CN205656630U - Electronic equipment with fingerprint sensing function - Google Patents

Abstract

The utility model discloses an electronic equipment with fingerprint sensing function. Electronic equipment includes first portion and second portion including the protection apron, the thickness of second portion is less than the thickness of first portion, capacitanc fingerprint sensing chip for sensing user's fingerprint information, and the conducting layer, with the capacitanc fingerprint sensing chip all be located the homonymy of protection apron, just the conducting layer is located around the capacitanc fingerprint sensing chip, the conducting layer is used for loading ground signal, whole or the part cover of second portion the conducting layer. Electronic equipment with fingerprint sensing function's fingerprint sensing sensitivity is higher.

Description

There is the electronic equipment of fingerprint sensing function

Technical field

This utility model relates to fingerprint sensing technical field, particularly relates to a kind of electronics with fingerprint sensing function and sets Standby.

Background technology

At present, it is positioned over the fingerprint sensing devices in electronic equipment front, is typically employed in the cover sheet of electronic equipment On carry out perforate, by fingerprint sensing devices with control button (Home key) combine, be placed in described perforate, So, it is so designed that for those in cover sheet not perforate but use the electronics of virtual controlling button to set on the market From the point of view of Bei and inapplicable.

Correspondingly, on the cover sheet of electronic equipment not perforate and dispose fingerprint sensing devices below cover sheet The market demand of (that is, the inside of electronic equipment) is strong.So, in the side of cover sheet positioned beneath fingerprint sensing devices Case makes the sensing signal of fingerprint sensing devices become more weak, causes fingerprint sensing the sensitiveest.

Utility model content

In order to solve above-mentioned technical problem, this utility model provide one arrange under cover sheet fingerprint sensing devices, And the electronic equipment that fingerprint sensing sensitivity is higher.

For achieving the above object, the following technical scheme of this utility model offer:

A kind of electronic equipment, including:

Cover sheet, including Part I and Part II, the thickness of described Part II is less than the thickness of Part I Degree；

Capacitance type fingerprint sensor chip, for sensing the finger print information of user；With

Conductive layer, and the homonymy that described capacitance type fingerprint sensor chip is respectively positioned on described cover sheet, and described conduction Layer is positioned at around described capacitance type fingerprint sensor chip；

Described Part II completely or partially covers described conductive layer.

Alternatively, described conductive layer is closed or non-enclosed ring-shaped conductive layer.

Alternatively, described capacitance type fingerprint sensor chip is positioned at described conductive layer area encompassed.

Alternatively, described conductive layer is used for loading ground signalling.

Alternatively, described conductive layer is for persistently loading ground connection when capacitance type fingerprint sensor chip performs fingerprint sensing Signal.

Alternatively, described conductive layer for only loading ground connection letter when capacitance type fingerprint sensor chip performs fingerprint sensing Number.

Alternatively, described electronic equipment include equipment ground, described equipment ground load ground signalling, described conductive layer with The electrical connection of described equipment ground.

Alternatively, described conductive layer is for loading ground connection when described capacitance type fingerprint sensor chip performs fingerprint sensing Signal, with described capacitance type fingerprint sensor chip, constitutes a closing of circuit loop equipment.

Alternatively, described electronic equipment farther includes touch sensing layer；Described cover sheet include first surface and The second surface relative with first surface；Described touch sensing layer, described conductive layer and described capacitance type fingerprint sense Survey chip and be arranged at the second surface side of cover sheet.

Alternatively, described Part II is to be formed to second surface depression by first surface, or/and, described second It is divided into and being formed to first surface depression by second surface.

Alternatively, described Part II completely or partially covers described capacitance type fingerprint sensor chip.

Alternatively, cover the Part II of described conductive layer and cover second of described capacitance type fingerprint sensor chip It is divided into a part of or different parts.

Alternatively, described Part I is just arranged by described capacitance type fingerprint sensor chip, does not weigh with Part II Folded.

Alternatively, described conductive layer adheres on a second surface.

Alternatively, described electronic equipment farther includes substrate, and described touch sensing layer is arranged on the substrate, Arranging through hole on described substrate, described conductive layer and described capacitance type fingerprint sensor chip are positioned in described through hole.

Alternatively, described electronic equipment farther includes substrate, described substrate and described capacitance type fingerprint sensor chip, Conductive layer is respectively positioned on the homonymy of described cover sheet, and described substrate arranges through hole, described conductive layer and described electric capacity Formula fingerprint sensing chip is positioned in described through hole.

Alternatively, described capacitance type fingerprint sensor chip includes induction electrode array and is connected with induction electrode array Testing circuit, described testing circuit is used for providing pumping signal to induction electrode array, drives described induction electrode Array performs fingerprint sensing.

Alternatively, described testing circuit includes that signal transmission ends and the first earth terminal, described first earth terminal are used for adding Carry modulated signal, described signal transmission ends be used for providing pumping signal to induction electrode array, described pumping signal with The rising of described modulated signal and raise, reduce with the reduction of described modulated signal.

Alternatively, described electronic equipment includes that fingerprint sensing module, described fingerprint sensing module include described condenser type Fingerprint sensing chip, the second earth terminal and modulation circuit；Described second earth terminal is used for loading described ground signalling, Described modulation circuit is connected between described second earth terminal and the first earth terminal, drives with one according to described ground signalling Dynamic signal produces described modulated signal, and provides described modulated signal to the first earth terminal.

Alternatively, described electronic equipment farther includes mainboard, and described fingerprint sensing module farther includes flexible electrical Road plate, described flexible PCB is used for connecting described mainboard and described capacitance type fingerprint sensor chip, at described mainboard And transmit signal between described capacitance type fingerprint sensor chip.

