CN106156581A - Electronic equipment - Google Patents
Electronic equipment Download PDFInfo
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- CN106156581A CN106156581A CN201610101158.7A CN201610101158A CN106156581A CN 106156581 A CN106156581 A CN 106156581A CN 201610101158 A CN201610101158 A CN 201610101158A CN 106156581 A CN106156581 A CN 106156581A
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- Prior art keywords
- electronic equipment
- bio
- signal
- identification module
- cover sheet
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F21/00—Security arrangements for protecting computers, components thereof, programs or data against unauthorised activity
- G06F21/30—Authentication, i.e. establishing the identity or authorisation of security principals
- G06F21/31—User authentication
- G06F21/32—User authentication using biometric data, e.g. fingerprints, iris scans or voiceprints
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/12—Fingerprints or palmprints
- G06V40/13—Sensors therefor
- G06V40/1306—Sensors therefor non-optical, e.g. ultrasonic or capacitive sensing
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/70—Multimodal biometrics, e.g. combining information from different biometric modalities
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V40/00—Recognition of biometric, human-related or animal-related patterns in image or video data
- G06V40/10—Human or animal bodies, e.g. vehicle occupants or pedestrians; Body parts, e.g. hands
- G06V40/15—Biometric patterns based on physiological signals, e.g. heartbeat, blood flow
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- Engineering & Computer Science (AREA)
- Theoretical Computer Science (AREA)
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Human Computer Interaction (AREA)
- Multimedia (AREA)
- Computer Security & Cryptography (AREA)
- Computer Hardware Design (AREA)
- Software Systems (AREA)
- General Engineering & Computer Science (AREA)
- Measurement Of The Respiration, Hearing Ability, Form, And Blood Characteristics Of Living Organisms (AREA)
Abstract
The invention discloses a kind of electronic equipment.Described electronic equipment includes: cover sheet, including first surface and the second surface relative with first surface；Touch sensing layer, is arranged on the second surface side of described cover sheet, arranges with described cover sheet stacking；Bio-identification module, is arranged on the second surface side of described cover sheet, and described cover sheet covers described bio-identification module；And conductive layer, it is arranged on the second surface side of described cover sheet, and is positioned at the periphery of described bio-identification module.Safety and the privacy of described electronic equipment are preferable.
Description
Technical field
The present invention relates to a kind of electronic equipment, particularly relate to a kind of electronic equipment with biological sensing function.
Background technology
The universal life style affecting people of the electronic equipment such as smart mobile phone, panel computer.Guarantor along with people
The gradually enhancing of close consciousness, the use of the application such as the most various payment client terminals, numerical ciphers can not meet people
Use demand, therefore, how to improve electronic equipment safety and privacy become technical staff research focus
One of.
Summary of the invention
In order to solve above-mentioned technical problem, the present invention provides a kind of safety and the preferable electronic equipment of privacy.
For achieving the above object, the present invention provides following technical scheme:
A kind of electronic equipment, including:
Cover sheet, including first surface and the second surface relative with first surface；
Touch sensing layer, is arranged on the second surface side of described cover sheet, arranges with described cover sheet stacking；
Bio-identification module, is arranged on the second surface side of described cover sheet, and described bio-identification module includes
Bio-identification chip, described bio-identification chip is for sensing the biological letter that user inputs from cover sheet first surface
Breath, wherein, described cover sheet covers described bio-identification chip；With
Conductive layer, is arranged on the second surface side of described cover sheet, and described conductive layer is closed or non-enclosed
Arrange around described bio-identification chip.
Alternatively, described conductive layer for loading ground connection letter when described bio-identification module performs bio information sensing
Number or load-modulate signal or load pumping signal or unsettled.
Alternatively, described conductive layer for persistently loading ground connection letter when bio-identification module performs bio information sensing
Number.
Alternatively, described conductive layer is for only loading ground signalling when bio-identification module performs bio information sensing.
Alternatively, described bio-identification module is capacitance type fingerprint identification module, described capacitance type fingerprint identification module
Including induction electrode array and testing circuit, described testing circuit includes earth terminal and signal output part, described ground connection
End is for load-modulate signal, and described signal output part to induction electrode array, drives sense for output drive signal
Answer electrod-array to perform fingerprint sensing, wherein, described pumping signal raises with the rising of described modulated signal, with
The reduction of described modulated signal and reduce.
Alternatively, described conductive layer is for loading ground signalling when described bio-identification module performs biological sensing.
Alternatively, described conductive layer is for the load-modulate signal when described bio-identification module performs biological sensing.
Alternatively, described electronic equipment is with including the equipment for loading ground signalling and modulation circuit, described detection
The earth terminal of circuit is connected with equipment ground by modulation circuit, and described modulation circuit drives signal to connect with described according to one
Earth signal produces described modulated signal.
