CN106155197A - The manufacture method of electronic equipment, mobile terminal and electronic equipment - Google Patents
The manufacture method of electronic equipment, mobile terminal and electronic equipment Download PDFInfo
- Publication number
- CN106155197A CN106155197A CN201610102488.8A CN201610102488A CN106155197A CN 106155197 A CN106155197 A CN 106155197A CN 201610102488 A CN201610102488 A CN 201610102488A CN 106155197 A CN106155197 A CN 106155197A
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- electronic equipment
- signal
- capacitance type
- sensor chip
- fingerprint sensor
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/1613—Constructional details or arrangements for portable computers
- G06F1/1626—Constructional details or arrangements for portable computers with a single-body enclosure integrating a flat display, e.g. Personal Digital Assistants [PDAs]
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
- G06V40/1306—Sensors therefor non-optical, e.g. ultrasonic or capacitive sensing
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- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Multimedia (AREA)
- Computer Hardware Design (AREA)
- General Engineering & Computer Science (AREA)
- Image Input (AREA)
- Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
Abstract
The invention discloses the manufacture method of a kind of electronic equipment, mobile terminal and electronic equipment.Described electronic equipment includes cover sheet, capacitance type fingerprint sensor chip and conductive layer.Described cover sheet includes first surface and the second surface relative with first surface.Described capacitance type fingerprint sensor chip is arranged on the second surface side of cover sheet, for sensing the finger print information that user inputs from the first surface of cover sheet.Described conductive layer is arranged on the second surface side of cover sheet, and is positioned at around described capacitance type fingerprint sensor chip, and described conductive layer is used for loading ground signalling.The fingerprint sensing sensitivity of described electronic equipment is higher.The invention also discloses the higher mobile terminal of a kind of fingerprint sensing sensitivity and the manufacture method of electronic equipment.
Description
Technical field
The present invention relates to fingerprint sensing technical field, particularly relate to a kind of there is fingerprint sensing function electronic equipment,
Mobile terminal and there is the manufacture method of electronic equipment of fingerprint sensing function.
Background technology
Fingerprint sensing devices becomes the standard configuration of increasing electronic equipment (such as mobile phone), at present, is positioned over electronic equipment
The fingerprint sensing devices in front, is typically employed on the cover sheet of electronic equipment and carries out perforate, by fingerprint sensor
Part combines with controlling button (also known as Home key), is placed in described perforate, so, be so designed that for
Those are not opened hole on cover sheet but use the electronics of virtual controlling button (also known as touch key-press) on the market
From the point of view of equipment and inapplicable.
Correspondingly, the cover sheet of electronic equipment does not opens hole and dispose fingerprint sensing devices under cover sheet
The market demand of side (that is, the inside of electronic equipment) is strong.So, at cover sheet positioned beneath fingerprint sensing devices
Scheme makes the sensing signal of fingerprint sensing devices become more weak, causes fingerprint sensing the sensitiveest.
Summary of the invention
In order to solve above-mentioned technical problem, the present invention provide a kind of arrange under cover sheet fingerprint sensing devices and
The manufacture method of electronic equipment, mobile terminal and electronic equipment that fingerprint sensing sensitivity is higher.
For achieving the above object, the present invention provides following technical scheme:
A kind of electronic equipment, including:
Cover sheet, including first surface and the second surface relative with first surface；
Capacitance type fingerprint sensor chip, is arranged on the second surface side of cover sheet, is used for sensing user from protection
The finger print information of the first surface input of cover plate；With
Conductive layer, is arranged on the second surface side of cover sheet, and described conductive layer is arranged on described capacitance type fingerprint
Around sensor chip, described conductive layer is used for loading ground signalling.
Alternatively, described conductive layer is closed or non-enclosed around described capacitance type fingerprint sensor chip region
Arrange.
Alternatively, described conductive layer is for persistently loading ground connection when capacitance type fingerprint sensor chip performs fingerprint sensing
Signal.
Alternatively, described conductive layer for only loading ground connection letter when capacitance type fingerprint sensor chip performs fingerprint sensing
Number.
Alternatively, described capacitance type fingerprint sensor chip includes induction electrode array and is connected with induction electrode array
Testing circuit, described testing circuit is used for providing pumping signal to induction electrode array, drives described induction electrode
Array performs fingerprint sensing.
Alternatively, described testing circuit includes that signal transmission ends and the first earth terminal, described first earth terminal are used for adding
Carry modulated signal, described signal transmission ends be used for providing pumping signal to induction electrode array, described pumping signal with
The change of described modulated signal and change.
Alternatively, described pumping signal raises with the rising of described modulated signal, with the reduction of described modulated signal
And reduce.
Alternatively, described testing circuit farther includes power end, and described power end is used for loading power voltage, institute
State supply voltage to change with the change of described modulated signal, and pressure reduction therebetween keeps constant, described pressure reduction
Rated voltage for testing circuit work.
Alternatively, described electronic equipment includes that fingerprint sensing module, described fingerprint sensing module include described condenser type
Fingerprint sensing chip, the second earth terminal and modulation circuit；Described second earth terminal is used for loading described ground signalling,
Described modulation circuit is connected between described second earth terminal and the first earth terminal, drives with one according to described ground signalling
Dynamic signal produces described modulated signal, and provides described modulated signal to the first earth terminal.
Alternatively, described electronic equipment farther includes mainboard, and described fingerprint sensing module farther includes flexible electrical
Road plate, described flexible PCB is used for connecting described mainboard and described capacitance type fingerprint sensor chip, at described mainboard
And transmit signal between described capacitance type fingerprint sensor chip.
Alternatively, described electronic equipment farther includes touch sensing layer, described touch sensing layer, described condenser type
Fingerprint sensing chip and described conductive layer are respectively positioned on the homonymy of described cover sheet, and described touch sensing layer is used for feeling
Survey whether electronic equipment is touched by user.
Alternatively, described electronic equipment farther includes substrate, and described touch sensing layer is arranged on the substrate,
Arranging through hole on described substrate, described capacitance type fingerprint sensor chip and described conductive layer are respectively positioned in described through hole.
Alternatively, described electronic equipment include equipment ground, described equipment ground load ground signalling, described conductive layer with
The electrical connection of described equipment ground.
Alternatively, described conductive layer is attached to second surface.
Alternatively, described capacitance type fingerprint sensor chip is self-capacitance fingerprint sensing chip.
