CN106127101A - Electronic equipment - Google Patents
Electronic equipment Download PDFInfo
- Publication number
- CN106127101A CN106127101A CN201610102587.6A CN201610102587A CN106127101A CN 106127101 A CN106127101 A CN 106127101A CN 201610102587 A CN201610102587 A CN 201610102587A CN 106127101 A CN106127101 A CN 106127101A
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- China
- Prior art keywords
- electronic equipment
- cover sheet
- identification module
- substrate
- bio
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F3/00—Input arrangements for transferring data to be processed into a form capable of being handled by the computer; Output arrangements for transferring data from processing unit to output unit, e.g. interface arrangements
- G06F3/01—Input arrangements or combined input and output arrangements for interaction between user and computer
- G06F3/03—Arrangements for converting the position or the displacement of a member into a coded form
- G06F3/041—Digitisers, e.g. for touch screens or touch pads, characterised by the transducing means
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
- G06V40/1329—Protecting the fingerprint sensor against damage caused by the finger
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- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Human Computer Interaction (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- General Engineering & Computer Science (AREA)
- Multimedia (AREA)
- Measurement Of Length, Angles, Or The Like Using Electric Or Magnetic Means (AREA)
Abstract
The invention discloses a kind of electronic equipment.Described electronic equipment includes: cover sheet, and including first surface and the second surface relative with first surface, cover sheet is provided through the through hole of first surface and second surface；Bio-identification module, is arranged on the second surface side of cover sheet, and just arranges described through hole, and described bio-identification module is for sensing the bio information that user inputs from the first surface of cover sheet；And substrate, it is arranged on the second surface side of cover sheet, arranges with cover sheet stacking, and between described cover sheet and described bio-identification module.The sensitivity of the bio-identification module of described electronic equipment is higher, and cover sheet is non-friable.
Description
Technical field
The present invention relates to a kind of electronic equipment, particularly relate to the electronic equipment with biological sensing function.
Background technology
Bio-identification module (e.g., fingerprint sensing devices) becomes increasing electronic equipment (e.g., hands
Machine) standard configuration, at present, be positioned over the bio-identification module in electronic equipment front, be typically employed in electricity
Carry out perforate on the cover sheet of subset, bio-identification module is tied with physical button (Home key)
It is combined, is placed in described perforate.
So, the most increasing electronic equipment does not use physical button in front, but uses
Virtual touch button, therefore it provides one arranges bio-identification module in front but bio-identification mould
Group electronic equipment without combining with physical button again is the most necessary.
Summary of the invention
In order to solve above-mentioned technical problem, the present invention provides and arranges bio-identification under a kind of cover sheet
The electronic equipment of module.
For achieving the above object, the present invention provides following technical scheme:
A kind of electronic equipment, including:
Cover sheet, including first surface and the second surface relative with first surface, cover sheet
It is provided through the through hole of first surface and second surface；
Bio-identification module, is arranged on the second surface side of cover sheet, and just to described through hole
Arranging, described bio-identification module is for sensing the life that user inputs from the first surface of cover sheet
Thing information；With
Substrate, is arranged on the second surface side of cover sheet, arranges with cover sheet stacking, and
Between described cover sheet and described bio-identification module.
Alternatively, defining the described substrate part just to described through hole is Part I, and definition is described
Substrate anon-normal is Part II to the part of described through hole, and wherein, described Part I is partly or completely
Bio-identification module described in all standing.
Alternatively, described electronic equipment farther includes touch sensing layer, and described touch sensing layer sets
Putting on the substrate, described touch sensing layer is used for sensing whether described electronic equipment is touched.
Alternatively, described electronic equipment farther includes display device, and described display device is used for showing
Diagram picture, described display device is arranged on the substrate side back to described cover sheet, described display
Setting touch sensing layer in device, described touch sensing layer is used for sensing whether described electronic equipment is touched
Touch.
Alternatively, described substrate is made by glass material with described cover sheet, or, institute
Stating cover sheet to be made up of sapphire material, described substrate is made up of glass material.
