CN205594497U

CN205594497U - Electronic equipment , mobile terminal

Info

Publication number: CN205594497U
Application number: CN201620140590.2U
Authority: CN
Inventors: 贾锋; 贾一锋
Original assignee: Shenzhen Sunwave Technology Co Ltd
Current assignee: Shenzhen Sunwave Technology Co Ltd
Priority date: 2016-02-24
Filing date: 2016-02-24
Publication date: 2016-09-21
Anticipated expiration: 2026-02-24
Also published as: CN205721484U

Abstract

The utility model discloses an electronic equipment, mobile terminal. Electronic equipment is including protection apron, capacitanc fingerprint sensing chip and conducting layer. The protection apron is including first surface and the second surface relative with the first surface. Capacitanc fingerprint sensing chip sets up the second surface one side at the visor board for the fingerprint information that the sensing user imported from the first surface of protection apron. The conducting layer sets up in second surface one side of visor board, and lies in around the capacitanc fingerprint sensing chip, the conducting layer is used for loading ground signal. Electronic equipment's fingerprint sensing sensitivity is higher. The utility model also discloses a mobile terminal of fingerprint sensing sensitivity is higher.

Description

Electronic equipment, mobile terminal

Technical field

This utility model relates to fingerprint sensing technical field, particularly relates to a kind of have the electronic equipment of fingerprint sensing function, mobile terminal.

Background technology

Fingerprint sensing devices becomes the standard configuration of increasing electronic equipment (such as mobile phone); at present; it is positioned over the fingerprint sensing devices in electronic equipment front; it is typically employed on the cover sheet of electronic equipment and carries out perforate; fingerprint sensing devices is combined with controlling button (also known as Home key); it is placed in described perforate; so, it is so designed that for from the point of view of those are not opened hole on cover sheet but use the electronic equipment of virtual controlling button (also known as touch key-press) on the market and inapplicable.

Correspondingly, the cover sheet of electronic equipment does not opens hole and dispose fingerprint sensing devices market demand of (that is, the inside of electronic equipment) below cover sheet strong.So, the scheme at cover sheet positioned beneath fingerprint sensing devices makes the sensing signal of fingerprint sensing devices become more weak, causes fingerprint sensing the sensitiveest.

Utility model content

In order to solve above-mentioned technical problem, this utility model provides a kind of and arranges fingerprint sensing devices and the higher electronic equipment of fingerprint sensing sensitivity, mobile terminal under cover sheet.

For achieving the above object, the following technical scheme of this utility model offer:

A kind of electronic equipment, including:

Cover sheet, including first surface and the second surface relative with first surface；

Capacitance type fingerprint sensor chip, is arranged on the second surface side of cover sheet, for sensing the finger print information that user inputs from the first surface of cover sheet；With

Conductive layer, is arranged on the second surface side of cover sheet, and described conductive layer is arranged on around described capacitance type fingerprint sensor chip, and described conductive layer is used for loading ground signalling.

Alternatively, described conductive layer is closed or non-enclosed around the setting of described capacitance type fingerprint sensor chip region.

Alternatively, described conductive layer is for persistently loading ground signalling when capacitance type fingerprint sensor chip performs fingerprint sensing.

Alternatively, described conductive layer is for only loading ground signalling when capacitance type fingerprint sensor chip performs fingerprint sensing.

Alternatively, described capacitance type fingerprint sensor chip includes induction electrode array and the testing circuit being connected with induction electrode array, and described testing circuit is used for providing pumping signal to induction electrode array, drives described induction electrode array to perform fingerprint sensing.

Alternatively, described testing circuit includes signal transmission ends and the first earth terminal, described first earth terminal is used for load-modulate signal, and described signal transmission ends is used for providing pumping signal to change with the change of described modulated signal to induction electrode array, described pumping signal.

Alternatively, described pumping signal raises with the rising of described modulated signal, reduces with the reduction of described modulated signal.

Alternatively, described testing circuit farther includes power end, and described power end is used for loading power voltage, and described supply voltage changes with the change of described modulated signal, and pressure reduction therebetween keeps constant, and described pressure reduction is the rated voltage of testing circuit work.

Alternatively, described electronic equipment includes that fingerprint sensing module, described fingerprint sensing module include described capacitance type fingerprint sensor chip, the second earth terminal and modulation circuit；Described second earth terminal is used for loading described ground signalling, and described modulation circuit is connected between described second earth terminal and the first earth terminal, drives signal to produce described modulated signal according to described ground signalling with one, and provides described modulated signal to the first earth terminal.

Alternatively, described electronic equipment farther includes mainboard, described fingerprint sensing module farther includes flexible PCB, and described flexible PCB is used for connecting described mainboard and described capacitance type fingerprint sensor chip, transmits signal between described mainboard and described capacitance type fingerprint sensor chip.

Alternatively; described electronic equipment farther includes touch sensing layer; described touch sensing layer, described capacitance type fingerprint sensor chip and described conductive layer are respectively positioned on the homonymy of described cover sheet, and described touch sensing layer is used for sensing whether electronic equipment is touched by user.

Alternatively, described electronic equipment farther includes substrate, and described touch sensing layer is arranged on the substrate, and described substrate arranges through hole, and described capacitance type fingerprint sensor chip and described conductive layer are respectively positioned in described through hole.

Alternatively, described electronic equipment includes that equipment ground, described equipment ground load ground signalling, electrically connects described conductive layer and described equipment.

