CN106055179A - Electronic equipment - Google Patents

Abstract

The invention discloses a piece of electronic equipment. The electronic equipment comprises a protective cover plate and a touch screen, wherein the protective cover plate and the touch screen are disposed in a stacked manner; the protective cover plate comprises a through hole; the electronic equipment further comprises a sensing identification module; the touch screen is disposed between the sensing identification module and the protective cover plate; and the sensing identification module directly faces the through hole. The sensing identification module of the electronic equipment has higher sensitivity; and the protective cover plate does not get broken easily.

Description

Electronic equipment

Technical field

The present invention relates to a kind of electronic equipment, particularly relate to a kind of electronics with sensing identification function Equipment.

Background technology

Sensing identifies that module (e.g., fingerprint sensing devices) becomes increasing electronic equipment (e.g., hands Machine) standard configuration, at present, be positioned over the sensing identification module in electronic equipment front, be typically employed in electricity Carry out perforate on the cover sheet of subset, sensing is identified that module is tied with physical button (Home key) It is combined, is placed in described perforate.

So, the most increasing electronic equipment does not use physical button in front, but uses Virtual touch button, therefore it provides one arranges sensing in front identifies module but sensing identification mould Group electronic equipment without combining with physical button again is the most necessary.

Summary of the invention

In order to solve above-mentioned technical problem, the present invention provides and arranges sensing identification under a kind of cover sheet The electronic equipment of module.

For achieving the above object, the present invention provides following technical scheme:

A kind of electronic equipment, including cover sheet and touch screen, described cover sheet and touch screen layer Folded setting, wherein, described cover sheet includes that through hole, described electronic equipment farther include sensing Identifying module, described touch screen is arranged on described sensing and identifies between module and described cover sheet, And, described sensing identifies that described through hole is just arranged by module.

Alternatively, described touch screen includes substrate and touch sensing layer, and described touch sensing layer is arranged On the substrate, described substrate identifies between module and described cover sheet in described sensing.

Alternatively, defining the described substrate part just to described through hole is Part I, and definition is described Substrate anon-normal is Part II to the part of described through hole, and wherein, described Part I is partly or completely Sensing described in all standing identifies module.

Alternatively, described touch sensing layer is positioned at the Part II of substrate.

Alternatively, described sensing identifies that module is positioned at the relative of described substrate with described touch sensing layer Both sides or homonymy.

Alternatively, described substrate is made by glass material with described cover sheet, or, institute Stating cover sheet to be made up of sapphire material, described substrate is made up of glass material.

Alternatively, described through hole includes the first opening and the second opening connected, wherein, described First opening relatively the second opening is adjacent to touch screen, and the area of the first opening is opened less than or equal to second The area of mouth.

Alternatively, described electronic equipment farther includes conductive layer, described conductive layer and described sensing Identify that module is arranged on the homonymy of substrate, or with described sensing, described conductive layer identifies that module sets respectively Put the opposite sides at substrate, and around described sensing, described conductive layer identifies that module is arranged, described Conductive layer is used for loading ground signalling.

Alternatively, in sensing, described conductive layer is for identifying that module persistently loads ground connection when performing sensing Signal.

Alternatively, in sensing, described conductive layer is for identifying that module only loads ground connection letter when performing sensing Number.

Alternatively, described sensing identify module be fingerprint recognition module, blood oxygen identification module, the heart Jump one or more identified in module.

Alternatively, described electronic equipment is portable electronic product or household formula electronic product.

The sensing identification module of the electronic equipment of the application is arranged under a touch screen, described cover sheet The corresponding position at sensing identification module arranges through hole, due to the general relatively protection cap of the thickness of touch screen The thickness of plate is thin, and therefore, the sensing of described electronic equipment identifies that the sensitivity of module is higher.It addition, Cover sheet arranges through hole be possible not only to play instruction user and sense and identify module position Effect, and, production firm can also use existing manufacture equipment and production procedure, saves Cost, further, cover sheet is not easy to broken relatively, it is ensured that the use matter of electronic equipment Amount.

Although disclosing multiple embodiment, change including it, but by illustrate and describing this The following detailed description of bright disclosed illustrative embodiment, other embodiments disclosed by the invention are by right Those skilled in the art is apparent.Can be in various showing it will be recognized that the present invention is open The aspect amendment being clear to, all modifications is all without departing from the spirit and scope of the present invention.Correspondingly, Accompanying drawing and detailed description substantially should be considered illustrative and not restrictive.