Alternatively, described through hole includes the first opening and the second opening connected, wherein, described
First opening relatively the second opening is adjacent to touch screen, and the area of the first opening is opened less than or equal to second
The area of mouth.
Alternatively, described electronic equipment farther includes conductive layer, described conductive layer and described biology
Identify that module is arranged on the homonymy of substrate or is arranged on relative two sides of substrate, and around described biology
Identifying that module region is arranged, described conductive layer is used for loading ground signalling.
Alternatively, described conductive layer is for when described bio-identification module performs bio information sensing
Persistently load ground signalling.
Alternatively, described conductive layer is for when described bio-identification module performs bio information sensing
Only load ground signalling.
Alternatively, described bio-identification module be fingerprint recognition module, blood oxygen identification module, the heart
Jump one or more identified in module.
Alternatively, the thickness of described cover sheet is 0.1 millimeter to 0.7 millimeter, the thickness of described substrate
Degree is 0.1 millimeter to 0.7 millimeter.
Alternatively, described electronic equipment is portable electronic product or household formula electronic product.
The bio-identification module of the electronic equipment of the application is arranged on below substrate, described cover sheet
Correspondence arranges through hole in the position of bio-identification module, therefore by appropriately selected cover sheet and base
The thickness of plate, can improve the sensitivity of the bio-identification module of described electronic equipment.
It is possible not only to play instruction user biological identification module it addition, arrange through hole on cover sheet
The effect of position, and, production firm can also use existing manufacture equipment and production
Flow process, cost-effective, further, cover sheet is not easy to broken relatively, it is ensured that electronics sets
Standby use quality.
Further, described cover sheet can select sapphire cover plate, described substrate to select
Selecting glass substrate, owing to there is described substrate, the thickness of cover sheet compares existing cover sheet
Thickness can be thinning, such that it is able to save the material of sapphire cover plate, and then saves electronic equipment
Manufacturing cost.
Although disclosing multiple embodiment, change including it, but by illustrate and describing this
The following detailed description of bright disclosed illustrative embodiment, other embodiments disclosed by the invention are by right
Those skilled in the art is apparent.Can be in various showing it will be recognized that the present invention is open
The aspect amendment being clear to, all modifications is all without departing from the spirit and scope of the present invention.Correspondingly,
Accompanying drawing and detailed description substantially should be considered illustrative and not restrictive.
Accompanying drawing explanation
Describe its example embodiment, inventive feature and advantage in detail by referring to accompanying drawing will become
Must become apparent from.
Fig. 1 is the part-structure schematic diagram of electronic equipment one embodiment of the present invention.
Fig. 2 is a kind of cut-away view of electronic equipment shown in Fig. 1.
Fig. 3 is the part-structure schematic diagram of the another embodiment of electronic equipment of the present invention.
Fig. 4 is a kind of cut-away view of electronic equipment shown in Fig. 3.
Fig. 5 is the part-structure schematic diagram of the another embodiment of electronic equipment shown in Fig. 1.
Fig. 6 is a kind of cut-away view of electronic equipment shown in Fig. 5.
Fig. 7 is the part-structure schematic diagram of the another embodiment of Fig. 3 electronic equipment.
Fig. 8 is a kind of cut-away view of electronic equipment shown in Fig. 7.
Fig. 9 is the decomposition texture schematic diagram of the another embodiment of electronic equipment shown in Fig. 1.
Detailed description of the invention
It is described more fully with example embodiment referring now to accompanying drawing.But, example embodiment
Can implement in a variety of forms, and be not understood as limited to embodiment set forth herein；On the contrary,
These embodiments are provided so that the present invention will fully and completely, and by the design of example embodiment
Convey to those skilled in the art all sidedly.For convenience or clear, may exaggerate, omit or
It is schematically illustrated in thickness and the size of every layer shown in accompanying drawing and schematically illustrates relevant unit
The quantity of part.It addition, the size of element not exclusively reflects actual size, and the number of related elements
Amount incomplete reaction actual quantity.
