CN205584617U - Multilayer impedance hdi circuit board - Google Patents
Multilayer impedance hdi circuit board Download PDFInfo
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- CN205584617U CN205584617U CN201620212936.5U CN201620212936U CN205584617U CN 205584617 U CN205584617 U CN 205584617U CN 201620212936 U CN201620212936 U CN 201620212936U CN 205584617 U CN205584617 U CN 205584617U
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- wiring board
- impedance line
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Abstract
The utility model relates to a circuit board field of making especially relates to a multilayer impedance HDI circuit board. A multilayer impedance HDI circuit board, includes: the first line board and the second line board, insulating layer between the first line board and the first line board and the the second line board, wherein, the upper surface of insulating layer is connected with the the first line board through a first shielding layer, and the lower surface of insulating layer is connected with the the second line board through a secondary shielding layer, is provided with parallel first impedance line and second impedance line in the the first line board to be provided with parallel third impedance line and fourth impedance line in the the second line board, first impedance line equals with the length of second impedance line that third impedance line equals with the length of fourth impedance line, interval between first impedance line and the second impedance line is less than 1 with the comparing of length of first impedance line, and the interval between third impedance line and the fourth impedance line is less than 1 with the comparing of length of third impedance line.
Description
Technical field
This utility model relates to wiring board and manufactures field, particularly relates to a kind of multilayer impedance HDI wiring board.
Background technology
Existing impedance HDI wiring board is due to thickness low LCL, and the yield causing wiring board product is relatively low, or unreasonable due to thickness design so that impedance is unstable.
Utility model content
The problem existed for prior art, now provides a kind of multilayer impedance HDI wiring board, it is possible to increase the yield of wiring board.
Concrete technical scheme is as follows:
A kind of multilayer impedance HDI wiring board, described multilayer impedance HDI wiring board includes:
First line plate and the second wiring board, the insulating barrier between described first line plate and described first line plate and described second wiring board；Wherein,
The upper surface of described insulating barrier is connected with described first line plate by one first screen layer, and the lower surface of described insulating barrier is connected with described second wiring board by a secondary shielding layer,
Described first line plate is provided with in the first parallel impedance line and the second impedance line, and described second wiring board and is provided with the 3rd parallel impedance line and the 4th impedance line；Described first impedance line is equal with the length of described second impedance line, and described 3rd impedance line is equal with the length of described 4th impedance line；
Spacing between described first impedance line and described second impedance line is less than 1 with the ratio of the length of described first impedance line, and the spacing between described 3rd impedance line and described 4th impedance line is less than 1 with the ratio of the length of described 3rd impedance line；Wherein, described first line plate is high-density interconnection circuit board, and/or described second wiring board is high-density interconnection circuit board.
Preferably, the material of described insulating barrier is glass fibre.
Preferably, described first screen layer is a shielding reflectance coating；And/or described secondary shielding layer is a shielding reflectance coating.
Preferably, the thickness of described insulating barrier is 5.3-6mil.
Technique scheme provides the benefit that:
Technique scheme is by rationally arranging the parameters such as thickness between wiring board and plate, layout, enabling the impedance making product is more stable, meets use requirement.
Accompanying drawing explanation
Fig. 1 is the structural representation of this utility model a kind of multilayer impedance HDI wiring board.
Detailed description of the invention
It should be noted that in the case of not conflicting, following technical proposals, can be mutually combined between technical characteristic.
Below in conjunction with the accompanying drawings detailed description of the invention of the present utility model is further described:
As it is shown in figure 1, a kind of multilayer impedance HDI wiring board, described multilayer impedance HDI wiring board includes:
First line plate and the second wiring board, the insulating barrier between described first line plate and described first line plate and described second wiring board；Wherein,
The upper surface of described insulating barrier is connected with described first line plate by one first screen layer, and the lower surface of described insulating barrier is connected with described second wiring board by a secondary shielding layer,
Described first line plate is provided with in the first parallel impedance line and the second impedance line, and described second wiring board and is provided with the 3rd parallel impedance line and the 4th impedance line；Described first impedance line is equal with the length of described second impedance line, and described 3rd impedance line is equal with the length of described 4th impedance line；
Spacing between described first impedance line and described second impedance line is less than 1 with the ratio of the length of described first impedance line, such as, can be 0.5,0.8,0.9 etc., spacing between described 3rd impedance line and described 4th impedance line is less than 1 with the ratio of the length of described 3rd impedance line, for example, it is possible to be 0.5,0.8,0.9 etc..The line length of ratio design and line-spacing, it is possible to the impedance making product is more stable, meet use requirement.