Accompanying drawing explanation

Describe its example embodiment, inventive feature and advantage in detail by referring to accompanying drawing will become Must become apparent from.

Fig. 1 is the part-structure schematic diagram of electronic equipment one embodiment of the present invention.

Fig. 2 is a kind of cut-away view of electronic equipment shown in Fig. 1.

Fig. 3 is the part-structure schematic diagram of the another embodiment of electronic equipment of the present invention.

Fig. 4 is a kind of cut-away view of electronic equipment shown in Fig. 3.

Fig. 5 is the decomposition texture schematic diagram of the another embodiment of electronic equipment shown in Fig. 1.

Detailed description of the invention

It is described more fully with example embodiment referring now to accompanying drawing.But, example embodiment Can implement in a variety of forms, and be not understood as limited to embodiment set forth herein；On the contrary, These embodiments are provided so that the present invention will fully and completely, and by the design of example embodiment Convey to those skilled in the art all sidedly.For convenience or clear, may exaggerate, omit or It is schematically illustrated in thickness and the size of every layer shown in accompanying drawing and schematically illustrates relevant unit The quantity of part.It addition, the size of element not exclusively reflects actual size, and the number of related elements Amount incomplete reaction actual quantity.

Additionally, described feature, structure can be combined in one or more in any suitable manner In many embodiments.In the following description, it is provided that many details thus be given the present invention The fully understanding of embodiment.But, one of ordinary skill in the art would recognize that there is no described spy That determines in details is one or more, or uses other structure, constituent element etc., it is also possible to practice this The technical scheme of invention.In other cases, it is not shown in detail or describes known features or operation To avoid the fuzzy present invention.

Embodiments of the invention are described below in detail, and the example of described embodiment is shown in the drawings, The most same or similar label represents same or similar element or has identical or class Element like function.The embodiment described below with reference to accompanying drawing is exemplary, it is intended to user Explain the present invention, and be not considered as limiting the invention.

In describing the invention, it is to be understood that term " thickness ", " on ", D score, "front", "rear", "left", "right", " vertically ", " level ", " top ", " end ", Orientation or the position relationship of the instruction such as " interior ", " outward " are based on orientation shown in the drawings or position Relation, is for only for ease of the description present invention and simplifies description rather than instruction or imply indication Position or element must have specific method, with specific azimuth configuration and operation, therefore can not It is interpreted as limitation of the present invention.

In the present invention, unless otherwise clearly defined and limited, term " install ", " being connected ", " connect ", the term such as " fixing " should be interpreted broadly, and connects, also for example, it may be fixing Can be to removably connect, or integral；Can be to be mechanically connected, it is also possible to be electrical connection；Can Being to be directly connected to, it is also possible to be to be indirectly connected with by intermediary, can be two element internals Connection or the interaction relationship of two elements.For the ordinary skill in the art, Above-mentioned term concrete meaning in the present invention can be understood as the case may be.

Further, in describing the invention, it is to be understood that: " multiple " include two And two or more, unless the present invention separately has the most concrete restriction.It addition, each element title and The word such as " first ", " second " occurred in signal name is not to limit element or signal goes out Existing sequencing, but name for convenience of element, clearly distinguish each element so that describe simpler Clean.

Lot of experiments through inventor finds, if sensing identifying, (e.g., fingerprint passes module Inductor component) directly it is configured to below the cover sheet of electronic equipment, owing to cover sheet compares Thickness, the sensitivity of module is relatively low to cause sensing to identify, but, if by thinning cover sheet correspondence sense Should identify the Thickness Mode of position of module to if improving induced signal intensity, cover sheet due to Exist variable thickness cause, cause cover sheet manufacturing process, be assembled into product process and During user uses, cover sheet thinner thickness and the thicker intersection of thickness be easier to send out Raw fracture, it addition, thickness is more frangible than relatively thin position, cause the user economic loss, And to series of technical such as brand are negatively affected, therefore, based on described technical problem Discovery, inventor is tested by substantial amounts of creative work and substantial amounts of experimentation, under proposition State the electronic equipment of the application.