Additionally, described feature, structure can be combined in one or more in any suitable manner
In many embodiments.In the following description, it is provided that many details thus be given the present invention
The fully understanding of embodiment.But, one of ordinary skill in the art would recognize that there is no described spy
That determines in details is one or more, or uses other structure, constituent element etc., it is also possible to practice this
The technical scheme of invention.In other cases, it is not shown in detail or describes known features or operation
To avoid the fuzzy present invention.
Embodiments of the invention are described below in detail, and the example of described embodiment is shown in the drawings,
The most same or similar label represents same or similar element or has identical or class
Element like function.The embodiment described below with reference to accompanying drawing is exemplary, it is intended to user
Explain the present invention, and be not considered as limiting the invention.
In describing the invention, it is to be understood that term " thickness ", " on ", D score,
"front", "rear", "left", "right", " vertically ", " level ", " top ", " end ",
Orientation or the position relationship of the instruction such as " interior ", " outward " are based on orientation shown in the drawings or position
Relation, is for only for ease of the description present invention and simplifies description rather than instruction or imply indication
Position or element must have specific method, with specific azimuth configuration and operation, therefore can not
It is interpreted as limitation of the present invention.
In the present invention, unless otherwise clearly defined and limited, term " install ", " being connected ",
" connect ", the term such as " fixing " should be interpreted broadly, and connects, also for example, it may be fixing
Can be to removably connect, or integral；Can be to be mechanically connected, it is also possible to be electrical connection；Can
Being to be directly connected to, it is also possible to be to be indirectly connected with by intermediary, can be two element internals
Connection or the interaction relationship of two elements.For the ordinary skill in the art,
Above-mentioned term concrete meaning in the present invention can be understood as the case may be.
Further, in describing the invention, it is to be understood that: " multiple " include two
And two or more, unless the present invention separately has the most concrete restriction.It addition, each element title goes out
Words such as existing " first ", " second " is not to limit element or the sequencing of signal appearance,
But name for convenience of element, clearly distinguish each element so that describe more succinct.
Lot of experiments through inventor finds, if (e.g., fingerprint passes by bio-identification module
Inductor component) directly it is configured to below the cover sheet of electronic equipment, owing to cover sheet compares
Thickness, the sensitivity causing bio-identification module is relatively low, but, if raw by thinning cover sheet correspondence
If the Thickness Mode of the position of thing identification module improves induced signal intensity, cover sheet due to
Exist variable thickness cause, cause cover sheet manufacturing process, be assembled into product process and
During user uses, cover sheet thinner thickness and the thicker intersection of thickness be easier to send out
Raw fracture, it addition, thickness is more frangible than relatively thin position, cause the user economic loss,
And to series of technical such as brand are negatively affected, therefore, based on described technical problem
Discovery, inventor is tested by substantial amounts of creative work and substantial amounts of experimentation, under proposition
State the electronic equipment of the application.
See also the part-structure that Fig. 1 and Fig. 2, Fig. 1 are electronic equipment one embodiment of the present invention
Schematic diagram.Fig. 2 is a kind of cut-away view of electronic equipment shown in Fig. 1.Described electronic equipment 100 is such as
For portable electronic product or household formula electronic product.Wherein, portable electronic product is as various
Mobile terminal, such as, mobile phone, panel computer, notebook computer and Wearable product etc. are each
The suitable electronic product of class；Household formula electronic product is as intelligent door lock, TV, refrigerator, desk-top
All kinds of suitable electronic product such as computer.Described electronic equipment 100 includes cover sheet 10, substrate
12 and bio-identification module 14.Described cover sheet 10 is arranged with substrate 12 stacking.Described base
Plate 12 is arranged between described bio-identification module 14 and described cover sheet 10.Described protection cap
Plate 10 includes through hole 101.Described through hole 101 is just arranged by described bio-identification module 14.
Defining the described substrate 12 part just to described through hole 101 is Part I A, and definition is described
Substrate 12 anon-normal is Part II B to the part of described through hole 101, wherein, and described Part I
Part A or described bio-identification module 14 is completely covered.It should be noted that in FIG first
Part A is to be positioned at the region of dotted line, and Part II B is the part outside dotted line.