Alternatively, described bio-identification module is capacitance type fingerprint identification module, described capacitance type fingerprint identification module
Including induction electrode array and testing circuit, described conductive layer forms mutual capacitance with described induction electrode array, is used for
Loading pumping signal, described testing circuit is for receiving the sensing signal of induction electrode array output.
Alternatively, described electronic equipment farther includes substrate, and described substrate is arranged on the second of described cover sheet
Side, surface, described conductive layer or be arranged between cover sheet and substrate, or it is arranged on substrate back to protection
The side of cover plate, or it is arranged on the opposite sides of substrate, or substrate is provided with through hole, and described conductive layer is corresponding
Arrange in described through hole.
Alternatively, described electronic equipment includes display device, described touch sensing layer or setting on the substrate,
Or arrange in a display device.
Alternatively, described cover sheet includes Part I and Part II, and the thickness of described Part II is less than institute
Stating the thickness of Part I, described Part II covers described bio-identification chip wholly or in part.
Alternatively, described Part II is that first surface is formed to second surface depression, or/and, described Part II
Formed to first surface depression for second surface.
Alternatively, during described bio-identification module is fingerprint recognition module, blood oxygen identification module, heart beating identification module
One or more.
Alternatively, described electronic equipment is portable electronic product or household formula electronic product.
Owing to arranging bio-identification module in the application electronic equipment, therefore, electronic equipment can pass through bio-identification mould
Group identifies that the bio information of user corresponding control whether to perform corresponding function or start and apply journey accordingly
Sequence, thus improve safety and the privacy of electronic equipment.
Further, described electronic equipment arranges conductive layer further at cover sheet, and described conductive layer is used for improving
The sensing sensitivity of bio-identification module or cooperation bio-identification module perform the sensing of bio information.
Although disclosing multiple embodiment, change including it, but by illustrate and describing theory disclosed by the invention
The following detailed description of bright property embodiment, those skilled in the art will be shown by other embodiments disclosed by the invention
And be clear to.Can revise at various obvious aspects it will be recognized that the present invention is open, all modifications all without
Deviation the spirit and scope of the present invention.Correspondingly, accompanying drawing and detailed description substantially should be considered illustrative, and
It not restrictive.
Accompanying drawing explanation
Describe its example embodiment, inventive feature and advantage in detail by referring to accompanying drawing will be apparent from.
Fig. 1 is the decomposed structural representation of electronic equipment of the present invention.
Fig. 2 is the part assembling structure schematic diagram of electronic equipment shown in Fig. 1.
Fig. 3 is the fingerprint sensing circuit diagram omitting conductive layer.
Fig. 4 is the fingerprint sensing circuit diagram including loading the conductive layer of ground signalling.
Fig. 5 is the schematic diagram of the another embodiment of conductive layer shown in Fig. 2.
Fig. 6 is the electrical block diagram of electronic equipment shown in Fig. 2.
Fig. 7 is the electrical block diagram of the another embodiment of the application electronic equipment.
Fig. 8 is the electrical block diagram of the another embodiment of the application electronic equipment.
Fig. 9 is the electrical block diagram of the another embodiment of the application electronic equipment.
Figure 10 is the structural representation of the another embodiment of the application electronic equipment.
Figure 11 is a kind of schematic cross-section of electronic equipment shown in Figure 10.
Figure 12 is the partial sectional schematic view of the another embodiment of electronic equipment shown in Fig. 1.
Detailed description of the invention
It is described more fully with example embodiment referring now to accompanying drawing.But, example embodiment can be with multiple
Form is implemented, and is not understood as limited to embodiment set forth herein；On the contrary, it is provided that these embodiments make
Obtaining the present invention will fully and completely, and the design of example embodiment is conveyed to those skilled in the art all sidedly.
For convenience or clear, may exaggerate, omit or be schematically illustrated in the thickness of every layer shown in accompanying drawing and size,
And schematically illustrate the quantity of related elements.It addition, the size of element not exclusively reflects actual size, Yi Jixiang
Close the quantity incomplete reaction actual quantity of element.
Additionally, described feature, structure can be combined in one or more embodiment in any suitable manner
In.In the following description, it is provided that many details thus be given and embodiments of the present invention fully understood.
But, one of ordinary skill in the art would recognize that, do not have in described specific detail is one or more, or uses it
Its structure, constituent element etc., it is also possible to put into practice technical scheme.In other cases, be not shown in detail or
Known features or operation are described to avoid the fuzzy present invention.
Embodiments of the invention are described below in detail, and the example of described embodiment is shown in the drawings, the most extremely
Same or similar label represents same or similar element or has the element of same or like function eventually.Lead to below
It is exemplary for crossing the embodiment being described with reference to the drawings, it is intended to user explains the present invention, and it is not intended that to this
Bright restriction.
