick
- resistor
- film
- integrated circuit
- hybrid integrated
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- 238000009966 trimming Methods 0.000 claims abstract description 54
- 239000000919 ceramic Substances 0.000 claims abstract description 22
- 239000000758 substrate Substances 0.000 claims abstract description 13
- 238000000034 method Methods 0.000 abstract description 8
- 235000012431 wafers Nutrition 0.000 description 11
- 238000005516 engineering process Methods 0.000 description 4
- 238000005245 sintering Methods 0.000 description 2
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005538 encapsulation Methods 0.000 description 1
- 238000002955 isolation Methods 0.000 description 1
- 238000003698 laser cutting Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 239000002002 slurry Substances 0.000 description 1
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Abstract
The utility model discloses a thick film hybrid integrated circuit module, comprising a ceramic substrate and a passive network printed on the ceramic substrate. The module is improved in that the passive network comprises a plurality of thick-film resistors whose appearance is in an I shape and a thick-film resistor whose appearance is in an L shape. The L-shaped thick-film resistor comprises a first resistor portion and a second resistor portion which are integrated. The first resistor portion and the second resistor portion are connected vertically to form the L-shaped resistor. Two ends of the L-shaped resistor are respectively connected with an electrode. The first resistor portion is provided with a laser resistor trimming groove A. The second resistor portion is provided with a laser resistor trimming groove B. In a resistor trimming process, the thick film hybrid integrated circuit module can position through the L-shaped thick-film resistor, so that consistency of the laser resistor trimming grooves on all thick film hybrid integrated circuit modules are better.
Description
Technical field
The utility model relates to thick film circuit, relates in particular to a kind of hybrid integrated circuit module.
Background technology
Thick film hybrid integrated circuit is a kind of miniature electronic functional part, it is to utilize by thick-film techniques such as silk screen printing and sintering, on same substrate, to make passive network, and assemble discrete semiconductor device chip or monolithic integrated circuit or micro element thereon, then the hybrid integrated circuit that forms of additional encapsulation.
And passive network is poured on thick film ink on silk screen, with scraper plate, slurry is pressed into mesh, bite and form on substrate, in this passive network, generally all include thick-film resistor, and thick-film resistor also needs to carry out sintering, laser resistor trimming etc. after forming, wherein, even if laser resistor trimming is adjusted to satisfactory value by laser cutting by the resistance value of each thick-film resistor.In laser resistor trimming process, be generally that whole ceramic wafer is put into laser resistor trimming equipment, on every ceramic wafer, there are a plurality of same thick film hybrid integrated circuit modules, the thick-film resistor on each thick film hybrid integrated circuit module needs to adjust.When ceramic wafer is put on the tool of laser resistor trimming equipment, need to position ceramic wafer, the outward flange of available technology adopting ceramic wafer positions, this locate mode, owing to there is error in the size of ceramic wafer, so each piece ceramic wafer position on tool exists error, so, in laser resistor trimming process, the laser resistor trimming grooving position on different ceramic wafers on thick-film resistor is inconsistent, and the consistency of the laser resistor trimming grooving on each thick film hybrid integrated circuit module is poor.In addition, laser resistor trimming grooving is generally " L " shape or " one " font, in its tip location, easily occurs point discharge, causes resistance to pressure lower.
Utility model content
The purpose of this utility model is to overcome deficiency of the prior art and a kind of thick film hybrid integrated circuit module with " L " shape thick-film resistor of providing, can, by " L " shape thick-film resistor as location, make the laser resistor trimming grooving consistency on each thick film hybrid integrated circuit module better.
The technical scheme that the utility model solution prior art problem adopts is: a kind of thick film hybrid integrated circuit module, it comprises ceramic substrate and is printed on the passive network on ceramic substrate, and its improvement is: in described passive network, comprise a plurality of profiles be " one " font one " font thick-film resistor and " L " shape thick-film resistor that profile is L-shaped;
Described " L " shape thick-film resistor comprises integrated the first resistance section and the second resistance section, described the first resistance section " L " shape resistive element of being connected to form vertical with the second resistance section, and the two ends of described " L " shape resistive element connect respectively an electrode;
Described the first resistance section is provided with laser resistor trimming grooving A, and described the second resistance section is provided with laser resistor trimming grooving B.