In one preferred embodiment of this utility model, the material of described insulating barrier is glass fibre.Glass fibre can effectively reduce wiring board signaling reflex and electromagnetic interference, uses glass fibre as insulating barrier, can effectively reduce the dielectric constant of wiring board, improve the impedance control of wiring board.
In one preferred embodiment of this utility model, described first screen layer is a shielding reflectance coating；And/or described secondary shielding layer is a shielding reflectance coating.
In the present embodiment, use the epiphragma of one layer of suitable thickness to be attached to shield reflectance coating, add product thickness, be greatly improved product yield.Easily realize in this utility model technique, shorten fabrication cycle the most to a certain extent simultaneously.
In one preferred embodiment of this utility model, described first line plate is that high density interconnects (HDI) wiring board.
In one preferred embodiment of this utility model, described second wiring board is that high density interconnects (HDI) wiring board.
In one preferred embodiment of this utility model, the thickness of described insulating barrier is 5.3-6mil, for example, it is possible to be 5.5,5.7,5.8 etc..So insulating barrier of thickness can play preferable insulation effect.
By the appropriate design of thickness of insulating layer in the present embodiment, the first line plate of this impedance circuit plate, the impedance matching of the second wiring board can be made, to reduce signal reflection and the Electromagnetic Interference of wiring board, reach wiring board resistance requirements.
By explanation and accompanying drawing, give the exemplary embodiments of the ad hoc structure of detailed description of the invention, based on this utility model spirit, also can make other conversion.Although above-mentioned utility model proposes existing preferred embodiment, but, these contents are not intended as limitation.
For a person skilled in the art, after reading described above, various changes and modifications will be apparent to undoubtedly.Therefore, appending claims should regard the whole variations and modifications containing true intention of the present utility model and scope as.In Claims scope, the scope of any and all equivalence and content, be all considered as still belonging in intention of the present utility model and scope.
Claims (4)
1. a multilayer impedance HDI wiring board, it is characterised in that including:
First line plate and the second wiring board, the insulating barrier between described first line plate and described first line plate and described second wiring board；Wherein,
The upper surface of described insulating barrier is connected with described first line plate by one first screen layer, and the lower surface of described insulating barrier is connected with described second wiring board by a secondary shielding layer,
Described first line plate is provided with in the first parallel impedance line and the second impedance line, and described second wiring board and is provided with the 3rd parallel impedance line and the 4th impedance line；Described first impedance line is equal with the length of described second impedance line, and described 3rd impedance line is equal with the length of described 4th impedance line；
Spacing between described first impedance line and described second impedance line is less than 1 with the ratio of the length of described first impedance line, and the spacing between described 3rd impedance line and described 4th impedance line is less than 1 with the ratio of the length of described 3rd impedance line；Wherein,
Described first line plate is high-density interconnection circuit board, and/or described second wiring board is high-density interconnection circuit board.
Multilayer impedance HDI wiring board the most according to claim 1, it is characterised in that the material of described insulating barrier is glass fibre.
Multilayer impedance HDI wiring board the most according to claim 1, it is characterised in that described first screen layer is a shielding reflectance coating；And/or described secondary shielding layer is a shielding reflectance coating.
Multilayer impedance HDI wiring board the most according to claim 1, it is characterised in that the thickness of described insulating barrier is 5.3-6mil.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620212936.5U CN205584617U (en) | 2016-03-21 | 2016-03-21 | Multilayer impedance hdi circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620212936.5U CN205584617U (en) | 2016-03-21 | 2016-03-21 | Multilayer impedance hdi circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205584617U true CN205584617U (en) | 2016-09-14 |
Family
ID=56868626
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620212936.5U Active CN205584617U (en) | 2016-03-21 | 2016-03-21 | Multilayer impedance hdi circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205584617U (en) |
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2016
- 2016-03-21 CN CN201620212936.5U patent/CN205584617U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |