CN206224292U - Electronic equipment - Google Patents
Electronic equipment Download PDFInfo
- Publication number
- CN206224292U CN206224292U CN201620570501.8U CN201620570501U CN206224292U CN 206224292 U CN206224292 U CN 206224292U CN 201620570501 U CN201620570501 U CN 201620570501U CN 206224292 U CN206224292 U CN 206224292U
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- China
- Prior art keywords
- bio
- identification chip
- cover sheet
- electronic equipment
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
- G06F3/0443—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using a single layer of sensing electrodes
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
- G06V40/1306—Sensors therefor non-optical, e.g. ultrasonic or capacitive sensing
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/033—Pointing devices displaced or positioned by the user, e.g. mice, trackballs, pens or joysticks; Accessories therefor
- G06F3/0354—Pointing devices displaced or positioned by the user, e.g. mice, trackballs, pens or joysticks; Accessories therefor with detection of 2D relative movements between the device, or an operating part thereof, and a plane or surface, e.g. 2D mice, trackballs, pens or pucks
- G06F3/03547—Touch pads, in which fingers can move on a surface
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
- G06F3/044—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means
- G06F3/0445—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means by capacitive means using two or more layers of sensing electrodes, e.g. using two layers of electrodes separated by a dielectric layer
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- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- General Engineering & Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Multimedia (AREA)
- Image Input (AREA)
- Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
- Telephone Set Structure (AREA)
Abstract
The utility model discloses a kind of electronic equipment.The electronic equipment includes that cover sheet and bio-identification chip include：Cover sheet, including first surface and the second surface relative with first surface；With bio-identification chip, it is bundled on the second surface of cover sheet by COG techniques, the bio-identification chip is used to sense the biological information that user is input into from the first surface of cover sheet.
Description
Technical field
The utility model is related to a kind of electronic equipment, more particularly to the electronic equipment with biological sensing function.
Background technology
Bio-identification chip (e.g., fingerprint sensor) turns into the standard configuration of increasing electronic equipment (e.g., mobile phone), mesh
Before, the positive bio-identification chip of electronic equipment is positioned over, being typically employed in carries out perforate on the cover sheet of electronic equipment, will
Bio-identification chip is combined together with physical button (Home key), is placed in the perforate.
So, increasing electronic equipment does not use physical button in front at present, but uses virtual touch button,
Therefore it provides a kind of set bio-identification chip but bio-identification chip electronics again without being combined with physical button in front
Equipment is actually necessary.
Utility model content
In order to solve the above-mentioned technical problem, the utility model provides a kind of electricity of setting bio-identification chip under cover sheet
Sub- equipment.
To achieve the above object, the utility model provides following technical scheme：
A kind of electronic equipment, including：
Cover sheet, including first surface and the second surface relative with first surface；With
Bio-identification chip, is bundled on the second surface of cover sheet by COG techniques, and the bio-identification chip is used
In the biological information that sensing user is input into from the first surface of cover sheet.
Alternatively, the bio-identification chip be nude film, or, the bio-identification chip be nude film via wafer stage chip
Packaged type is formed, or, the bio-identification chip is formed for nude film encapsulates a protective layer on the surface back to cover sheet.
Alternatively, conductor layer is provided with the second surface of the cover sheet, the electronic equipment further includes different
Side's property conductive layer, the anisotropy conductive layer is located between the conductor layer and the bio-identification chip, for electrically connecting
Conductor layer is stated with the bio-identification chip.
Alternatively, the electronic equipment further includes mainboard and connector, and the mainboard passes through the connector and institute
Conductor layer connection is stated, whether the biological information that the mainboard is sensed according to the bio-identification chip corresponds to control electronics
Perform corresponding function or start corresponding application program.
Alternatively, the connector is flexible circuit board.
Alternatively, the conductor layer is made up of silver paste or molybdenum lithium molybdenum.