By selecting the suitable thickness of substrate 12, such that it is able to improve the biological knowledge of electronic equipment 100
The sensing sensitivity of other module.It is possible not only to it addition, arrange through hole 101 on cover sheet 10
To the effect of instruction user biological identification module 14 position, and, production firm can also make
With existing manufacture equipment and production procedure, cost-effective, further, cover sheet 10 phase
Broken to being not easy to, it is ensured that the use quality of electronic equipment 100.
Described cover sheet 10 includes first surface 102 and second table relative with first surface 102
Face 103.Described substrate 12 and described bio-identification module 14 are arranged at the of cover sheet 10
The side on two surfaces 103.Described bio-identification module 14 is further disposed at described substrate 12 and carries on the back
Side to described cover sheet 10.
Glass that described cover sheet 10 is the most transparent or sapphire cover plate, so, described protection cap
The material of plate 10 is alternatively other suitable material, is not limited to glass or sapphire cover plate, example
Such as alternatively thin film cover plate.Further, described cover sheet 10 is alternatively translucent or nontransparent
Cover plate, the application is not limiting as cover sheet 10 for transparent cover plate, can be according to the situation pair of product
Corresponding cover sheet should be selected.
Glass that described substrate 12 is the most transparent or sapphire substrate, so, described substrate 12
Material is alternatively other suitable material, is not limited to glass or sapphire substrate, the most also may be used
For film substrate.Further, described substrate 12 is alternatively translucent or nontransparent cover plate, this
It is transparency carrier that application is not limiting as substrate 12, can protect accordingly according to the situation corresponding selection of product
Protecting cover plate.
Described bio-identification module 14 is for sensing user's first surface 102 from cover sheet 10
The bio information of input.The bio information detected when bio-identification module 14 and electronic equipment 100
When the bio information inside prestored is consistent, then the corresponding function performing to preset of electronic equipment 100 or application
Program, such as, solves screen function, payment function, startup wechat application program, file opening folder etc.
Deng.Described bio-identification module 14 for example, fingerprint recognition module, blood oxygen identification module, heart beating are known
One or more in other module, so, the application is not limited thereto, described bio-identification module
The 14 identification modules being alternatively other suitable type.
Specifically, described fingerprint recognition module such as capacitance type fingerprint identification module.Described condenser type refers to
Stricture of vagina identification module includes self-capacitance fingerprint recognition module and mutual capacitance type fingerprint recognition module.
In the present embodiment, described bio-identification module 14 is attached to by adhesion coating (not shown)
On described substrate 12.So, changing ground, described bio-identification module 14 also can be imprinted with
Other suitable method is attached on described substrate 12, is not limiting as the mode of adhesion.
Described through hole 101 includes the first opening 104 and the second opening 105 connected, wherein, institute
State first opening 104 relatively the second opening 105 adjacent substrates 12.In the present embodiment, described logical
The area of area e.g., less than second opening 105 of first opening 104 in hole 101.Preferably,
The sensing region of described bio-identification module 14 is positioned at the region just limited the second opening 105
In.
So, ground, in other embodiments, the first opening 102 of described through hole 101 are changed
Area also can be equal to arranging more than the area of the second opening 103.
In the present embodiment, the through hole of described through hole 101 for example, truncated cone-shaped.So, the application
Being not limited to this, described through hole 101 is alternatively the through hole of other suitable shape, for example, cylindrical
Through hole, or the cross section of described through hole 101 be rectangle or rounding rectangle or chamfering rectangle or
Oval etc..
One substrate 12 is additionally set due to the application, therefore, for cover sheet 10, its
Selection can be more diversified.Selection for cover sheet 10 can mainly include at least two aspects: the
One, the variation that thickness selects；Second, the variation that material selects.