Alternatively, described capacitance type fingerprint sensor chip is self-capacitance fingerprint sensing chip.

Alternatively, described electronic equipment is portable electronic product or household formula electronic product.

Owing to described electronic equipment arranges conductive layer around capacitance type fingerprint sensor chip further, thus, electric capacity The intensity of the fingerprint sensing signal of formula fingerprint sensing chip can be improved, and then, the fingerprint sensing spirit of electronic equipment Sensitivity is improved.Further, cover sheet is thinning in the position of corresponding conductive layer, can further improve fingerprint The intensity of sensing signal.

Although disclosing multiple embodiment, change including it, but open by illustrate and describing this utility model The following detailed description of illustrative embodiment, this utility model other embodiments disclosed are by the skill to art Art personnel are apparent.Can revise at various obvious aspects it will be recognized that this utility model is open, institute There is amendment all without departing from spirit and scope of the present utility model.Correspondingly, accompanying drawing and describe in detail substantially should be by It is considered as illustrative and not restrictive.

Accompanying drawing explanation

Describe its example embodiment, feature of the present utility model and advantage in detail by referring to accompanying drawing will become more Substantially.

Fig. 1 is the decomposed structural representation of this utility model electronic equipment.

Fig. 2 is the part assembling structure schematic diagram of electronic equipment shown in Fig. 1.

Fig. 3 is the fingerprint sensing circuit diagram omitting conductive layer.

Fig. 4 is the fingerprint sensing circuit diagram including loading the conductive layer of ground signalling.

Fig. 5 is the schematic diagram of the another embodiment of Fig. 2 conductive layer.

Fig. 6 is the electrical block diagram of electronic equipment shown in Fig. 2.

Fig. 7 is the partial sectional schematic view of electronic equipment shown in Fig. 1.

Fig. 8 is the partial sectional schematic view of a change embodiment of electronic equipment shown in Fig. 1.

Fig. 9 is the partial sectional schematic view of the another change embodiment of electronic equipment shown in Fig. 1.

Figure 10 is the partial sectional schematic view of the another change embodiment of electronic equipment shown in Fig. 1.

Figure 11 is the partial sectional schematic view of the another change embodiment of electronic equipment shown in Fig. 1.

Figure 12 is the partial sectional schematic view of the another change embodiment of electronic equipment shown in Fig. 1.

Figure 13 is the partial sectional schematic view of the another change embodiment of electronic equipment shown in Fig. 1.

Figure 14 is the partial sectional schematic view of the another change embodiment of electronic equipment shown in Fig. 1.

Detailed description of the invention

It is described more fully with example embodiment referring now to accompanying drawing.But, example embodiment can be with multiple Form is implemented, and is not understood as limited to embodiment set forth herein；On the contrary, it is provided that these embodiments make Obtaining this utility model will fully and completely, and the design of example embodiment conveys to the technology of this area all sidedly Personnel.For convenience or clear, may exaggerate, omit or be schematically illustrated in the thickness of every layer shown in accompanying drawing With size and the quantity that schematically illustrates related elements.It addition, the size of element not exclusively reflects actual size, And the quantity incomplete reaction actual quantity of related elements.

Additionally, described feature, structure can be combined in one or more embodiment in any suitable manner In.In the following description, it is provided that many details thus be given embodiment of the present utility model abundant Understand.But, one of ordinary skill in the art would recognize that, do not have in described specific detail is one or more, or Use other structure, constituent element etc., it is also possible to put into practice the technical solution of the utility model.In other cases, no It is shown specifically or describes known features or operation to avoid fuzzy this utility model.

Of the present utility model embodiment is described below in detail, and the example of described embodiment is shown in the drawings, wherein certainly Begin to same or similar label eventually represent same or similar element or there is the element of same or like function.Under Face is exemplary by the embodiment being described with reference to the drawings, it is intended to user explains this utility model, and is not understood that For to restriction of the present utility model.

In description of the present utility model, it is to be understood that term " thickness ", " on ", D score, " front ", " afterwards ", "left", "right", " vertically ", " level ", " top ", " end ", " interior ", " outward " It is based on orientation shown in the drawings or position relationship in the orientation indicated or position relationship, is for only for ease of description originally Utility model and simplifying describes rather than instruction or the hint position of indication or element must have specific method, With specific azimuth configuration and operation, therefore it is not intended that to restriction of the present utility model.

In this utility model, unless otherwise clearly defined and limited, term " install ", " being connected ", " even Connect ", the term such as " fixing " should be interpreted broadly, connect for example, it may be fixing, it is also possible to be detachably to connect Connect, or integral；Can be to be mechanically connected, it is also possible to be electrical connection；Can be to be directly connected to, it is also possible to be logical Cross intermediary to be indirectly connected with, can be connection or the interaction relationship of two elements of two element internals.Right For those of ordinary skill in the art, can understand that above-mentioned term is in this utility model as the case may be Concrete meaning.

Further, in description of the present utility model, it is to be understood that: " multiple " include two and two Above, unless this utility model separately has the most concrete restriction.It addition, each element title and signal name go out Words such as existing " first ", " second " is not to limit element or the sequencing of signal appearance, but the side of being Just element name, clearly distinguishes each element so that describe more succinct.

At present, the electronic equipment being provided with fingerprint sensing chip in front would generally configure one around fingerprint sensing chip Becket, described becket for loading the pumping signal of change, with the sensing electrode in fingerprint sensing chip Array forms mutual capacitance, thus performs fingerprint sensing.