Below technique scheme is further elaborated:
Further, described laser resistor trimming grooving A and laser resistor trimming grooving B are " one " font; Described laser resistor trimming grooving A is vertical with described the first resistance section, and described laser resistor trimming grooving B is vertical with described the second resistance section.
Further, described " L " shape thick-film resistor is arranged at and on described ceramic substrate, keeps to the side or the position of corner.
Further, described " one " font thick-film resistor comprises " one " font resistive element and is arranged at the electrode at " one " font resistive element two ends, laser resistor trimming grooving C is set on described resistive element.
Further, described laser resistor trimming grooving C is " U " shape.
The beneficial effects of the utility model are: one, the thick film hybrid integrated circuit module that the utility model provides, by being provided with thereon " L " shape thick-film resistor, in laser resistor trimming process, can be by positioning by " L " shape thick-film resistor, concrete, because " L " the shape thick-film resistor position on each thick film hybrid integrated circuit module is identical, so can utilize laser resistor trimming grooving A on " L " shape thick-film resistor and laser resistor trimming grooving B as location reference, go again other thick-film resistors to carry out resistance trimming, so, laser resistor trimming grooving position on each thick film hybrid integrated circuit module on other thick-film resistors can be consistent, can make the consistency of laser resistor trimming grooving on each thick film hybrid integrated circuit module better, two, on " one " font thick-film resistor, laser resistor trimming grooving C is " U " shape, and the L shaped or yi word pattern grooving with respect in technology, can not produce the problems such as point discharge, can improve the withstand voltage of thick-film resistor.
Accompanying drawing explanation
Fig. 1 is the overall structure schematic diagram of the utility model embodiment;
Fig. 2 is the partial enlarged drawing at A place in Fig. 1;
Fig. 3 is the structural representation of " one " font thick-film resistor in the utility model embodiment;
Fig. 4 is the ceramic wafer with a plurality of the utility model thick film hybrid integrated circuit modules.
The realization of the utility model object, functional characteristics and advantage, in connection with embodiment, are described further with reference to accompanying drawing.
Embodiment
Below with reference to drawings and the specific embodiments, describe the technical solution of the utility model in detail, so as clearer, understand invention essence of the present utility model intuitively.
Shown in Fig. 1, the utility model provides a kind of thick film hybrid integrated circuit module 100, it comprises ceramic substrate 10 and is printed on the passive network on ceramic substrate 10, comprises " one " font thick-film resistor 20 and " L " shape thick-film resistor 30 that profile is L-shaped that a plurality of profiles are " one " font in described passive network.Should comprise integrated the first resistance section 301 and the second resistance section 302 by " L " shape thick-film resistor 30, described the first resistance section 301 " L " shape resistive element of being connected to form vertical with the second resistance section 302, the two ends of described " L " shape resistive element connect respectively an electrode 303; Described the first resistance section 301 is provided with laser resistor trimming grooving A3011, and described the second resistance section 302 is provided with laser resistor trimming grooving B3021.
Shown in Fig. 2, laser resistor trimming grooving A3011 and laser resistor trimming grooving B3021 are " one " font; Described laser resistor trimming grooving A3011 is vertical with described the first resistance section 301, and described laser resistor trimming grooving B3021 is vertical with described the second resistance section 302.
" L " shape thick-film resistor 30 is arranged at and on described ceramic substrate 10, keeps to the side or the position of corner, so, is convenient to thick film hybrid integrated circuit module 100 location fast in laser resistor trimming equipment.