Alternatively, described conductive layer is attached to second surface.

Alternatively, described capacitance type fingerprint sensor chip is self-capacitance fingerprint sensing chip.

Alternatively, described electronic equipment is portable electronic product or household formula electronic product.

Owing to described electronic equipment arranges conductive layer around capacitance type fingerprint sensor chip further, and described conductive layer is for loading ground signalling when capacitance type fingerprint sensor chip performs fingerprint sensing, and therefore, user diminishes to the impedance between systematically.Correspondingly, the intensity of the fingerprint sensing signal of capacitance type fingerprint sensor chip can be improved, and then, the fingerprint sensing sensitivity of electronic equipment is improved.

Further, first earth terminal of capacitance type fingerprint sensor chip is used for load-modulate signal rather than ground signalling, therefore, the signal of the testing circuit of capacitance type fingerprint sensor chip all raises with the rising of modulated signal, reduces with the reduction of modulated signal, additionally, capacitance type fingerprint sensor chip is self-capacitance fingerprint sensing chip, thus, the signal to noise ratio making the fingerprint sensing signal of capacitance type fingerprint sensor chip improves, correspondingly, the fingerprint sensing sensitivity of electronic equipment is further enhanced.

This utility model provides again a kind of mobile terminal, and described mobile terminal includes:

Display screen, is arranged on the second surface side of cover sheet, and definition cover sheet is just showing to display screen that the visible area that region is mobile terminal of picture, definition cover sheet anon-normal are non-visible area to the region of display screen display picture；

Capacitance type fingerprint sensor chip, is arranged on the second surface side of described cover sheet, and is positioned at described non-display area, for sensing the finger print information of user；With

Conductive layer, is arranged on the second surface side of described cover sheet, is positioned at non-display area, and closed or non-enclosed around the setting of described capacitance type fingerprint sensor chip region, and described conductive layer is used for loading ground signalling.

Alternatively, described capacitance type fingerprint sensor chip includes induction electrode array and the testing circuit being connected with induction electrode array, described testing circuit includes signal transmission ends and the first earth terminal, described first earth terminal is used for load-modulate signal, described signal transmission ends is used for providing pumping signal to induction electrode array, driving described induction electrode array to perform self-capacitance fingerprint sensing, described pumping signal raises with the rising of described modulated signal, reduces with the reduction of described modulated signal.

Owing to described mobile terminal arranges conductive layer around capacitance type fingerprint sensor chip further, and described conductive layer is for loading ground signalling when capacitance type fingerprint sensor chip performs fingerprint sensing, and therefore, user diminishes to the impedance between systematically.Correspondingly, the intensity of the fingerprint sensing signal of capacitance type fingerprint sensor chip can be improved, and then, the fingerprint sensing sensitivity of mobile terminal is improved.

Further, first earth terminal of capacitance type fingerprint sensor chip is used for load-modulate signal rather than ground signalling, therefore, the signal of the testing circuit of capacitance type fingerprint sensor chip all raises with the rising of modulated signal, reduces with the reduction of modulated signal, it addition, capacitance type fingerprint sensor chip performs self-capacitance fingerprint sensing, thus, the signal to noise ratio making the fingerprint sensing signal of capacitance type fingerprint sensor chip improves, and correspondingly, the fingerprint sensing sensitivity of electronic equipment is further enhanced.

Although disclosing multiple embodiment, change including it, but by illustrate and describing the following detailed description of illustrative embodiment disclosed in this utility model, this utility model other embodiments disclosed will be readily apparent to those skilled in the art.Can revise at various obvious aspects it will be recognized that this utility model is open, all modifications is all without departing from spirit and scope of the present utility model.Correspondingly, accompanying drawing and detailed description substantially should be considered illustrative and not restrictive.

Accompanying drawing explanation

Describing its example embodiment in detail by referring to accompanying drawing, feature of the present utility model and advantage will be apparent from.

Fig. 1 is the decomposed structural representation of this utility model electronic equipment.

Fig. 2 is the part assembling structure schematic diagram of electronic equipment shown in Fig. 1.

Fig. 3 is the fingerprint sensing circuit diagram omitting conductive layer.

Fig. 4 is the fingerprint sensing circuit diagram including loading the conductive layer of ground signalling.

Fig. 5 is the schematic diagram of the another embodiment of Fig. 2 conductive layer.

Fig. 6 is the electrical block diagram of electronic equipment shown in Fig. 2.

Fig. 7 is the partial section view of electronic equipment shown in Fig. 1.

Fig. 8 is the partial section view of a change embodiment of electronic equipment shown in Fig. 1.

Fig. 9 is the partial section view of the another change embodiment of electronic equipment shown in Fig. 1.

Figure 10 is the partial section view of the another change embodiment of electronic equipment shown in Fig. 1.

Figure 11 is the flow chart of the manufacture method of electronic equipment shown in Fig. 1.

Detailed description of the invention

It is described more fully with example embodiment referring now to accompanying drawing.But, example embodiment can be implemented in a variety of forms, and is not understood as limited to embodiment set forth herein；On the contrary, it is provided that these embodiments make this utility model will fully and completely, and the design of example embodiment is conveyed to those skilled in the art all sidedly.For convenience or clear, the thickness of every layer shown in accompanying drawing and size may be exaggerated, omit or be schematically illustrated in and schematically illustrate the quantity of related elements.It addition, the size of element not exclusively reflects actual size, and the quantity incomplete reaction actual quantity of related elements.