Found by the lot of experiments of inventor, fingerprint sensing chip and becket are all displaced to cover sheet If lower section (electronic equipment internal), in view of the decay in transmitting procedure of the thickness of cover sheet, pumping signal, with And pumping signal is protected the factors such as the interference inside and outside cover plate, the pumping signal on becket passes protection cap The signal intensity coupleding on fingerprint sensing chip after plate becomes more weak, therefore, uses above-mentioned capacitance type fingerprint sense The fingerprint sensing sensitivity of the electronic equipment of survey mode is relatively low.

For improving the intensity of the fingerprint sensing signal being arranged on the fingerprint sensing chip below cover sheet, inventor's warp Cross a large amount of creative work and experimentation test proposes the electronic equipment that the application is following.

Before introducing the electronic equipment of the application, in addition it is also necessary to further illustrate mutual capacitance type fingerprint sensing module and oneself The basic functional principle of capacitance type sensing module.

In fingerprint sensing module based on mutual capacitance type, fingerprint sensing module includes fingerprint sensing chip and becket, Described fingerprint sensing chip includes the detection electricity that sensor electrode array is connected respectively with sensor electrode array and becket Road.Mutual capacitance is formed between described becket and described sensor electrode array.Described testing circuit provides swashing of change Encouraging signal to becket, described sensor electrode array exports corresponding fingerprint sensing signal to testing circuit.Described inspection Slowdown monitoring circuit obtains information in fingerprint according to described sensing signal.

Relatively, in fingerprint sensing module based on self-capacitance, fingerprint sensing module can be saved aforementioned loading and become The becket of the pumping signal changed.The testing circuit of self-capacitance fingerprint sensing chip provides excitation letter by data wire Number give sensor electrode array, and receive fingerprint sensing signal by identical data wire from sensor electrode array.Described Sensor electrode array includes the sensing electrode of multiple formation self-capacitance over the ground.At an object (e.g., finger) close to described During sensing electrode, another direct-to-ground capacitance can be formed between this object and described sensing electrode.

See also the decomposed structure that Fig. 1 and Fig. 2, Fig. 1 are this utility model electronic equipment one embodiment to show It is intended to.Fig. 2 is the part assembling structure schematic diagram of electronic equipment shown in Fig. 1.Described electronic equipment 100 is such as can Take formula electronic product or household formula electronic product.Wherein, portable electronic product is as various mobile terminals, such as, Each electronic product such as mobile phone, panel computer, notebook computer and Wearable product；Household formula electronic product As for each electronic product such as intelligent door lock, TV, refrigerator, desktop computers.It should be noted that electronic equipment 100 can increase the element not shown in diagram further or reduce some element shown in diagram, according to different electricity Sub-product can corresponding selection.Described electronic equipment 100 includes cover sheet 10, capacitance type fingerprint sensor chip 12 and conductive layer 14.Described cover sheet 10 is arranged on the front side of electronic equipment 100, to electronic equipment 100 Play the effect of protection, such as, prevent the materials such as grieshoch from entering electronic equipment 100 inside etc..Described capacitance type fingerprint Sensor chip 12 is for sensing the finger print information of target object.Described target object such as the finger for user, so, institute Stating target object and be not limited to finger, described target object can also be other suitable objects such as toe, main below To illustrate as a example by finger.Described conductive layer 14 is used for loading ground signalling, to improve capacitance type fingerprint sensing The sensing signal intensity of chip 12.

Generally, electronic equipment 100 includes equipment ground.Described equipment ground also known as systematically, for example, electronic equipment 100 The negative pole of power supply, power supply is as battery, described power supply end such as the positive pole for battery.Equipment ground For loading ground signalling, therefore, ground signalling is also known as equipment earth signal or systematically signal.Described ground signalling For constant voltage signal, as the voltage reference of circuit each in electronic equipment 100, described ground signalling is such as For voltage signals such as 0V (volt), 2V, (-1) V.Generally, the equipment ground or systematically and native to this world of electronic equipment 100 The earth or definitely the most greatly.So, when electronic equipment 100 is connected with earth ground by conductor, described equipment ground is also It can be earth ground.

Described cover sheet 10 includes first surface 101 and the second surface 103 relative with first surface 101.Institute Stating the outer surface that first surface 101 is electronic equipment 100, described second surface 103 is positioned at described electronic equipment 100 Inside.Glass that described cover sheet 10 is the most transparent or sapphire cover plate, so, described cover sheet 10 Material be alternatively other suitable material, be not limited to glass or sapphire cover plate, the most alternatively film cover Plate.Further, described cover sheet 10 is alternatively translucent or nontransparent cover plate, and the application is not limiting as protecting Protecting cover plate 10 is transparent cover plate.

Described capacitance type fingerprint sensor chip 12 is arranged on second surface 103 side of cover sheet 10, is used for feeling Survey the finger print information that user inputs from the first surface 101 of cover sheet 10.In the present embodiment, described electric capacity Formula fingerprint sensing chip 12 is self-capacitance fingerprint sensing chip.So, it should be noted that described capacitance type fingerprint Sensor chip 12 is alternatively the capacitance type fingerprint sensor chips such as self-capacitance or the mutual capacitance type of other suitable type, and It is not limited to the self-capacitance fingerprint sensing chip of herein described type.

Described conductive layer 14 is arranged on second surface 103 side of cover sheet 10, and is positioned at described condenser type and refers to Around stricture of vagina sensor chip 12.Described conductive layer 14 is for when capacitance type fingerprint sensor chip 12 performs fingerprint sensing Load ground signalling.Preferably, touch on cover sheet 10 just to capacitance type fingerprint sensor chip 12 when finger Region time, can together touch on cover sheet 10 region just to conductive layer 14.

Seeing also Fig. 3 and Fig. 4, Fig. 3 is the fingerprint sensing circuit diagram omitting conductive layer 14.Fig. 4 is Fingerprint sensing circuit diagram including the conductive layer 14 loading ground signalling.As seen from Figure 3, at finger F, electricity In the circuit loop formed between appearance formula fingerprint sensing chip 12 and systematically GND, finger F, cover sheet Electric capacity Cf it is formed with, finger F, cover sheet 10 and systematically between 10 and capacitance type fingerprint sensor chip 12 Electric capacity Cs it is formed with between GND.

Relatively, in the diagram, due to electronic equipment 100 include load ground signalling conductive layer 14, therefore, Be equal to an electric capacity Ci the most in parallel at electric capacity Cs two ends, described electric capacity Ci by finger F, cover sheet 10, Conductive layer 14 is constituted.According to circuit theory, the impedance between finger F to systematically GND diminishes, accordingly Ground, the intensity of the fingerprint sensing signal of capacitance type fingerprint sensor chip 12 can be improved.

Owing to electronic equipment 100 of the present utility model is arranged further in second surface 103 side of cover sheet 10 Load the conductive layer 14 of ground signalling, thus, the intensity of the fingerprint sensing signal of capacitance type fingerprint sensor chip 12 obtains To improving, and then, the fingerprint sensing sensitivity of electronic equipment 100 is improved.

Usually, described capacitance type fingerprint sensor chip 12 be shaped as elongated rectangular shape, it addition, in order to increase electronics The visual range of equipment 100, in the present embodiment, described conductive layer 14 is a rectangular ring, closed around Described capacitance type fingerprint sensor chip 12 region is arranged.So, changing ground, described conductive layer 14 is alternatively Other shape, as circular, oval ring-type, it addition, described conductive layer 14 also can be non-enclosed around described electric capacity Formula fingerprint sensing chip 12 is arranged, such as it is shown in figure 5, described conductive layer 14 is divided into several sections.

Described conductive layer 14 is as used the Suitable conductive such as silver slurry, molybdenum lithium molybdenum, tin indium oxide, nanometer silver or Graphene Material is made.Described conductive layer 14 is formed at for example with suitably production method such as coating, spraying or impressing etc. On two surfaces 103.

Described capacitance type fingerprint sensor chip 12 is attached on second surface 103 for example with the mode pasted.So, Before the mode that described capacitance type fingerprint sensor chip 12 and conductive layer 14 are formed on second surface 103 is not limited to State the mode of stickup, it is possible to use other suitable set-up mode, such as impressing etc..It addition, described condenser type refers to Stricture of vagina sensor chip 12 also directly can be pressed close to second surface 103 or fit, and and unrestricted employing third party's physics be situated between Matter secures the two together.Further, described conductive layer 14 is with described capacitance type fingerprint sensor chip 12 also Can be to arrange near second surface 103, and non-limiting contact with second surface 103.

Refer to the electrical block diagram of the embodiment that Fig. 6, Fig. 6 are electronic equipment 100 shown in Fig. 2.Institute State conductive layer 14 and connect equipment ground GND.Described capacitance type fingerprint sensor chip 12 includes induction electrode array 121 And the testing circuit 123 being connected with induction electrode array 121.Described testing circuit 123 is used for providing pumping signal To induction electrode array 121, described induction electrode array 121 is driven to perform capacitance type fingerprint sensing.Described detection electricity Road 123 is further used for receiving the sensing signal (also referred to as " fingerprint sensing signal ") of induction electrode array 121 output, And obtain information in fingerprint according to sensing signal.In the present embodiment, described testing circuit 123 is used for driving Innervation answers electrod-array 121 to perform self-capacitance fingerprint sensing.

Described induction electrode array 121 includes multiple induction electrode 122.The plurality of induction electrode 122 is in array Arrangement, the shape for example, rectangle of each electrode 122, so, it is possible to for other various suitable shapes.It addition, The size and shape of each electrode 122 is identical, so, it is possible to select difference.The plurality of induction electrode 122 can be with Coupled capacitance-wise is to finger F (see Fig. 3 and Fig. 4).

Further, described testing circuit 123 includes signal transmission ends T and the first earth terminal G1.Described first connects Ground end G1 for load-modulate signal, described signal transmission ends T be used for providing pumping signal to induction electrode 122, Described pumping signal changes with the change of described modulated signal.Wherein, described pumping signal is with described modulated signal Rising and raise, reduce with the reduction of described modulated signal.

Described testing circuit 123 farther includes power end P1, described power end P1 for loading power voltage, institute State supply voltage to change with the change of described modulated signal.Pressure between described supply voltage and described modulated signal Difference keeps constant, and described pressure reduction is the described testing circuit 123 rated voltage when working.

Signal in described testing circuit 123 the most all raises, with described modulation with the rising of described modulated signal The reduction of signal and reduce.That is, the signal in described testing circuit 123 is unified modulated signal and is modulated.

Comparative apparatus ground GND loads constant ground signalling, the first earth terminal G1 load change modulated signal and Non-described ground signalling, thus be conducive to improving the signal to noise ratio of fingerprint sensing signal, and then electricity can be improved further The fingerprint sensing sensitivity of subset 100.

It should be noted that in the present embodiment, the first earth terminal G1 is used for load-modulate signal, so, variable More, other suitable terminals in testing circuit 123 also can load-modulate signal, it is not limited to the first earth terminal G1 is used for load-modulate signal.Such as, the power end P1 in testing circuit 123 can also be used for load-modulate signal, Correspondingly, the modulation that the signal that described pumping signal and the first earth terminal G1 are loaded is loaded with power end P1 The change of signal and change.