In describing the invention, it is to be understood that term " thickness ", " on ", D score, " front ",
" afterwards ", "left", "right", " vertically ", " level ", " top ", " end ", " interior ", " outward "
It is based on orientation shown in the drawings or position relationship in the orientation indicated or position relationship, is for only for ease of description originally
Invention and simplification describe rather than indicate or imply that the position of indication or element must have specific method, Yi Te
Fixed azimuth configuration and operation, be therefore not considered as limiting the invention.
In the present invention, unless otherwise clearly defined and limited, term " install ", " being connected ", " connection ",
The term such as " fix " should be interpreted broadly, connect for example, it may be fixing, it is also possible to be to removably connect, or
Integral；Can be to be mechanically connected, it is also possible to be electrical connection；Can be to be directly connected to, it is also possible to be by centre
Medium is indirectly connected with, and can be connection or the interaction relationship of two elements of two element internals.For ability
For the those of ordinary skill in territory, above-mentioned term concrete meaning in the present invention can be understood as the case may be.
Further, in describing the invention, it is to be understood that: " multiple " include two and two or more,
Unless the present invention separately has the most concrete restriction.It addition, " first " that each element title and signal name occur,
The word such as " second ", " the 3rd " is not to limit element or the sequencing of signal appearance, but for convenience of unit
Part is named, and clearly distinguishes each element so that describe more succinct.
See also the decomposed structural representation that Fig. 1 and Fig. 2, Fig. 1 are electronic equipment one embodiment of the present invention.
Fig. 2 is the part assembling structure schematic diagram of electronic equipment shown in Fig. 1.Described electronic equipment 100 is such as portable electricity
Sub-product or household formula electronic product.Wherein, portable electronic product is as various mobile terminals, such as, mobile phone,
Each electronic product such as panel computer, notebook computer and Wearable product；Household formula electronic product is such as intelligence
Each electronic product such as energy door lock, TV, refrigerator, desktop computer.It should be noted that electronic equipment 100 can
Increase the element not shown in diagram further or reduce some element shown in diagram, producing according to different electronics
Product can corresponding selection.Described electronic equipment 100 includes cover sheet 10, bio-identification module 12 and conduction
Layer 14.Described cover sheet 10 is arranged on the front side of electronic equipment 100, and electronic equipment 100 plays the work of protection
With, such as prevent the materials such as grieshoch from entering electronic equipment 100 inside etc..Described bio-identification module 12 is used for sensing
The bio information of target object.Described bio-identification module 12 for example, fingerprint recognition module, blood oxygen identification module,
One or more in heart beating identification module, so, the application is not limited in this, and described bio-identification module 12 is also
It can be other suitable identification chip.The described target object such as finger for user, described bio information, so, institute
Stating target object and be not limited to finger, described target object can also be other suitable objects such as toe.Described life
Thing information for example, fingerprint, blood oxygen, heart beating etc..
Described cover sheet 10 includes first surface 101 and the second surface 103 relative with first surface 101.Institute
Stating the outer surface that first surface 101 is electronic equipment 100, described second surface 103 is positioned at described electronic equipment 100
Inside.Glass that described cover sheet 10 is the most transparent or sapphire cover plate, so, described cover sheet 10
Material be alternatively other suitable material, be not limited to glass or sapphire cover plate, the most alternatively film cover
Plate.Further, described cover sheet 10 is alternatively translucent or nontransparent cover plate, and the application is not limiting as protecting
Protecting cover plate 10 is transparent cover plate, can be according to the corresponding cover sheet of situation corresponding selection of product.
Described bio-identification module 12 is arranged on second surface 103 side of cover sheet 10, is used for sensing user
The bio information inputted from the first surface 101 of cover sheet 10.Described bio-identification module 12 includes biological knowledge
Other chip 120.Described cover sheet 10 covers described bio-identification chip 120.
Described conductive layer 14 is arranged on second surface 103 side of cover sheet 10, for closed or non-close
Formula is arranged around described bio-identification chip 120.Preferably, touch on cover sheet 10 just to biology when finger
During the region of identification chip 120, can together touch on cover sheet 10 region just to conductive layer 14.
Owing to arranging bio-identification module 12 in the application electronic equipment 100, therefore, electronic equipment 100 can pass through
Bio-identification module 12 identifies that the bio information of user carrys out corresponding controlling whether and performs corresponding function or start phase
The application program answered, thus improve safety and the privacy of electronic equipment 100.
Further, described electronic equipment 100 arranges conductive layer 14, described conductive layer further at cover sheet 10
14 for improving the sensing sensitivity of bio-identification module 12 and/or coordinating bio-identification module 12 to perform bio information
Sensing.