Alternatively, the electronic equipment further includes light shield layer, and the light shield layer is arranged on the cover sheet and institute
State between conductor layer, the light shield layer covers the bio-identification chip, conductor layer and connector
Alternatively, set fluted on the cover sheet, the groove part or all the covering bio-identification core
Piece, wherein, the groove is recessed to be formed for the first surface of cover sheet to second surface, or/and, the groove is protection cap
The second surface of plate is recessed to be formed to first surface.
Alternatively, the electronic equipment further includes the touch-screen of the second surface side for being located at cover sheet, described
Whether touch-screen is used to sense the touch operation for having user on the first surface of the cover sheet；The touch-screen includes substrate
With setting touch sensing layer on the substrate；The substrate includes through hole, and the bio-identification chip is located at the through hole
Place.
Alternatively, the electronic equipment further includes rear shell and display device, and the display device is used for display picture,
The cover sheet cooperatively forms receiving space with the rear shell phase, to house the bio-identification chip and the display device
In receiving space.
Alternatively, the anisotropy conductive layer is anisotropic conductive film or anisotropic conductive.
Alternatively, the bio-identification chip is in fingerprint recognition chip, blood oxygen identification chip, heartbeat identification chip
Plant or various.
Alternatively, the electronic equipment is portable electronic product or household formula electronic product.
The second surface of cover sheet is bundled in by COG techniques due to the bio-identification chip of the electronic equipment of the application
On, so that the bio-identification chip is more securely fixed on an electronic device, it is difficult to be come off from electronic equipment.Separately
Outward, the connection between the bio-identification chip and interior other elements of electronic equipment becomes simple, and more firm.Further,
Bio-identification chip is bundled on the second surface of cover sheet by COG techniques, so that the bio-identification chip is more
Close to user, the intensity of the sensing signal of the bio-identification chip is relatively strong and relatively stablizes.
A kind of mobile terminal, including：
Cover sheet, including first surface and the second surface relative with first surface；With
Bio-identification chip, is bundled on the second surface of cover sheet by Flip Chip technique, the bio-identification
Chip is used to sense the biological information that user is input into from the first surface of cover sheet.
Alternatively, groove is set on the cover sheet, and the groove covers the bio-identification chip, and the groove is
First surface is recessed to be formed to second surface, or/and, the groove is recessed to be formed for second surface to first surface.
Alternatively, when the groove is formed in second surface, the bio-identification chip bonding is in the groove.
Alternatively, the mobile terminal further includes conductor layer, connector and mainboard, and the conductor layer is arranged on institute
State between bio-identification chip and the cover sheet, for being electrically connected with the bio-identification chip, the conductor layer extends
To outside groove, and it is further used for being electrically connected with the connector outside groove, the connector is further used for
Electrically connected with the mainboard, the biological information correspondence control mobile terminal that the mainboard is sensed according to the bio-identification chip
Perform corresponding function.
Alternatively, the bio-identification chip be nude film, or, the bio-identification chip be nude film via wafer stage chip
Packaged type is formed, or, the bio-identification chip is formed for nude film encapsulates a protective layer on the surface back to cover sheet.
Alternatively, the mobile terminal further includes light shield layer, and the light shield layer is arranged on the cover sheet and institute
State between conductor layer, the light shield layer covers the bio-identification chip, conductor layer and connector.
Because the bio-identification chip of the mobile terminal of the application is bundled in the of cover sheet by Flip Chip technique
On two surfaces, so that the bio-identification chip is more securely fixed on an electronic device, it is difficult to be taken off from electronic equipment
Fall.In addition, the connection in the bio-identification chip and electronic equipment between other elements becomes simple, and it is more firm.Enter one
Step ground, bio-identification chip is bundled on the second surface of cover sheet by Flip Chip technique, so that the biology
, closer to user, the intensity of the sensing signal of the bio-identification chip is relatively strong and relatively stablizes for identification chip.