Alternatively, described electronic equipment is portable electronic product or household formula electronic product.
Owing to described electronic equipment arranges conductive layer, and described conduction around capacitance type fingerprint sensor chip further
Layer is for loading ground signalling when capacitance type fingerprint sensor chip performs fingerprint sensing, and therefore, user is to systematically
Between impedance diminish.Correspondingly, the intensity of the fingerprint sensing signal of capacitance type fingerprint sensor chip can be improved,
And then, the fingerprint sensing sensitivity of electronic equipment is improved.
Further, the first earth terminal of capacitance type fingerprint sensor chip is used for load-modulate signal rather than ground signalling,
Therefore, the signal of the testing circuit of capacitance type fingerprint sensor chip all raises with the rising of modulated signal, with modulation
The reduction of signal and reduce, it addition, capacitance type fingerprint sensor chip is self-capacitance fingerprint sensing chip, thus,
The signal to noise ratio making the fingerprint sensing signal of capacitance type fingerprint sensor chip improves, correspondingly, and the fingerprint of electronic equipment
Sensing sensitivity is further enhanced.
The present invention provides again a kind of mobile terminal, and described mobile terminal includes:
Cover sheet, including first surface and the second surface relative with first surface；
Display screen, is arranged on the second surface side of cover sheet, and definition cover sheet just shows picture to display screen
The visible area that region is mobile terminal, definition cover sheet anon-normal to display screen display picture region be non-visually
District；
Capacitance type fingerprint sensor chip, is arranged on the second surface side of described cover sheet, and is positioned at described non-aobvious
Show district, for sensing the finger print information of user；With
Conductive layer, is arranged on the second surface side of described cover sheet, is positioned at non-display area, and closed or non-
Closed around the setting of described capacitance type fingerprint sensor chip region, described conductive layer is used for loading ground signalling.
Alternatively, described capacitance type fingerprint sensor chip includes induction electrode array and is connected with induction electrode array
Testing circuit, described testing circuit includes that signal transmission ends and the first earth terminal, described first earth terminal are used for adding
Carrying modulated signal, described signal transmission ends is used for providing pumping signal to induction electrode array, drives described faradism
Pole array performs self-capacitance fingerprint sensing, and described pumping signal raises, with institute with the rising of described modulated signal
State the reduction of modulated signal and reduce.
Owing to described mobile terminal arranges conductive layer, and described conduction around capacitance type fingerprint sensor chip further
Layer is for loading ground signalling when capacitance type fingerprint sensor chip performs fingerprint sensing, and therefore, user is to systematically
Between impedance diminish.Correspondingly, the intensity of the fingerprint sensing signal of capacitance type fingerprint sensor chip can be improved,
And then, the fingerprint sensing sensitivity of mobile terminal is improved.
Further, the first earth terminal of capacitance type fingerprint sensor chip is used for load-modulate signal rather than ground signalling,
Therefore, the signal of the testing circuit of capacitance type fingerprint sensor chip all raises with the rising of modulated signal, with modulation
The reduction of signal and reduce, it addition, capacitance type fingerprint sensor chip performs self-capacitance fingerprint sensing, thus, make
The signal to noise ratio of the fingerprint sensing signal obtaining capacitance type fingerprint sensor chip improves, correspondingly, and the fingerprint sense of electronic equipment
Survey sensitivity is further enhanced.
The present invention provides again the manufacture method of a kind of electronic equipment, described electronic equipment to include equipment ground, described equipment
Ground is used for loading ground signalling, and described manufacture method includes:
One transparent cover sheet is provided；
Color layers is formed to form visible area and the non-visible area of electronic equipment in the side of cover sheet；
Forming a closed or conductive layer for non-enclosed annular in color layers, described conductive layer is connected to equipment ground；
Capacitance type fingerprint sensor chip is set in the annular region that conductive layer is surrounded, for sensing the fingerprint of user
Information.
Alternatively, described manufacture method farther includes: form touch sensing layer in the visible area of electronic equipment,
The touch operation of user whether is had for sensing.
Alternatively, described capacitance type fingerprint sensor chip includes testing circuit and induction electrode array, described detection electricity
Road includes the first earth terminal and signal transmission ends, and described signal transmission ends is used for output drive signal to induction electrode battle array
Row, drive induction electrode array to perform self-capacitance fingerprint sensing；Described manufacture method farther includes: is formed and adjusts
Circuit processed is between the first earth terminal and equipment ground, and described modulation circuit is for according to driving signal and equipment ground
Ground signalling forms modulated signal to the first earth terminal, described pumping signal raises with the rising of described modulated signal,
Reduce with the reduction of described modulated signal.
Owing to described manufacture method forms conductive layer, and described conduction around capacitance type fingerprint sensor chip further
Layer with equipment be connected, be used for loading ground signalling, therefore, user diminishes to the impedance between systematically.Phase
Ying Di, the intensity of the fingerprint sensing signal of capacitance type fingerprint sensor chip can be improved, and then, by described manufacture
The fingerprint sensing sensitivity of the electronic equipment that method obtains is improved.
Described manufacture method farther includes: formed modulation circuit between the first earth terminal and equipment ground, described tune
Circuit processed is for driving signal and equipment ground signalling on the ground to form modulated signal to the first earth terminal, institute according to one
State pumping signal to raise with the rising of described modulated signal, reduce with the reduction of described modulated signal, thus,
The signal to noise ratio performing the fingerprint sensing signal of the capacitance type fingerprint sensor chip of self-capacitance fingerprint sensing is improved, phase
Ying Di, described manufacture method the fingerprint sensing sensitivity of the electronic equipment obtained is further enhanced.
Although disclosing multiple embodiment, change including it, but by illustrate and describing theory disclosed by the invention
The following detailed description of bright property embodiment, those skilled in the art will be shown by other embodiments disclosed by the invention
And be clear to.Can revise at various obvious aspects it will be recognized that the present invention is open, all modifications all without
Deviation the spirit and scope of the present invention.Correspondingly, accompanying drawing and detailed description substantially should be considered illustrative, and
It not restrictive.
Accompanying drawing explanation
Describe its example embodiment, inventive feature and advantage in detail by referring to accompanying drawing will be apparent from.
Fig. 1 is the decomposed structural representation of electronic equipment of the present invention.
Fig. 2 is the part assembling structure schematic diagram of electronic equipment shown in Fig. 1.