Specifically, described conductive layer 14 is such as when described bio-identification module 12 performs bio information sensing
Loading ground signalling or load-modulate signal or load pumping signal or unsettled, so, this is not limited by the present invention
System, described conductive layer 14 also can load other suitable signal.Main with bio-identification module 12 as electric capacity below
As a example by formula fingerprint recognition chip, conductive layer 14 is loaded respectively ground signalling, load-modulate signal, loads excitation letter
Number, the various situations such as unsettled carry out correspondence and illustrate.The principle of other type of bio-identification chip is similar to, this
Place repeats no more.
Before illustrating, in addition it is also necessary to further illustrate capacitance type fingerprint identification module and be respectively mutual capacitance type fingerprint
Identify basic functional principle when module and self-capacitance identification module.
In fingerprint recognition module based on mutual capacitance type, fingerprint recognition module includes fingerprint sensing chip and becket,
Described fingerprint sensing chip includes the detection electricity that sensor electrode array is connected respectively with sensor electrode array and becket
Road.Mutual capacitance is formed between described becket and described sensor electrode array.Described testing circuit provides swashing of change
Encouraging signal to becket, described sensor electrode array exports corresponding fingerprint sensing signal to testing circuit.Described inspection
Slowdown monitoring circuit obtains information in fingerprint according to described sensing signal.
Relatively, in fingerprint recognition module based on self-capacitance, fingerprint recognition module can be saved aforementioned loading and become
The becket of the pumping signal changed.The testing circuit of self-capacitance fingerprint sensing chip provides excitation letter by data wire
Number give sensor electrode array, and receive fingerprint sensing signal by identical data wire from sensor electrode array.Described
Sensor electrode array includes the sensing electrode of multiple formation self-capacitance over the ground.At an object (e.g., finger) close to described
During sensing electrode, another direct-to-ground capacitance can be formed between this object and described sensing electrode.
Generally, electronic equipment 100 includes equipment ground.Described equipment ground also known as systematically, for example, electronic equipment 100
The negative pole of power supply, power supply is as battery.Being used for loading ground signalling, therefore, ground connection is believed equipment
Number also known as equipment earth signal or systematically signal.Described ground signalling is constant voltage signal, as electronic equipment 100
In the voltage reference of each circuit, the voltage signal such as described ground signalling for example, 0V (volt), 2V, (-1) V.Logical
Often, the equipment ground of electronic equipment 100 or the most not earth ground or definitely the most greatly.So, when electronic equipment 100
When being connected with earth ground by conductor, can also be earth ground described equipment.
(1) conductive layer is used for loading ground signalling
First, when bio-identification module 12 is self-capacitance fingerprint recognition module, described conductive layer 14 is used for
Bio-identification module 12 performs to load ground signalling during bio information sensing.So, it should be noted that described biology
Identify that module 12 is alternatively the capacitance type fingerprint identification modules such as self-capacitance or the mutual capacitance type of other suitable type, and
It is not limited to the self-capacitance fingerprint recognition module of herein described type.
Seeing also Fig. 3 and Fig. 4, Fig. 3 is the fingerprint sensing circuit diagram omitting conductive layer 14.Fig. 4 is
Fingerprint sensing circuit diagram including the conductive layer 14 loading ground signalling.As seen from Figure 3, in finger F, life
Between thing identification module 12 and systematically GND formed circuit loop in, finger F, cover sheet 10 and
Electric capacity Cf it is formed with, finger F, cover sheet 10 and systematically shape between GND between bio-identification module 12
Become to have electric capacity Cs.
Relatively, in the diagram, due to electronic equipment 100 include load ground signalling conductive layer 14, therefore,
Be equal to an electric capacity Ci the most in parallel at electric capacity Cs two ends, described electric capacity Ci by finger F, cover sheet 10,
Conductive layer 14 is constituted.According to circuit theory, the impedance between finger F to systematically GND diminishes, accordingly
Ground, the intensity of the fingerprint sensing signal of bio-identification module 12 can be improved.
Owing to the electronic equipment 100 of the present invention arranges loading further in second surface 103 side of cover sheet 10
The conductive layer 14 of ground signalling, thus, the intensity of the fingerprint sensing signal of bio-identification module 12 is improved, and enters
And, the fingerprint sensing sensitivity of electronic equipment 100 is improved.
Usually, described bio-identification chip 120 be shaped as elongated rectangular shape, it addition, in order to increase electronic equipment
The visual range of 100, in the present embodiment, described conductive layer 14 is a rectangular ring, closed around described
Bio-identification chip 120 region is arranged.So, changing ground, described conductive layer 14 is alternatively other shape,
As circular, oval ring-type, it addition, described conductive layer 14 also can be non-enclosed around described bio-identification chip 120
Arrange, such as it is shown in figure 5, described conductive layer 14 is divided into several sections.