The variation that thickness is selected: owing to electronic equipment 100 farther includes substrate 12, because of
This, the thickness of described cover sheet 10 can be thinning, further, since substrate 12 and cover sheet
10 stackings are arranged, thus it is also ensured that the protection intensity of electronic equipment 100.Alternatively, protection
The thickness of cover plate 10 is 0.1 millimeter to 0.7 millimeter, the thickness of substrate 12 be 0.1 millimeter to 0.7
Millimeter, the thickness sum of the two is 0.2 millimeter to 1.4 millimeters.So, the application is for cover sheet
Thickness, the thickness of substrate 12 and the thickness sum of the two of 10 are not limited to this described scope,
Situation according to product is different, can make suitable change.Each thickness range described herein is applicable
The electronic equipments such as mobile phone.
The variation that material is selected: for reaching predetermined protection intensity, for different material systems
The thickness ordinary circumstance of the cover sheet 10 become can be different, so, as the material cost of sapphire cover plate
Higher, therefore, existing electronic equipment 100 the most less employing sapphire cover plate.Due to this Shen
Please calling subset 100 and arrange substrate 12 further, therefore, cover sheet 10 may select sapphire lid
Plate, substrate 12 may select glass substrate.The explanation selected based on above-mentioned thickness understands cover sheet 10
Thickness can be relatively thin, such that it is able to cost-effective, further, since cover sheet 10 is sapphire lid
Plate, and have more resistant to the good characteristic such as scraping.Further, cover sheet 10 selects sapphire cover plate,
Electrology characteristic based on sapphire cover plate, the sensing sensitivity of bio-identification module 14 can be more preferably.
It should be noted that owing to the cover sheet 10 of the application is at corresponding bio-identification module 14
Position be provided with through hole 101, correspondingly, the thickness of the good substrate 12 of corresponding selection, it is also possible to carry
The sensing sensitivity of high bio-identification module 14.So, the thickness of cover sheet 10 can also be with existing
The thickness of some cover sheets is identical, and not limiting must be thinning, can be corresponding as the case may be
Suitably change.
Alternatively, described electronic equipment 100 farther includes touch sensing layer 13.Described touch passes
Sense layer 13 is arranged on the substrate 12.Whether described touch sensing layer 13 has touching of user for sensing
Touch operation.
Specifically, in the present embodiment, described electronic equipment 100 includes one layer of touch sensing layer
13, described one layer of touch sensing layer 13 is arranged on described substrate 12 in the face of described cover sheet 10
Side, match formation touch screen 1 with described substrate 12.Change ground, at other embodiment
In, described one layer of touch sensing layer 13 may also be arranged on described substrate 12 back to described cover sheet
The side of 10.Changing ground further, described electronic equipment 100 may also comprise two layers of touch sensing
Layer 13, described two layers of touch sensing layer 13 are separately positioned on the opposite sides of described substrate 12.
It should be noted that in this case, electronic equipment 100 such as multiplexing touch screen 1
Substrate 12, can be without additionally arranging substrate 12, and correspondingly, the thickness of cover sheet 10 can basis
The situation correspondence of substrate 12 keeps constant or thinning.Thus, a substrate 12 can be saved.
Alternatively, described electronic equipment 100 farther includes display device 16.Described display device
16 are used for showing picture, and are arranged on the described substrate 12 side back to described cover sheet 10.
In the present embodiment, hang in described display device 16 outside described touch screen 1.
See also the part of the another embodiment that Fig. 3 and Fig. 4, Fig. 3 are electronic equipment of the present invention
Structural representation.Fig. 4 is a kind of cut-away view of electronic equipment shown in Fig. 3.Described electronic equipment 200
Essentially identical with the structure of described electronic equipment 100, the two differs primarily in that: described electronics sets
The touch sensing layer (not shown) of standby 200 is arranged in display device 26, such as, with on box
(On-Cell) or box in (In-Cell) mode be formed in display device 26.That is, described display fills
Put 26 for embedded touch display unit.Such as, for box upper type, touch sensing layer is such as
It is arranged between substrate and the colored filter of display device 26；For mode in box, touch and pass
Common electrode layer of sense layer such as multiplexing display device 26 etc..Correspondingly, substrate 22 is arranged on
Between cover sheet 20 and display device 26.
See also the another embodiment that Fig. 5 and Fig. 6, Fig. 5 are electronic equipment 100 of the present invention
Part-structure schematic diagram.Fig. 6 is a kind of cut-away view of electronic equipment 100 shown in Fig. 5.Described electricity
Subset 100 arranges conductive layer 15 further below at substrate 12.That is, described conductive layer 15
With the homonymy that bio-identification module 14 is arranged on substrate 12.
In the present embodiment, described conductive layer 15 is closed around described bio-identification module 14
Region is arranged.So, changing ground, described conductive layer 15 also can be non-enclosed around described life
Thing identification module 14 region is arranged, and in other words, described conductive layer 15 can be divided into several sections to set
Put.
Further, described conductive layer 15 may also be arranged between substrate 12 and cover sheet 10,
With the opposite sides that bio-identification module 14 is positioned at substrate 12.Additionally, it is possible in the phase of substrate 12
Both sides are all correspondingly arranged conductive layer 15.
Through hole 101 is the most just arranged, so by described conductive layer 15, it is possible to outside just to through hole 101
Enclose setting.Preferably, user near to or in contact with during to the position of corresponding bio-identification module 14,
Can be together near to or in contact with the position to corresponding conductive layer 15.
In the present embodiment, described conductive layer 15 is for performing identification at bio-identification module 14
Ground signalling is loaded during sensing.
Generally, electronic equipment 100 includes equipment ground GND, and described conductive layer 15 is connected to equipment
Ground GND.Described equipment ground GND is also known as systematically, and for example, power supply of electronic equipment 100 is electric
The negative pole in source, power supply is such as battery.Equipment ground GND is used for loading ground signalling, therefore,
Ground signalling is also known as equipment earth signal or systematically signal.Described ground signalling is constant voltage signal,
As the voltage reference of circuit each in electronic equipment 100, described ground signalling is for example,
The voltage signals such as 0V (volt), 2V, (-1) V.Generally, electronic equipment 100 equipment ground GND or
Systematically GND not earth ground or definitely the most greatly.So, when electronic equipment 100 by conductor with
When earth ground connects, described equipment ground GND can also be earth ground.
Especially, when bio-identification module 14 is capacitance type fingerprint identification module, it is loaded with ground connection
The conductive layer 15 of signal can improve the intensity of the fingerprint sensing signal of bio-identification module 14.Institute
State capacitance type fingerprint identification module and preferably be from capacitance type fingerprint identification module.
Further, when bio-identification module 14 is capacitance type fingerprint identification module, change ground,
Described conductive layer 15 also can load the signal of change, such as pumping signal, described conductive layer 15 with
The induction electrode array of capacitance type fingerprint identification module forms mutual capacitance.Or, work as bio-identification
When module 14 is self-capacitance fingerprint recognition module, described conductive layer 15 load-modulate signal.Separately
Outward, described conductive layer 15 also can be unsettled.
Further, when bio-identification module 14 is capacitance type fingerprint identification module, condenser type
Fingerprint recognition module includes induction electrode array, testing circuit, control circuit, filter circuit, deposits
The circuit of the series of complexes such as storage circuit.Wherein, described induction electrode array is preferably placed at just to institute
State in the region that the second opening 105 is limited.So, the part in described induction electrode array also may be used
Being positioned at outside the region just limited described second opening 105, bio-identification module 14 is by soft
Body algorithm is modified.
See also the another embodiment that Fig. 7 and Fig. 8, Fig. 7 are electronic equipment 200 of the present invention
Part-structure schematic diagram.Fig. 8 is a kind of cut-away view of electronic equipment 200 shown in Fig. 7.Described electricity
Subset 200 arranges conductive layer 25 further below at substrate 22.That is, described conductive layer 25
With the homonymy that bio-identification module 24 is arranged on substrate 22.
In the present embodiment, described conductive layer 25 is closed around described bio-identification module 24
Region is arranged.So, changing ground, described conductive layer 25 also can be non-enclosed around described life
Thing identification module 24 region is arranged, and in other words, described conductive layer 25 can be divided into several sections to set
Put.