Although multiple embodiments are disclosed, including its change, by having shown and described disclosed in the utility model
The following detailed description of illustrative embodiment, other embodiment will show to those skilled in the art disclosed in the utility model
And be clear to.It will be recognized that the utility model is disclosed can be changed at various obvious aspects, all modifications all without departing from
Spirit and scope of the present utility model.Correspondingly, accompanying drawing and detailed description should substantially be considered as illustrative, rather than limitation
Property.
Brief description of the drawings
Its example embodiment is described in detail by referring to accompanying drawing, feature of the present utility model and advantage will become brighter
It is aobvious.
Fig. 1 is the decomposed structural representation of an implementation method of the utility model electronic equipment.
Fig. 2 is the part part assembling structure schematic diagram of electronic equipment shown in Fig. 1.
Fig. 3 is the partial sectional schematic view of electronic equipment shown in Fig. 2.
Fig. 4 is the partial sectional schematic view of a change implementation method of electronic equipment shown in Fig. 2.
Fig. 5 is the partial sectional schematic view of the another change implementation method of electronic equipment shown in Fig. 2.
Fig. 6 is the partial sectional schematic view of the another change implementation method of electronic equipment shown in Fig. 2.
Specific embodiment
Example embodiment is described more fully with referring now to accompanying drawing.However, example embodiment can be with various shapes
Formula is implemented, and is not understood as limited to implementation method set forth herein；Conversely, thesing embodiments are provided so that this practicality is new
The design of example embodiment fully and completely, and will comprehensively be conveyed to those skilled in the art by type.For convenience or
It is clear, may exaggerate, omit or be schematically illustrated in the thickness and size of every layer shown in accompanying drawing and schematically illustrate phase
Close the quantity of element.In addition, the size of element not exclusively reflects actual size, and related elements quantity incomplete reaction reality
Border quantity.
Additionally, described feature, structure can be combined in one or more implementation methods in any suitable manner.
In the following description, there is provided many details fully understand so as to be given to implementation method of the present utility model.However,
One of ordinary skill in the art would recognize that, there is no one or more in the specific detail, or using other structures, constituent element
Deng, it is also possible to put into practice the technical solution of the utility model.In other cases, it is not shown in detail or describes known features or behaviour
Make to avoid fuzzy the utility model.
In description of the present utility model, it is to be understood that term " thickness ", " on ", D score, "front", "rear",
The orientation or position relationship of the instruction such as "left", "right", " vertical ", " level ", " top ", " bottom ", " interior ", " outward " are based on accompanying drawing institute
The orientation or position relationship for showing, are for only for ease of description the utility model and simplify description, signified rather than indicating or implying
Position or element must have specific method, with specific azimuth configuration and operation, therefore it is not intended that to this practicality
New limitation.
Further, in description of the present utility model, it is to be understood that：" multiple " includes two and two or more,
Unless the utility model separately has clearly specific restriction.
Also referring to Fig. 1-3, Fig. 1 is the decomposed structural representation of an implementation method of the utility model electronic equipment
Figure.Fig. 2 is the part part assembling structure schematic diagram of electronic equipment shown in Fig. 1.Fig. 3 cuts for the part of electronic equipment shown in Fig. 2
Face schematic diagram.The electronic equipment 100 is as being portable electronic product or household formula electronic product.Wherein, portable electronic is produced
Product are such as various mobile terminals, for example, all kinds of suitable electricity such as mobile phone, panel computer, notebook computer and Wearable product
Sub- product；Household formula electronic product is such as intelligent door lock, TV, refrigerator, all kinds of suitable electronic products of desktop computer.Need
Illustrate, electronic equipment 100 can further increase the element not shown in diagram or reduce some elements shown in diagram,
According to different electronic product corresponding selections.The electronic equipment 100 includes cover sheet 10 and bio-identification chip 12.
The cover sheet 10 includes first surface 101 and the second surface 103 relative with first surface 101.Described
One surface 101 is the outer surface of electronic equipment 100, and the second surface 103 is located at the inside of the electronic equipment 100.At this
In implementation method, the cover sheet 10 is glass cover-plate.So, the material of the cover sheet 10 is alternatively other suitable materials
Material, is not limited to glass, and the cover sheet 10 is for example alternatively sapphire cover plate or film cover plate etc..Further, institute
Cover sheet 10 or translucent or nontransparent cover plate are stated, the application is not intended to limit cover sheet 10 for transparent cover plate, can
The corresponding cover sheet of situation corresponding selection according to product.
In the present embodiment, the bio-identification chip 12 passes through COG (Chip On Glass, glass flip chip) technique
Binding (bonding) is on the second surface 103 of cover sheet 10.The bio-identification chip 12 is used to sense user from protection
The biological information of the input of first surface 101 of cover plate 10.So, ground, in other embodiments, the bio-identification core are changed
Piece 12 can be also fixed on the cover sheet 10 using other flip (Flip-Chip) technologies, such as when cover sheet 10 is thin
During membrane cover plate, correspondingly, the bio-identification chip 12 can also be bound by COF (Chip On Film, membrane of flip chip) technique
On the second surface 103 of cover sheet 10.The bio-identification chip 12 is, for example, fingerprint recognition chip, blood oxygen identification core
One or more in piece, heartbeat identification chip.So, the application is not limited thereto, and the bio-identification chip 12 is alternatively
The identification chip of other suitable types.
Because bio-identification chip 12 is bundled on the second surface 103 of cover sheet 10 by COG techniques, so that
The bio-identification chip 12 is more securely fixed on electronic equipment 100, is difficult to be come off from electronic equipment 100.Further
Ground, the bio-identification chip 12 is bundled on the second surface 103 of cover sheet 10 by COG techniques, so that described
, closer to user, the intensity of the sensing signal of the bio-identification chip 12 is relatively strong and relatively stablizes for bio-identification chip 12.
The electronic equipment 100 further includes conductor layer 13 and anisotropy conductive layer 14.The conductor layer 13 is formed in
On the second surface 103 of the cover sheet 10.The anisotropy conductive layer 14 is arranged on the conductor layer 13.The biology
Identification chip 12 is arranged on the anisotropy conductive layer 14, is electrically connected by the anisotropy conductive layer 14 and the conductor layer 13
Connect.The anisotropy conductive layer 14 be, for example, anisotropic conductive film (Anisotropic Conductive Film, ACF) 14 or
Anisotropic conductive (Anisotropic conductive adhesive/paste, ACA/ACP).So, the anisotropy is conductive
Layer 14 or other can suitably realize the material of anisotropic conductive function, and be confined to ACF described herein,
ACA、ACP。
The conductor layer 13 includes a plurality of wire 131.The conductor layer 13 is for example made up of conductive silver paste or molybdenum lithium molybdenum.
So, ground is changed, the conductor layer 13 can also be made up of conductive materials such as metal or tin indium oxides.
The electronic equipment 100 further includes mainboard (Motherboard, or Mainboard) 15 and connector 16.
The mainboard 15, also known as motherboard, system board, logic card, motherboard or base plate etc., is the core of electronic equipment 100
Element.The mainboard 15 generally comprises the devices such as processor, memory, chipset.The mainboard 15 is used to enter various types of signal
Row transmission and treatment, and control electronics 100 perform corresponding function.
The mainboard 15 is connected by the connector 16 with the conductor layer 13.It is different with described by the conductor layer 13
Side's property conductive layer 14, signal transmission is carried out between the mainboard 15 and the bio-identification chip 12.The mainboard 15 is according to institute
State whether the biological information correspondence control electronics 100 that bio-identification chip 12 sensed perform corresponding function or start phase
The application program answered, for example, solution screen function, payment function, startup wechat application program, file opening folder etc..For example, when life
The biological information prestored in the biological information that thing identification chip 12 is detected and electronic equipment 100 is consistent or meets predetermined condition
When, electronic equipment 100 is then corresponded to and performs corresponding function or the corresponding application program of startup.
The connector 16 is, for example, flexible circuit board.So, the connector 16 or other suitable elements.