Fig. 3 is the fingerprint sensing circuit diagram omitting conductive layer.
Fig. 4 is the fingerprint sensing circuit diagram including loading the conductive layer of ground signalling.
Fig. 5 is the schematic diagram of the another embodiment of Fig. 2 conductive layer.
Fig. 6 is the electrical block diagram of electronic equipment shown in Fig. 2.
Fig. 7 is the partial section view of electronic equipment shown in Fig. 1.
Fig. 8 is the partial section view of a change embodiment of electronic equipment shown in Fig. 1.
Fig. 9 is the partial section view of the another change embodiment of electronic equipment shown in Fig. 1.
Figure 10 is the partial section view of the another change embodiment of electronic equipment shown in Fig. 1.
Figure 11 is the flow chart of the manufacture method of electronic equipment shown in Fig. 1.
Detailed description of the invention
It is described more fully with example embodiment referring now to accompanying drawing.But, example embodiment can be with multiple
Form is implemented, and is not understood as limited to embodiment set forth herein；On the contrary, it is provided that these embodiments make
Obtaining the present invention will fully and completely, and the design of example embodiment is conveyed to those skilled in the art all sidedly.
For convenience or clear, may exaggerate, omit or be schematically illustrated in the thickness of every layer shown in accompanying drawing and size,
And schematically illustrate the quantity of related elements.It addition, the size of element not exclusively reflects actual size, Yi Jixiang
Close the quantity incomplete reaction actual quantity of element.
Additionally, described feature, structure can be combined in one or more embodiment in any suitable manner
In.In the following description, it is provided that many details thus be given and embodiments of the present invention fully understood.
But, one of ordinary skill in the art would recognize that, do not have in described specific detail is one or more, or uses it
Its structure, constituent element etc., it is also possible to put into practice technical scheme.In other cases, be not shown in detail or
Known features or operation are described to avoid the fuzzy present invention.
Embodiments of the invention are described below in detail, and the example of described embodiment is shown in the drawings, the most extremely
Same or similar label represents same or similar element or has the element of same or like function eventually.Lead to below
It is exemplary for crossing the embodiment being described with reference to the drawings, it is intended to user explains the present invention, and it is not intended that to this
Bright restriction.
In describing the invention, it is to be understood that term " thickness ", " on ", D score, " front ",
" afterwards ", "left", "right", " vertically ", " level ", " top ", " end ", " interior ", " outward "
It is based on orientation shown in the drawings or position relationship in the orientation indicated or position relationship, is for only for ease of description originally
Invention and simplification describe rather than indicate or imply that the position of indication or element must have specific method, Yi Te
Fixed azimuth configuration and operation, be therefore not considered as limiting the invention.
In the present invention, unless otherwise clearly defined and limited, term " install ", " being connected ", " connection ",
The term such as " fix " should be interpreted broadly, connect for example, it may be fixing, it is also possible to be to removably connect, or
Integral；Can be to be mechanically connected, it is also possible to be electrical connection；Can be to be directly connected to, it is also possible to be by centre
Medium is indirectly connected with, and can be connection or the interaction relationship of two elements of two element internals.For ability
For the those of ordinary skill in territory, above-mentioned term concrete meaning in the present invention can be understood as the case may be.
Further, in describing the invention, it is to be understood that: " multiple " include two and two or more,
Unless the present invention separately has the most concrete restriction.It addition, " first " that each element title and signal name occur,
The word such as " second ", " the 3rd " is not to limit element or the sequencing of signal appearance, but for convenience of unit
Part is named, and clearly distinguishes each element so that describe more succinct.
At present, the electronic equipment being provided with fingerprint sensing chip in front would generally configure one around fingerprint sensing chip
Becket, described becket for loading the pumping signal of change, with the sensing electrode in fingerprint sensing chip
Array forms mutual capacitance, thus performs fingerprint sensing.
Found by the lot of experiments of inventor, fingerprint sensing chip and becket are all displaced to cover sheet
If lower section (electronic equipment internal), in view of the decay in transmitting procedure of the thickness of cover sheet, pumping signal, with
And pumping signal is protected the factors such as the interference inside and outside cover plate, the pumping signal on becket passes protection cap
The signal intensity coupleding on fingerprint sensing chip after plate becomes more weak, therefore, uses above-mentioned capacitance type fingerprint sense
The fingerprint sensing sensitivity of the electronic equipment of survey mode is relatively low.
For improving the intensity of the fingerprint sensing signal being arranged on the fingerprint sensing chip below cover sheet, inventor's warp
Cross a large amount of creative work and experimentation test proposes the electronic equipment that the application is following.
Before introducing the electronic equipment of the application, in addition it is also necessary to further illustrate mutual capacitance type fingerprint sensing module and oneself
The basic functional principle of capacitance type fingerprint sensing module.
In fingerprint sensing module based on mutual capacitance type, fingerprint sensing module includes fingerprint sensing chip and becket,
Described fingerprint sensing chip includes the detection electricity that sensor electrode array is connected respectively with sensor electrode array and becket
Road.Mutual capacitance is formed between described becket and described sensor electrode array.Described testing circuit provides swashing of change
Encouraging signal to becket, described sensor electrode array exports corresponding fingerprint sensing signal to testing circuit.Described inspection
Slowdown monitoring circuit is according to described fingerprint sensing signal acquisition information in fingerprint.
Relatively, in fingerprint sensing module based on self-capacitance, fingerprint sensing module can be saved aforementioned loading and become
The becket of the pumping signal changed.The testing circuit of self-capacitance fingerprint sensing chip provides excitation letter by data wire
Number give sensor electrode array, and receive fingerprint sensing signal by identical data wire from sensor electrode array.Described
Sensor electrode array includes the sensing electrode of multiple formation self-capacitance over the ground.At an object (e.g., finger) close to described
During sensing electrode, another direct-to-ground capacitance can be formed between this object and described sensing electrode.
See also the decomposed structural representation that Fig. 1 and Fig. 2, Fig. 1 are electronic equipment one embodiment of the present invention.