Described conductive layer 14 is as used the Suitable conductive such as silver slurry, molybdenum lithium molybdenum, tin indium oxide, nanometer silver or Graphene
Material is made.Described conductive layer 14 is formed at for example with suitably production method such as coating, spraying or impressing etc.
On two surfaces 103.
Described bio-identification chip 120 is attached on second surface 103 for example with the mode pasted.So, described
The mode that bio-identification chip 120 and conductive layer 14 are formed on second surface 103 is not limited to the side of aforementioned stickup
Formula, it is possible to use other suitable set-up mode, such as impressing etc..It addition, described bio-identification chip 120 is also
Directly can press close to second surface 103 or fit, and and unrestricted employing third party's physical medium the two is fixed on
Together.
Refer to the electrical block diagram of the embodiment that Fig. 6, Fig. 6 are electronic equipment 100 shown in Fig. 2.Institute
State conductive layer 14 and connect equipment ground GND, be used for loading ground signalling.Described bio-identification chip 120 includes sense
Answer electrod-array 121 and the testing circuit 123 being connected with induction electrode array 121.Described testing circuit 123
For providing pumping signal to induction electrode array 121, described induction electrode array 121 is driven to perform capacitance type fingerprint
Sensing.Described testing circuit 123 is further used for receiving the sensing signal of induction electrode array 121 output (also referred to as
" fingerprint sensing signal "), and obtain information in fingerprint according to sensing signal.In the present embodiment, described
Testing circuit 123 is used for driving induction electrode array 121 to perform self-capacitance fingerprint sensing.
Described induction electrode array 121 includes multiple induction electrode 122.The plurality of induction electrode 122 is in array
Arrangement, the shape for example, rectangle of each electrode 122, so, it is possible to for other various suitable shapes.It addition,
The size and shape of each electrode 122 is identical, so, it is possible to select difference.The plurality of induction electrode 122 can be with
Coupled capacitance-wise is to finger F (see Fig. 3 and Fig. 4).
Further, described testing circuit 123 includes signal transmission ends T and the first earth terminal G1.Described first connects
Ground end G1 for load-modulate signal, described signal transmission ends T be used for providing pumping signal to induction electrode 122,
Described pumping signal changes with the change of described modulated signal.Wherein, described pumping signal is with described modulated signal
Rising and raise, reduce with the reduction of described modulated signal.
Described testing circuit 123 farther includes power end P1, described power end P1 for loading power voltage, institute
State supply voltage to change with the change of described modulated signal.Pressure between described supply voltage and described modulated signal
Difference keeps constant, and described pressure reduction is the described testing circuit 123 rated voltage when working.
Signal in described testing circuit 123 the most all raises, with described modulation with the rising of described modulated signal
The reduction of signal and reduce.That is, the signal in described testing circuit 123 is unified modulated signal and is modulated.
Comparative apparatus ground GND loads constant ground signalling, the first earth terminal G1 load change modulated signal and
Non-described ground signalling, thus be conducive to improving the signal to noise ratio of fingerprint sensing signal, and then electricity can be improved further
The fingerprint sensing sensitivity of subset 100.
It should be noted that in the present embodiment, the first earth terminal G1 is used for load-modulate signal, so, variable
More, other suitable terminals in testing circuit 123 also can load-modulate signal, it is not limited to the first earth terminal
G1 is used for load-modulate signal.Such as, the power end P1 in testing circuit 123 can also be used for load-modulate signal,
Correspondingly, the modulation that the signal that described pumping signal and the first earth terminal G1 are loaded is loaded with power end P1
The change of signal and change.
Described modulated signal for example, includes described ground signalling and a signal driving signal.In the present embodiment,
Described driving signal is higher than ground signalling, and described driving signal is boost signal compared to ground signalling.Further,
The most periodically variable square-wave signal of described modulated signal.So, changing ground, described modulated signal is alternatively
Nonperiodic signal, it addition, described modulated signal is alternatively the signal of other suitable waveform, it is not limited to square wave is believed
Number.Described driving signal may be lower than ground signalling, and described driving signal is buck signal compared to ground signalling.
Owing to described bio-identification module 12 provides the pumping signal changed with modulated signal change to induction electrode
122, therefore, the signal to noise ratio of fingerprint sensing signal can be improved, correspondingly, it is possible to increase the intensity of fingerprint sensing signal.
So, the sensitivity arranging bio-identification module 12 below cover sheet 10 improves further.
In the above-described embodiment, the first earth terminal G1 is for loading the modulated signal of change.So, the application is not
As limit, changing ground, described first earth terminal G1 can also be used for loading described ground signalling.
Referring again to Fig. 1 and Fig. 6, described bio-identification module 12 farther includes the second earth terminal G2 and modulation
Circuit 16.Described second earth terminal G2, for being connected with equipment ground GND, loads described ground signalling.Described tune
Circuit 16 processed is connected between described second earth terminal G2 and the first earth terminal G1, and receives described driving signal,
Produce described modulated signal according to described ground signalling and described driving signal, and export described modulated signal to first
Earth terminal G1.In the present embodiment, the signal in described testing circuit 123 is all with the tune of the first earth terminal G1
The change of signal processed and change.