Further, the bio-identification chip 12 be nude film or be nude film via wafer stage chip encapsulate (Wafer
Level Chip Scale Packaging, WLCSP) mode formed.In addition, the bio-identification chip 12 or nude film exist
A protective layer is encapsulated on back to the surface of cover sheet 10 to form.
Because bio-identification chip 12 is bundled in cover sheet 10 by the electronic equipment 100 of the application by the way of COG
On, so that, compared to quad flat non-pin package (Quad Flat No-Lead Package, QFN) or BGA Package
The bio-identification chip that modes such as (Ball Grid Array Package, BGA) is formed, the bio-identification chip of the application
12 structure becomes simpler, and thickness is thinner, so as to be more beneficial for the ultralight thinning of electronic equipment 100 development, will not be because of will be raw
Thing identification chip 12 is placed on the lower section of cover sheet 10 and takes the larger inner space of electronic equipment 100.In addition, compared to soft
When circuit board is connected with bio-identification chip, reinforcing plate need to be set for the position of correspondence bio-identification chip on flexible circuit board
Mode is better relatively accurate to connect bio-identification chip, and the connected mode between the connector 16 and conductor layer 13 of the application is simpler
It is single and more stable and firm, cost-effective.
The electronic equipment 100 can further include light shield layer 17.The light shield layer 17 is arranged on the cover sheet 10
Between the conductor layer 13.The light shield layer 17 covers the bio-identification chip 12.The light shield layer 17 can also have finger
Show the effect of the region of bio-identification chip 12.In addition, the light shield layer 17 is also used for limiting on cover sheet 10
Transmission region or viewing area.In addition, the light shield layer 17 can further cover the conductor layer 13 with the connector 16.
Cover the conductor layer 13 and be same or different from the covering bio-identification chip 12 with the light shield layer 17 of the connector 16
Light shield layer.
After light shield layer 17 is formed on the second surface 103 of the cover sheet 10, by coating or brush silver paste or
Molybdenum lithium molybdenum is in forming the conductor layer 13 on the light shield layer 17.Then, such as operation such as etching shape is being carried out to conductor layer 13
Into wire 131.Ground is changed, wire 131 is also can be formed directly on the light shield layer 17.Inventor is by a large amount of creativeness labor
It is dynamic, and found after lot of experiments, compared to other conductive materials, conductive silver paste is attached to light shield layer with molybdenum lithium molybdenum
Stability on 17 is stronger, and conductive effect is more preferable.
Please continue to refer to Fig. 1-3, the electronic equipment 100 can further include display device 18 and rear shell 20.It is described aobvious
Showing device 18 is used for display picture.The display device 18 is for example also connected with the mainboard 15, receives aobvious from mainboard 15
Show signal, so as to realize that picture shows.The cover sheet 10 is engaged to form receiving space with the rear shell 20, with collecting post
Bio-identification chip 12 is stated with the grade element of the display device 18 in receiving space.
Fig. 4 is referred to, Fig. 4 is the partial sectional schematic view of a change implementation method of electronic equipment 100.The protection cap
Fluted 105 are set on the first surface 101 of plate 10.The groove 105 is from first surface 101 to the concave shape of second surface 103
Into.Wherein, the groove 105 partly or entirely covers the bio-identification chip 12.The groove 105 is set, on the one hand may be used
Improve the intensity of the sensing signal of bio-identification chip 12, the position where on the other hand can also pointing out bio-identification chip 12.
Fig. 5 is referred to, Fig. 5 is the partial sectional schematic view of the another change implementation method of electronic equipment 100.The protection
Cover plate 10 sets groove 105 on second surface 103, and the groove 105 is from second surface 103 to the concave shape of first surface 101
Into.Wherein, the groove 105 partly or entirely covers the bio-identification chip 12.The groove 105 is set, life can be improved
The intensity of the sensing signal of thing identification chip 12.
