CN205614858U - 一种新型多晶硅切片粘棒用刮胶工装 - Google Patents
一种新型多晶硅切片粘棒用刮胶工装 Download PDFInfo
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CN108144814A (zh) * | 2017-12-21 | 2018-06-12 | 重庆超硅半导体有限公司 | 一种集成电路用单晶硅棒的均匀涂胶粘接方法 |
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CN108144814A (zh) * | 2017-12-21 | 2018-06-12 | 重庆超硅半导体有限公司 | 一种集成电路用单晶硅棒的均匀涂胶粘接方法 |
CN108144814B (zh) * | 2017-12-21 | 2020-11-03 | 重庆超硅半导体有限公司 | 一种集成电路用单晶硅棒的均匀涂胶粘接方法 |
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Effective date of registration: 20201214 Address after: No.198 Guangming Road, Yangzhong Economic Development Zone, Zhenjiang City, Jiangsu Province Patentee after: Jiangsu Meike Solar Energy Technology Co.,Ltd. Address before: 212200 new material industrial park, Yangzhong City, Zhenjiang City, Jiangsu Province Patentee before: ZHENJIANG HUANTAI SILICON TECHNOLOGY Co.,Ltd. |
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Address after: No.198 Guangming Road, Yangzhong Economic Development Zone, Zhenjiang City, Jiangsu Province Patentee after: Jiangsu Meike Solar Energy Technology Co.,Ltd. Address before: No.198 Guangming Road, Yangzhong Economic Development Zone, Zhenjiang City, Jiangsu Province Patentee before: Jiangsu Meike Solar Energy Technology Co.,Ltd. |