Fig. 2 is the part assembling structure schematic diagram of electronic equipment shown in Fig. 1.Described electronic equipment 100 is such as portable electricity
Sub-product or household formula electronic product.Wherein, portable electronic product is as various mobile terminals, such as, mobile phone,
Each electronic product such as panel computer, notebook computer and Wearable product；Household formula electronic product is such as intelligence
Each electronic product such as energy door lock, TV, refrigerator, desktop computer.It should be noted that electronic equipment 100 can
Increase the element not shown in diagram further or reduce some element shown in diagram, producing according to different electronics
Product corresponding selection.Described electronic equipment 100 includes cover sheet 10, capacitance type fingerprint sensor chip 12 and
Conductive layer 14.Described cover sheet 10 is arranged on the front side of electronic equipment 100, and electronic equipment 100 is played protection
Effect, such as prevent the material such as grieshoch from entering electronic equipment 100 internal etc..Described capacitance type fingerprint sensor chip
12 for sensing the finger print information of target object.Described target object such as the finger for user, so, described object
Body is not limited to finger, and described target object can also be other suitable objects such as toe, below main with finger
As a example by illustrate.Described conductive layer 14 is used for loading ground signalling, to improve capacitance type fingerprint sensor chip 12
Sensing signal intensity.
Generally, electronic equipment 100 is with including equipment and power supply end.Described equipment ground is also known as systematically, such as
For the negative pole of the power supply of electronic equipment 100, power supply is as battery, and described power supply end is as battery
Positive pole.Being used for loading ground signalling, therefore, ground signalling is also known as equipment earth signal or systematically signal equipment.
Described ground signalling is constant voltage signal, as the voltage reference of circuit each in electronic equipment 100, described
The voltage signals such as ground signalling for example, 0V (volt), 2V, (-1) V.Generally, electronic equipment 100 equipment ground or be
System ground not earth ground or definitely the most greatly.So, when electronic equipment 100 is connected with earth ground by conductor,
Can also be earth ground described equipment.
Described cover sheet 10 includes first surface 101 and the second surface 103 relative with first surface 101.Institute
Stating the outer surface that first surface 101 is electronic equipment 100, described second surface 103 is positioned at described electronic equipment 100
Inside.Glass that described cover sheet 10 is the most transparent or sapphire cover plate, so, described cover sheet 10
Material be alternatively other suitable material, be not limited to glass or sapphire cover plate, the most alternatively film cover
Plate.Further, described cover sheet 10 is alternatively translucent or nontransparent cover plate, and the application is not limiting as protecting
Protecting cover plate 10 is transparent cover plate.
Described capacitance type fingerprint sensor chip 12 is arranged on second surface 103 side of cover sheet 10, is used for feeling
Survey the finger print information that user inputs from the first surface 101 of cover sheet 10.In the present embodiment, described electric capacity
Formula fingerprint sensing chip 12 is self-capacitance fingerprint sensing chip.So, it should be noted that described capacitance type fingerprint
Sensor chip 12 is alternatively the capacitance type fingerprint sensor chips such as self-capacitance or the mutual capacitance type of other suitable type, and
It is not limited to the self-capacitance fingerprint sensing chip of herein described type.
Described conductive layer 14 is arranged on second surface 103 side of cover sheet 10, and is positioned at described condenser type and refers to
Around stricture of vagina sensor chip 12.Described conductive layer 14 is for when capacitance type fingerprint sensor chip 12 performs fingerprint sensing
Load ground signalling.Preferably, touch on cover sheet 10 just to capacitance type fingerprint sensor chip 12 when finger
Region time, can together touch on cover sheet 10 region just to conductive layer 14.
Seeing also Fig. 3 and Fig. 4, Fig. 3 is the fingerprint sensing circuit diagram omitting conductive layer 14.Fig. 4 is
Fingerprint sensing circuit diagram including the conductive layer 14 loading ground signalling.As seen from Figure 3, at finger F, electricity
In the circuit loop formed between appearance formula fingerprint sensing chip 12 and equipment ground GND, finger F, cover sheet
Electric capacity Cf, finger F, cover sheet 10 and equipment ground it is formed with between 10 and capacitance type fingerprint sensor chip 12
Electric capacity Cs it is formed with between GND.
Relatively, in the diagram, due to electronic equipment 100 include load ground signalling conductive layer 14, therefore,
Be equal to an electric capacity Ci the most in parallel at electric capacity Cs two ends, described electric capacity Ci by finger F, cover sheet 10,
Conductive layer 14 is constituted.According to circuit theory, the impedance between finger F to equipment ground GND diminishes, accordingly
Ground, the intensity of the fingerprint sensing signal of capacitance type fingerprint sensor chip 12 can be improved.
Owing to the electronic equipment 100 of the present invention arranges loading further in second surface 103 side of cover sheet 10
The conductive layer 14 of ground signalling, thus, the intensity of the fingerprint sensing signal of capacitance type fingerprint sensor chip 12 is carried
Height, and then, the fingerprint sensing sensitivity of electronic equipment 100 is improved.
Usually, described capacitance type fingerprint sensor chip 12 be shaped as elongated rectangular shape, it addition, in order to increase electronics
The visual range of equipment 100, in the present embodiment, described conductive layer 14 is a rectangular ring, closed around
Described capacitance type fingerprint sensor chip 12 region is arranged.So, changing ground, described conductive layer 14 is alternatively
Other shape, as circular, oval ring-type, it addition, described conductive layer 14 also can be non-enclosed around described electric capacity
Formula fingerprint sensing chip 12 is arranged, such as it is shown in figure 5, described conductive layer 14 is divided into several sections.
Described conductive layer 14 is as used the Suitable conductive such as silver slurry, molybdenum lithium molybdenum, tin indium oxide, nanometer silver or Graphene
Material is made.Described conductive layer 14 is formed at for example with suitably production method such as coating, spraying or impressing etc.
On two surfaces 103.So, changing ground, described conductive layer 14 is not limiting as necessarily being formed on second surface 103,
Second surface 103 can also be proximate to arrange.
Described capacitance type fingerprint sensor chip 12 is attached on second surface 103 for example with the mode pasted.So,
Before the mode that described capacitance type fingerprint sensor chip 12 and conductive layer 14 are formed on second surface 103 is not limited to
State the mode of stickup, it is possible to use other suitable set-up mode, such as impressing etc..It addition, described condenser type refers to
Stricture of vagina sensor chip 12 also directly can be pressed close to second surface 103 or fit, and and unrestricted employing third party's physics be situated between
Matter secures the two together.Further, described capacitance type fingerprint sensor chip 12 can also be proximate to the second table
Face 103 is arranged.
