CN205657918U - 易金属化导通的内嵌电容多层印制板 - Google Patents
易金属化导通的内嵌电容多层印制板 Download PDFInfo
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CN114585157A (zh) * | 2020-12-01 | 2022-06-03 | 深南电路股份有限公司 | 埋容线路板的制作方法及埋容线路板 |
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Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
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CN114585157A (zh) * | 2020-12-01 | 2022-06-03 | 深南电路股份有限公司 | 埋容线路板的制作方法及埋容线路板 |
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Legal Events
Date | Code | Title | Description |
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C14 | Grant of patent or utility model | ||
GR01 | Patent grant | ||
TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20171110 Address after: Kunshan City Qiandeng Town in Jiangsu province 215341 1000 Yang Road, No. 2 Patentee after: Jiangsu Suhang Electronic Co., Ltd. Address before: Kunshan City Qiandeng Town 1000 Yang Road of Suzhou city Jiangsu province 215341 No. 2 Patentee before: Kunshan Suhang Circuit Board Co., Ltd. |
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TR01 | Transfer of patent right | ||
TR01 | Transfer of patent right |
Effective date of registration: 20180425 Address after: No. 2, Qian Yang Town, Qian Deng Town, Kunshan, Jiangsu Patentee after: Kunshan Suhang Circuit Board Co., Ltd. Address before: No. 2, Qian Yang Town, Qian Deng Town, Kunshan, Jiangsu Patentee before: Jiangsu Suhang Electronic Co., Ltd. |