Change ground, in other embodiments, in described testing circuit 123 also can the signal of partial circuit modulated
The modulation of signal processed, changing with the change of modulated signal of the first earth terminal G1, the signal of partial circuit is not by
The modulated signal of one earth terminal G1 is modulated.
Described modulation circuit 16 such as includes two-transistor and a controller, and wherein a transistor receives described driving letter
Number, a transistor receives described ground signalling, and described controller is controlled by controlling described two-transistor alternate conduction
Make described two-transistor and alternately export described ground signalling with described driving signal to form described modulated signal.So,
Described modulation circuit 16 is not limited to structure described here, it is possible to for other suitable circuit structure.
Please continue to refer to Fig. 1 and Fig. 6, described electronic equipment 100 farther includes mainboard 2, and described mainboard 2 includes
Main control chip 21.Described main control chip 21 includes the 3rd earth terminal G3 and power end P2.Described 3rd earth terminal
G3 is used for connecting equipment ground GND.Described power end P2 gives described power end P1 for output supply voltage.Described
Communication interface (sign) is set between main control chip 21 and described bio-identification module 12 further, to carry out information
Communication.
Described main control chip 21 can be one chip, it is also possible to be a chipset.When main control chip 21 is chip
During group, described chipset includes application processor (Application Processor, AP) and power supply chip.It addition, institute
State chipset and can farther include storage chip.It addition, described application processor also can be replaced by central processing unit
(Central Processing Unit,CPU)。
Further, in order to avoid the electricity of power end P1 occurs when the signal on the first earth terminal G1 is and drives signal
Stream is anti-fills the situation being back to power end P2, described bio-identification module 12 farther include to be arranged at power end P1 with
Protection circuit 17 between power end P2.Described protection circuit 17 is higher than for the supply voltage on power end P1
Supply voltage on power end P2 or when being predetermined value higher than the supply voltage on power end P2, deenergization end P2
And the connection between power end P1.
Described protection circuit 17 such as includes a diode being connected between power end P2 and power end P1, or
Including the control unit being connected and transistor, the control end (such as, grid) of described transistor connects control unit,
The control two of described transistor connects end (such as, source electrode and drain electrode) and is connected between power end P2 and power end P1.
Change ground, when the first earth terminal G1 be used for loading ground signalling and during unmodulated signal, described modulation circuit
16, described protection circuit 17 etc. all can be omitted accordingly.
The most in the lump refering to Fig. 1 and Fig. 2, described bio-identification module 12 farther includes flexible PCB 18.Institute
State flexible PCB 18 for connecting described mainboard 2 and described bio-identification module 12, at described mainboard 2 with described
Signal is transmitted between bio-identification module 12.
In the present embodiment, described modulation circuit 16, protection circuit 17 and described second earth terminal G2 are formed
On described flexible PCB 18.So, changing ground, described modulation circuit 16, protection circuit 17 are with described
Second earth terminal G2 may alternatively be integrated within a control chip, and described control chip is encapsulated in described bio-identification chip
In 120.Described bio-identification chip 120 the most also can be packaged with power management chip (not shown), described power supply
Managing chip is used for providing supply voltage to bio-identification chip 120.It addition, described modulation circuit 16, protection electricity
Road 17 and described second earth terminal G2 also may be formed on described mainboard 2.
Described bio-identification module 12 may also include more circuit, such as store circuit, control circuit, level turn
Change circuit, filter circuit etc..Similarly, described mainboard 2 may also comprise more circuit.
(2) conductive layer is used for load-modulate signal
Refer to the electrical block diagram of the another embodiment that Fig. 7, Fig. 7 are the application electronic equipment.Described electricity
Subset 200 is the most identical with the basic structure of electronic equipment 100 shown in Fig. 6, and the two differs primarily in that: lead
Electric layer 24, for connecting between the first earth terminal G11 and modulation circuit 26, performs biology at bio-identification module 22
Load-modulate signal during sensing.Owing to conductive layer 24 connects modulated signal for loading, therefore, bio-identification can be improved
The signal to noise ratio of module 22.
(3) conductive layer is used for loading pumping signal
Refer to the electrical block diagram of the another embodiment that Fig. 8, Fig. 8 are the application electronic equipment.Described electricity
Subset 300 is the most identical with the basic structure of electronic equipment 100 shown in Fig. 6, and the two differs primarily in that: raw
Thing identification module 32 is mutual capacitance type fingerprint recognition module, and conductive layer 34 is connected with testing circuit 323, and with sense
Answering electrod-array 321 to form mutual capacitance, described conductive layer 34 is for performing bio information at bio-identification module 32
Receiving the pumping signal of self-detection circuit 323 during sensing, described testing circuit 323 receives induction electrode further
The sensing signal of array 321 output, thus determine bio information according to sensing signal.