Described modulated signal for example, includes described ground signalling and a signal driving signal.In the present embodiment, Described driving signal is higher than ground signalling, and described driving signal is boost signal compared to ground signalling.Further, The most periodically variable square-wave signal of described modulated signal.So, changing ground, described modulated signal is alternatively Nonperiodic signal, it addition, described modulated signal is alternatively the signal of other suitable waveform, it is not limited to square wave is believed Number.Described driving signal may be lower than ground signalling, and described driving signal is buck signal compared to ground signalling.

Owing to described capacitance type fingerprint sensor chip 12 provides the pumping signal changed with modulated signal change to sensing Electrode 122, therefore, can improve the signal to noise ratio of fingerprint sensing signal, correspondingly, it is possible to increase fingerprint sensing signal Intensity.So, the sensitivity arranging capacitance type fingerprint sensor chip 12 below cover sheet 10 improves further.

In the above-described embodiment, the first earth terminal G1 is for loading the modulated signal of change.So, the application is not As limit, changing ground, described first earth terminal G1 can also be used for loading described ground signalling.

Referring again to Fig. 1 and Fig. 6, described electronic equipment 100 includes fingerprint sensing module 1.Described fingerprint sensing mould Group 1 includes described capacitance type fingerprint sensor chip the 12, second earth terminal G2 and modulation circuit 16.Described second Earth terminal G2, for being connected with equipment ground GND, loads described ground signalling.Described modulation circuit 16 is connected to institute State between the second earth terminal G2 and the first earth terminal G1, and receive described driving signal, according to described ground signalling Produce described modulated signal with described driving signal, and export described modulated signal to the first earth terminal G1.In this reality Executing in mode, the signal in described testing circuit 123 all changes with the change of modulated signal of the first earth terminal G1.

Change ground, in other embodiments, in described testing circuit 123 also can the signal of partial circuit modulated The modulation of signal processed, changing with the change of modulated signal of the first earth terminal G1, the signal of partial circuit is not by The modulated signal of one earth terminal G1 is modulated.

Described modulation circuit 16 such as includes two-transistor and a controller, and wherein a transistor receives described driving letter Number, a transistor receives described ground signalling, and described controller is controlled by controlling described two-transistor alternate conduction Make described two-transistor and alternately export described ground signalling with described driving signal to form described modulated signal.So, Described modulation circuit 16 is not limited to structure described here, it is possible to for other suitable circuit structure.

Please continue to refer to Fig. 1 and Fig. 6, described electronic equipment 100 farther includes mainboard 2, and described mainboard 2 includes Main control chip 21.Described main control chip 21 includes the 3rd earth terminal G3 and power end P2.Described 3rd earth terminal G3 is used for connecting equipment ground GND.Described power end P2 gives described power end P1 for output supply voltage.Described Communication interface (sign) is set between main control chip 21 and described capacitance type fingerprint sensor chip 12 further, to enter Row information communicates.

Described main control chip 21 can be one chip, it is also possible to be a chipset.When main control chip 21 is chip During group, described chipset includes application processor (Application Processor, AP) and power supply chip.It addition, institute State chipset and can farther include storage chip.It addition, described application processor also can be replaced by central processing unit (Central Processing Unit,CPU)。

Further, in order to avoid the electricity of power end P1 occurs when the signal on the first earth terminal G1 is and drives signal Stream is anti-fills the situation being back to power end P2, described fingerprint sensing module 1 farther include to be arranged at power end P1 with Protection circuit 17 between power end P2.Described protection circuit 17 is higher than for the supply voltage on power end P1 Supply voltage on power end P2 or when being predetermined value higher than the supply voltage on power end P2, deenergization end P2 And the connection between power end P1.

Described protection circuit 17 such as includes a diode being connected between power end P2 and power end P1, or Including the control unit being connected and transistor, the control end (such as, grid) of described transistor connects control unit, The control two of described transistor connects end (such as, source electrode and drain electrode) and is connected between power end P2 and power end P1.

Change ground, when the first earth terminal G1 be used for loading ground signalling and during unmodulated signal, described modulation circuit 16, described protection circuit 17 etc. all can be omitted accordingly.

The most in the lump refering to Fig. 1 and Fig. 2, described fingerprint sensing module 1 farther includes flexible PCB 18.Institute State flexible PCB 18 for connecting described mainboard 2 and described capacitance type fingerprint sensor chip 12, at described mainboard 2 And transmit signal between described capacitance type fingerprint sensor chip 12.

In the present embodiment, described modulation circuit 16, protection circuit 17 and described second earth terminal G2 are formed On described flexible PCB 18.So, changing ground, described modulation circuit 16, protection circuit 17 are with described Second earth terminal G2 may alternatively be integrated within a control chip, described control chip and described capacitance type fingerprint sensor chip 12 are packaged together, and form chipset.Described chipset the most also can be packaged with power management chip (not shown), Described power management chip is used for providing supply voltage to capacitance type fingerprint sensor chip 12.It addition, described modulation electricity Road 16, protection circuit 17 and described second earth terminal G2 also may be formed on described mainboard 2.

Described capacitance type fingerprint sensor chip 12 may also include more circuit, such as store circuit, control circuit, Level shifting circuit, filter circuit etc..Similarly, described mainboard 2 may also comprise more circuit.

In the present embodiment, described conductive layer 14 is for performing fingerprint sensing at capacitance type fingerprint sensor chip 12 Time load ground signalling, so, change ground, in other embodiments, such as, use above-mentioned condenser type refer to When stricture of vagina sensor chip 12 uses the type of drive of modulation the first earth terminal G1, described conductive layer 14 also can load described Modulated signal；Or described conductive layer 14 is unsettled.Compared to being not provided with the situation of conductive layer 14, the application sets Put the intensity that conductive layer 14 all can improve the fingerprint sensing signal of capacitance type fingerprint sensor chip 12 to a certain extent.