See also the part-structure that Fig. 1 and Fig. 2, Fig. 1 are electronic equipment one embodiment of the present invention Schematic diagram.Fig. 2 is a kind of cut-away view of electronic equipment shown in Fig. 1.Described electronic equipment 100 is such as For portable electronic product or household formula electronic product.Wherein, portable electronic product is as various Mobile terminal, such as, mobile phone, panel computer, notebook computer and Wearable product etc. are each The suitable electronic product of class；Household formula electronic product is as intelligent door lock, TV, refrigerator, desk-top All kinds of suitable electronic product such as computer.Described electronic equipment 100 includes cover sheet 10, touches Screen 12 and sensing identify module 14.Described cover sheet 10 is arranged with touch screen 12 stacking.Institute State touch screen 12 to be arranged between described sensing identification module 14 and described cover sheet 10.Described Cover sheet 10 includes through hole 101.Described sensing identifies that described through hole 101 is just arranged by module 14.

Described touch screen 12 includes substrate 121 and touch sensing layer 123, described touch sensing layer 123 Being arranged on described substrate 121, described substrate 121 is positioned at described sensing and identifies that module 14 is with described Between cover sheet 10.

Defining the described substrate 121 part just to described through hole 101 is Part I A, defines institute Stating substrate 121 anon-normal to the part of described through hole 101 is Part II B, wherein, and described first Portion A or be completely covered described sensing identify module 14.It should be noted that in FIG Part I A is the region being positioned at dotted line, and Part II B is the part outside dotted line.

Owing to the thickness of the substrate 121 of touch screen 12 is typically thin compared with the thickness of cover sheet 10, because of This, the sensing of described electronic equipment 100 identifies that the sensitivity of module 14 is higher.It addition, in protection Arrange through hole 101 on cover plate 10 to be possible not only to play instruction user to sense identification module 14 institute in place The effect put, and, production firm can also use existing manufacture equipment and production procedure, Cost-effective, further, cover sheet 10 is not easy to broken relatively, it is ensured that electronic equipment 100 Use quality.

Glass that described cover sheet 10 is the most transparent or sapphire cover plate, so, described protection cap The material of plate 10 is alternatively other suitable material, is not limited to glass or sapphire cover plate, example Such as alternatively thin film cover plate.Further, described cover sheet 10 is alternatively translucent or nontransparent Cover plate, the application is not limiting as cover sheet 10 for transparent cover plate.

Glass that described substrate 121 is the most transparent or sapphire substrate, so, described substrate 121 Material be alternatively other suitable material, be not limited to glass or sapphire substrate, the most also It can be film substrate.Further, described substrate 121 is alternatively translucent or nontransparent cover plate, The application is not limiting as substrate 121 for transparency carrier.

In the present embodiment, described touch sensing layer 123 is one layer, and described touch sensing layer The 123 Part II B being positioned at described substrate 121.Further, described sensing identifies module 14 With the opposite sides that described touch sensing layer 123 is positioned at described substrate 12.

So, changing ground, in other embodiments, described sensing identifies that module 14 touches with described Touch sensing layer 123 and be respectively positioned on the homonymy of described substrate 12, or, described touch sensing layer 123 is also Can be two-layer, be separately positioned on the opposite sides of substrate 121.Described touch sensing layer 123 includes Whether touch-sensing electrode (not shown), have the touch operation of user for sensing.

Further, described touch screen 12 can be self-capacitance touch screen, it is possible to touch for mutual capacitance type Touch screen.

Described sensing identifies that module 14 is preferably bio-identification module, so, however it is not limited to bio-identification Module, it is possible to for the sensing identification module of other suitable type.Described bio-identification module is used for knowing Not Jie Chu or the predetermined biological information of user close to electronic equipment 100.When bio-identification mould The biological information that group 14 detects is consistent with the biological information prestored in electronic equipment 100 Time, then the corresponding function performing to preset of electronic equipment 100 or application program.Described bio-identification mould One or many in group 14 for example, fingerprint recognition module, blood oxygen identification module, heart beating identification module Kind, so, the application is not limited thereto, and described bio-identification module 12 is alternatively other suitable class The identification module of type.

Specifically, described fingerprint recognition module is such as self-capacitance fingerprint recognition module or mutual capacitance type Fingerprint recognition module.

Described through hole 101 includes the first opening 102 and the second opening 103 connected, wherein, institute State first opening 102 relatively the second opening 103 adjacent to touch screen 12.In the present embodiment, described The area of area e.g., less than second opening 103 of the first opening 102 of through hole 101.Preferably, Described sensing identifies that the sensing region of module 14 is positioned at the region just limited the second opening 103 In.