Additionally, described feature, structure can be combined in one or more embodiment in any suitable manner.In the following description, it is provided that many details thus be given and embodiment of the present utility model fully understood.But, one of ordinary skill in the art would recognize that, do not have in described specific detail is one or more, or uses other structure, constituent element etc., it is also possible to put into practice the technical solution of the utility model.In other cases, known features or operation are not shown in detail or describe to avoid fuzzy this utility model.

Of the present utility model embodiment is described below in detail, and the example of described embodiment is shown in the drawings, and the most same or similar label represents same or similar element or has the element of same or like function.The embodiment described below with reference to accompanying drawing is exemplary, it is intended to user explains this utility model, and it is not intended that to restriction of the present utility model.

In description of the present utility model, it will be appreciated that, term " thickness ", " on ", D score, "front", "rear", "left", "right", " vertically ", " level ", " top ", " end ", " interior ", the orientation of the instruction such as " outward " or position relationship be based on orientation shown in the drawings or position relationship, it is for only for ease of description this utility model and simplifies description, rather than instruction or the position of hint indication or element must have specific method, with specific azimuth configuration and operation, therefore it is not intended that to restriction of the present utility model.

In this utility model, unless otherwise clearly defined and limited, term " is installed ", " being connected ", " connection ", the term such as " fixing " should be interpreted broadly, and connects for example, it may be fixing, it is also possible to be to removably connect, or integral；Can be to be mechanically connected, it is also possible to be electrical connection；Can be to be directly connected to, it is also possible to be to be indirectly connected with by intermediary, can be connection or the interaction relationship of two elements of two element internals.For the ordinary skill in the art, above-mentioned term concrete meaning in this utility model can be understood as the case may be.

Further, in description of the present utility model, it is to be understood that: " multiple " include two and two or more, unless this utility model separately has the most concrete restriction.It addition, words such as " first ", " second ", " the 3rd " that occur in each element title and signal name is not to limit element or sequencing that signal occurs, but name for convenience of element, clearly distinguish each element so that describe more succinct.

At present; the electronic equipment being provided with fingerprint sensing chip in front would generally configure the becket of a cincture fingerprint sensing chip; described becket, for loading the pumping signal of change, to form mutual capacitance with the sensor electrode array in fingerprint sensing chip, thus performs fingerprint sensing.

Found by the lot of experiments of inventor; fingerprint sensing chip and becket are all displaced to below cover sheet if (electronic equipment internal); in view of the decay in transmitting procedure of the thickness of cover sheet, pumping signal and pumping signal are protected the factors such as the interference inside and outside cover plate; pumping signal on becket passes the signal intensity coupleding on fingerprint sensing chip after cover sheet and becomes more weak; therefore, the fingerprint sensing sensitivity using the electronic equipment of above-mentioned capacitance type fingerprint sensing mode is relatively low.

For improving the intensity of the fingerprint sensing signal being arranged on the fingerprint sensing chip below cover sheet, inventor tests through a large amount of creative works and experimentation and proposes the electronic equipment that the application is following.

Before introducing the electronic equipment of the application, in addition it is also necessary to further illustrate the basic functional principle of mutual capacitance type fingerprint sensing module and self-capacitance fingerprint sensing module.

In fingerprint sensing module based on mutual capacitance type, fingerprint sensing module includes that fingerprint sensing chip and becket, described fingerprint sensing chip include the testing circuit that sensor electrode array is connected respectively with sensor electrode array and becket.Mutual capacitance is formed between described becket and described sensor electrode array.Described testing circuit provides the pumping signal of change to becket, and described sensor electrode array exports corresponding fingerprint sensing signal to testing circuit.Described testing circuit is according to described fingerprint sensing signal acquisition information in fingerprint.

Relatively, in fingerprint sensing module based on self-capacitance, fingerprint sensing module can save the becket of the aforementioned pumping signal loading change.The testing circuit of self-capacitance fingerprint sensing chip provides pumping signal to sensor electrode array by data wire, and receives fingerprint sensing signal by identical data wire from sensor electrode array.Described sensor electrode array includes the sensing electrode of multiple formation self-capacitance over the ground.An object (e.g., finger) close to described sensing electrode time, another direct-to-ground capacitance can be formed between this object and described sensing electrode.

See also the decomposed structural representation that Fig. 1 and Fig. 2, Fig. 1 are this utility model electronic equipment one embodiment.Fig. 2 is the part assembling structure schematic diagram of electronic equipment shown in Fig. 1.Described electronic equipment 100 is such as portable electronic product or household formula electronic product.Wherein, portable electronic product is as various mobile terminals, such as, and each electronic product such as mobile phone, panel computer, notebook computer and Wearable product；Household formula electronic product is such as each electronic product such as intelligent door lock, TV, refrigerator, desktop computers.It should be noted that electronic equipment 100 can increase the element not shown in diagram further or reduce some element shown in diagram, according to different electronic product corresponding selection.Described electronic equipment 100 includes cover sheet 10, capacitance type fingerprint sensor chip 12 and conductive layer 14.Described cover sheet 10 is arranged on the front side of electronic equipment 100, and electronic equipment 100 plays the effect of protection, such as, prevent the materials such as grieshoch from entering electronic equipment 100 inside etc..Described capacitance type fingerprint sensor chip 12 is for sensing the finger print information of target object.Described target object is as the finger of user, and so, described target object is not limited to finger, and described target object can also be other suitable objects such as toe, below mainly illustrate as a example by finger.Described conductive layer 14 is used for loading ground signalling, to improve the sensing signal intensity of capacitance type fingerprint sensor chip 12.

