CN205645270U

CN205645270U - Solid state disk

Info

Publication number: CN205645270U
Application number: CN201620244290.9U
Authority: CN
Inventors: 孙日欣; 孙成思; 李振华; 廖义渊
Original assignee: Biwin Storage Technology Co Ltd
Current assignee: Biwin Storage Technology Co Ltd
Priority date: 2016-03-28
Filing date: 2016-03-28
Publication date: 2016-10-12
Anticipated expiration: 2026-03-28

Abstract

The utility model provides a solid state disk, it includes circuit substrate, power management module, a plurality of flash storage module, host system, golden finger interface and encapsulated layer, power management module locates on this circuit substrate, a plurality of flash storage module locate and are connected on this circuit substrate and with this power management module electricity, host system locate on this circuit substrate and with this power management module with should a plurality of flash storage module are electric be connected, a surface of this circuit substrate is located to the golden finger interface, the encapsulated layer encapsulates this power management module, these a plurality of flash storage module and this host system an organic whole in another surface of this circuit substrate, makes each modular structure firm, and the acid and alkali -resistance is waterproof dustproof, longe -lived, small.

Description

Solid state hard disc

Technical field

This utility model relates to technical field of electronic equipment, particularly to a kind of solid state hard disc.

Background technology

Solid state hard disc (Solid State Disk or Solid State Drive), also referred to as electronic hard disc or Person's solid-state electronic dish, be by solid state hard disc control unit and solid state storage elements (DRAM or FLASH chip, is commonly called as flash memory) hard disk that forms.The interface specification of solid state hard disc, definition, merit Can and using method on identical with common hard disc, also with common hard in product design and size Dish is consistent.Be now widely used for military, vehicle-mounted, industry control, video monitoring, network monitoring, The fields such as the network terminal, electric power, medical treatment, aviation, navigator.The most traditional Solid state hard disc, storage chip and other chips, element are the most individually mounted on circuit board and are installed on In hard-disk cartridge, at the process of use, the water in the hard-disk cartridge that chip is easily penetrated into by the external world, thin dirt Affect quality and life-span Deng material, make circuit easily break down phenomenon further.

Utility model content

This utility model provides a kind of solid state hard disc, to solve prior art chips easily by by outward The materials such as the water in the hard-disk cartridge that boundary is penetrated into, thin dirt affect quality and life-span, make circuit hold further Easily break down the technical problems such as phenomenon.

For solving above-mentioned technical problem, the technical scheme that this utility model uses is: provide one Kind of solid state hard disc, it include circuit substrate, power management module, multiple Flash memory module, Main control module, golden finger interface and encapsulated layer, power management module is located on this circuit substrate； Multiple Flash memory modules are located on this circuit substrate and are electrically connected with this power management module；Main Control module be located on this circuit substrate and with this power management module and the plurality of Flash memory module Electrical connection；Golden finger interface is located at a surface of this circuit substrate；Encapsulated layer is by this power management mould Another in this circuit substrate of block, the plurality of Flash memory module and this main control module integral packaging One surface.

Wherein, this power management module, the plurality of Flash memory module and this main control module are Encapsulate chip and/or unencapsulated wafer, be located at this by SMT mode or wire bonding mode Circuit substrate surface.

Wherein, this circuit substrate includes body region and epitaxial region, this power management module, the plurality of Flash memory module and this main control module are located at this body region, and this golden finger interface is located at this extension District.

Wherein, this solid state hard disc also includes passive device, and this passive device is located on this circuit substrate Electrically connect with this main control module and by this encapsulated layer integral packaging.

Wherein, this passive device includes electric capacity, inductance and resistance.

Wherein, the size that body region length is generous is 46.5mm × 35.5mm × 2.2mm or 72mm ×47mm×2.2mm。

Wherein, this packing colloid is epoxy resin.

Wherein, this golden finger interface is standard SATA interface.

Wherein, this golden finger interface is CD-ROM drive SATA interface.