Owing to adopting said structure, the thick film hybrid integrated circuit module 100 that the utility model provides, in laser resistor trimming process, can be by positioning by " L " shape thick-film resistor 30, concrete, shown in Fig. 4, whole ceramic wafer 200 is put into laser resistor trimming equipment, on every ceramic wafer 200, there are a plurality of same thick film hybrid integrated circuit modules 100, because " L " shape thick-film resistor 30 positions on each thick film hybrid integrated circuit module 100 are identical, so can utilize on " L " shape thick-film resistor 30 laser resistor trimming grooving A3011 and laser resistor trimming grooving B3021 as location reference, go again other thick-film resistors to carry out resistance trimming, so, laser resistor trimming grooving position on each thick film hybrid integrated circuit module 100 on other thick-film resistors can be consistent, can make the consistency of laser resistor trimming grooving on each thick film hybrid integrated circuit module 100 better.
Shown in Fig. 3, " one " font thick-film resistor 20 in the present embodiment comprises " one " font resistive element 201 and is arranged at the electrode 202 at " one " font resistive element 201 two ends, laser resistor trimming grooving C2011 is set on described resistive element 202, and this laser resistor trimming grooving C2011 is " U " shape.The laser resistor trimming grooving C2011 of this " U " shape, the active component that is positioned at U-shaped inside is completely severed, with other part isolation, therefore, there is not tip portion, with respect to the L shaped or yi word pattern grooving in technology, the problems such as point discharge can be do not produced, the withstand voltage of thick-film resistor can be improved.
The foregoing is only preferred embodiment of the present utility model; not thereby limit the scope of the claims of the present utility model; every equivalent structure or conversion of equivalent flow process that utilizes the utility model specification and accompanying drawing content to do; or be directly or indirectly used in other relevant technical fields, be all in like manner included in scope of patent protection of the present utility model.
Claims (5)
1. a thick film hybrid integrated circuit module, it comprises ceramic substrate and is printed on the passive network on ceramic substrate, it is characterized in that: in described passive network, comprise " one " font thick-film resistor and " L " shape thick-film resistor that profile is L-shaped that a plurality of profiles are " one " font;
Described " L " shape thick-film resistor comprises integrated the first resistance section and the second resistance section, described the first resistance section " L " shape resistive element of being connected to form vertical with the second resistance section, and the two ends of described " L " shape resistive element connect respectively an electrode;
Described the first resistance section is provided with laser resistor trimming grooving A, and described the second resistance section is provided with laser resistor trimming grooving B.
2. thick film hybrid integrated circuit module according to claim 1, is characterized in that: described laser resistor trimming grooving A and laser resistor trimming grooving B are " one " font; Described laser resistor trimming grooving A is vertical with described the first resistance section, and described laser resistor trimming grooving B is vertical with described the second resistance section.
3. thick film hybrid integrated circuit module according to claim 1 and 2, is characterized in that: described " L " shape thick-film resistor is arranged at and on described ceramic substrate, keeps to the side or the position of corner.
4. thick film hybrid integrated circuit module according to claim 1, it is characterized in that: described " one " font thick-film resistor comprises " one " font resistive element and is arranged at the electrode at " one " font resistive element two ends, laser resistor trimming grooving C is set on described resistive element.
5. thick film hybrid integrated circuit module according to claim 4, is characterized in that: described laser resistor trimming grooving C is " U " shape.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320739622.7U CN203536437U (en) | 2013-11-20 | 2013-11-20 | Thick film hybrid integrated circuit module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201320739622.7U CN203536437U (en) | 2013-11-20 | 2013-11-20 | Thick film hybrid integrated circuit module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203536437U true CN203536437U (en) | 2014-04-09 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201320739622.7U Expired - Lifetime CN203536437U (en) | 2013-11-20 | 2013-11-20 | Thick film hybrid integrated circuit module |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203536437U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115846893A (en) * | 2023-03-03 | 2023-03-28 | 长春光华微电子设备工程中心有限公司 | Method for realizing photoetching cutter type |
-
2013
- 2013-11-20 CN CN201320739622.7U patent/CN203536437U/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115846893A (en) * | 2023-03-03 | 2023-03-28 | 长春光华微电子设备工程中心有限公司 | Method for realizing photoetching cutter type |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20140409 |