Further, described conductive layer 25 may also be arranged between substrate 22 and cover sheet 40,
With the opposite sides that bio-identification module 24 is positioned at substrate 22.Additionally, it is possible in the phase of substrate 22
Both sides are all correspondingly arranged conductive layer 25.
Through hole 201 is the most just arranged, so by described conductive layer 25, it is possible to outside just to through hole 201
Enclose setting.Preferably, user near to or in contact with during to the position of corresponding bio-identification module 24,
Can be together near to or in contact with the position to corresponding conductive layer 25.
In the present embodiment, described conductive layer 25 is for performing identification at bio-identification module 24
Ground signalling is loaded during sensing.
Especially, when bio-identification module 24 is capacitance type fingerprint identification module, it is loaded with ground connection
The conductive layer 25 of signal can improve the intensity of the fingerprint sensing signal of bio-identification module 24.Institute
State capacitance type fingerprint identification module and preferably be from capacitance type fingerprint identification module.
Further, when bio-identification module 24 is capacitance type fingerprint identification module, change ground,
Described conductive layer 25 also can load the signal of change, such as pumping signal, described conductive layer 25 with
The induction electrode array of capacitance type fingerprint identification module forms mutual capacitance.Or, work as bio-identification
When module 24 is self-capacitance fingerprint recognition module, described conductive layer 25 load-modulate signal.
Further, when bio-identification module 24 is capacitance type fingerprint identification module, condenser type
Fingerprint recognition module includes induction electrode array, testing circuit, control circuit, filter circuit, deposits
The circuit of the series of complexes such as storage circuit.Wherein, described induction electrode array is preferably placed at just to institute
State in the region that the second opening 205 is limited.So, the part in described induction electrode array also may be used
Being positioned at outside the region just limited described second opening 205, bio-identification module 24 is by soft
Body algorithm is modified.
Refer to the decomposition texture schematic diagram of the another embodiment that Fig. 9, Fig. 9 are electronic equipment 100.
Described electronic equipment 100 farther include mainboard (Motherboard, or Mainboard) 17 and after
Shell 18.Described back cover 18 for the formation receiving space that matches with described cover sheet 10, in order to
House substrate 12, touch sensing layer 13, bio-identification module 14, display device 16, Yi Jizhu
Plate 17 is in wherein.If electronic equipment 100 farther includes conductive layer 15, then receiving space is further
House conductive layer 15.
Described mainboard 17, also known as motherboard, system board, logic card, motherboard or base plate etc., is electricity
The core parts of subset 100.Described mainboard 17 generally comprises processor, memorizer, chipset
Deng device.Described mainboard 17 is for being transmitted various types of signal and processing, and controls electronic equipment
100 perform corresponding function.
Described touch sensing layer 13, described bio-identification module 14 and described display device 16 are equal
For being connected with described mainboard 17.
In the present embodiment, described bio-identification module 14 includes sensing identification chip 141 and soft
Property circuit board 143.Described flexible circuit board 143 is used for connecting sensing identification chip 141 to mainboard
17, carry out signal transmission between.
Described sensing identification chip 141 for example, one chip or a chipset.When sensing identifies core
When sheet 141 is chipset, it may include sensing identifies sensor and control chip and power supply chip
Both one or whole.
Shown in above-mentioned Fig. 9, the structure of electronic equipment 100 is equally applicable electronic equipment 200.
Need it is further noted that for display picture electronic equipment 100,200 for, institute
State electronic equipment 100,200 include the viewing area for showing picture and be positioned at around viewing area non-
Viewing area, wherein, corresponding non-display area, described cover sheet 10,20 is such as provided with color
Layer, described bio-identification module 14,24, conductive layer 15,25 be preferably provided at electronic equipment 100,
The non-display area of 200.So, the present invention is not limited thereto, described bio-identification module 14,24,
Conductive layer 15,25 may also be arranged on viewing area.