Generally, electronic equipment 100 is with including equipment and power supply end.Described equipment ground is also known as systematically, and for example, negative pole of the power supply of electronic equipment 100, power supply is such as battery, described power supply end such as the positive pole for battery.Being used for loading ground signalling, therefore, ground signalling is also known as equipment earth signal or systematically signal equipment.Described ground signalling is constant voltage signal, as voltage signals such as the voltage reference of circuit each in electronic equipment 100, described ground signalling for example, 0V (volt), 2V, (-1) V.Generally, the equipment ground of electronic equipment 100 or the most not earth ground or definitely the most greatly.So, when electronic equipment 100 is connected with earth ground by conductor, can also be earth ground described equipment.

Described cover sheet 10 includes first surface 101 and the second surface 103 relative with first surface 101.Described first surface 101 is the outer surface of electronic equipment 100, and described second surface 103 is positioned at the inside of described electronic equipment 100.Glass that described cover sheet 10 is the most transparent or sapphire cover plate, so, the material of described cover sheet 10 is alternatively other suitable material, is not limited to glass or sapphire cover plate, the most alternatively thin film cover plate.Further, described cover sheet 10 is alternatively translucent or nontransparent cover plate, and it is transparent cover plate that the application is not limiting as cover sheet 10.

Described capacitance type fingerprint sensor chip 12 is arranged on second surface 103 side of cover sheet 10, for sensing the finger print information that user inputs from the first surface 101 of cover sheet 10.In the present embodiment, described capacitance type fingerprint sensor chip 12 is self-capacitance fingerprint sensing chip.So, it should be noted that described capacitance type fingerprint sensor chip 12 is alternatively the capacitance type fingerprint sensor chips such as self-capacitance or the mutual capacitance type of other suitable type, however it is not limited to the self-capacitance fingerprint sensing chip of herein described type.

Described conductive layer 14 is arranged on second surface 103 side of cover sheet 10, and is positioned at around described capacitance type fingerprint sensor chip 12.Described conductive layer 14 for loading ground signalling when capacitance type fingerprint sensor chip 12 performs fingerprint sensing.Preferably, when finger touches on cover sheet 10 just region to capacitance type fingerprint sensor chip 12, can together touch on cover sheet 10 region just to conductive layer 14.

Seeing also Fig. 3 and Fig. 4, Fig. 3 is the fingerprint sensing circuit diagram omitting conductive layer 14.Fig. 4 is the fingerprint sensing circuit diagram including loading the conductive layer 14 of ground signalling.As seen from Figure 3; in the circuit loop formed between finger F, capacitance type fingerprint sensor chip 12 and equipment ground GND; it is formed with electric capacity Cf between finger F, cover sheet 10 and capacitance type fingerprint sensor chip 12, between finger F, cover sheet 10 and equipment ground GND, is formed with electric capacity Cs.

Relatively, in the diagram, owing to electronic equipment 100 includes the conductive layer 14 of loading ground signalling, therefore, being equal to an electric capacity Ci the most in parallel at electric capacity Cs two ends, described electric capacity Ci is made up of finger F, cover sheet 10, conductive layer 14.According to circuit theory, the impedance between finger F to equipment ground GND diminishes, and correspondingly, the intensity of the fingerprint sensing signal of capacitance type fingerprint sensor chip 12 can be improved.

Due to electronic equipment 100 of the present utility model in second surface 103 side of cover sheet 10 further arrange load ground signalling conductive layer 14; thus; the intensity of the fingerprint sensing signal of capacitance type fingerprint sensor chip 12 is improved; and then, the fingerprint sensing sensitivity of electronic equipment 100 is improved.

Usually, described capacitance type fingerprint sensor chip 12 be shaped as elongated rectangular shape, additionally, in order to increase the visual range of electronic equipment 100, in the present embodiment, described conductive layer 14 is a rectangular ring, closed around the setting of described capacitance type fingerprint sensor chip 12 region.So, changing ground, described conductive layer 14 is alternatively other shape, as circular, oval ring-type, it addition, described conductive layer 14 also can non-enclosed be arranged around described capacitance type fingerprint sensor chip 12, such as it is shown in figure 5, described conductive layer 14 is divided into several sections.

Described conductive layer 14 is made as used the suitable conductive material such as silver slurry, molybdenum lithium molybdenum, tin indium oxide, nanometer silver or Graphene.Described conductive layer 14 is formed on second surface 103 for example with suitably production methods such as coating, spraying or impressings.So, changing ground, described conductive layer 14 is not limiting as necessarily being formed on second surface 103, it is also possible to is proximate to second surface 103 and arranges.

Described capacitance type fingerprint sensor chip 12 is attached on second surface 103 for example with the mode pasted.So, the mode that described capacitance type fingerprint sensor chip 12 and conductive layer 14 are formed on second surface 103 is not limited to the mode of aforementioned stickup, it is possible to use other suitable set-up mode, such as impressing etc..It addition, described capacitance type fingerprint sensor chip 12 also directly can be pressed close to second surface 103 or fit, and and unrestricted employing third party's physical medium secure the two together.Further, described capacitance type fingerprint sensor chip 12 can also be proximate to second surface 103 and arranges.