Please continue to refer to Fig. 1 and Fig. 2, alternatively, described electronic equipment 100 farther includes display screen 3, described Display screen 3 and described capacitance type fingerprint sensor chip 12 are respectively positioned on the homonymy of described cover sheet 10.Definition is described Cover sheet 10 is just showing to described display screen 3 that the region of picture is viewing area 31, defines described cover sheet 10 Anon-normal shows that to described display screen 3 region of picture is non-display area 33.Described capacitance type fingerprint sensor chip 12 It is arranged at non-display area 33 with described conductive layer 14.

Generally, described electronic equipment 100 is formed with color layers 19 at the non-display area 33 of cover sheet 10, as in vain The color layers of color or the color layers etc. of black.Described conductive layer 14 is formed with described capacitance type fingerprint sensor chip 12 In color layers 19.Changing ground, described electronic equipment 100 is at corresponding described capacitance type fingerprint sensor chip 12 And/or the position of described conductive layer 14 also can omit color layers 19；Described electronic equipment 100 is at corresponding described electric capacity The position of formula fingerprint sensing chip 12 and/or described conductive layer 14 may also set up the marker different from color layers 19, For indicating described capacitance type fingerprint sensor chip 12 and/or the position at described conductive layer 14 place.

Seeing also Fig. 1 and Fig. 7, Fig. 7 is the partial sectional schematic view of electronic equipment 100 shown in Fig. 1.Optional Ground, described electronic equipment 100 farther includes touch sensing layer 4, and described touch sensing layer 4 is used for sensing electronics and sets Whether standby 100 touched by user.Described touch sensing layer 4 can be that external hanging type is formed on display screen 3, it is possible to for On box, (On-Cell) mode is formed in display screen 3, it addition, alternatively interior (In-Cell) mode of box is formed at aobvious In display screen 3.In the present embodiment, touch sensing layer 4 is to use external hanging type to enter as a example by being formed on display screen 3 Row explanation.Described touch sensing layer 4 is arranged with described display screen 3 stacking.Described touch sensing layer 4, described electric capacity Formula fingerprint sensing chip 12 and described conductive layer 14 are respectively positioned on the homonymy of described cover sheet 10, and described electric capacity Formula fingerprint sensing chip 12 and described conductive layer 14 may be contained within color layers 19.

For the touch sensing layer 4 of external hanging type, described touch sensing layer 4 can be formed directly on cover sheet 10, Also may be formed on an extra substrate, or be formed on the outer surface of display screen 3.

It should be noted that when touch tactile layer 4 whether by box or box in the way of be formed at display In screen 3, a substrate (scheming non-formula) additionally can be set between display screen 3 and cover sheet 10, described substrate sets Putting through hole, described capacitance type fingerprint sensor chip 12 is arranged in the through hole of described substrate with described conductive layer 14, Or described capacitance type fingerprint sensor chip 12 is arranged in the through hole of described substrate, described conductive layer 14 is arranged on The second surface 103 of cover sheet 10 or the real estate surface to cover sheet 10, or real estate is to display screen 3 Surface.Described substrate for example, transparent glass substrate or sapphire substrate.

Refer to the partial sectional schematic view of the change embodiment that Fig. 8, Fig. 8 are electronic equipment 100.Described protection Cover plate 10 includes Part I A and Part II B, and the thickness of described Part II B is less than described Part I A Thickness.In the present embodiment, described Part II B is to first surface 101 concave shape by second surface 103 Become.Described Part II B completely or partially covers described conductive layer 14.Correspondingly, then see also Fig. 4, From circuit theory, described electric capacity Ci becomes big, thus finger F diminishes to the impedance between systematically GND, Correspondingly, the intensity of the fingerprint sensing signal of capacitance type fingerprint sensor chip 12 can be further enhanced.And then, The fingerprint sensing sensitivity of electronic equipment 100 obtains correspondence and is further enhanced.

Refer to the partial sectional schematic view of the another change embodiment that Fig. 9, Fig. 9 are electronic equipment 100.Described guarantor Protecting cover plate 10 includes Part I A and Part II B, and the thickness of described Part II B is less than described Part I The thickness of A.In the present embodiment, described Part II B is for be caved in second surface 103 by first surface 101 Formed.Described Part II B completely or partially covers described conductive layer 14.Correspondingly, then see also Fig. 4, From circuit theory, described electric capacity Ci becomes big, thus finger F diminishes to the impedance between systematically GND, Correspondingly, the intensity of the fingerprint sensing signal of capacitance type fingerprint sensor chip 12 can be further enhanced.And then, The fingerprint sensing sensitivity of electronic equipment 100 obtains correspondence and is further enhanced.

Refer to the partial sectional schematic view of the another change embodiment that Figure 10, Figure 10 are electronic equipment 100.Described Cover sheet 10 includes Part I A and Part II B, and the thickness of described Part II B is less than described first Divide the thickness of A.In the present embodiment, described Part II B is recessed to second surface 103 by first surface 101 Fall into and caved in first surface 101 by second surface 103 and formed.Described Part II B completely or partially covers Cover described conductive layer 14.Correspondingly, then seeing also Fig. 4, from circuit theory, described electric capacity Ci becomes big, Thus finger F diminishes to the impedance between systematically GND, correspondingly, the finger of capacitance type fingerprint sensor chip 12 The intensity of stricture of vagina sensing signal can be further enhanced.And then, the fingerprint sensing sensitivity of electronic equipment 100 obtains Correspondence is further enhanced.

In the electronic equipment 100 of three change embodiments of above-mentioned Fig. 8 to Figure 10, described capacitance type fingerprint senses Described Part I A is the most just arranged by chip 12, the most overlapping with Part II B.