Refer to the electrical block diagram of the embodiment that Fig. 6, Fig. 6 are electronic equipment 100 shown in Fig. 2.Institute
State conductive layer 14 and connect equipment ground GND.Described capacitance type fingerprint sensor chip 12 includes induction electrode array 121
And the testing circuit 123 being connected with induction electrode array 121.Described testing circuit 123 is used for providing pumping signal
To induction electrode array 121, described induction electrode array 121 is driven to perform capacitance type fingerprint sensing.Described detection electricity
Road 123 is further used for receiving the sensing signal (also referred to as " fingerprint sensing signal ") of induction electrode array 121 output,
And obtain information in fingerprint according to sensing signal.In the present embodiment, described testing circuit 123 is used for driving
Innervation answers electrod-array 121 to perform self-capacitance fingerprint sensing.
Described induction electrode array 121 includes multiple induction electrode 122.The plurality of induction electrode 122 is in array
Arrangement, the shape for example, rectangle of each electrode 122, so, it is possible to for other various suitable shapes.It addition,
The size and shape of each electrode 122 is identical, so, it is possible to select difference.The plurality of induction electrode 122 can be with
Coupled capacitance-wise is to finger F (see Fig. 3 and Fig. 4).It addition, the plurality of induction electrode 122 also can be in non-rule
Arrangement, and and unrestricted in array arrange.
Further, described testing circuit 123 includes signal transmission ends T and the first earth terminal G1.Described first connects
Ground end G1 for load-modulate signal, described signal transmission ends T be used for providing pumping signal to induction electrode 122,
Described pumping signal changes with the change of described modulated signal.Wherein, described pumping signal is with described modulated signal
Rising and raise, reduce with the reduction of described modulated signal.
Described testing circuit 123 farther includes power end P1, described power end P1 for loading power voltage, institute
State supply voltage to change with the change of described modulated signal.Pressure between described supply voltage and described modulated signal
Difference keeps constant, and described pressure reduction is the described testing circuit 123 rated voltage when working.
Signal in described testing circuit 123 the most all raises, with described modulation with the rising of described modulated signal
The reduction of signal and reduce.That is, the signal in described testing circuit 123 is unified modulated signal and is modulated.
Comparative apparatus ground GND loads constant ground signalling, the first earth terminal G1 load change modulated signal and
Non-described ground signalling, thus be conducive to improving the signal to noise ratio of fingerprint sensing signal, and then electricity can be improved further
The fingerprint sensing sensitivity of subset 100.
It should be noted that in the present embodiment, the first earth terminal G1 is used for load-modulate signal, so, variable
More, other suitable terminals in testing circuit 123 also can load-modulate signal, it is not limited to the first earth terminal
G1 is used for load-modulate signal.Such as, the power end P1 in testing circuit 123 can also be used for load-modulate signal,
Correspondingly, the modulation that the signal that described pumping signal and the first earth terminal G1 are loaded is loaded with power end P1
The change of signal and change.
Described modulated signal for example, includes described ground signalling and a signal driving signal.In the present embodiment,
Described driving signal is higher than ground signalling, and described driving signal is boost signal compared to ground signalling.Further,
The most periodically variable square-wave signal of described modulated signal.So, changing ground, described modulated signal is alternatively
Nonperiodic signal, it addition, described modulated signal is alternatively the signal of other suitable waveform, it is not limited to square wave is believed
Number.Described driving signal may be lower than ground signalling, and described driving signal is buck signal compared to ground signalling.
Owing to described capacitance type fingerprint sensor chip 12 provides the pumping signal changed with modulated signal change to sensing
Electrode 122, therefore, can improve the signal to noise ratio of fingerprint sensing signal, correspondingly, it is possible to increase fingerprint sensing signal
Intensity.So, the sensitivity arranging capacitance type fingerprint sensor chip 12 below cover sheet 10 improves further.
In the above-described embodiment, the first earth terminal G1 is for loading the modulated signal of change.So, the application is not
As limit, changing ground, described first earth terminal G1 can also be used for loading described ground signalling.
Referring again to Fig. 1 and Fig. 6, described electronic equipment 100 includes fingerprint sensing module 1.Described fingerprint sensing mould
Group 1 includes described capacitance type fingerprint sensor chip the 12, second earth terminal G2 and modulation circuit 16.Described second
Earth terminal G2, for being connected with equipment ground GND, loads described ground signalling.Described modulation circuit 16 is connected to institute
State between the second earth terminal G2 and the first earth terminal G1, and receive described driving signal, according to described ground signalling
Produce described modulated signal with described driving signal, and export described modulated signal to the first earth terminal G1.In this reality
Executing in mode, the signal in described testing circuit 123 all changes with the change of modulated signal of the first earth terminal G1.
Change ground, in other embodiments, in described testing circuit 123 also can the signal of partial circuit modulated
The modulation of signal processed, changing with the change of modulated signal of the first earth terminal G1, the signal of partial circuit is not by
The modulated signal of one earth terminal G1 is modulated.
Described modulation circuit 16 such as includes two-transistor and a controller, and wherein a transistor receives described driving letter
Number, a transistor receives described ground signalling, and described controller is controlled by controlling described two-transistor alternate conduction
Make described two-transistor and alternately export described ground signalling with described driving signal to form described modulated signal.So,
Described modulation circuit 16 is not limited to structure described here, it is possible to for other suitable circuit structure.
Please continue to refer to Fig. 1 and Fig. 6, described electronic equipment 100 farther includes mainboard 2, and described mainboard 2 includes
Main control chip 21.Described main control chip 21 includes the 3rd earth terminal G3 and power end P2.Described 3rd earth terminal
G3 is used for connecting equipment ground GND.Described power end P2 gives described power end P1 for output supply voltage.Described
Communication interface (sign) is set between main control chip 21 and described capacitance type fingerprint sensor chip 12 further, to enter
Row information communicates.
Described main control chip 21 can be one chip, it is also possible to be a chipset.When main control chip 21 is chip
During group, described chipset includes application processor (Application Processor, AP) and power supply chip.It addition, institute
State chipset and can farther include storage chip.It addition, described application processor also can be replaced by central processing unit
(Central Processing Unit,CPU)。
Further, in order to avoid the electricity of power end P1 occurs when the signal on the first earth terminal G1 is and drives signal
Stream is anti-fills the situation being back to power end P2, described fingerprint sensing module 1 farther include to be arranged at power end P1 with
Protection circuit 17 between power end P2.Described protection circuit 17 is higher than for the supply voltage on power end P1
Supply voltage on power end P2 or when reaching predetermined value higher than the supply voltage on power end P2, deenergization end
Connection between P2 and power end P1.