(4) conductive layer is unsettled
Refer to the electrical block diagram of the another embodiment that Fig. 9, Fig. 9 are the application electronic equipment.Described electricity
Subset 400 is the most identical with the basic structure of electronic equipment 100 shown in Fig. 6, and the two differs primarily in that: institute
State conductive layer 44 unsettled.
It should be noted that electronic equipment 300 and 400 can also omit modulation circuit, use the life not modulating ground
Thing sensing drive scheme.
See also the structural representation of the another embodiment that Figure 10 and Figure 11, Figure 10 are the application electronic equipment.
Figure 11 is the partial sectional schematic view of electronic equipment shown in Figure 10.Shown electronic equipment 500 and electronics shown in Fig. 1
The basic structure of equipment 100 is the most identical, differring primarily in that of the two: described electronic equipment 500 wraps further
Include substrate 53, be arranged on the side of the second surface 503 of cover sheet 50, set with the stacking of described cover sheet 50
Put.Described substrate 53 includes that through hole 531, conductive layer 54 and bio-identification chip 520 are arranged in through hole 531.
So, changing ground, described conductive layer 54 may also set up the substrate 53 side back to cover sheet 50, or
It is arranged between cover sheet 50 and substrate 53, or is arranged on the opposite sides of substrate 53.Described conductive layer 54
Ground signalling, modulated signal, pumping signal or unsettled can be loaded.
Alternatively, described electronic equipment 500 farther includes touch sensing layer 4 and display device 3.Described touch passes
Sense layer is used for sensing whether electronic equipment 500 is touched by user.Described display device 3 is used for showing image.
In the present embodiment, described touch sensing layer 4 is formed on substrate 53.So, changing ground, described touch passes
Sense layer 4 also may be formed in display device 3, forms embedded touch display unit.It should be noted that when being
During embedded touch display unit, described substrate 53 preferably retains, and it is highly preferred that arranges collecting on substrate 53
The through hole 531 of bio-identification module 52 and/or conductive layer 54, thus, to improve the sensing of bio-identification module 52
Intensity.Described embedded touch display unit can include that on box, (On-Cell) and box interior (In-Cell) are two kinds of
Touch display unit.
Please continue to refer to Figure 10, alternatively, described electronic equipment 500 farther includes back cover 5, for described
Cover sheet 50 forms receiving space, house aforementioned touch sensing layer 4, display device 3, bio-identification module 52,
Conductive layer 54 element such as grade is in described receiving space.
Refer to the partial sectional schematic view of the another embodiment that Figure 12, Figure 12 are electronic equipment 500.Described protection
Cover plate 50 includes Part I A and Part II B, and the thickness of described Part II B is less than described Part I A
Thickness, described Part II A covers described bio-identification module 52 wholly or in part.Described Part II B is
First surface 501 is formed to second surface 503 depression.Alternatively, described Part II B can further completely or
Part covers described conductive layer 54.
Changing ground, described Part II B is alternatively second surface 503 and is formed to first surface 501 depression.Or
Person, described Part II is first surface 501 and second surface 503 caves in formation the most to each other.
It should be noted that the structure of the electronic equipment 500 shown in Figure 10-12 be also suitable above-mentioned electronic equipment 100,
200,300,400, repeat the most one by one.
Need it is further noted that the electronic equipment of the various embodiments described above such as includes the display for showing picture
District and the non-display area being positioned at around viewing area, wherein, corresponding non-display area, described cover sheet such as enters one
Step arranges color layers, and described bio-identification module and conductive layer are preferably provided at the non-display area of electronic equipment.So,
The present invention is not limited thereto, and described bio-identification module and conductive layer may also be arranged on viewing area.
Open, it will be appreciated that these embodiments are illustrative despite describing the present invention with reference to each embodiment
, and the scope of the present invention is not limited only to them.Many changes, revises, adds and improves is all possible
's.More generally, describe in the context of specific embodiments according to each embodiment disclosed by the invention.
Function can in each embodiment disclosed by the invention the most separately or in combination, or utilize not
Same term describes.These and other change, revise, add and improve can right the most subsequently want
In seeking scope disclosed by the invention defined in book.
Claims (13)
1. an electronic equipment, including:
Cover sheet, including first surface and the second surface relative with first surface；
Touch sensing layer, is arranged on the second surface side of described cover sheet, arranges with described cover sheet stacking；
Bio-identification module, is arranged on the second surface side of described cover sheet, and described bio-identification module includes
Bio-identification chip, described bio-identification chip is for sensing the biological letter that user inputs from cover sheet first surface
Breath, wherein, described cover sheet covers described bio-identification chip；With
Conductive layer, is arranged on the second surface side of described cover sheet, and described conductive layer is closed or non-enclosed
Arrange around described bio-identification chip.