Further, also can be in the first surface 101 of cover sheet 10 bio-identification chip 12 corresponding with second surface 103
Position be each formed with groove 105.
It should be noted that because bio-identification chip 12 is bundled in the groove 105 by the application using COG techniques
In, the thickness of the bio-identification chip 12 is again relatively thin, so that the groove 105 can be correspondingly relatively thin, when the bio-identification core
When piece 12 is bundled in the groove 105, the bio-identification chip 12 can be accomplished and back to the surface of cover sheet 10
Two surfaces 103 are concordant, so that save space, can reduce cover sheet 10 and easily be sent out because forming groove 105 in second surface 103 again
The situation of raw fragmentation.
In addition, the conductor layer 13 can be extended to outside the groove 105 from the groove 105, so that, the connection
Part 16 is more preferably connected by the conductor layer 13 with the bio-identification chip 12, more succinct convenient and reliable.
Further, because be bundled in bio-identification chip 12 in the groove 105 by COG techniques, the bio-identification
Chip 12 can also protrude from the second surface 103, or the bio-identification chip back to the surface of cover sheet 10
12 are fully located in the groove 105.The size depth of the groove 105 can be adjusted dynamically as needed, to its limit
Property processed diminishes.
Fig. 6 is referred to, Fig. 6 is the partial sectional schematic view of the another change implementation method of electronic equipment 100.The electricity
Sub- equipment further includes touch sensing layer 191.The touch sensing layer 191 is used to sense the first table of the cover sheet 10
Whether the touch operation of user is had on face 101.The touch sensing layer 191 is formed on the second surface of the cover sheet 10
Or be formed on a substrate 193, so as to form touch-screen 19.
The substrate 193 is for example provided with through hole 194 in the region where the correspondence bio-identification chip 12.The biology
Identification chip 12 is located at the through hole 194.
The substrate 193 is, for example, transparent glass or sapphire substrate, and so, the material of the substrate 193 is alternatively it
Its suitable material, is not limited to glass or sapphire substrate, for example, be alternatively film substrate.Further, the substrate
193 are alternatively translucent or nontransparent cover plate, and the application is not intended to limit substrate 193 for transparency carrier.
In the present embodiment, the touch sensing layer 191 is one layer, and touch sensing layer 191 is located at the base
Plate 193 is in face of the side of the cover sheet 10.So, ground, the touch sensing layer 191 or two-layer are changed, is set respectively
Put the opposite sides in substrate 193.Touch sensing layer 191 includes touch-sensing electrode (not shown), for sense whether
There is the touch operation of user.
Further, the touch sensing layer 191 can touch biography for self-capacitance touch sensing layer, or mutual capacitance type
Sense layer.
In this embodiment, be may also set up on the first surface 101 or/and second surface 103 of the cover sheet 10
Groove 105.
It should be noted that when groove 105 is formed on second surface 103, the thickness of the bio-identification chip 12
Relatively thin, when the bio-identification chip 12 is bound in the groove 105, it can be with back to the surface of cover sheet 10
The second surface of cover sheet 10 is concordant, so as to can be corresponded on the substrate 193 be not provided with through hole 194.
In the present embodiment, the touch sensing layer 191 is stacked with the cover sheet 10.The touch sensing
Display device 18 can be further stacked under layer 191 (see Fig. 1).So, the touch sensing layer 19 also may be formed at display dress
Put in 18, as an embedded touch display unit.
The utility model is described despite each embodiment of reference to disclose, it will be appreciated that these embodiments are explanations
Property, and scope of the present utility model is not limited only to them.Many changes, modification, addition and improvement are all possible.
More generally, each embodiment is described in the context of specific embodiments according to disclosed in the utility model.Function can
In the process in a different manner separately or in combination, or different terms is utilized with each embodiment disclosed in the utility model
To describe.These and other change, modification, addition and improve can be in this reality as defined in subsequent claims
With in new scope of disclosure.