Described protection circuit 17 such as includes a diode being connected between power end P2 and power end P1, or
Including the control unit being connected and transistor, the control end (such as, grid) of described transistor connects control unit,
The control two of described transistor connects end (such as, source electrode and drain electrode) and is connected between power end P2 and power end P1.
Change ground, when the first earth terminal G1 be used for loading ground signalling and during unmodulated signal, described modulation circuit
16, described protection circuit 17 etc. all can be omitted accordingly.
The most in the lump refering to Fig. 1 and Fig. 2, described fingerprint sensing module 1 farther includes flexible PCB 18.Institute
State flexible PCB 18 for connecting described mainboard 2 and described capacitance type fingerprint sensor chip 12, at described mainboard 2
And transmit signal between described capacitance type fingerprint sensor chip 12.
In the present embodiment, described modulation circuit 16, protection circuit 17 and described second earth terminal G2 are formed
On described flexible PCB 18.So, changing ground, described modulation circuit 16, protection circuit 17 are with described
Second earth terminal G2 may alternatively be integrated within a control chip, described control chip and described capacitance type fingerprint sensor chip
12 are packaged together, and form chipset.Described chipset the most also can be packaged with power management chip (not shown),
Described power management chip is used for providing supply voltage to capacitance type fingerprint sensor chip 12.It addition, described modulation electricity
Road 16, protection circuit 17 and described second earth terminal G2 also may be formed on described mainboard 2.
Described capacitance type fingerprint sensor chip 12 may also include more circuit, such as store circuit, control circuit,
Level shifting circuit, filter circuit etc..Similarly, described mainboard 2 may also comprise more circuit.
Please continue to refer to Fig. 1 and Fig. 2, alternatively, described electronic equipment 100 farther includes display screen 3, described
Display screen 3 and described capacitance type fingerprint sensor chip 12 are respectively positioned on the homonymy of described cover sheet 10.Definition is described
Cover sheet 10 is just showing to described display screen 3 that the region of picture is viewing area 31, defines described cover sheet 10
Anon-normal shows that to described display screen 3 region of picture is non-display area 33.Described capacitance type fingerprint sensor chip 12
It is arranged at non-display area 33 with described conductive layer 14.
Generally, described electronic equipment 100 is formed with color layers 19 at the non-display area 33 of cover sheet 10, as in vain
The color layers of color or the color layers etc. of black.Described conductive layer 14 is formed with described capacitance type fingerprint sensor chip 12
In color layers 19.Changing ground, described electronic equipment 100 is at corresponding described capacitance type fingerprint sensor chip 12
And/or the position of described conductive layer 14 also can omit color layers 19；Or, described electronic equipment 100 is in correspondence
The position of described capacitance type fingerprint sensor chip 12 and/or described conductive layer 14 may also set up different from color layers 19
Marker, for indicating described capacitance type fingerprint sensor chip 12 and/or the position at described conductive layer 14 place.
Seeing also Fig. 1 and Fig. 7, Fig. 7 is the partial section view of electronic equipment 100 shown in Fig. 1.Alternatively,
Described electronic equipment 100 farther includes touch sensing layer 4, and described touch sensing layer 4 is used for sensing electronic equipment
Whether 100 touched by user.Described touch sensing layer 4 can be that external hanging type is formed on display screen 3, it is possible to for box
Upper (On-Cell) mode is formed in display screen 3, it addition, alternatively interior (In-Cell) mode of box is formed at display screen
In 3.In the present embodiment, touch sensing layer 4 is to use external hanging type to illustrate as a example by being formed on display screen 3.
Described touch sensing layer 4 is arranged with described display screen 3 stacking.Described touch sensing layer 4, described capacitance type fingerprint sense
Survey chip 12 and described conductive layer 14 are respectively positioned on the homonymy of described cover sheet 10, and described capacitance type fingerprint sense
Survey chip 12 and described conductive layer 14 may be contained within color layers 19.
For the touch sensing layer 4 of external hanging type, described touch sensing layer 4 can be formed directly on cover sheet 10,
Also may be formed on an extra transparency carrier, or be formed on the outer surface of display screen 3.
Refer to the partial section view of the change embodiment that Fig. 8, Fig. 8 are electronic equipment 100.Described cover sheet
10 arrange groove 102 on first surface 101, described groove 102 by first surface 101 to second surface 103
Depression is formed.Wherein, described groove 102 partly or entirely covers described capacitance type fingerprint sensor chip 12.Arrange
Described groove 102, on the one hand can improve the intensity of fingerprint sensing signal, on the other hand user's condenser type also can be pointed out to refer to
The position at stricture of vagina sensor chip 12 place.
Refer to the partial section view of the another change embodiment that Fig. 9, Fig. 9 are electronic equipment 100 shown in Fig. 1.Institute
State cover sheet 10 and groove 102 be set on second surface 103, described groove 102 by second surface 103 to
One surface 101 depression is formed.Wherein, described groove 102 partly or entirely covers described capacitance type fingerprint sensing core
Sheet 12.Described groove 102 is set, the intensity of fingerprint sensing signal can be improved.
Further, it is possible to first surface 101 capacitance type fingerprint corresponding with second surface 103 at cover sheet 10
The position of sensor chip 12 is each formed with groove 102.
Refer to the partial section view of the another change embodiment that Figure 10, Figure 10 are electronic equipment 100 of the present invention.Institute
State touch sensing layer 4 to be formed on a substrate 40.Being formed with through hole 401 on described substrate 40, described condenser type refers to
Stricture of vagina sensor chip 12 and conductive layer 14 are arranged in described through hole 401.
It should be noted that the conductive layer 14 of this embodiment may be provided on second surface 103, it is possible to be not disposed on
On second surface 103.
Glass that described substrate 40 is the most transparent or sapphire substrate, so, the material of described substrate 40 is alternatively
Other suitable material, is not limited to glass or sapphire substrate, the most alternatively film substrate.Further,
Described substrate 40 is alternatively translucent or nontransparent cover plate, and it is transparency carrier that the application is not limiting as substrate 40.