It is open despite describing the present invention with reference to each embodiment, it will be appreciated that these are implemented
Example is illustrative, and the scope of the present invention is not limited only to them.Many changes, revises, adds
It is all possible for adding and improving.More generally, according to each embodiment disclosed by the invention it is
Describe in the context of specific embodiments.Function can be in each embodiment disclosed by the invention
The most separately or in combination, or utilize different terms to describe.These and
Other change, revise, add and improve can be as defined in subsequent claim
In scope disclosed by the invention.
Claims (10)
1. an electronic equipment, including:
Cover sheet, including first surface and the second surface relative with first surface, cover sheet
It is provided through the through hole of first surface and second surface；
Bio-identification module, is arranged on the second surface side of cover sheet, and just to described through hole
Arranging, described bio-identification module is for sensing the life that user inputs from the first surface of cover sheet
Thing information；With
Substrate, is arranged on the second surface side of cover sheet, arranges with cover sheet stacking, and
Between described cover sheet and described bio-identification module.
2. electronic equipment as claimed in claim 1, it is characterised in that: define described substrate just to institute
The part stating through hole is Part I, and defining described substrate anon-normal to the part of described through hole is second
Part, wherein, bio-identification module described in the partly or completely all standing of described Part I.
3. electronic equipment as claimed in claim 1, it is characterised in that: described electronic equipment is further
Including touch sensing layer, described touch sensing layer is arranged on the substrate, described touch sensing layer
For sensing whether described electronic equipment is touched.
4. electronic equipment as claimed in claim 1, it is characterised in that: described electronic equipment is further
Including display device, described display device is used for showing that image, described display device are arranged on substrate
Back to the side of described cover sheet, setting touch sensing layer in described display device, described touch passes
Sense layer is used for sensing whether described electronic equipment is touched.
5. electronic equipment as claimed in claim 1, it is characterised in that: described substrate and described protection
Cover plate is made by glass material, or, described cover sheet is made up of sapphire material, institute
State substrate to be made up of glass material.
6. electronic equipment as claimed in claim 1, it is characterised in that: described through hole includes connecting
The first opening and the second opening, wherein, described first opening relatively the second opening adjacent to touch screen,
And first the area of opening less than or equal to the area of the second opening.
7. electronic equipment as claimed in claim 1, it is characterised in that: described electronic equipment is further
Including conductive layer, described conductive layer and described bio-identification module are arranged on homonymy or the setting of substrate
In relative two sides of substrate, and arrange around described bio-identification module region, described conduction
Layer is used for loading ground signalling.
8. electronic equipment as claimed in claim 1, it is characterised in that: described bio-identification module is
For one or more in fingerprint recognition module, blood oxygen identification module, heart beating identification module.
9. electronic equipment as claimed in claim 1, it is characterised in that: the thickness of described cover sheet
Being 0.1 millimeter to 0.7 millimeter, the thickness of described substrate is 0.1 millimeter to 0.7 millimeter.
10. electronic equipment as claimed in claim 1, it is characterised in that: described electronic equipment is can
Take formula electronic product or household formula electronic product.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610102587.6A CN106127101A (en) | 2016-02-24 | 2016-02-24 | Electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610102587.6A CN106127101A (en) | 2016-02-24 | 2016-02-24 | Electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106127101A true CN106127101A (en) | 2016-11-16 |
Family
ID=57269755
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610102587.6A Withdrawn CN106127101A (en) | 2016-02-24 | 2016-02-24 | Electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106127101A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11417138B2 (en) | 2018-04-23 | 2022-08-16 | Guangdong Oppo Mobile Telecommunications Corp., Ltd. | Fingerprint identification apparatus, display apparatus, and electronic device |
-
2016
- 2016-02-24 CN CN201610102587.6A patent/CN106127101A/en not_active Withdrawn
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US11417138B2 (en) | 2018-04-23 | 2022-08-16 | Guangdong Oppo Mobile Telecommunications Corp., Ltd. | Fingerprint identification apparatus, display apparatus, and electronic device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WW01 | Invention patent application withdrawn after publication | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20161116 |