The beneficial effects of the utility model are: be different from the situation of prior art, and this utility model carries Having supplied a kind of solid state hard disc, it is provided with encapsulated layer, and encapsulated layer is by power management module, multiple Flash Memory module and main control module integral packaging, in a surface of circuit substrate, make each modular structure steady Gu, acid and alkali-resistance, water proof and dust proof, the life-span is long, and volume is little.

Accompanying drawing explanation

In order to be illustrated more clearly that the technical scheme in this utility model embodiment, below will be to enforcement In example description, the required accompanying drawing used is briefly described, it should be apparent that, in describing below Accompanying drawing is only embodiments more of the present utility model, for those of ordinary skill in the art, On the premise of not paying creative work, it is also possible to obtain other accompanying drawing according to these accompanying drawings, Wherein:

Fig. 1 is the profile of this utility model solid state hard disc；

Fig. 2 is a schematic surface of this utility model solid state hard disc；

Fig. 3 is the circuit connection diagram of this utility model solid state hard disc；

Fig. 4 is another example structure signal of the golden finger interface of this utility model solid state hard disc Figure.

Detailed description of the invention

Below in conjunction with the accompanying drawing in this utility model embodiment, in this utility model embodiment Technical scheme is clearly and completely described, it is clear that described embodiment is only that this practicality is new A part of embodiment of type rather than whole embodiments.Based on the embodiment in this utility model, It is every other that those of ordinary skill in the art are obtained under not making creative work premise Embodiment, broadly falls into the scope of this utility model protection.

Referring to Fig. 1-3, Fig. 1 is the profile of this utility model solid state hard disc, and Fig. 2 is this reality With a schematic surface of novel solid hard disk, Fig. 3 is that the circuit of this utility model solid state hard disc connects Connect schematic diagram.Solid state hard disc 1 of the present utility model includes circuit substrate 10, power management module 20, multiple Flash (flash memory) memory module 30, main control module 40, golden finger interface 50 and Encapsulated layer 60.

Power management module 20 connects external power interface, in order to power solid state hard disc 1.Flash Memory module 30 is in order to access data.Main control module 40 is in order to the operation to whole solid state hard disc 1 It is managed.Golden finger interface 50 is used for peripheral hardware grafting to be charged or to transmit data.Electricity Source control module 20 is located on circuit substrate 10.Multiple Flash memory modules 30 are located at circuit base Electrically connect on plate 10 and with power management module 20.Main control module 40 is located on circuit substrate 10 And electrically connect with power management module 20 and multiple Flash memory module 30.Golden finger interface 50 It is located at a surface of circuit substrate 10.Encapsulated layer 60 is by power management module 20, multiple Flash Memory module 30 and main control module 40 integral packaging are in another surface of circuit substrate 10.

Power management module 20, multiple Flash memory module 30 and main control module 40 are for seal Cartridge chip, it is also possible to be for unencapsulated wafer, it is also possible to for the chip encapsulated and unencapsulated Wafer is mashed up, specifically, and power management module 20, multiple Flash memory module 30 and master control Module 40 can be power management chip, multiple Flash memory chip and main control chip, power supply Management module 20, multiple Flash memory module 30 and main control module 40 can also be power supply pipe Reason wafer, multiple Flash storage wafer and master control wafer, power management module 20, multiple Flash Memory module 30 and main control module 40 can also be power management chip, multiple Flash storage Wafer and master control wafer, can also is that other chip and the mode of wafer combination certainly, can root Select according to being actually needed, limit the most one by one.Can pass through between above-mentioned module and module SMT (Surface Mounted Technology, surface mounting technology) mode is electrically connected to circuit Substrate 10 surface, it is also possible to wire bonding mode is electrically connected to circuit substrate 10 surface, it is also possible to Being SMT and wire bonding two ways all uses, it can select electrical connection according to actual needs Mode, limits the most one by one.Circuit substrate 10 can be BT (bismaleimide and Triazine, BMI and triazine) resin substrate.