Refer to the electrical block diagram of the embodiment that Fig. 6, Fig. 6 are electronic equipment 100 shown in Fig. 2.Described conductive layer 14 connects equipment ground GND.Described capacitance type fingerprint sensor chip 12 includes induction electrode array 121 and the testing circuit 123 being connected with induction electrode array 121.Described testing circuit 123 is used for providing pumping signal to induction electrode array 121, drives described induction electrode array 121 to perform capacitance type fingerprint sensing.Described testing circuit 123 is further used for receiving the sensing signal (also referred to as " fingerprint sensing signal ") of induction electrode array 121 output, and obtains information in fingerprint according to sensing signal.In the present embodiment, described testing circuit 123 is used for driving induction electrode array 121 to perform self-capacitance fingerprint sensing.

Described induction electrode array 121 includes multiple induction electrode 122.The plurality of induction electrode 122 is arranged in array, the shape for example, rectangle of each electrode 122, so, it is possible to for other various suitable shapes.It addition, the size and shape of each electrode 122 is identical, so, it is possible to select difference.The plurality of induction electrode 122 can be capacitively coupled to finger F (see Fig. 3 and Fig. 4).It addition, the plurality of induction electrode 122 also can in non-aligned transfer, and and unrestricted in array arrange.

Further, described testing circuit 123 includes signal transmission ends T and the first earth terminal G1.Described first earth terminal G1 is used for load-modulate signal, and described signal transmission ends T is used for providing pumping signal to change with the change of described modulated signal to induction electrode 122, described pumping signal.Wherein, described pumping signal raises with the rising of described modulated signal, reduces with the reduction of described modulated signal.

Described testing circuit 123 farther includes power end P1, described power end P1 and is used for loading power voltage, and described supply voltage changes with the change of described modulated signal.Pressure reduction between described supply voltage and described modulated signal keeps constant, and described pressure reduction is the described testing circuit 123 rated voltage when working.

Signal in described testing circuit 123 the most all raises with the rising of described modulated signal, reduces with the reduction of described modulated signal.That is, the signal in described testing circuit 123 is unified modulated signal and is modulated.

Comparative apparatus ground GND loads constant ground signalling, and the first earth terminal G1 loads the modulated signal rather than described ground signalling changed, thus is conducive to improving the signal to noise ratio of fingerprint sensing signal, and then can improve the fingerprint sensing sensitivity of electronic equipment 100 further.

It should be noted that in the present embodiment, the first earth terminal G1 is used for load-modulate signal, so, changes ground, and other suitable terminals in testing circuit 123 also can load-modulate signal, it is not limited to the first earth terminal G1 is used for load-modulate signal.Such as, the power end P1 in testing circuit 123 can also be used for load-modulate signal, correspondingly, the change of the modulated signal that the signal that described pumping signal and the first earth terminal G1 are loaded is loaded with power end P1 and change.

Described modulated signal for example, includes described ground signalling and a signal driving signal.In the present embodiment, described driving signal is higher than ground signalling, and described driving signal is boost signal compared to ground signalling.Further, the most periodically variable square-wave signal of described modulated signal.So, changing ground, described modulated signal is alternatively nonperiodic signal, it addition, described modulated signal is alternatively the signal of other suitable waveform, it is not limited to square-wave signal.Described driving signal may be lower than ground signalling, and described driving signal is buck signal compared to ground signalling.

Owing to described capacitance type fingerprint sensor chip 12 provides the pumping signal changed with modulated signal change to induction electrode 122, therefore, the signal to noise ratio of fingerprint sensing signal can be improved, correspondingly, it is possible to increase the intensity of fingerprint sensing signal.So, the sensitivity arranging capacitance type fingerprint sensor chip 12 below cover sheet 10 improves further.

In the above-described embodiment, the first earth terminal G1 is for loading the modulated signal of change.So, the application is not limited thereto, and changes ground, and described first earth terminal G1 can also be used for loading described ground signalling.

Referring again to Fig. 1 and Fig. 6, described electronic equipment 100 includes fingerprint sensing module 1.Described fingerprint sensing module 1 includes described capacitance type fingerprint sensor chip the 12, second earth terminal G2 and modulation circuit 16.Described second earth terminal G2, for being connected with equipment ground GND, loads described ground signalling.Described modulation circuit 16 is connected between described second earth terminal G2 and the first earth terminal G1, and receives described driving signal, produces described modulated signal according to described ground signalling and described driving signal, and exports described modulated signal to the first earth terminal G1.In the present embodiment, the signal in described testing circuit 123 all changes with the change of modulated signal of the first earth terminal G1.

Change ground, in other embodiments, in described testing circuit 123 also can partial circuit signal modulated signal modulation, change with the change of modulated signal of the first earth terminal G1, the signal of partial circuit is not modulated by the modulated signal of the first earth terminal G1.

Described modulation circuit 16 such as includes two-transistor and a controller, wherein a transistor receives described driving signal, one transistor receives described ground signalling, and described controller controls described two-transistor and alternately exports described ground signalling and described driving signal by controlling described two-transistor alternate conduction and form described modulated signal.So, described modulation circuit 16 is not limited to structure described here, it is possible to for other suitable circuit structure.