Refer to the partial sectional schematic view of the another change embodiment that Figure 11, Figure 11 are electronic equipment 100.Described Cover sheet 10 includes Part I A and Part II B, and the thickness of described Part II B is less than described first Divide the thickness of A.In the present embodiment, described Part II B is recessed to second surface 103 by first surface 101 Fall into and formed.Described Part II B completely or partially covers described conductive layer 14 and described capacitance type fingerprint sensor chip 12.Correspondingly, then seeing also Fig. 4, from circuit theory, described electric capacity Ci becomes big, thus finger F Impedance between systematically GND diminishes, further, since the corresponding capacitance type fingerprint sensor chip of cover sheet 10 The position of 12 is thinning, and correspondingly, the intensity of the fingerprint sensing signal of capacitance type fingerprint sensor chip 12 can further obtain To improving.And then, the fingerprint sensing sensitivity of electronic equipment 100 obtains correspondence and is further enhanced.

Refer to the partial sectional schematic view of the another change embodiment that Figure 12, Figure 12 are electronic equipment 100.Described Cover sheet 10 includes Part I A and Part II B, and the thickness of described Part II B is less than described first Divide the thickness of A.In the present embodiment, described Part II B is recessed to first surface 101 by second surface 103 Fall into and formed.Described Part II B completely or partially covers described conductive layer 14 and described capacitance type fingerprint sensor chip 12.Correspondingly, then seeing also Fig. 4, from circuit theory, described electric capacity Ci becomes big, thus finger F Impedance between systematically GND diminishes, further, since the corresponding capacitance type fingerprint sensor chip of cover sheet 10 The position of 12 is thinning, and correspondingly, the intensity of the fingerprint sensing signal of capacitance type fingerprint sensor chip 12 can further obtain To improving.And then, the fingerprint sensing sensitivity of electronic equipment 100 obtains correspondence and is further enhanced.

Refer to the partial sectional schematic view of the another change embodiment that Figure 13, Figure 13 are electronic equipment 100.Described Cover sheet 10 includes Part I A and Part II B, and the thickness of described Part II B is less than described first Divide the thickness of A.In the present embodiment, described Part II B is recessed to second surface 103 by first surface 101 Fall into and caved in first surface 101 by second surface 103 and formed.Described Part II B completely or partially covers Cover described conductive layer 14 and described capacitance type fingerprint sensor chip 12.Correspondingly, then see also Fig. 4, by electricity Road principle understands, and described electric capacity Ci becomes big, further, since the corresponding capacitance type fingerprint sensor chip of cover sheet 10 The position of 12 is thinning, thus finger F diminishes to the impedance between systematically GND, correspondingly, and capacitance type fingerprint The intensity of the fingerprint sensing signal of sensor chip 12 can be further enhanced.And then, the fingerprint of electronic equipment 100 Sensing sensitivity obtains correspondence and is further enhanced.

In the electronic equipments 100 of 6 of above-mentioned Fig. 8 to Figure 13 change embodiments, described Part II B by The first surface 101 of cover sheet 10 is formed to another surface indentation with a surface in second surface 103, Or caving in formation to each other in two surfaces, so, the application is not restricted to this, described Part II B is alternatively Internal the hollowing out of cover sheet 10 forms, so that the thickness that the thickness of Part II B is less than Part I A.

Further, for the cover sheet 10 of above-mentioned 6 embodiments, wherein, the thickness of described Part II B For 0.2mm (millimeter) to 0.7mm, the thickness of described Part I is 0.4mm to 2.0mm.

It addition, the surface for example, plane of Part II B formed through depression or sphere.

It should be noted that the depression that the Part II B in Fig. 9 Yu Figure 10, Figure 12 Yu Figure 13 is formed can enter one Step plays instruction user's capacitance type fingerprint sense side core sheet 12 or/and the effect of position of conductive layer 14.

Need it is further noted that capacitance type fingerprint sensor chip in Figure 11 to Figure 13 12 and conductive layer 14 It is arranged at the region at same Part II B place.So, changing ground, described cover sheet 10 can include multiple Part II B separately.The Part II B covering described conductive layer 14 senses with covering described capacitance type fingerprint The Part II B of chip 12 is different part.

Refer to the partial sectional schematic view of the another change embodiment that Figure 14, Figure 14 are electronic equipment 100.Described Second surface 103 side of cover sheet 10 is arranged on a substrate 40 further.It is formed with logical on described substrate 40 Hole 401, described capacitance type fingerprint sensor chip 12 is arranged in described through hole 401 with conductive layer 14.

It should be noted that as it was previously stated, described conductive layer 14 may be provided on second surface 103, it is possible to do not set Put on second surface 103.It addition, may also be arranged on the surface of substrate 40.Further, change ground, Described cover sheet 10 is alternatively such as the cover sheet in Fig. 8 to embodiment illustrated in fig. 13.

Glass that described substrate 40 is the most transparent or sapphire substrate, so, the material of described substrate 40 is alternatively Other suitable material, is not limited to glass or sapphire substrate, the most alternatively film substrate.Further, Described substrate 40 is alternatively translucent or nontransparent cover plate, and it is transparency carrier that the application is not limiting as substrate 40.

In the present embodiment, described touch sensing layer 4 is arranged on described substrate 40, and is one layer.Described tactile Touch sensing layer 4 and be positioned at described substrate 40 in the face of the side of described cover sheet 10.So, change ground, described tactile Touch sensing layer 4 and be alternatively two-layer, be separately positioned on the opposite sides of substrate 40.Described touch sensing layer 40 includes Whether touch-sensing electrode (not shown), have the touch operation of user for sensing.