In the present embodiment, described touch sensing layer 4 is one layer, and described touch sensing layer 4 is positioned at described base
Plate 40 is in the face of the side of described cover sheet 10.So, changing ground, described touch sensing layer 4 is alternatively two-layer,
It is separately positioned on the opposite sides of substrate 40.Described touch sensing layer 40 includes touch-sensing electrode (not shown),
The touch operation of user whether is had for sensing.
Further, described touch sensing layer 4 can be self-capacitance touch sensing layer, it is possible to touch for mutual capacitance type
Sensing layer.
Please continue to refer to Fig. 1, alternatively, described electronic equipment 100 farther includes back cover 5, is used for and described guarantor
Protecting cover plate 10 forms receiving space, houses aforementioned touch sensing layer 4, display screen 3, mainboard 2, fingerprint sensing module
1 element such as grade is in described receiving space.
Seeing also Fig. 1 and Figure 11, Figure 11 is the flow chart of the manufacture method of electronic equipment 100 shown in Fig. 1.
Described electronic equipment 100 includes that equipment ground GND, described equipment ground GND are used for loading ground signalling, described system
Include as method:
S1: a transparent cover sheet 10 is provided；
S2: form color layers 19 in the side of cover sheet 10 to form the visible area 31 of electronic equipment 100 and non-
Visible area 33；
S3: form closed or the conductive layer 14 of non-enclosed annular, a described conductive layer 14 in color layers 19
It is connected to equipment ground GND；
S4: arrange capacitance type fingerprint sensor chip 12 in the annular region that conductive layer 14 is surrounded, is used for sensing use
The finger print information at family.
Described capacitance type fingerprint sensor chip 12 for example, self-capacitance fingerprint sensing chip.
Please be one refering to Fig. 6, described capacitance type fingerprint sensor chip 12 includes induction electrode array 121 and and faradism
The testing circuit 123 that pole array 121 is connected.Described testing circuit 123 is used for driving induction electrode array 121
Perform self-capacitance fingerprint sensing.
Described testing circuit 123 includes the first earth terminal G1 and multiple signal transmission ends T.The plurality of signal transmits
End T is used for output drive signal to induction electrode array 121.
Described manufacture method farther includes:
S5: form touch sensing layer 4 in the visible area of electronic equipment 100, whether have the touch of user for sensing
Operation.
Described manufacture method farther includes:
S6: formed modulation circuit 16 in described equipment ground GND and described first earth terminal G1 between, described tune
Circuit 16 processed produces modulated signal according to the ground signalling driving signal and equipment ground GND to load, and provides modulation
Signal gives the first earth terminal G1.
In the present embodiment, described pumping signal raises with the rising of described modulated signal, with described modulation letter
Number reduction and reduce.
Described testing circuit 123 farther includes power end P1, described power end P1 for loading power voltage, institute
State supply voltage to change with the change of described modulated signal.Pressure between described supply voltage and described modulated signal
Difference keeps constant, and described pressure reduction is the described testing circuit 123 rated voltage when working.
It should be noted that in the present embodiment, modulation circuit 16 is formed at described equipment ground GND with described
Between first earth terminal G1, the first earth terminal G1 is used for load-modulate signal, so, changes ground, it is possible to adjust
Modulation circuit 16 is between power end P2 and power end P1, and described power end P1 is used for load-modulate signal, phase
The modulation that the signal that Ying Di, described pumping signal and the first earth terminal G1 are loaded all is loaded with power end P1
The change of signal and change.
Described modulated signal for example, includes described ground signalling and drives the signal of signal.In the present embodiment,
Described driving signal is higher than ground signalling, and described driving signal is boost signal compared to ground signalling.Further,
The most periodically variable square-wave signal of described modulated signal.So, changing ground, described modulated signal is alternatively
Nonperiodic signal, it addition, described modulated signal is alternatively the signal of other suitable waveform, it is not limited to square wave is believed
Number.Described driving signal may be lower than ground signalling, and described driving signal is buck signal compared to ground signalling.
The intensity using the fingerprint sensing signal of the electronic equipment 100 that method manufactured as above obtained is improved, from
And, electronic equipment 100 fingerprint sensing sensitivity correspondence is improved.
The above-mentioned manufacture method of the application is to illustrate as a example by electronic equipment 100, so, by described manufacture method
Obtain electronic equipment and be not limited to electronic equipment 100, it is possible to for other suitable electronic equipment.
Open, it will be appreciated that these embodiments are illustrative despite describing the present invention with reference to each embodiment
, and the scope of the present invention is not limited only to them.Many changes, revises, adds and improves is all possible
's.More generally, describe in the context of specific embodiments according to each embodiment disclosed by the invention.
Function can in each embodiment disclosed by the invention the most separately or in combination, or utilize not
Same term describes.These and other change, revise, add and improve can right the most subsequently want
In seeking scope disclosed by the invention defined in book.
Claims (19)
1. an electronic equipment, including:
Cover sheet, including first surface and the second surface relative with first surface；
Capacitance type fingerprint sensor chip, is arranged on the second surface side of cover sheet, is used for sensing user from cover sheet
First surface input finger print information；With
Conductive layer, is arranged on the second surface side of cover sheet, is positioned at around described capacitance type fingerprint sensor chip, institute
State conductive layer for loading ground signalling.
Electronic equipment the most according to claim 1, it is characterised in that: described conductive layer closed or non-enclosed around
Described capacitance type fingerprint sensor chip region is arranged.
Electronic equipment the most according to claim 1, it is characterised in that: described capacitance type fingerprint sensor chip includes sensing
Electrod-array and the testing circuit being connected with induction electrode array, described testing circuit be used for providing pumping signal to
Induction electrode array, drives described induction electrode array to perform fingerprint sensing.
Electronic equipment the most according to claim 3, it is characterised in that: described testing circuit includes signal transmission ends and
One earth terminal, described first earth terminal is used for load-modulate signal, and described signal transmission ends is used for providing pumping signal
To induction electrode array, described pumping signal changes with the change of described modulated signal.
Electronic equipment the most according to claim 4, it is characterised in that: described pumping signal is with the liter of described modulated signal
High and raise, reduce with the reduction of described modulated signal.
Electronic equipment the most according to claim 4, it is characterised in that: described testing circuit farther includes power end,
Described power end is used for loading power voltage, and described supply voltage changes with the change of described modulated signal, and institute
Stating the pressure reduction between supply voltage and described modulated signal and keep constant, described pressure reduction is the specified of testing circuit work
Voltage.