So, ground, in other embodiments, the first opening 102 of described through hole 101 are changed Area also can be equal to arranging more than the area of the second opening 103.

In the present embodiment, the through hole of described through hole 101 for example, truncated cone-shaped.So, the application Being not limited to this, described through hole 101 is alternatively the through hole of other suitable shape, for example, cylindrical Through hole, or the cross section of described through hole 101 be rectangle or rounding rectangle or chamfering rectangle or Oval etc..

See also the part of the another embodiment that Fig. 3 and Fig. 4, Fig. 3 are electronic equipment of the present invention Structural representation.Fig. 4 is a kind of cut-away view of electronic equipment shown in Fig. 3.Described electronic equipment 200 Essentially identical with the primary structure of described electronic equipment 100, differring primarily in that of the two: described Electronic equipment 200 arranges conductive layer 25 further below at substrate 221.That is, described conductive layer With sensing, 25 identify that module 24 is arranged on the homonymy of touch screen 22.

In the present embodiment, described conductive layer 25 is closed identifies module 24 around described sensing Region is arranged.So, changing ground, described conductive layer 25 also can be non-enclosed around described sense Should identify that module 24 region is arranged, in other words, described conductive layer 25 can be divided into several sections to set Put.

Further, described conductive layer 25 may also be arranged between touch screen 22 and cover sheet 20, Identify that module 24 is positioned at the opposite sides of touch screen 22 with sensing.Additionally, it is possible at touch screen 22 Opposite sides be all correspondingly arranged conductive layer 25.

Through hole 201 is the most just arranged, so by described conductive layer 25, it is possible to outside just to through hole 201 Enclose setting.Preferably, user near to or in contact with to correspondence sensing identify module 24 position time, Can be together near to or in contact with the position to corresponding conductive layer 25.

In the present embodiment, in sensing, described conductive layer 25 is for identifying that module 24 performs identification Ground signalling is loaded during sensing.

Generally, electronic equipment 100 includes equipment ground GND, and described conductive layer 25 is connected to equipment Ground GND.Described equipment ground GND is also known as systematically, and for example, power supply of electronic equipment 100 is electric The negative pole in source, power supply is such as battery.Equipment ground GND is used for loading ground signalling, therefore, Ground signalling is also known as equipment earth signal or systematically signal.Described ground signalling is constant voltage signal, As the voltage reference of circuit each in electronic equipment 100, described ground signalling is for example, The voltage signals such as 0V (volt), 2V, (-1) V.Generally, electronic equipment 100 equipment ground GND or Systematically GND not earth ground or definitely the most greatly.So, when electronic equipment 100 by conductor with When earth ground connects, described equipment ground GND can also be earth ground.

Especially, when sensing identifies that module 24 is capacitance type fingerprint identification module, it is loaded with ground connection The conductive layer 25 of signal can improve the intensity that sensing identifies the fingerprint sensing signal of module 24.Institute State capacitance type fingerprint identification module and preferably be from capacitance type fingerprint identification module.

Further, when sensing identifies that module 24 is capacitance type fingerprint identification module, change ground, Described conductive layer 25 also can load the signal of change, such as pumping signal, described conductive layer 25 with The induction electrode array of capacitance type fingerprint identification module forms mutual capacitance.Or, when sensing identifies When module 24 is self-capacitance fingerprint recognition module, described conductive layer 25 load-modulate signal.Institute Stating conductive layer 25 also can be unsettled.

Further, when sensing identifies that module 24 is capacitance type fingerprint identification module, condenser type Fingerprint recognition module includes induction electrode array, testing circuit, control circuit, filter circuit, deposits The circuit of the series of complexes such as storage circuit.Wherein, described induction electrode array is preferably placed at described In two openings 103.So, the part in described induction electrode array may be alternatively located at described second opening Outside 103, sensing identifies that module 24 is modified by software algorithm.

Refer to the decomposition texture schematic diagram of the another embodiment that Fig. 5, Fig. 5 are electronic equipment 100. Described electronic equipment 100 farther include display device 16, mainboard (Motherboard, or Mainboard) 17 and back cover 18.Described back cover 18 is for matching with described cover sheet 10 Formed receiving space, in order to house touch screen 12, sensing identify module 14, display device 16, with And mainboard 17 is in wherein.

Described mainboard 17, also known as motherboard, system board, logic card, motherboard or base plate etc., is electricity The core parts of subset 100.Described mainboard 17 generally comprises processor, memorizer, chipset Deng device.Described mainboard 17 is for being transmitted various types of signal and processing, and controls electronic equipment 100 perform corresponding function.