It addition, described touch sensing layer 4 also may be formed in display screen 3, thus form embedded touch and show dress Put.

Further, described touch sensing layer 4 can be self-capacitance touch sensing layer, it is possible to touch for mutual capacitance type Sensing layer.

Please continue to refer to Fig. 1, alternatively, described electronic equipment 100 farther includes back cover 5, is used for and described guarantor Protecting cover plate 10 forms receiving space, houses aforementioned touch sensing layer 4, display screen 3, mainboard 2, fingerprint sensing module 1 element such as grade is in described receiving space.

Open, it will be appreciated that these embodiments are to say despite describing this utility model with reference to each embodiment Bright property, and scope of the present utility model is not limited only to them.Many changes, revises, adds and improves It is all possible.More generally, it is upper and lower at specific embodiment according to embodiment each disclosed in this utility model Described in literary composition.Function can separate in embodiment each disclosed in this utility model the most in a different manner Or combination, or different terms is utilized to describe.These and other change, revise, add and improve permissible In this utility model scope of disclosure as defined in subsequent claim.

Claims (20)

1. an electronic equipment, including:

Cover sheet, including Part I and Part II, the thickness of described Part II is less than the thickness of Part I Degree；

Capacitance type fingerprint sensor chip, for sensing the finger print information of user；With

Conductive layer, and the homonymy that described capacitance type fingerprint sensor chip is respectively positioned on described cover sheet, and described conduction Layer is positioned at around described capacitance type fingerprint sensor chip；

Described Part II completely or partially covers described conductive layer.

Electronic equipment the most according to claim 1, it is characterised in that: described conductive layer is closed or non-close The ring-shaped conductive layer of formula.

Electronic equipment the most according to claim 2, it is characterised in that: described capacitance type fingerprint sensor chip is positioned at Described conductive layer area encompassed.

Electronic equipment the most according to claim 1, it is characterised in that: described conductive layer is used for loading ground signalling.

Electronic equipment the most according to claim 1, it is characterised in that: described electronic equipment includes equipment ground, institute Load ground signalling with stating equipment, electrically connect described conductive layer and described equipment.

Electronic equipment the most according to claim 5, it is characterised in that: described conductive layer is at described condenser type Fingerprint sensing chip performs to load ground signalling during fingerprint sensing, with described capacitance type fingerprint sensor chip, equipment ground Constitute a closing of circuit loop.

7. according to the electronic equipment described in any one in claim 1-6, it is characterised in that: described electronic equipment enters One step includes touch sensing layer；Described cover sheet includes first surface and the second surface relative with first surface； Described touch sensing layer, described conductive layer and described capacitance type fingerprint sensor chip are arranged at the of cover sheet Two side, surfaces.

Electronic equipment the most according to claim 7, it is characterised in that: described Part II be by first surface to Second surface depression is formed, or/and, described Part II is to be formed to first surface depression by second surface.

Electronic equipment the most according to claim 8, it is characterised in that: described Part II completely or partially covers Described capacitance type fingerprint sensor chip.

Electronic equipment the most according to claim 9, it is characterised in that: cover the Part II of described conductive layer It is with a part of or different parts from the Part II covering described capacitance type fingerprint sensor chip.

11. electronic equipments according to claim 8, it is characterised in that: described capacitance type fingerprint sensor chip is just Described Part I is arranged, the most overlapping with Part II.

12. electronic equipments according to claim 1, it is characterised in that: described conductive layer is arranged on second surface On.

13. electronic equipments according to claim 8, it is characterised in that: described electronic equipment farther includes base Plate, described touch sensing layer arranges on the substrate, described substrate arranges through hole, and described conductive layer is with described Capacitance type fingerprint sensor chip is positioned in described through hole.

14. electronic equipments according to claim 1, it is characterised in that: described electronic equipment farther includes base Plate, described substrate and described capacitance type fingerprint sensor chip, conductive layer are respectively positioned on the homonymy of described cover sheet, institute Stating and arrange through hole on substrate, described conductive layer and described capacitance type fingerprint sensor chip are positioned in described through hole.

15. electronic equipments according to claim 7, it is characterised in that: described capacitance type fingerprint sensor chip bag Including induction electrode array and the testing circuit being connected with induction electrode array, described testing circuit is used for providing excitation Signal, to induction electrode array, drives described induction electrode array to perform fingerprint sensing.

16. electronic equipments according to claim 15, it is characterised in that: described testing circuit includes that signal transmits End and the first earth terminal, described first earth terminal is used for load-modulate signal, and described signal transmission ends is used for providing sharp Encourage signal to raise, with described modulation with the rising of described modulated signal to induction electrode array, described pumping signal The reduction of signal and reduce.

17. electronic equipments according to claim 16, it is characterised in that: described electronic equipment includes fingerprint sensing Module, described fingerprint sensing module includes described capacitance type fingerprint sensor chip, the second earth terminal and modulation circuit； Described second earth terminal is used for loading described ground signalling, and described modulation circuit is connected to described second earth terminal and Between one earth terminal, drive signal to produce described modulated signal according to described ground signalling with one, and described tune is provided Signal processed gives the first earth terminal.

18. electronic equipments according to claim 17, it is characterised in that: described electronic equipment farther includes main Plate, described fingerprint sensing module farther includes flexible PCB, and described flexible PCB is used for connecting described mainboard With described capacitance type fingerprint sensor chip, between described mainboard and described capacitance type fingerprint sensor chip, transmit signal.

19. electronic equipments as claimed in claim 1, it is characterised in that: described capacitance type fingerprint sensor chip is certainly Capacitance type fingerprint sensor chip.

20. electronic equipments as claimed in claim 1, it is characterised in that: described electronic equipment is that portable electronic produces Product or household formula electronic product.