As in figure 2 it is shown, circuit substrate 10 includes body region 11 and epitaxial region 12, power management mould Block 20, multiple Flash memory module 30 and main control module 40 are located at body region 11, golden finger Interface 50 is located at epitaxial region 12.The long generous size in body region 11 can be 46.5mm × 35.5mm × 2.2mm, the long generous size in body region 11 can be 72mm × 47mm × 2.2mm, It is, of course, also possible to other specification, it can carry out specification selection according to actual needs.

Further, solid state hard disc 1 also includes that passive device 70, passive device 70 are located at circuit Electrically connect with main control module 40 on substrate 10 and by encapsulated layer 60 integral packaging.Passive device 70 Including electric capacity, inductance and resistance.

As in figure 2 it is shown, golden finger interface 50 of the present utility model be standard SATA (Serial ATA, Serial ports) interface with the SATA connector grafting of peripheral hardware with realize data transmission, such as: gold hands Finger mouth 50 can be inserted directly into the SATA connector of computer-internal.

See also another of golden finger interface that Fig. 4, Fig. 4 are this utility model solid state hard discs Example structure schematic diagram, the golden finger interface 50 of the present embodiment can also be CD-ROM drive SATA interface. During computer uses, the CD-ROM drive of some users is also not frequently used.It is desirable to by changing Dress, installs hard disk by CD-ROM drive position, thus increases memory capacity.Solid state hard disc of the present utility model 1 has storage chip 122 and the CD-ROM drive SATA interface with CD-ROM drive location matches, therefore need not volume Outer repacking CD-ROM drive position, can realize increasing memory capacity.

This utility model provides a kind of solid state hard disc 1, and it includes encapsulated layer 60, circuit substrate 10, Active device module, passive device 70 module and packing colloid, encapsulated layer 60 is by power management Module 20, multiple Flash memory module 30 and main control module 40 integral packaging are in this circuit base One surface of plate 10, makes each modular structure consolidate, and acid and alkali-resistance, water proof and dust proof, the life-span is long, body Long-pending little.

These are only embodiment of the present utility model, not thereby limit patent model of the present utility model Enclose, every equivalent structure utilizing this utility model description and accompanying drawing content to be made or equivalence flow process Conversion, or directly or indirectly it is used in other relevant technical fields, the most in like manner it is included in this practicality In novel scope of patent protection.

Claims

1. a solid state hard disc, it is characterised in that including:

Circuit substrate；

Power management module, is located on described circuit substrate；

Multiple Flash memory modules, be located on described circuit substrate and with described power management module Electrical connection；

Main control module, be located on described circuit substrate and with described power management module and the plurality of Flash memory module electrically connects；

Golden finger interface, is located at a surface of described circuit substrate；And

Encapsulated layer, by described power management module, the plurality of Flash memory module and described Main control module integral packaging is in another surface of described circuit substrate.

Solid state hard disc the most according to claim 1, it is characterised in that described power management Module, the plurality of Flash memory module and described main control module are for having encapsulated chip and/or not The wafer of encapsulation, is located at described circuit substrate surface by SMT mode or wire bonding mode.

Solid state hard disc the most according to claim 1, it is characterised in that described circuit substrate Including body region and epitaxial region, described power management module, the plurality of Flash memory module with And described main control module is located at described body region, described golden finger interface is located at described epitaxial region.

Solid state hard disc the most according to claim 1, it is characterised in that described solid state hard disc Also include that passive device, described passive device are located on described circuit substrate and described main control module electricity Connect and by described encapsulated layer integral packaging.

Solid state hard disc the most according to claim 4, it is characterised in that described passive device Including electric capacity, inductance and resistance.

Solid state hard disc the most according to claim 3, it is characterised in that body region length is generous Size be 46.5mm × 35.5mm × 2.2mm or 72mm × 47mm × 2.2mm.

Solid state hard disc the most according to claim 1, it is characterised in that described packing colloid For epoxy resin.

Solid state hard disc the most according to claim 1, it is characterised in that described golden finger connects Mouth is standard SATA interface.

Solid state hard disc the most according to claim 1, it is characterised in that described golden finger connects Mouth is CD-ROM drive SATA interface.