In the present embodiment, described display device 16 is arranged with described touch screen 12 stacking, uses Show in performing picture.So, changing ground, the touch sensing layer 123 of described touch screen 12 also may be used It is formed in display device 16, or corresponding element, described substrate in shared display device 16 121 substrates sharing described display device 16.

Described touch screen 12, described sensing identify that module 14 and described display device 16 are used to It is connected with described mainboard 17.

In the present embodiment, described sensing identifies that module 14 includes sensing identification chip 141 and soft Property circuit board 143.Described flexible circuit board 143 is used for connecting sensing identification chip 141 to mainboard 17, carry out signal transmission between.

Described sensing identification chip 141 for example, one chip or a chipset.When sensing identifies core When sheet 141 is chipset, it may include sensing identifies sensor and control chip and power supply chip Both one or whole.

Shown in above-mentioned Fig. 5, the structure of electronic equipment 100 is equally applicable electronic equipment 200, need into One step explanation, the conductive layer 25 of electronic equipment 200 can be by flexible circuit board and equipment ground GND connects.

Need it is further noted that for display picture electronic equipment 100,200 for, institute State electronic equipment 100,200 include the viewing area for showing picture and be positioned at around viewing area non- Viewing area, wherein, corresponding non-display area, described cover sheet 10,20 is such as provided with color Layer, described bio-identification module 14,24, conductive layer 15,25 be preferably provided at electronic equipment 100, The non-display area of 200.So, the present invention is not limited thereto, described bio-identification module 14,24, Conductive layer 15,25 may also be arranged on viewing area.

It is open despite describing the present invention with reference to each embodiment, it will be appreciated that these are implemented Example is illustrative, and the scope of the present invention is not limited only to them.Many changes, revises, adds It is all possible for adding and improving.More generally, according to each embodiment disclosed by the invention it is Describe in the context of specific embodiments.Function can be in each embodiment disclosed by the invention The most separately or in combination, or utilize different terms to describe.These and Other change, revise, add and improve can be as defined in subsequent claim In scope disclosed by the invention.

Claims (10)

1. an electronic equipment, including cover sheet and touch screen, described cover sheet and touch screen layer Folded setting, it is characterised in that: described cover sheet includes that through hole, described electronic equipment wrap further Including sensing and identify module, described touch screen is arranged on described sensing and identifies module and described cover sheet Between, and, described sensing identifies that described through hole is just arranged by module.

2. electronic equipment as claimed in claim 1, it is characterised in that: described touch screen includes substrate With touch sensing layer, described touch sensing layer is arranged on the substrate, and described substrate is positioned at described Sensing identifies between module and described cover sheet.

3. electronic equipment as claimed in claim 2, it is characterised in that: define described substrate just to institute The part stating through hole is Part I, and defining described substrate anon-normal to the part of described through hole is second Part, wherein, sensing described in the partly or completely all standing of described Part I identifies module.

4. electronic equipment as claimed in claim 3, it is characterised in that: described touch sensing layer is positioned at The Part II of substrate.

5. electronic equipment as claimed in claim 2, it is characterised in that: described sensing identify module with Described touch sensing layer is positioned at opposite sides or the homonymy of described substrate.

6. electronic equipment as claimed in claim 2, it is characterised in that: described substrate and described protection Cover plate is made by glass material, or, described cover sheet is made up of sapphire material, institute State substrate to be made up of glass material.

7. electronic equipment as claimed in claim 1, it is characterised in that: described through hole includes connecting The first opening and the second opening, wherein, described first opening relatively the second opening adjacent to touch screen, And first the area of opening less than or equal to the area of the second opening.

8. electronic equipment as claimed in claim 2, it is characterised in that: described electronic equipment is further Including conductive layer, described conductive layer and described sensing identify that module is arranged on the homonymy of substrate, or institute State conductive layer and identify that module is separately positioned on the opposite sides of substrate, and described conduction with described sensing Around described sensing, layer identifies that module is arranged, described conductive layer is used for loading ground signalling.

9. electronic equipment as claimed in claim 1, it is characterised in that: described sensing identifies that module is For one or more in fingerprint recognition module, blood oxygen identification module, heart beating identification module.

10. electronic equipment as claimed in claim 1, it is characterised in that: described electronic equipment is can Take formula electronic product or household formula electronic product.