Please continue to refer to Fig. 1 and Fig. 6, described electronic equipment 100 farther includes mainboard 2, and described mainboard 2 includes main control chip 21.Described main control chip 21 includes the 3rd earth terminal G3 and power end P2.Described 3rd earth terminal G3 is used for connecting equipment ground GND.Described power end P2 gives described power end P1 for output supply voltage.Communication interface (sign) is set between described main control chip 21 and described capacitance type fingerprint sensor chip 12 further, to communicate.

Described main control chip 21 can be one chip, it is also possible to be a chipset.When main control chip 21 is chipset, described chipset includes application processor (Application Processor, AP) and power supply chip.It addition, described chipset can farther include storage chip.It addition, described application processor also can be replaced by central processing unit (Central Processing Unit, CPU).

Further, in order to avoid occurring that the current flowing backwards of power end P1 is back to the situation of power end P2 when the signal on the first earth terminal G1 is and drives signal, described fingerprint sensing module 1 farther includes the protection circuit 17 being arranged between power end P1 and power end P2.When the supply voltage that described protection circuit 17 is used on power end P1 higher than the supply voltage on power end P2 or reaches predetermined value higher than the supply voltage on power end P2, the connection between deenergization end P2 and power end P1.

Described protection circuit 17 such as includes a diode being connected between power end P2 and power end P1; or including the control unit being connected and transistor; the control end of described transistor is (such as; grid) connect control unit; the control two of described transistor connects end (such as, source electrode and drain electrode) and is connected between power end P2 and power end P1.

Change ground, when the first earth terminal G1 is used for loading ground signalling and during unmodulated signal, described modulation circuit 16, described protection circuit 17 etc. all can be omitted accordingly.

The most in the lump refering to Fig. 1 and Fig. 2, described fingerprint sensing module 1 farther includes flexible PCB 18.Described flexible PCB 18 is used for connecting described mainboard 2 and described capacitance type fingerprint sensor chip 12, transmits signal between described mainboard 2 and described capacitance type fingerprint sensor chip 12.

In the present embodiment, described modulation circuit 16, protection circuit 17 and described second earth terminal G2 are formed on described flexible PCB 18.So, changing ground, described modulation circuit 16, protection circuit 17 and described second earth terminal G2 may alternatively be integrated within a control chip, and described control chip is packaged together with described capacitance type fingerprint sensor chip 12, form chipset.The most also can be packaged with power management chip (not shown) in described chipset, described power management chip is used for providing supply voltage to capacitance type fingerprint sensor chip 12.It addition, described modulation circuit 16, protection circuit 17 and described second earth terminal G2 also may be formed on described mainboard 2.

Described capacitance type fingerprint sensor chip 12 may also include more circuit, such as stores circuit, control circuit, level shifting circuit, filter circuit etc..Similarly, described mainboard 2 may also comprise more circuit.

Please continue to refer to Fig. 1 and Fig. 2, alternatively, described electronic equipment 100 farther includes display screen 3, described display screen 3 and described capacitance type fingerprint sensor chip 12 and is respectively positioned on the homonymy of described cover sheet 10.Define described cover sheet 10 and just described display screen 3 being shown, the region of picture is viewing area 31, define described cover sheet 10 anon-normal and described display screen 3 is shown, and the region of picture is non-display area 33.Described capacitance type fingerprint sensor chip 12 is arranged at non-display area 33 with described conductive layer 14.

Generally, described electronic equipment 100 is formed with color layers 19 at the non-display area 33 of cover sheet 10, such as color layers or the color layers etc. of black of white.Described conductive layer 14 is formed in color layers 19 with described capacitance type fingerprint sensor chip 12.Changing ground, described electronic equipment 100 also can omit color layers 19 in the position of corresponding described capacitance type fingerprint sensor chip 12 and/or described conductive layer 14；Or, described electronic equipment 100 may also set up the marker different from color layers 19 in the position of corresponding described capacitance type fingerprint sensor chip 12 and/or described conductive layer 14, for indicating described capacitance type fingerprint sensor chip 12 and/or the position at described conductive layer 14 place.

Seeing also Fig. 1 and Fig. 7, Fig. 7 is the partial section view of electronic equipment 100 shown in Fig. 1.Alternatively, described electronic equipment 100 farther includes touch sensing layer 4, and described touch sensing layer 4 is used for sensing whether electronic equipment 100 is touched by user.Described touch sensing layer 4 can be that external hanging type is formed on display screen 3, it is possible to is formed in display screen 3 for (On-Cell) mode on box, it addition, alternatively interior (In-Cell) mode of box is formed in display screen 3.In the present embodiment, touch sensing layer 4 is to use external hanging type to illustrate as a example by being formed on display screen 3.Described touch sensing layer 4 is arranged with described display screen 3 stacking.Described touch sensing layer 4, described capacitance type fingerprint sensor chip 12 and described conductive layer 14 are respectively positioned on the homonymy of described cover sheet 10, and described capacitance type fingerprint sensor chip 12 and described conductive layer 14 may be contained within color layers 19.

For the touch sensing layer 4 of external hanging type, described touch sensing layer 4 can be formed directly on cover sheet 10, it is possible to is formed on an extra transparency carrier, or is formed on the outer surface of display screen 3.