Claims (19)
1. a kind of electronic equipment, including：
Cover sheet, including first surface and the second surface relative with first surface；With
Bio-identification chip, is bundled on the second surface of cover sheet by COG techniques, and the bio-identification chip is used to feel
Survey the biological information that user is input into from the first surface of cover sheet.
2. electronic equipment as claimed in claim 1, it is characterised in that：The bio-identification chip is nude film, or, the biology
Identification chip is formed for nude film via wafer stage chip packaged type, or, the bio-identification chip is nude film back to protection
A protective layer is encapsulated on the surface of cover plate to form.
3. electronic equipment as claimed in claim 1, it is characterised in that：Wire is provided with the second surface of the cover sheet
Layer, the electronic equipment further includes anisotropy conductive layer, and the anisotropy conductive layer is located at the conductor layer and the life
Between thing identification chip, for electrically connecting the conductor layer with the bio-identification chip.
4. electronic equipment as claimed in claim 3, it is characterised in that：The electronic equipment further includes mainboard and connection
Part, the mainboard is connected by the connector with the conductor layer, and the mainboard is sensed according to the bio-identification chip
Biological information correspondence control electronics whether perform corresponding function or start corresponding application program.
5. electronic equipment as claimed in claim 4, it is characterised in that：The connector is flexible circuit board.
6. electronic equipment as claimed in claim 3, it is characterised in that：The conductor layer is made up of silver paste or molybdenum lithium molybdenum.
7. electronic equipment as claimed in claim 4, it is characterised in that：The electronic equipment further includes light shield layer, described
Light shield layer is arranged between the cover sheet and the conductor layer, and the light shield layer covers the bio-identification chip, wire
Layer and connector.
8. electronic equipment as claimed in claim 1, it is characterised in that：Set fluted on the cover sheet, the groove
The bio-identification chip is partly or entirely covered, wherein, the groove is recessed to second surface for the first surface of cover sheet
Fall into and formed, or/and, the groove is recessed to be formed for the second surface of cover sheet to first surface.
9. the electronic equipment as described in claim 1 or 8, it is characterised in that：The electronic equipment further includes to be located at protection
Whether the touch-screen of the second surface side of cover plate, the touch-screen is useful on the first surface of the cover sheet for sensing
The touch operation at family；The touch-screen includes substrate touch sensing layer with setting on the substrate；The substrate includes logical
Hole, the bio-identification chip is located at the through hole.
10. electronic equipment as claimed in claim 1, it is characterised in that：The electronic equipment further includes rear shell and display
Device, the display device is used for display picture, and the cover sheet cooperatively forms receiving space with the rear shell phase, to house
The bio-identification chip is with the display device in receiving space.
11. electronic equipments as claimed in claim 3, it is characterised in that：The anisotropy conductive layer be anisotropic conductive film or
Anisotropic conductive.
12. electronic equipments as claimed in claim 1, it is characterised in that：The bio-identification chip is fingerprint recognition chip, blood
One or more in oxygen identification chip, heartbeat identification chip.
13. electronic equipments as claimed in claim 1, it is characterised in that：The electronic equipment is portable electronic product or family
Occupy formula electronic product.
A kind of 14. mobile terminals, including：
Cover sheet, including first surface and the second surface relative with first surface；With
Bio-identification chip, is bundled on the second surface of cover sheet by Flip Chip technique, the bio-identification chip
For sensing the biological information that user is input into from the first surface of cover sheet.
15. mobile terminals as claimed in claim 14, it is characterised in that：Groove, the groove are set on the cover sheet
The bio-identification chip is covered, the groove is recessed to be formed for first surface to second surface, or/and, the groove is the
Two surfaces are recessed to be formed to first surface.
16. mobile terminals as claimed in claim 15, it is characterised in that：It is described when the groove is formed in second surface
Bio-identification chip bonding is in the groove.