Electronic equipment the most according to claim 1, it is characterised in that: described conductive layer is in described biological knowledge
Other module performs load ground signalling or load-modulate signal during bio information sensing or load pumping signal or unsettled.
Electronic equipment the most according to claim 1, it is characterised in that: described bio-identification module is that condenser type refers to
Stricture of vagina identification module, described capacitance type fingerprint identification module includes induction electrode array and testing circuit, described detection electricity
Road includes earth terminal and signal output part, and described earth terminal is used for load-modulate signal, and described signal output part is used for
Output drive signal, to induction electrode array, drives induction electrode array to perform fingerprint sensing, wherein, described excitation
Signal raises with the rising of described modulated signal, reduces with the reduction of described modulated signal.
4. according to the electronic equipment described in claim 1 or 3, it is characterised in that: described conductive layer is in described life
Thing identification module performs to load ground signalling during biological sensing.
5. according to the electronic equipment described in claim 1 or 3, it is characterised in that: described conductive layer is in described life
Thing identification module performs load-modulate signal during biological sensing.
Electronic equipment the most according to claim 3, it is characterised in that: described electronic equipment includes connecing for loading
The equipment ground of earth signal and modulation circuit, the earth terminal of described testing circuit is connected with equipment ground by modulation circuit,
Described modulation circuit drives signal to produce described modulated signal with described ground signalling according to one.
Electronic equipment the most according to claim 1, it is characterised in that: described bio-identification module is that condenser type refers to
Stricture of vagina identification module, described capacitance type fingerprint identification module includes induction electrode array and testing circuit, described conductive layer
Forming mutual capacitance with described induction electrode array, be used for loading pumping signal, described testing circuit is used for receiving sensing
The sensing signal of electrod-array output.
Electronic equipment the most according to claim 1, it is characterised in that: described electronic equipment farther includes substrate,
Described substrate is arranged on the second surface side of described cover sheet, described conductive layer or be arranged on cover sheet with
Between substrate, or it is arranged on the substrate side back to cover sheet, or is arranged on the opposite sides of substrate, or
Person's substrate is provided with through hole, and described conductive layer is correspondingly arranged in described through hole.
9. according to the electronic equipment described in claim 1 or 8, it is characterised in that: described electronic equipment includes display dress
Putting, described touch sensing layer or setting on the substrate, or are arranged in a display device.
Electronic equipment the most according to claim 1, it is characterised in that: described cover sheet includes Part I
With Part II, the thickness of described Part II less than the thickness of described Part I, described Part II completely or
Part covers described bio-identification chip.
11. electronic equipments according to claim 10, it is characterised in that: described Part II be first surface to
Second surface depression is formed, or/and, described Part II is that second surface is formed to first surface depression.
12. electronic equipments according to claim 1, it is characterised in that: described bio-identification module is that fingerprint is known
One or more in other module, blood oxygen identification module, heart beating identification module.
13. electronic equipments according to claim 1, it is characterised in that: described electronic equipment is portable electronic
Product or household formula electronic product.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610101158.7A CN106156581A (en) | 2016-02-24 | 2016-02-24 | Electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201610101158.7A CN106156581A (en) | 2016-02-24 | 2016-02-24 | Electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN106156581A true CN106156581A (en) | 2016-11-23 |
Family
ID=57353252
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201610101158.7A Withdrawn CN106156581A (en) | 2016-02-24 | 2016-02-24 | Electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN106156581A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107705716A (en) * | 2017-10-27 | 2018-02-16 | 京东方科技集团股份有限公司 | A kind of OLED modules and display device |
| CN108780496A (en) * | 2017-02-13 | 2018-11-09 | 深圳市汇顶科技股份有限公司 | Sensing device and terminal device |
| US11417138B2 (en) | 2018-04-23 | 2022-08-16 | Guangdong Oppo Mobile Telecommunications Corp., Ltd. | Fingerprint identification apparatus, display apparatus, and electronic device |
-
2016
- 2016-02-24 CN CN201610101158.7A patent/CN106156581A/en not_active Withdrawn
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108780496A (en) * | 2017-02-13 | 2018-11-09 | 深圳市汇顶科技股份有限公司 | Sensing device and terminal device |
| CN107705716A (en) * | 2017-10-27 | 2018-02-16 | 京东方科技集团股份有限公司 | A kind of OLED modules and display device |
| US11417138B2 (en) | 2018-04-23 | 2022-08-16 | Guangdong Oppo Mobile Telecommunications Corp., Ltd. | Fingerprint identification apparatus, display apparatus, and electronic device |
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Application publication date: 20161123 |