Refer to the partial section view of the change embodiment that Fig. 8, Fig. 8 are electronic equipment 100.Described cover sheet 10 arranges groove 102 on first surface 101, and described groove 102 is caved in second surface 103 by first surface 101 and formed.Wherein, described groove 102 partly or entirely covers described capacitance type fingerprint sensor chip 12.Described groove 102 is set, on the one hand can improve the intensity of fingerprint sensing signal, on the other hand also can point out the position at user's capacitance type fingerprint sensor chip 12 place.

Refer to the partial section view of the another change embodiment that Fig. 9, Fig. 9 are electronic equipment 100 shown in Fig. 1.Described cover sheet 10 arranges groove 102 on second surface 103, and described groove 102 is caved in first surface 101 by second surface 103 and formed.Wherein, described groove 102 partly or entirely covers described capacitance type fingerprint sensor chip 12.Described groove 102 is set, the intensity of fingerprint sensing signal can be improved.

Further, it is possible to the position of the first surface 101 capacitance type fingerprint sensor chip 12 corresponding with second surface 103 at cover sheet 10 is each formed with groove 102.

Refer to the partial section view of the another change embodiment that Figure 10, Figure 10 are this utility model electronic equipment 100.Described touch sensing layer 4 is formed on a substrate 40.Being formed with through hole 401 on described substrate 40, described capacitance type fingerprint sensor chip 12 is arranged in described through hole 401 with conductive layer 14.

It should be noted that the conductive layer 14 of this embodiment may be provided on second surface 103, it is possible to be not disposed on second surface 103.

Glass that described substrate 40 is the most transparent or sapphire substrate, so, the material of described substrate 40 is alternatively other suitable material, is not limited to glass or sapphire substrate, the most alternatively film substrate.Further, described substrate 40 is alternatively translucent or nontransparent cover plate, and it is transparency carrier that the application is not limiting as substrate 40.

In the present embodiment, described touch sensing layer 4 is one layer, and described touch sensing layer 4 is positioned at described substrate 40 in the face of the side of described cover sheet 10.So, changing ground, described touch sensing layer 4 is alternatively two-layer, is separately positioned on the opposite sides of substrate 40.Described touch sensing layer 40 includes touch-sensing electrode (not shown), whether has the touch operation of user for sensing.

Further, described touch sensing layer 4 can be self-capacitance touch sensing layer, it is possible to for mutual capacitance type touch sensing layer.

Please continue to refer to Fig. 1, alternatively, described electronic equipment 100 farther includes back cover 5, for forming receiving space with described cover sheet 10, houses the elements such as aforementioned touch sensing layer 4, display screen 3, mainboard 2, fingerprint sensing module 1 in described receiving space.

Seeing also Fig. 1 and Figure 11, Figure 11 is the flow chart of the manufacture method of electronic equipment 100 shown in Fig. 1.Described electronic equipment 100 includes that equipment ground GND, described equipment ground GND are used for loading ground signalling, and described manufacture method includes:

S1: a transparent cover sheet 10 is provided；

S2: form color layers 19 in the side of cover sheet 10 to form visible area 31 and the non-visible area 33 of electronic equipment 100；

S3: form a closed or conductive layer 14 for non-enclosed annular in color layers 19, described conductive layer 14 is connected to equipment ground GND；

S4: arrange capacitance type fingerprint sensor chip 12 in the annular region that conductive layer 14 is surrounded, for sensing the finger print information of user.

Described capacitance type fingerprint sensor chip 12 for example, self-capacitance fingerprint sensing chip.

Please be one refering to Fig. 6, described capacitance type fingerprint sensor chip 12 includes induction electrode array 121 and the testing circuit 123 being connected with induction electrode array 121.Described testing circuit 123 is used for driving induction electrode array 121 to perform self-capacitance fingerprint sensing.

Described testing circuit 123 includes the first earth terminal G1 and multiple signal transmission ends T.The plurality of signal transmission ends T is used for output drive signal to induction electrode array 121.

Described manufacture method farther includes:

S5: form touch sensing layer 4 in the visible area of electronic equipment 100, whether have the touch operation of user for sensing.

Described manufacture method farther includes:

S6: formation modulation circuit 16 is between described equipment ground GND and described first earth terminal G1, and described modulation circuit 16 is according to driving the signal ground signalling with the GND loading of equipment ground to produce modulated signal, and provides modulated signal to the first earth terminal G1.

In the present embodiment, described pumping signal raises with the rising of described modulated signal, reduces with the reduction of described modulated signal.

It should be noted that, in the present embodiment, modulation circuit 16 is formed between described equipment ground GND and described first earth terminal G1, first earth terminal G1 is used for load-modulate signal, so, changes ground, also adjustable modulation circuit 16 is between power end P2 and power end P1, described power end P1 is used for load-modulate signal, correspondingly, the change of the modulated signal that the signal that described pumping signal and the first earth terminal G1 are loaded all is loaded with power end P1 and change.

Described modulated signal for example, includes described ground signalling and drives the signal of signal.In the present embodiment, described driving signal is higher than ground signalling, and described driving signal is boost signal compared to ground signalling.Further, the most periodically variable square-wave signal of described modulated signal.So, changing ground, described modulated signal is alternatively nonperiodic signal, it addition, described modulated signal is alternatively the signal of other suitable waveform, it is not limited to square-wave signal.Described driving signal may be lower than ground signalling, and described driving signal is buck signal compared to ground signalling.

The intensity using the fingerprint sensing signal of the electronic equipment 100 that method manufactured as above obtained is improved, thus, electronic equipment 100 fingerprint sensing sensitivity correspondence is improved.