17. mobile terminals as claimed in claim 16, it is characterised in that：The mobile terminal further includes conductor layer, connects
Fitting and mainboard, the conductor layer are arranged between the bio-identification chip and the cover sheet, for the biology
Identification chip is electrically connected, and the conductor layer is extended to outside groove, and is further used for and the connection outside groove
Part is electrically connected, and the connector is further used for being electrically connected with the mainboard, and the mainboard is according to the bio-identification chip institute
The biological information correspondence control mobile terminal of sensing performs corresponding function.
18. mobile terminals as claimed in claim 14, it is characterised in that：The bio-identification chip is nude film, or, the life
Thing identification chip is formed for nude film via wafer stage chip packaged type, or, the bio-identification chip is nude film back to guarantor
A protective layer is encapsulated on the surface of protecting cover plate to form.
19. mobile terminals as claimed in claim 17, it is characterised in that：The mobile terminal further includes light shield layer, institute
State light shield layer to be arranged between the cover sheet and the conductor layer, the light shield layer covers the bio-identification chip, leads
Line layer and connector.
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/CN2016/077154 WO2017161526A1 (en) | 2016-03-23 | 2016-03-23 | Electronic device |
| IBPCT/CN2016/077154 | 2016-03-23 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206224292U true CN206224292U (en) | 2017-06-06 |
Family
ID=56532178
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201680000099.2A Pending CN105830094A (en) | 2016-03-23 | 2016-03-23 | Electronic device |
| CN201620570501.8U Active CN206224292U (en) | 2016-03-23 | 2016-06-14 | Electronic equipment |
Family Applications Before (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201680000099.2A Pending CN105830094A (en) | 2016-03-23 | 2016-03-23 | Electronic device |
Country Status (2)
| Country | Link |
|---|---|
| CN (2) | CN105830094A (en) |
| WO (1) | WO2017161526A1 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105830094A (en) * | 2016-03-23 | 2016-08-03 | 深圳信炜科技有限公司 | Electronic device |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108429985A (en) * | 2018-04-23 | 2018-08-21 | 深圳市沃特沃德股份有限公司 | Intelligent sound box |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20150022495A1 (en) * | 2013-07-19 | 2015-01-22 | Apple Inc. | Multi-Sensor Chip |
| CN104615980B (en) * | 2015-01-27 | 2018-11-23 | 华进半导体封装先导技术研发中心有限公司 | A kind of fingerprint identification device and preparation method thereof |
| CN104932763B (en) * | 2015-04-17 | 2018-06-01 | 汕头超声显示器技术有限公司 | A kind of capacitance touch screen and its fingerprint detection method with fingerprint identification function |
| CN204577415U (en) * | 2015-04-28 | 2015-08-19 | 上海思立微电子科技有限公司 | Bio-identification module |
| CN204759453U (en) * | 2015-07-14 | 2015-11-11 | 阿里巴巴集团控股有限公司 | Terminal |
| WO2017161526A1 (en) * | 2016-03-23 | 2017-09-28 | 深圳信炜科技有限公司 | Electronic device |
-
2016
- 2016-03-23 WO PCT/CN2016/077154 patent/WO2017161526A1/en active Application Filing
- 2016-03-23 CN CN201680000099.2A patent/CN105830094A/en active Pending
- 2016-06-14 CN CN201620570501.8U patent/CN206224292U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105830094A (en) * | 2016-03-23 | 2016-08-03 | 深圳信炜科技有限公司 | Electronic device |
Also Published As
| Publication number | Publication date |
|---|---|
| WO2017161526A1 (en) | 2017-09-28 |
| CN105830094A (en) | 2016-08-03 |
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Effective date of registration: 20210604 Address after: 545000 No.108, 2nd floor, building 2, 29 Xinliu Avenue, Liuzhou City, Guangxi Zhuang Autonomous Region Patentee after: Liuzhou Zibo Technology Co.,Ltd. Address before: 518055 Shenzhen, Nanshan District, Guangdong Xili Street Honghua Ling Industrial Zone 2 District 1 District 5 Building (Xi Bian) Patentee before: SHENZHEN XINWEI TECHNOLOGY Co.,Ltd. |