Electronic equipment the most according to claim 4, it is characterised in that: described electronic equipment includes fingerprint sensing module,
Described fingerprint sensing module includes described capacitance type fingerprint sensor chip, the second earth terminal and modulation circuit；Described
Second earth terminal is used for loading described ground signalling, and described modulation circuit is connected to described second earth terminal and first and connects
Between ground end, drive signal to produce described modulated signal according to described ground signalling with one, and described modulation letter is provided
Number give the first earth terminal.
Electronic equipment the most according to claim 7, it is characterised in that: described electronic equipment farther includes mainboard, institute
Stating fingerprint sensing module and farther include flexible PCB, described flexible PCB is used for connecting described mainboard with described
Capacitance type fingerprint sensor chip, transmits signal between described mainboard and described capacitance type fingerprint sensor chip.
Electronic equipment the most according to claim 1, it is characterised in that: described electronic equipment farther includes touch sensing
Layer, described touch sensing layer, described capacitance type fingerprint sensor chip and described conductive layer are respectively positioned on described protection cap
The homonymy of plate, described touch sensing layer is used for sensing whether electronic equipment is touched by user.
Electronic equipment the most according to claim 9, it is characterised in that: described electronic equipment farther includes substrate,
Described touch sensing layer is arranged on the substrate, and described substrate arranges through hole, described capacitance type fingerprint sensing core
Sheet and described conductive layer are respectively positioned in described through hole.
11. electronic equipments according to claim 1, it is characterised in that: described electronic equipment includes equipment ground, described
Equipment ground loads ground signalling, electrically connects described conductive layer and described equipment.
12. electronic equipments according to claim 1, it is characterised in that: described conductive layer is arranged on a second surface.
13. electronic equipments according to claim 1, it is characterised in that: described capacitance type fingerprint sensor chip is from electricity
Appearance formula fingerprint sensing chip.
14. according to the electronic equipment described in any one in claim 1-13, it is characterised in that: described electronic equipment is can
Take formula electronic product or household formula electronic product.
15. 1 kinds of mobile terminals, including:
Cover sheet, including first surface and the second surface relative with first surface；
Display screen, is arranged on the second surface side of cover sheet, and definition cover sheet is just showing the district of picture to display screen
Territory is the visible area of mobile terminal, and definition cover sheet anon-normal is non-visible area to the region of display screen display picture；
Capacitance type fingerprint sensor chip, is arranged on the second surface side of described cover sheet, and is positioned at described non-display area,
For sensing the finger print information of user；With
Conductive layer, is arranged on the second surface side of described cover sheet, is positioned at described non-display area, and closed or non-
Closed around the setting of described capacitance type fingerprint sensor chip region, described conductive layer is used for loading ground signalling.
16. mobile terminals according to claim 15, it is characterised in that: described capacitance type fingerprint sensor chip includes sense
Answer electrod-array and the testing circuit being connected with induction electrode array, described testing circuit include signal transmission ends and
First earth terminal, described first earth terminal is used for load-modulate signal, and described signal transmission ends is used for providing excitation letter
Number give induction electrode array, drive described induction electrode array perform self-capacitance fingerprint sensing, described pumping signal
Raise with the rising of described modulated signal, reduce with the reduction of described modulated signal.
The manufacture method of 17. 1 kinds of electronic equipments, described electronic equipment includes equipment ground, is used for loading ground connection described equipment
Signal, described manufacture method includes:
One transparent cover sheet is provided；
Color layers is formed to form visible area and the non-visible area of electronic equipment in the side of cover sheet；
Forming a closed or conductive layer for non-enclosed annular in color layers, described conductive layer is connected to equipment ground；
Capacitance type fingerprint sensor chip is set in the annular region that conductive layer is surrounded, for sensing the finger print information of user.
18. manufacture methods according to claim 17, it is characterised in that: described manufacture method farther includes: at electricity
Form touch sensing layer in the visible area of subset, whether have the touch operation of user for sensing.
19. manufacture methods according to claim 17, it is characterised in that: described capacitance type fingerprint sensor chip includes inspection
Slowdown monitoring circuit and induction electrode array, described testing circuit includes the first earth terminal and signal transmission ends, and described signal passes
Defeated end to induction electrode array, drives induction electrode array to perform self-capacitance fingerprint sensing for output drive signal；
Described manufacture method farther includes: formation modulation circuit is between the first earth terminal and equipment ground, and described modulation is electric
Road is for giving the first earth terminal according to a driving signal with equipment ground signalling formation modulated signal on the ground, described sharp
Encourage signal to raise with the rising of described modulated signal, reduce with the reduction of described modulated signal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610102488.8A CN106155197A (en) | 2016-02-24 | 2016-02-24 | The manufacture method of electronic equipment, mobile terminal and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610102488.8A CN106155197A (en) | 2016-02-24 | 2016-02-24 | The manufacture method of electronic equipment, mobile terminal and electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106155197A true CN106155197A (en) | 2016-11-23 |
Family
ID=57353251
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610102488.8A Withdrawn CN106155197A (en) | 2016-02-24 | 2016-02-24 | The manufacture method of electronic equipment, mobile terminal and electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106155197A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107077618A (en) * | 2017-01-24 | 2017-08-18 | 深圳市汇顶科技股份有限公司 | Fingerprint identification system |
| CN107577278A (en) * | 2017-09-14 | 2018-01-12 | 维沃移动通信有限公司 | A kind of display screen component and mobile terminal |
| CN109416742A (en) * | 2018-10-11 | 2019-03-01 | 深圳市汇顶科技股份有限公司 | Fingerprint mould group touches wake-up module, door lock |
-
2016
- 2016-02-24 CN CN201610102488.8A patent/CN106155197A/en not_active Withdrawn
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107077618A (en) * | 2017-01-24 | 2017-08-18 | 深圳市汇顶科技股份有限公司 | Fingerprint identification system |
| CN107577278A (en) * | 2017-09-14 | 2018-01-12 | 维沃移动通信有限公司 | A kind of display screen component and mobile terminal |
| CN107577278B (en) * | 2017-09-14 | 2020-02-04 | 维沃移动通信有限公司 | Display screen assembly and mobile terminal |
| CN109416742A (en) * | 2018-10-11 | 2019-03-01 | 深圳市汇顶科技股份有限公司 | Fingerprint mould group touches wake-up module, door lock |
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