The above-mentioned manufacture method of the application is to illustrate as a example by electronic equipment 100, so, described manufacture method obtains electronic equipment and is not limited to electronic equipment 100, it is possible to for other suitable electronic equipment.

Open despite describing this utility model with reference to each embodiment, it will be appreciated that these embodiments are illustrative, and scope of the present utility model is not limited only to them.Many changes, revises, adds and improves is all possible.More generally, describe in the context of specific embodiments according to embodiment each disclosed in this utility model.Function in embodiment each disclosed in this utility model the most separately or in combination, or can utilize different terms to describe.These and other change, revise, add and improve can be in this utility model scope of disclosure as defined in subsequent claim.

Claims

1. an electronic equipment, including:

Capacitance type fingerprint sensor chip, is arranged on the second surface side of cover sheet, is used for sensing user from cover sheet First surface input finger print information；With

Conductive layer, is arranged on the second surface side of cover sheet, is positioned at around described capacitance type fingerprint sensor chip, institute State conductive layer for loading ground signalling.

Electronic equipment the most according to claim 1, it is characterised in that: described conductive layer closed or non-enclosed around Described capacitance type fingerprint sensor chip region is arranged.

Electronic equipment the most according to claim 1, it is characterised in that: described capacitance type fingerprint sensor chip includes sensing Electrod-array and the testing circuit being connected with induction electrode array, described testing circuit be used for providing pumping signal to Induction electrode array, drives described induction electrode array to perform fingerprint sensing.

Electronic equipment the most according to claim 3, it is characterised in that: described testing circuit includes signal transmission ends and One earth terminal, described first earth terminal is used for load-modulate signal, and described signal transmission ends is used for providing pumping signal To induction electrode array, described pumping signal changes with the change of described modulated signal.

Electronic equipment the most according to claim 4, it is characterised in that: described pumping signal is with the liter of described modulated signal High and raise, reduce with the reduction of described modulated signal.

Electronic equipment the most according to claim 4, it is characterised in that: described testing circuit farther includes power end, Described power end is used for loading power voltage, and described supply voltage changes with the change of described modulated signal, and institute Stating the pressure reduction between supply voltage and described modulated signal and keep constant, described pressure reduction is the specified of testing circuit work Voltage.

Electronic equipment the most according to claim 4, it is characterised in that: described electronic equipment includes fingerprint sensing module, Described fingerprint sensing module includes described capacitance type fingerprint sensor chip, the second earth terminal and modulation circuit；Described Second earth terminal is used for loading described ground signalling, and described modulation circuit is connected to described second earth terminal and first and connects Between ground end, drive signal to produce described modulated signal according to described ground signalling with one, and described modulation letter is provided Number give the first earth terminal.

Electronic equipment the most according to claim 7, it is characterised in that: described electronic equipment farther includes mainboard, institute Stating fingerprint sensing module and farther include flexible PCB, described flexible PCB is used for connecting described mainboard with described Capacitance type fingerprint sensor chip, transmits signal between described mainboard and described capacitance type fingerprint sensor chip.

Electronic equipment the most according to claim 1, it is characterised in that: described electronic equipment farther includes touch sensing Layer, described touch sensing layer, described capacitance type fingerprint sensor chip and described conductive layer are respectively positioned on described protection cap The homonymy of plate, described touch sensing layer is used for sensing whether electronic equipment is touched by user.

Electronic equipment the most according to claim 9, it is characterised in that: described electronic equipment farther includes substrate, Described touch sensing layer is arranged on the substrate, and described substrate arranges through hole, described capacitance type fingerprint sensing core Sheet and described conductive layer are respectively positioned in described through hole.

11. electronic equipments according to claim 1, it is characterised in that: described electronic equipment includes equipment ground, described Equipment ground loads ground signalling, electrically connects described conductive layer and described equipment.

12. electronic equipments according to claim 1, it is characterised in that: described conductive layer is arranged on a second surface.

13. electronic equipments according to claim 1, it is characterised in that: described capacitance type fingerprint sensor chip is from electricity Appearance formula fingerprint sensing chip.

14. according to the electronic equipment described in any one in claim 1-13, it is characterised in that: described electronic equipment is can Take formula electronic product or household formula electronic product.

15. 1 kinds of mobile terminals, including:

Display screen, is arranged on the second surface side of cover sheet, and definition cover sheet is just showing the district of picture to display screen Territory is the visible area of mobile terminal, and definition cover sheet anon-normal is non-visible area to the region of display screen display picture； Capacitance type fingerprint sensor chip, is arranged on the second surface side of described cover sheet, and is positioned at described non-display area, For sensing the finger print information of user；With

Conductive layer, is arranged on the second surface side of described cover sheet, is positioned at described non-display area, and closed or non- Closed around the setting of described capacitance type fingerprint sensor chip region, described conductive layer is used for loading ground signalling.

16. mobile terminals according to claim 15, it is characterised in that: described capacitance type fingerprint sensor chip includes sense Answer electrod-array and the testing circuit being connected with induction electrode array, described testing circuit include signal transmission ends and First earth terminal, described first earth terminal is used for load-modulate signal, and described signal transmission ends is used for providing excitation letter Number give induction electrode array, drive described induction electrode array perform self-capacitance fingerprint sensing, described pumping signal Raise with the rising of described modulated signal, reduce with the reduction of described modulated signal.